An aeronautical high-density package housing and heat dissipation assembly
By using a heat pipe heat conduction structure and a double-layer shell design, the problem of low thermal conductivity in traditional aluminum alloy heat dissipation structures is solved, achieving efficient heat dissipation for aerospace electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HARBIN ZHUDINGGONGDA NEW MATERIALS TECH CO LTD
- Filing Date
- 2025-06-17
- Publication Date
- 2026-06-23
Smart Images
Figure CN224401919U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging shell technology, and in particular to an aerospace high-density packaging shell and heat dissipation component. Background Technology
[0002] The descriptions in this section provide background information relating to this disclosure and do not constitute prior art.
[0003] In the aerospace field, the packaging requirements for electronic devices are more stringent than those for ordinary electronic devices. Packaged electronic devices in the aerospace field need to have a lightweight design, which leads to a dense distribution of internal components and a corresponding need for better heat dissipation performance. At the same time, the increased chip power density required in the aerospace field places higher demands on heat dissipation performance. Traditional aluminum alloy heat dissipation structures have low thermal conductivity and are difficult to meet the heat dissipation requirements of packaged electronic devices in the aerospace field. Utility Model Content
[0004] The purpose of this utility model is to provide an aerospace high-density packaging shell and heat dissipation assembly, which has the advantages of transferring heat to the heat dissipation fin assembly through the characteristics of the heat pipe itself, and dissipating heat through the heat dissipation fin assembly; at the same time, the heat-conducting outer shell and heat-conducting inner shell of the packaging shell provide auxiliary heat dissipation to form a three-dimensional heat dissipation effect, which solves the technical problem that the traditional aluminum alloy heat dissipation structure has a low thermal conductivity and cannot meet the heat dissipation requirements of packaged electronic devices in the aerospace field.
[0005] This utility model provides a heat dissipation component, including:
[0006] The housing is connected to a heat-conducting base, which is located near the heat-generating device.
[0007] The heat dissipation fins are located away from the heat-generating device.
[0008] The heat pipe heat conduction structure has its heated ends evenly distributed within the shell connecting heat conduction base;
[0009] The condensation ends of the heat pipe heat conduction structure are evenly distributed within the heat dissipation fin assembly.
[0010] As a further optimization, in order to utilize the inherent characteristics of the heat pipe to direct the heat generated by the heat-generating device to the heat dissipation fin assembly for heat dissipation, the heat pipe heat-conducting structure includes:
[0011] There are two heat pipes symmetrically distributed front and back;
[0012] The heat pipe assembly consists of multiple heat pipes distributed in parallel.
[0013] The first insertion hole, corresponding to the heat pipe, is opened on the side wall of the housing connecting the heat-conducting seat;
[0014] The second insertion hole is located on the side wall of the heat dissipation fin assembly, corresponding to the heat pipe.
[0015] The heated end of the heat pipe is inserted into the corresponding first socket;
[0016] The condenser end of the heat pipe is inserted into the corresponding second socket.
[0017] As a further optimization, to quickly absorb heat from electronic devices, heat is transferred outwards via a thermally conductive protrusion array. This array has higher thermal conductivity. The housing connection to the thermally conductive base includes:
[0018] The housing protrusion is fixedly connected to the heating element;
[0019] A graphene film is fixedly assembled on the outer wall of the housing boss away from the fixed side;
[0020] The graphene film has a uniform array of thermally conductive protrusions fixedly mounted on its outer wall away from the fixed side, and the array of thermally conductive protrusions is fixedly connected to the heating device away from the fixed side.
[0021] The first insertion hole is formed along the length direction on the side wall of the housing boss.
[0022] As a further optimization, in order to form a gradient heat conduction channel and enhance the diffusion of heat to the shell, the shell protrusion is specifically a porous metal foam with pores perpendicular to the graphene film.
[0023] As a further optimization, in order to quickly dissipate the heat transferred from the heat pipe assembly through the heat dissipation fins, the heat dissipation fin assembly includes:
[0024] Heat dissipation fins are fixedly sleeved along the length of the outer wall of the heat pipe assembly on the same side;
[0025] The heat dissipation fins are uniformly and integrally formed with a strip heat dissipation plate along the length direction at the end of the heat dissipation fins that are away from the shell and connected to the heat conduction base.
[0026] A heat dissipation gap is formed between adjacent strip heat dissipation plates.
[0027] An aerospace high-density packaging housing, employing the aforementioned heat dissipation assembly, includes:
[0028] The composite shell structure is provided, and the shell connection heat conduction base is fixed to the inner wall of the composite shell structure.
