Wafer coating arm processing mechanism and wafer processing apparatus

By designing a multi-cavity structure and a jet cleaning and drying system, the problems of cleaning and drying the coating arm were solved, improving the coating quality and the reliability of semiconductor devices.

CN224405561UActive Publication Date: 2026-06-26WUSHI MICROELECTRONICS (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUSHI MICROELECTRONICS (SUZHOU) CO LTD
Filing Date
2025-04-29
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing adhesive coating arms are prone to uneven coating after the coating process due to adhesive buildup, residue, and improper drying methods, which affects the performance and reliability of semiconductor devices.

Method used

A wafer coating arm processing mechanism was designed, comprising a first chamber, a second chamber, and a third chamber arranged sequentially. The first chamber stores a volatile processing liquid, the second chamber contains a nozzle for spraying the processing liquid, and the third chamber contains a nozzle for spraying nitrogen gas. This mechanism is used to clean and dry the coating arm, and combined with an exhaust mechanism, it achieves comprehensive cleaning and drying.

Benefits of technology

It effectively removes impurities and residues from the surface of the coating arm, improving cleanliness and dryness, enhancing coating quality and precision, and reducing defects in semiconductor devices.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224405561U_ABST
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Abstract

The utility model relates to a kind of wafer gluing arm processing mechanism and wafer processing equipment, and gluing arm processing mechanism includes: tank, at least including first cavity, second cavity and third cavity sequentially arranged along first direction, first cavity is configured as, for storing processing liquid, processing liquid generates volatile gas, gluing arm can be in volatile gas, and then gluing arm is always in wet state, prevent glue solidification accumulation;First nozzle is arranged in second cavity, for spraying processing liquid towards gluing arm;Second nozzle is arranged in third cavity, for spraying nitrogen towards gluing arm, so that gluing arm can be moved from first cavity to second cavity before preparing to carry out next gluing, first nozzle sprays processing liquid and washes it, and after washing, gluing arm is finally entered third cavity and is completed drying by nitrogen that second nozzle sprays, to realize more comprehensive, effectively remove the impurity, residue on the surface of gluing arm.
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