A computer mainboard dust removal and drying device

Abstract

The embodiment of the present disclosure provides a computer mainboard dust removal and drying device, which comprises a hot air generator, a hot air distribution disc connected to the output end of the hot air generator, wherein the hot air distribution disc is provided with an adjustable air volume distribution valve, and a plurality of hot air shunt plates are arranged in the hot air distribution disc, and the surface of the hot air shunt plates is provided with flow guide lines; a plurality of groups of hot air nozzles are connected with the hot air distribution disc; a mainboard support frame is used for fixing the computer mainboard; and an anti-static shell is arranged on the outside of the whole device; wherein the plurality of groups of hot air nozzles comprise a plurality of groups of micro nozzles, each group of micro nozzles can independently adjust the direction and the size of the air outlet; and the mainboard support frame is provided with a plurality of groups of height-adjustable supporting legs for adjusting the height of the supporting legs according to the size of the mainboard. Through the scheme of the embodiment of the present disclosure, the sensitive elements of the mainboard can be prevented from being damaged due to overheating.

Description

Technical Field

[0001] This application relates to the field of electronic equipment maintenance technology, specifically to a computer motherboard dust removal and drying device. Background Technology

[0002] Computer motherboard dust removal and drying devices are primarily used to clean and dry computer motherboards, removing surface dust, moisture, and other substances that may affect device performance, thereby improving operational stability and lifespan. However, technical challenges may arise during operation, such as preventing damage to sensitive components on the motherboard due to overheating. This is because heat generation and control are critical factors during dust removal or drying; improper handling can cause irreversible damage to temperature-sensitive components such as chips and capacitors on the motherboard, thus affecting its normal operation. Summary of the Invention

[0003] In view of this, the present disclosure provides a computer motherboard dust removal and drying device, which at least partially solves the problems existing in the prior art.

[0004] This application discloses a computer motherboard dust removal and drying device, comprising:

[0005] Hot air generator;

[0006] A hot air distribution plate is connected to the output end of the hot air generator. The hot air distribution plate has an adjustable airflow distribution valve. The hot air distribution plate has multiple layers of hot air diversion plates inside, and the surface of the hot air diversion plates has guide patterns.

[0007] Multiple sets of hot air nozzles are connected to the hot air distribution plate;

[0008] Motherboard support bracket, used to secure the computer motherboard;

[0009] An anti-static housing is located on the outside of the entire device; wherein,

[0010] The multiple sets of hot air nozzles include multiple sets of micro nozzles, each of which can independently adjust its direction and outlet size;

[0011] The motherboard support frame has multiple sets of height-adjustable legs, which are used to adjust the height of the legs according to the size of the motherboard.

[0012] In one specific embodiment, the hot air generator includes an adjustable temperature heating element and a fan, wherein the adjustable temperature heating element is capable of adjusting the temperature range of the hot air.

[0013] In one specific embodiment, the hot air distribution plate further includes multiple diversion holes, which cooperate with the multiple layers of the hot air distribution plate to achieve uniform distribution of hot air.

[0014] In one specific embodiment, the guide pattern is set to a wave shape and arranged in accordance with the position of the hot air nozzle.

[0015] In one specific implementation, each set of hot air nozzles is equipped with an independent electrically controlled valve.

[0016] In one specific embodiment, the motherboard support frame is also equipped with an electrostatic discharge module for releasing static electricity accumulated on the motherboard.

[0017] In one specific embodiment, a temperature monitoring sensor is installed inside the antistatic housing to detect the temperature at the hot air outlet.

[0018] In one specific embodiment, the hot air distribution plate is connected to the hot air generator via a flexible connecting pipe, which is capable of heat insulation and vibration absorption.

[0019] In one specific embodiment, the antistatic housing is provided with ventilation windows and a filter screen.