[0029] The heat dissipation fin assembly is fixed to the outer wall of the composite shell structure;
[0030] The heat pipe heat conduction structure has a reserved through hole in the middle that passes through the outer wall of the composite shell structure.
[0031] As a further optimization, in order to protect the internal components using a double-layered housing, a composite housing structure is provided, which includes:
[0032] A heat-conducting outer shell, with a heat-conducting inner shell coaxially arranged inside it;
[0033] A support assembly is fixedly connected between the heat-conducting outer shell and the heat-conducting inner shell.
[0034] As a further optimization, in order to form an air gap between the heat-conducting outer shell and the heat-conducting inner shell and enhance the electromagnetic interference resistance of the device, the support assembly is composed of support blocks evenly distributed on the upper and lower sides of the space between the heat-conducting outer shell and the heat-conducting inner shell.
[0035] A gap is left between adjacent support blocks.
[0036] As a further optimization, in order to better distribute the force, the support block is frustum-shaped, with the end furthest from the heat-conducting inner shell being the smaller end.
[0037] As a further optimization, in order to better protect the outer wall of the heat-conducting shell, the outer wall of the heat-conducting shell is provided with an electroplating layer.
[0038] This utility model provides an improved high-density aerospace packaging housing and heat dissipation assembly, which has the following improvements and advantages compared with the prior art:
[0039] The heat dissipation components used quickly direct the heat generated by the electronic devices inside the packaged housing to the heated end of the heat pipe heat conduction structure through the heat pipe's own characteristics. The heat pipe heat conduction structure transfers the heat to the heat dissipation fin assembly through the heat dissipation fin assembly. At the same time, the heat dissipation is assisted by the heat-conducting outer shell and heat-conducting inner shell of the packaged housing, achieving better heat dissipation effect and meeting the heat dissipation requirements of packaged electronic devices in the aerospace field. Attached Figure Description
[0040] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0041] Figure 1 This is a schematic diagram of the structure of this utility model;
[0042] Figure 2 This is a schematic cross-sectional view of the structure of this utility model;
[0043] Figure 3 This is a schematic diagram of the heat dissipation fin assembly structure of this utility model;
[0044] Figure 4 This is a schematic diagram of the shell connecting the heat-conducting base structure of this utility model;
[0045] Figure 5 This is a schematic cross-sectional view of the housing boss structure of this utility model.
[0046] Explanation of reference numerals in the attached figures:
[0047] 1-Composite shell structure, 11-Heat-conducting outer shell, 12-Heat-conducting inner shell, 13-Supporting component, 2-Heat dissipation fin assembly, 21-Heat dissipation fins, 22-Strip heat dissipation plate, 23-Heat dissipation gap, 3-Heat pipe heat conduction structure, 31-First insertion hole, 32-Second insertion hole, 33-Heat pipe, 4-Shell connecting heat conduction base, 41-Graphene film, 42-Heat-conducting protrusion array, 43-Shell protrusion, 5-Electroplated layer. Detailed Implementation
[0048] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0049] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0050] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0051] Please see Figure 1-5This utility model provides a technical solution: a heat dissipation component, comprising:
[0052] The housing is connected to the heat-conducting base 4, which is located near the heat-generating device;
[0053] Heat dissipation fin assembly 2 is located away from the heat-generating device;
[0054] The heat pipe heat conduction structure 3 has its heated ends evenly distributed within the shell connecting heat conduction base 4;
[0055] The condensation ends of the heat pipe heat conduction structure 3 are evenly distributed within the heat dissipation fin assembly 2.
[0056] Specifically, in this embodiment, the heat-conducting base 4 connected to the shell needs to be made of a good heat-conducting material to achieve rapid heat conduction.
[0057] The heat pipe heat conduction structure 3 utilizes the heat conduction characteristics of the heat pipe 33 itself. The heat pipe 33 consists of a shell, a liquid wick, and an end cap. After the interior is evacuated, a suitable amount of working fluid is filled in. The working fluid at the heated end absorbs heat and evaporates. The vapor flows to the condensing end through the pressure difference. The vapor releases latent heat and condenses into liquid. It flows back to the evaporation section along the liquid wick, forming a closed loop. This is a direct application of existing technology.
