A chassis heat dissipation structure
By combining embedded and enhanced heat dissipation devices, multi-directional heat dissipation channels are achieved, solving the problem of insufficient number of fans in the chassis and improving heat dissipation effect and service life.
CN224417257UActive Publication Date: 2026-06-26程烨
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 程烨
- Filing Date
- 2025-06-14
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
In existing chassis designs, the number of fans is insufficient, leading to heat accumulation and affecting the chassis's heat dissipation performance and lifespan.
Method used
It adopts an embedded and enhanced heat dissipation device, combined with multiple heat dissipation channels, including an embedded cooling fan and a coolant storage structure for the graphics card. It utilizes coolant circulation and multi-directional heat dissipation, and is equipped with copper wires to enhance heat dissipation efficiency.
Benefits of technology
It improves the heat dissipation of the chassis, ensures independent heat dissipation for heat-generating components, and extends the service life and stability of the chassis.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224417257U_ABST
Abstract
This utility model belongs to the field of chassis technology, and in particular to a chassis heat dissipation structure. It includes a chassis body, which includes a base. A chassis frame is fixed to the top of the base, and a mounting plate is fixedly installed on the inner side of the chassis frame. The motherboard and graphics card are movably connected to the side of the mounting plate, and a power supply is movably connected to the top of the base. By utilizing three sets of embedded heat dissipation devices mounted inside the chassis body, multiple heat dissipation channels in different directions are formed inside the chassis, enabling multi-directional heat dissipation during chassis operation. Combined with an enhanced heat dissipation device for independent cooling of the graphics card, the components with the highest heat generation inside the chassis receive individual cooling, further improving the chassis's heat dissipation effect. This solves the problem that chassis design often results in a small number of fans, leading to the accumulation of heat-generating components, which is detrimental to heat dissipation, affects chassis performance, and shortens chassis lifespan.
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