[0020] This disclosure provides a computer motherboard dust removal and drying device, comprising: a hot air generator; a hot air distribution plate connected to the output end of the hot air generator, wherein the hot air distribution plate has an adjustable airflow distribution valve, and the hot air distribution plate has multiple layers of hot air diversion plates inside, the surface of which is provided with guide patterns; multiple sets of hot air nozzles connected to the hot air distribution plate; a motherboard support frame for fixing the computer motherboard; and an anti-static housing disposed on the outside of the entire device; wherein the multiple sets of hot air nozzles include multiple sets of micro nozzles, each set of micro nozzles being independently adjustable in direction and outlet size; the motherboard support frame has multiple sets of adjustable height legs for adjusting the height of the legs according to the motherboard size. The solution provided by this disclosure can solve the problem of preventing overheating damage to sensitive components on the motherboard. Attached Figure Description

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of a partial cross-section of the antistatic housing.

[0024] Figure 3 A schematic diagram of the structure of the hot air generator and hot air distribution plate;

[0025] Figure 4 Schematic diagram of the hot air distribution plate in the open state;

[0026] Figure 5 This is a schematic diagram of the structure at the hot air nozzle.

[0027] Figure 6 This is a schematic diagram of the structure of the hot air generator;

[0028] Figure 7 This is a schematic diagram of the hot air generator in its open state.

[0029] In the diagram: 1. Hot air generator; 2. Hot air distribution plate; 3. Hot air nozzle; 4. Main board support frame; 5. Anti-static housing; 6. Adjustable temperature heating element; 7. Fan; 8. Diverter hole; 9. Multi-stage rotary valve core structure; 10. Miniature nozzle; 11. Electrically controlled valve; 12. Support leg; 13. Static electricity elimination module; 14. Temperature monitoring sensor; 15. Flexible connection pipe; 16. Ventilation window; 17. Filter screen; 21. Air volume distribution valve; 22. Hot air diverter plate; 23. Guide pattern. Detailed Implementation

[0030] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0031] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0032] like Figure 1 and Figure 2 As shown, a computer motherboard dust removal and drying device according to this application includes a hot air generator 1, a hot air distribution plate 2, multiple hot air nozzles 3, a motherboard support frame 4, and an anti-static housing 5. The functions, structures, and connections of each component are described in detail below.

[0033] As the core component of the entire device, the hot air generator 1's main function is to generate uniform hot air and deliver it to the hot air distribution plate 2 through pipes. Specifically, the hot air generator 1 can be implemented using a combination of a built-in heating element and a fan 7. For example, ceramic or metal PTC heating elements can be used in conjunction with a high-speed fan 7 to ensure that the generated hot air is evenly distributed at a stable temperature. The hot air generator 1 is typically located on one side inside the device for easy installation, inspection, and maintenance, and the specific parameters of the output hot air can be controlled by adjusting the fan speed or the heating power.

[0034] The hot air distribution plate 2 is a key component responsible for receiving hot air from the hot air generator 1 and precisely delivering it to the hot air nozzles 3 in various areas through a series of technical measures. The hot air distribution plate 2 comprises several components, such as an adjustable airflow distribution valve 21 (see details). Figure 6 ), multi-layer hot air distribution plate 22 (see details) Figure 4 The design incorporates special airflow guiding patterns 23 on the surface to ensure air uniformity. The airflow distribution valve 21 dynamically adjusts the hot air flow rate in different areas according to actual needs, preventing damage to sensitive components due to excessive local hot air concentration. The multi-layer hot air distribution plate 22 further refines the distribution of hot airflow, gradually breaking down a single hot airflow into several smaller parts, ensuring more uniform airflow coverage of the entire target surface. The surface guiding patterns guide the direction of hot air flow and eliminate eddy current effects, thereby achieving precise control of hot air distribution.