[0058] Furthermore, the heat-conducting base 4 connected to the housing quickly directs the heat generated by the electronic devices inside the housing to the heat-conducting structure 3 at the heat-receiving end. The heat-conducting structure 3 transfers the heat to the heat dissipation fins 2 through the characteristics of the heat pipe 33 itself, and the heat is dissipated through the heat dissipation fins 2.
[0059] Understandably, this heat dissipation component can be widely used for heat dissipation of electronic devices and electrical equipment, directing heat from the electronic devices and electrical equipment to the outside of the device for heat dissipation.
[0060] In some embodiments, the heat pipe heat conduction structure 3 includes:
[0061] There are two heat pipes symmetrically distributed front and back;
[0062] The heat pipe assembly consists of multiple heat pipes 33 arranged in parallel;
[0063] The first insertion hole 31, and its corresponding heat pipe 33 are opened on the side wall of the housing connecting heat conduction base 4;
[0064] The second socket 32, and its corresponding heat pipe 33 is opened on the side wall of the heat dissipation fin assembly 2;
[0065] The heated end of the heat pipe 33 is inserted into the corresponding first socket 31;
[0066] The condenser end of the heat pipe 33 is inserted into the corresponding second socket 32.
[0067] Specifically in this embodiment, the heat pipe group consists of fourteen heat pipes 33. The number of heat pipes 33 can be increased or decreased according to the size of the device to ensure that the existing distribution density of heat pipes 33 meets the heat dissipation requirements.
[0068] The gap between the first socket 31 and the corresponding heat pipe 33 is filled with heat-conducting paste.
[0069] The gap between the second socket 32 and the corresponding heat pipe 33 is filled with heat-conducting paste.
[0070] Furthermore, the heat pipe 33 transfers the heat absorbed by the electronic components at the heat-conducting base 4 of the shell to the heat dissipation fin assembly 2 for heat dissipation.
[0071] More specifically, the first insertion hole 31 can be configured as a curved channel in the internal channel of the heat-conducting base 4 connected to the housing to extend the heat conduction path;
[0072] It is understandable that the heat pipe groups are symmetrically distributed front and back, and each heat pipe group is equipped with parallel heat pipes 33. The evenly distributed heat pipes 33 front and back meet the requirements of efficient heat dissipation.
[0073] In some embodiments, the housing connection heat-conducting base 4 includes:
[0074] The housing protrusion 43 is fixedly connected to the heating element;
[0075] A graphene film 41 is fixedly assembled on the outer wall of the housing protrusion 43 away from the fixed side;
[0076] A thermally conductive protrusion array 42 is uniformly and fixedly mounted on the outer wall of the graphene film 41 away from the fixed side, and the thermally conductive protrusion array 42 is fixedly connected to the heating device away from the fixed side.
[0077] The first insertion hole 31 is formed along the length direction on the side wall of the housing boss 43.
[0078] Specifically, in this embodiment, the housing protrusion 43 is made of a thermally conductive material; the graphene film 41 is a thin film made of graphene material; the thermally conductive protrusion array 42 is a rectangular array of protrusions, made of a high thermal conductivity metal, which in this embodiment is copper-plated nickel, and is set on the outer wall of the graphene film 41 by micro-stamping technology.
[0079] Furthermore, when objects are in planar contact, surface roughness causes the actual contact area to be much smaller than the apparent area. The micro-bump array, through the regular distribution of bumps, allows more bumps to undergo elastic or plastic deformation under pressure, increasing the number of effective contact points. Under the same load, dense micro-bumps can reduce the pressure at a single contact point, lower the material yield probability, and keep more bumps in contact, significantly increasing the actual contact area and the effective heat conduction area. Therefore, the rectangular array of heat-conducting bumps 42 can better transfer the heat of electronic devices to the graphene film 41. The graphene film 41 has good thermal conductivity, quickly transferring heat to the housing bump 43, and finally transferring it to the heat dissipation fin assembly 2 through the heat pipe heat conduction structure 3 inside the housing bump 43 for heat dissipation.
[0080] In some embodiments, the housing protrusion 43 is specifically a porous metal foam with pores perpendicular to the graphene film 41.
[0081] In this specific embodiment, the porous metal foam is specifically a porous copper foam, which is a direct application of existing technology;
[0082] Furthermore, the porous metal foam has good thermal conductivity. Its porous structure reduces thermal conductivity compared to the solid structure. Its pores are perpendicular to the graphene film 41, forming a gradient thermal conduction channel with the graphene film 41, which enhances the diffusion of heat to the shell. The porous metal foam has a pore diameter of 0.5 to 3 mm, combined with a high porosity design of >90%.
[0083] In some embodiments, the heat sink fin assembly 2 includes:
[0084] Heat dissipation fins 21 are fixedly sleeved on the outer wall of the heat pipe assembly on the same side along the length direction;
[0085] The heat dissipation fins 21 are located away from the shell and connected to the heat conduction base 4. A strip heat dissipation plate 22 is uniformly and integrally formed along the length direction of the end of the heat dissipation fins 21.
[0086] A heat dissipation gap 23 is formed between adjacent strip heat dissipation plates 22; the heat transferred from the heat pipe assembly is quickly dissipated through the heat dissipation fins 21. The strip heat dissipation plates 22 and the heat dissipation gap 23 set on the heat dissipation fins 21 are used to increase the heat dissipation area. The strip heat dissipation plates 22 and the heat dissipation gap 23 have the same width.
[0087] An aerospace high-density packaging housing, employing the aforementioned heat dissipation assembly, includes:
[0088] The composite shell structure 1 is provided, and the shell connecting heat-conducting base 4 is fixed to the inner wall of the composite shell structure 1.
[0089] The heat dissipation fin assembly 2 is fixed to the outer wall of the composite shell structure 1;
[0090] The heat pipe heat conduction structure 3 has a reserved through hole in the middle that passes through the outer wall of the composite shell structure 1.
[0091] Specifically, in this embodiment, a split-type encapsulation shell is adopted, including a heat-conducting inner shell 12 as the main shell and a heat-conducting outer shell 11 as an auxiliary heat dissipation shell. The two are thermally connected by a heat pipe heat-conducting structure 3. The heat-conducting outer shell 11 and the heat-conducting inner shell 12 cooperate to perform auxiliary heat dissipation, while the heat pipe heat-conducting structure 3 performs the main heat dissipation, forming a three-dimensional heat dissipation network to improve heat dissipation efficiency.
[0092] In some embodiments, the composite shell structure 1 includes:
[0093] A heat-conducting outer shell 11, with a heat-conducting inner shell 12 coaxially disposed inside it;
[0094] A support assembly 13 is fixedly connected between the heat-conducting outer shell 11 and the heat-conducting inner shell 12.
[0095] Specifically, in this embodiment, both the heat-conducting outer shell 11 and the heat-conducting inner shell 12 are made of heat-conducting materials. In this embodiment, they are silicon carbide ceramic or boron nitride ceramic, which have good thermal conductivity and low thermal resistance.
[0096] Furthermore, the internal electronic components are better protected by the double-layer shell of thermally conductive outer shell 11 and thermally conductive inner shell 12, while the inner cavity of thermally conductive outer shell 11 serves as an encapsulation chamber for the electronic components.
[0097] The support assembly 13 is used to connect the thermally conductive outer shell 11 and the thermally conductive inner shell 12.
[0098] In some embodiments, the support assembly 13 consists of support blocks evenly distributed on the upper and lower sides between the heat-conducting outer shell 11 and the heat-conducting inner shell 12;
[0099] A gap is left between adjacent support blocks.
[0100] Specifically, in this embodiment, the support block is made of a material with good thermal conductivity, high mechanical strength, and high temperature resistance; in this embodiment, tungsten copper alloy is used.
[0101] Furthermore, gaps are left between adjacent support blocks to form an air interlayer. As a low-conductivity medium, the air interlayer creates an impedance difference with the outer shell, which can enhance the reflection loss of electromagnetic waves. According to the electromagnetic shielding principle, when electromagnetic waves enter the low-impedance medium air interlayer from the outer shell, the reflectivity is significantly improved, which is an application of existing technology.
[0102] The spaced support blocks can change the propagation path of electromagnetic waves in the air gap, forcing the electromagnetic waves to undergo multiple reflections and refractions, increasing energy dissipation. The density and spacing of the support blocks need to be optimized through simulation to avoid the formation of electromagnetic leakage channels.
[0103] More specifically, the evenly distributed support blocks uniformly disperse the pressure, ensuring the device's resistance to deformation under high-pressure conditions.
[0104] In some embodiments, the support block is frustum-shaped, with the smaller end being the end furthest from the heat-conducting inner shell 12.
[0105] More specifically, the evenly distributed support blocks uniformly disperse the pressure, ensuring the device's resistance to deformation under high-pressure conditions.