[0035] The hot air nozzle 3 is an integral component consisting of several small air vents, directly connected to the hot air distribution plate 2. After being transferred from the distribution plate, the hot air is dispersed and concentrated towards specific target locations on the computer motherboard. The nozzles are typically designed to be slender and have adjustable angles. This allows operators to adjust the airflow direction towards specific components according to actual conditions, enhancing operational flexibility. Furthermore, these nozzles can be connected to the hot air distribution plate 2 via quick-connect interfaces for easy replacement and cleaning. For example, when encountering computer motherboards of different sizes or shapes, users can flexibly change different types of hot air nozzle 3 configurations to meet personalized requirements.

[0036] The main function of the motherboard support bracket 4 is to provide a fixed mounting position for the computer motherboard to be processed and ensure that it maintains an appropriate preset distance from the hot air nozzle 3. This support bracket adopts a frame structure design, creating an open space at the top to allow heat to pass smoothly without interfering with the motherboard. Meanwhile, multiple fixing holes and adjustment devices are provided at the bottom of the bracket to accommodate motherboards of different models and thicknesses. During installation, the support bracket can also be equipped with anti-slip pads or soft rubber strips to prevent scratches on the circuit surface and protect the integrity of sensitive components.

[0037] The anti-static housing 5 encloses the entire device, thus isolating it from external contaminants and enhancing overall equipment stability. Its main body is made of high-temperature resistant material and incorporates an anti-static coating or embedded grounding structure to prevent damage to electronic components caused by environmental electric fields. The housing design also includes seals for the air inlet and outlet, as well as necessary ventilation slots to maintain good thermal circulation efficiency. This housing not only improves operational safety but also enhances efficiency during the dust removal process.

[0038] To avoid overheating damage to certain sensitive components in computer motherboards, multiple components in the aforementioned structure work together effectively. First, the precise temperature and airflow adjustment capabilities of the hot air generator 1 ensure that airflow remains within a suitable and safe range from the source. Second, the multiple control modules in the hot air distribution plate 2, such as the design of the splitter plate, airflow paths, and adjustable valves, allow for even airflow distribution and avoidance of specific areas containing highly sensitive components, thus preventing overheating. Therefore, this device effectively solves the technical challenge of sensitive components easily overheating during dust removal and drying, a problem that traditional cleaning equipment struggles to address.

[0039] like Figure 7 As shown, in one embodiment, the hot air generator 1 of a computer motherboard dust removal and drying device of this application includes an adjustable temperature heating element 6 and a fan 7. These components work together to generate hot air with an adjustable temperature. The adjustable temperature heating element 6 heats the air passing through it, while the fan 7 blows the heated air out and delivers it to the hot air distribution plate 2. The adjustable temperature heating element 6 is typically installed upstream of the airflow from the fan 7, ensuring that cold air enters the heating element for preheating before being delivered by the fan 7 to form a stable flow of hot air. To accommodate different types of sensitive components on the motherboard, the temperature of the heating element can be adjusted in real time via an internal control circuit.

[0040] For example, multiple power modes can be set within the adjustable heating element 6 and integrated with a temperature sensor. When the current set temperature is detected to be higher or lower than a preset value, the output temperature of the hot air can be precisely controlled by changing the power level. Specifically, the fan 7 is connected to the hot air distribution plate 2 via a connecting pipe, and the heating element is tightly fitted to the outlet of the fan 7 to minimize heat loss. This installation structure ensures the consistency of the hot air temperature and avoids damage to sensitive components on the main board.

[0041] like Figure 4 As shown, in one embodiment, the hot air distribution structure of a computer motherboard dust removal and drying device of this application includes multiple sets of diversion holes 8 for segmented and uniform hot air distribution, which work in conjunction with a multi-layer hot air diversion plate 22 to optimize hot air flow control. The diversion holes 8 are located on the hot air distribution plate 2, and after receiving uniform hot air provided by the hot air generator 1, their distribution density and position are adjusted according to the needs of a predetermined area. This distribution design allows the hot air to be initially distributed through the diversion holes 8 and ultimately guided to the hot air nozzles 3. Meanwhile, the multi-layer hot air diversion plate 22 is located inside or near the surface of the hot air distribution plate 2, enabling further regulation of the hot air flow to match the heat dissipation needs of different areas.

[0042] For example, three layers of diversion plates can be embedded inside the hot air distribution plate 2. The installation position and opening size of each diversion plate gradually change to achieve segmented blocking and guiding of the hot air flow. Specifically, the diversion plates can be fixed to the hot air distribution plate 2 with screws or formed by snap-fit ​​connections to create a stable assembly structure. At the same time, diversion holes 8 are distributed between the different layers of the diversion plates, thus providing an independent flow path for each stream of hot air.

[0043] Specifically, the hot air distribution plate 2 can be machined using precision machining equipment during the manufacturing process to ensure that the diversion holes 8 and the hot air distribution plate 22 achieve the expected assembly accuracy and matching relationship. This ensures the consistency and uniformity of the hot air flow from distribution to final output, thereby adapting to the different sensitivity requirements of various components on the motherboard.

[0044] like Figure 6As shown, in one embodiment, the airflow distribution valve 21 of a computer motherboard dust removal and drying device of this application adopts a multi-stage rotary valve core structure 9. This structure can precisely control the opening area of ​​each hot air channel by adjusting its rotation angle. Specifically, the airflow distribution valve 21 is disposed inside the hot air distribution plate 2 and connected to the pipe delivered by the hot air generator 1. Its main body includes a rotatable multi-stage rotary valve core, which is composed of several layers of stacked annular components, each annular component having airflow channels at different positions and sizes. By adjusting the overall rotation angle of the multi-stage rotary valve core, the degree of overlap between these airflow channels can be dynamically changed, thereby precisely controlling the distribution of hot air flowing to each hot air nozzle 3.

[0045] For example, a motor can be used to drive the multi-stage rotary valve core to rotate, while an encoder detects the current rotation angle and feeds it back to the control system to ensure accuracy. Furthermore, the installation position of the airflow distribution valve 21 needs to ensure that it can work in conjunction with the diverter plate and guide patterns in the hot air distribution plate 2 to form a unified airflow control system. Specifically, the multi-stage rotary valve core can be fixed to the preset holes in the hot air distribution plate 2 using threads or snap-fit ​​methods, ensuring good sealing to reduce hot air leakage.

[0046] like Figure 1 As shown, in one embodiment, the airflow guiding pattern of the computer motherboard dust removal and drying device of this application is designed as a wave-shaped or polygonal structure, and is differentiated according to the position of different hot air nozzles 3. The main function of the airflow guiding pattern is to concentrate and guide the hot air flow to a specific motherboard area, so that the airflow can more accurately cover the part that needs to be processed, avoiding efficiency reduction or component damage caused by disordered flow. Specifically, the airflow guiding pattern optimizes the directionality and concentration of the hot airflow through its specific geometry and distribution, thereby ensuring that each stream of hot air can move to the designated position according to a predetermined trajectory.

[0047] Multiple airflow guiding patterns are formed on the surface of the hot air distribution plate 2, with the geometry of each pattern matching the position of its corresponding hot air nozzle 3. By differentiating these airflow guiding patterns, different airflow requirements for different mainboard areas can be met. Furthermore, the spatial arrangement between the airflow guiding patterns and the hot air splitter plate 22 further enhances the stability and controllability of the hot airflow along its path.

[0048] For example, the morphological parameters of the airflow pattern can be defined through precise modeling. Specifically, during the manufacturing process, CNC machine tools or other high-precision machining equipment are used to directly engrave the pre-calculated wavy or polygonal contour onto the outer surface area of ​​the hot air distribution plate 2. Subsequently, the model is fine-tuned based on actual test data, so that the final product can adapt to the positional requirements of each hot air nozzle 3 and effectively improve the concentration.