[0106] In some embodiments, the support block is specifically frustum-shaped, with the outer end of the frustum being the smaller end. The shape of the frustum allows the pressure applied to its surface to be distributed more evenly. This uniform pressure distribution helps to reduce local stress concentration, thereby improving the overall stability and durability of the structure. The upper and lower base radii of the frustum are different. This design allows the pressure to change gradually during transmission, rather than changing abruptly. This gradual design helps to smooth the pressure transition, further reducing stress concentration, better dispersing pressure, and improving the device's pressure resistance.
[0107] In some embodiments, the outer wall of the heat-conducting housing 11 is provided with an electroplating layer 5. The electroplating layer is provided on the outer wall of the heat-conducting housing 11. The housing is protected by a process of nickel plating followed by gold plating. A vacuum heat treatment hydrogen removal process is used to remove hydrogen ions attached to the plating layer, so as to avoid hydrogen ions penetrating into the interior of the plating layer, which would greatly reduce the toughness of the material and make it brittle. The above electroplating process is a direct application of the prior art.
[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A heat dissipation component, characterized in that, include: The housing is connected to a heat-conducting base (4), which is located near the heat-generating device; Heat dissipation fin assembly (2), which is located away from the heat-generating device; The heat pipe heat conduction structure (3) has its heated ends evenly distributed within the shell connecting heat conduction base (4); The condensation end of the heat pipe heat conduction structure (3) is evenly distributed within the heat dissipation fin assembly (2).
2. A heat dissipation component according to claim 1, characterized in that, The heat pipe heat conduction structure (3) includes: There are two heat pipes symmetrically distributed front and back; The heat pipe assembly consists of multiple heat pipes (33) arranged in parallel; The first insertion hole (31) is opened on the side wall of the housing connecting heat conduction seat (4) corresponding to the heat pipe (33); The second insertion hole (32) is opened on the side wall of the heat dissipation fin assembly (2) corresponding to the heat pipe (33); The heated end of the heat pipe (33) is inserted into the corresponding first socket (31); The condenser end of the heat pipe (33) is inserted into the corresponding second socket (32).
3. A heat dissipation component according to claim 1, characterized in that, The housing connection heat-conducting base (4) includes: The housing protrusion (43) is fixedly connected to the heating element; A graphene film (41) is fixedly assembled on the outer wall of the housing protrusion (43) away from the fixed side; The graphene film (41) has a uniformly fixed array of thermally conductive protrusions (42) on its outer wall away from the fixed side, and the thermally conductive protrusion array (42) is fixedly connected to the heating device away from the fixed side. The first insertion hole (31) is formed along the length direction on the side wall of the housing boss (43).
4. A heat dissipation component according to claim 3, characterized in that, The shell protrusion (43) is specifically a porous metal foam with pores perpendicular to the graphene film (41).
5. A heat dissipation assembly according to claim 2, characterized in that, The heat dissipation fin assembly (2) includes: Heat dissipation fins (21) are fixedly sleeved on the outer wall of the heat pipe assembly on the same side along the length direction; The heat dissipation fins (21) are connected to the heat conduction base (4) away from the shell and are uniformly integrally formed with a strip heat dissipation plate (22) along the length direction; A heat dissipation gap (23) is formed between adjacent strip heat dissipation plates (22).
6. An aerospace high-density encapsulation housing, employing the heat dissipation component according to any one of claims 1-5, characterized in that, include: A composite shell structure (1) is provided, and the shell connecting heat-conducting base (4) is fixed to the inner wall of the composite shell structure (1); The heat dissipation fin assembly (2) is fixed to the outer wall of the composite shell structure (1); The heat pipe heat conduction structure (3) passes through a reserved through hole in the outer wall of the composite shell structure (1) in the middle.
7. The aerospace high-density packaging housing according to claim 6, characterized in that, Composite shell structure (1), comprising: A heat-conducting outer shell (11) is provided with a heat-conducting inner shell (12) coaxially inside it; A support assembly (13) is fixedly connected between the heat-conducting outer shell (11) and the heat-conducting inner shell (12).
8. The aerospace high-density packaging housing according to claim 7, characterized in that, The support assembly (13) consists of support blocks evenly distributed on the upper and lower sides between the heat-conducting outer shell (11) and the heat-conducting inner shell (12); A gap is left between adjacent support blocks.
9. The aerospace high-density packaging housing according to claim 8, characterized in that, The support block is frustum-shaped, with the smaller end being the end furthest from the heat-conducting inner shell (12).
10. The aerospace high-density packaging housing according to claim 7, characterized in that, The outer wall of the heat-conducting outer shell (11) is provided with an electroplated layer (5).