[0049] like Figure 5 As shown, in one embodiment, the multiple hot air nozzles 3 of the computer motherboard dust removal and drying device of this application include multiple sets of micro nozzles 10. These micro nozzles 10 can independently adjust their direction and outlet size to adapt to the different component layout requirements on the motherboard. The arrangement of the micro nozzles 10 flexibly adjusts the concentration and targeting of the hot air blowing, and can cover sensitive components, high-density areas or other special parts when facing complex motherboard structures. Specifically, the hot air nozzles 3 are installed above the motherboard support frame 4 and receive the diverted hot air from the hot air distribution plate 2 through connecting pipes, so that each micro nozzle 10 has an independent and controllable airflow input source.

[0050] The direction adjustment mechanism of the micro-nozzle 10 is achieved through an integrated rotary joint. This joint allows each micro-nozzle 10 to rotate at multiple angles around its own axis, and the desired blowing angle is fixed by a locking screw. The outlet size is changed by a telescopic or foldable design component. For example, the end of the micro-nozzle 10 is designed as a flexible petal, allowing the operator to manually open or compress its edges to create different outlet diameters. This achieves precise control. The components are assembled in a modular fashion, facilitating replacement and calibration, thereby improving convenience and accuracy during long-term use.

[0051] like Figure 5 As shown, in one embodiment, each hot air nozzle 3 of the computer motherboard dust removal and drying device of this application is equipped with an independent electrically controlled valve 11 for dynamically adjusting the opening and closing state of a single nozzle. This design allows for precise control of the effect of hot air on different areas of the motherboard, thereby preventing damage to sensitive components that may be caused by overheating in localized areas. Specifically, these electrically controlled valves 11 are installed inside the air inlet duct of each hot air nozzle 3, adjacent to the hot air distribution plate 2, and are electrically connected to the control system. Furthermore, these valves are made of durable materials and can withstand airflow impacts within a certain temperature range for extended periods. To ensure operational reliability, each valve also integrates a real-time feedback module to monitor the current opening and closing degree and send the information to the main controller.

[0052] For example, when the equipment starts running, the main controller generates control signals based on a preset algorithm or by detecting the temperature of different areas of the motherboard. These signals are then transmitted to the electrically controlled valves 11 corresponding to each hot air nozzle 3. Upon receiving the signal, the valves quickly adjust their opening or completely close the corresponding channels, thus matching the flow of hot air to the current operational requirements. This coordinated process enables highly customized dust removal and drying operations tailored to the complex structure of the motherboard surface.

[0053] like Figure 2As shown, in one embodiment, the motherboard support frame 4 of the computer motherboard dust removal and drying device of this application is designed with multiple sets of height-adjustable legs 12. These legs 12 are fixed to the bottom of the motherboard support frame 4 and can be adjusted in height to accommodate motherboards of different shapes and sizes, thereby ensuring that the motherboard maintains an optimal distance from the hot air nozzle 3 during processing. Specifically, each set of legs 12 includes an adjusting sleeve with internal threads and a matching screw. By manually rotating or using tools to adjust the position of the screw relative to the adjusting sleeve, the total length of the legs 12 can be changed, thereby enabling precise height fine-tuning of the motherboard support frame 4.

[0054] For example, graduations and locking devices can be installed on each adjusting sleeve to allow operators to intuitively set and fix the extension of the outrigger 12. Furthermore, to improve stability, anti-slip pads can be installed on the bottom of the outrigger 12, while ensuring a reliable vertical mounting relationship between these anti-slip pads and the mainboard support frame 4. This design combines a mechanical precision adjustment structure with robust support functionality, meeting the needs of various application scenarios.

[0055] like Figure 2 As shown, in one embodiment, the motherboard support frame 4 of the computer motherboard dust removal and drying device of this application, in addition to fixing the computer motherboard and maintaining a preset distance between it and the hot air nozzle 3, also includes an electrostatic discharge module 13. This module works in conjunction with the entire device to effectively release the static electricity accumulated on the motherboard while performing dust removal and drying. The electrostatic discharge module 13 is located inside the motherboard support frame 4 or adjacent to the installation area, and can directly act on the motherboard surface. Through a reasonable spatial layout, the electrostatic discharge module 13 and the motherboard support frame 4 achieve a tight structural fit, ensuring that it completes the electrostatic treatment task without affecting the operation of other functional components.

[0056] The electrostatic elimination module 13 specifically consists of a power supply unit, a high-voltage discharge needle assembly, and a grounding circuit. It can be operated independently or in conjunction with the main power supply for integrated operation. For example, by connecting to the main power supply of the equipment and working in coordination with the main control system, the electrostatic elimination module 13 can be simultaneously activated during the drying process, using ions generated by the high-voltage discharge needles to neutralize the static charge on the motherboard surface. Specifically, the electrostatic elimination module 13 can be securely mounted on one side of the motherboard support frame 4 using clips or a fixed bracket, with its discharge end pointing near the working area of ​​the motherboard to improve electrostatic removal efficiency. This arrangement not only optimizes module integration but also ensures the effective integration of dust removal, drying, and electrostatic discharge functions.

[0057] like Figure 2As shown, in one embodiment, a temperature monitoring sensor 14 for real-time temperature monitoring is installed inside the anti-static housing 5 of the computer motherboard dust removal and drying device of this application. The temperature monitoring sensor 14 is located near the hot air outlet and can accurately collect local temperature data, transmitting it to an external control device via an electrical signal to form a feedback loop. This effectively prevents damage to sensitive components on the motherboard that may be caused by excessively high temperatures. This design ensures that the operating temperature of the entire device remains within a preset range, further improving the reliability and safety of the device operation. The temperature monitoring sensor 14 is fixedly connected to the anti-static housing 5, enabling it to adapt to the complex working environment inside the device.

[0058] For example, the temperature monitoring sensor 14 can be securely fixed to the anti-static housing 5 near the hot air outlet by an embedded installation method. Specifically, the temperature monitoring sensor 14 can consist of a temperature sensing element, a signal conditioning circuit, and a signal output terminal. Its temperature sensing element is arranged facing the direction of the hot air flow to directly sense the airflow temperature, and the signal output terminal is led out to an external control system for further processing to ensure fast and accurate temperature monitoring.

[0059] like Figure 3 As shown, in one embodiment, the hot air generator 1 and the hot air distribution plate 2 of the computer motherboard dust removal and drying device of this application achieve hot air transmission through a flexible connection. The hot air distribution plate 2 is arranged near the side of multiple hot air nozzles 3, and one end of the flexible connecting pipe 15 is installed at the air outlet of the hot air generator 1, while the other end is tightly connected to the hot air distribution plate 2. This connection allows for a certain relative displacement between the hot air generator 1 and the hot air distribution plate 2, thereby reducing the mutual influence of vibrations during equipment operation. The flexible connecting pipe 15 is wrapped with a heat insulation layer made of high-temperature resistant material, and the outer wall adopts a composite structure with elastic properties to absorb vibrations generated by the external environment and the components themselves.

[0060] Specifically, highly flexible and heat-resistant materials such as silicone rubber or polytetrafluoroethylene can be selected to make the connecting pipes, while multiple layers of heat-insulating coatings can be used to prevent hot air from being conducted to the external environment. For example, during the assembly process, buckles or sealing rings can be installed at both ends of the flexible pipes to form a stable and detachable connection with the hot air generator 1 and the hot air distribution plate 2.

[0061] like Figure 1As shown, in one embodiment, the antistatic housing 5 of a computer motherboard dust removal and drying device of this application is disposed around the hot air generator 1, the hot air distribution plate 2, the hot air nozzle 3, and the motherboard support frame 4. This antistatic housing 5 not only provides a dust-free environment to protect internal components but also ensures air pressure balance through a special structural design. Specifically, ventilation windows 16 and matching filters 17 are installed on the side walls of the antistatic housing 5. The location of the ventilation windows 16 needs careful consideration; they are typically placed in a location that does not affect the normal operation of other functional components and are tightly connected to the housing. The filters 17 are made of high-efficiency filter material and have excellent dust blocking performance to ensure that outside air does not carry particulate contaminants when it enters. This design satisfies the airflow required for heat dissipation of internal components while effectively preventing dust intrusion.

[0062] For example, the ventilation window 16 can be embedded in a pre-drilled hole on the side of the antistatic housing 5, and a filter screen 17 can be tightly installed on its outer side. The structure of the ventilation window 16 may include one or more breathable panels, combined with a high-precision sealing process, to achieve the purpose of regulating internal and external air pressure and ensuring a dust-free environment.

[0063] In actual operation, when this device is used, the computer motherboard is placed on the motherboard support frame 4 and a suitable preset distance is maintained between it and the hot air nozzle 3. Then, the hot air generator 1 is turned on to generate uniform hot air and delivers the hot air to the hot air distribution plate 2 through the pipe. After receiving the hot air, the hot air distribution plate 2 distributes it evenly using a multi-layer diversion plate and guide pattern. At the same time, the adjustable airflow distribution valve 21 optimizes the hot air flow to meet the needs of different motherboard areas and prevent sensitive components from overheating and being damaged. The distributed hot air is blown out from multiple hot air nozzles 3, covering different parts of the computer motherboard to complete the dust removal and drying process. Throughout the operation, the anti-static housing 5 can effectively isolate external dust from entering and ensure the stability of the hot air circulation system.

[0064] The above description is the preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this invention, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A computer motherboard dust removal and drying device, characterized in that, include: Hot air generator (1); A hot air distribution plate (2) is connected to the output end of the hot air generator (1). The hot air distribution plate (2) has an adjustable airflow distribution valve (21). The hot air distribution plate (2) has multiple layers of hot air diversion plates (22) inside. The surface of the hot air diversion plates (22) is provided with guide patterns (23). Multiple sets of hot air nozzles (3) are connected to the hot air distribution plate (2); Motherboard support bracket (4) is used to fix the computer motherboard; An antistatic housing (5) is located on the outside of the entire device; wherein, The multiple sets of hot air nozzles (3) include multiple sets of micro nozzles (10), each set of micro nozzles (10) can independently adjust the direction and air outlet size; The motherboard support frame (4) has multiple sets of adjustable height legs (12) for adjusting the height of the legs according to the size of the motherboard.

2. The computer motherboard dust removal and drying device according to claim 1, characterized in that: The hot air generator (1) includes an adjustable temperature heating element (6) and a fan (7), wherein the adjustable temperature heating element (6) can adjust the temperature range of the hot air.

3. The computer motherboard dust removal and drying device according to claim 1, characterized in that: The hot air distribution plate (2) also includes multiple distribution holes (8), which cooperate with the multiple layers of hot air distribution plates (22) to achieve uniform distribution of hot air.

4. The computer motherboard dust removal and drying device according to claim 1, characterized in that: The guide pattern (23) is set in a wave shape and arranged in accordance with the position of the hot air nozzle (3).

5. The computer motherboard dust removal and drying device according to claim 4, characterized in that: Each set of hot air nozzles (3) is equipped with an independent electrically controlled valve (11).

6. The computer motherboard dust removal and drying device according to claim 1, characterized in that: The motherboard support frame (4) is also equipped with an electrostatic discharge module (13) for releasing the static electricity accumulated on the motherboard.

7. The computer motherboard dust removal and drying device according to claim 1, characterized in that: A temperature monitoring sensor (14) is installed inside the antistatic housing (5) to detect the temperature at the hot air outlet.

8. The computer motherboard dust removal and drying device according to claim 1, characterized in that: The hot air distribution plate (2) is connected to the hot air generator (1) via a flexible connecting pipe (15), which is capable of heat insulation and vibration absorption.

9. A computer motherboard dust removal and drying device according to claim 1, characterized in that: The antistatic housing (5) is provided with a ventilation window (16) and a filter screen (17).

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