A press device for improving the lap joint of nanosilver wire
By integrating a composite cleaning module of scraper and cleaning roller and a hydraulic adjustment structure into the pressing device, the problem of insufficient surface cleaning of conductive film materials is solved, achieving efficient pressing of nano-silver wire conductive films and flexible adjustment of the equipment, improving conductivity and production efficiency, and adapting to different material specifications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI YINZHIDAO NANOTECHNOLOGY CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-06-26
AI Technical Summary
Existing lamination equipment lacks an effective surface cleaning mechanism when processing conductive film materials of different thicknesses and materials, resulting in decreased conductivity. Furthermore, the fixed structure makes it difficult to adjust, and the equipment has poor versatility, increasing the workload of replacing equipment and adjusting parameters, and reducing production efficiency.
The pressing device integrates a composite cleaning module consisting of a scraper and a cleaning roller. The bearing frame is driven to move up and down by a hydraulic cylinder. Combined with the rotating rod and pressing sleeve structure, it realizes automatic surface cleaning of the nano-silver wire conductive film material. The continuous cleaning action is ensured by belt linkage transmission. At the same time, the pressing gap can be adjusted according to the material type and thickness.
It significantly improves the consistency and stability of conductivity, reduces local resistance, enhances adhesion, and improves the versatility and production efficiency of equipment. It overcomes the problems of insufficient cleaning ability and inconvenient adjustment, and meets the needs of high-end electronic product manufacturing.
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Figure CN224418184U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silver nanowire technology, and in particular to a pressing device for improving the overlap of silver nanowires. Background Technology
[0002] Improving the bonding of silver nanowires through lamination equipment plays a crucial role in the nanomaterials processing and flexible electronic device manufacturing industries. As a key piece of equipment for the post-processing of conductive films made from silver nanowires, its lamination precision and control capabilities have a decisive impact on the overall conductivity, surface uniformity, and reliability of subsequent applications of the film. Especially in the core aspects of the lamination process—the pressure, speed, and contact surface condition applied to the material—existing lamination equipment has gradually revealed a series of significant limitations and technical problems when processing conductive film materials of different thicknesses, materials, and surface properties.
[0003] Specifically, existing technologies, such as utility model patent CN213483476U, disclose a pressing device for improving the overlap of silver nanowires. The device includes a pressing back roller, a PU rubber roller, and a support roller arranged sequentially from top to bottom, and is equipped with a pressing control system for adjusting the position and speed of each roller. By adjusting the pressing gap and pressing speed, the conductive film material is effectively pressed, so that the silver nanowires are fully overlapped, thereby reducing sheet resistance and enhancing adhesion.
[0004] However, in practical applications, this type of lamination device still has significant technical shortcomings, especially the lack of an effective surface cleaning mechanism before laminating the conductive film. Because the conductive film of silver nanowires easily adsorbs dust, particles, or other impurities during production, transportation, or storage, if these contaminants are not removed in time, they will affect the effective contact between the silver nanowires during lamination, and may even cause problems such as increased local resistance and decreased conductivity. Furthermore, the existing lamination device has a relatively fixed structural design, making it difficult to flexibly adjust to different types or thicknesses of conductive film materials. This results in poor equipment versatility, limited adaptability, increased workload for equipment replacement or parameter adjustment, and reduced production efficiency. Therefore, to address the many shortcomings of the existing technology, we urgently need an innovative lamination device that improves the bonding of silver nanowires to solve these problems. Utility Model Content
[0005] The purpose of this invention is to provide a pressing device for improving the bonding of silver nanowires, which solves the problem that the existing technology is difficult to flexibly adjust according to different types or thicknesses of conductive film materials, resulting in poor equipment versatility, limited adaptability, increased workload for changing equipment or adjusting parameters, and reduced production efficiency.
[0006] To achieve the above objectives, this utility model provides a pressing device for improving the overlap of silver nanowires, including a frame, a support frame slidably connected to the inner side of the frame, and a base plate fixedly connected to one side of the lower inner side of the frame.
[0007] Several rotating rods are rotatably connected to one side of the inner side of the load-bearing frame and one side of the bottom plate. All rotating rods are fitted with pressing sleeves. The rotating rods on the inner side of the load-bearing frame and the rotating rods on the bottom plate are distributed in a one-to-one correspondence. A top plate is fixedly connected to the top of the frame. A hydraulic cylinder is fixedly connected to one side of the top of the top plate by bolts. The output shaft of the hydraulic cylinder passes through the top plate and is fixedly connected to the top of the load-bearing frame. Side frames are connected to both sides of the frame. Load-bearing rods are rotatably connected to the inner side of both side frames. One end of the two load-bearing rods is connected by a belt. Several scrapers are fixedly connected to one of the two load-bearing rods, and a cleaning roller is fitted onto the other load-bearing rod.
[0008] One of the two side frames is fixedly connected to a drive motor by bolts on one side, and one end of one of the two support rods passes through the side wall of the side frame and is connected to the output shaft of the drive motor. One end of each support rod is rotatably connected to the inner wall of the two side frames by a rotating shaft, and the other end of each support rod passes through the side wall of the two side frames by a bearing sleeve.
[0009] Each of the two support rods has a pulley fitted onto one end, and the two pulleys are connected by a belt winding around each other.
[0010] Both side frames have soft pads fixedly connected to their inner bottom sides, and the soft pads are located at the bottom of the support rod.
[0011] One side of the support frame is fixedly connected to a slider, and the slider is slidably connected to the side wall of the frame through a groove.
[0012] One side of each of the two side frames is connected to the inner side of the frame through a side groove, and one end of each of the rotating rods is rotatably connected to the inner wall of the load-bearing frame and one side of the bottom plate through a rotating shaft.
[0013] This invention discloses a pressing device for improving the overlap of silver nanowires. By integrating a composite cleaning module consisting of a scraper and a cleaning roller before and after the pressing structure, it achieves automatic surface cleaning of the conductive film material of the silver nanowires before pressing. This avoids the impact of impurities adsorbed on the material surface on the effective overlap between the silver nanowires, significantly improving the consistency and stability of conductivity, reducing sheet resistance, and enhancing adhesion. It solves the problems of decreased conductivity and unstable product quality caused by the lack of a cleaning mechanism in existing technologies. Simultaneously, by driving the support frame up and down with a hydraulic cylinder, and combining the paired rotating rods and pressing sleeve structure on the support frame and the base plate, the pressing gap can be flexibly adjusted according to different types, thicknesses, and widths of conductive film materials. This greatly improves the versatility and applicability of the equipment, overcomes the limitations of traditional pressing devices with fixed structures and inconvenient adjustments, reduces the workload of changing equipment or frequently adjusting parameters, and improves production efficiency and process adaptability. Furthermore, the support rod is driven by a belt to ensure synchronous operation of the scraper and cleaning roller, guaranteeing the continuity and consistency of the cleaning action. The connecting structure of the side frame provides a good guiding channel for material entry and exit, improving the smoothness of overall operation and ease of use. The entire device has a compact structure and high functional integration, making it easy to interface with existing flexible electronics manufacturing production lines and meeting the demands of modern high-end electronic product manufacturing for efficient, high-precision, and intelligent processing equipment. By introducing a material surface cleaning function, a hydraulic adjustment mechanism for the pressing gap, and a multi-specification material adaptability structure, the device successfully overcomes the shortcomings of existing pressing equipment in terms of insufficient cleaning capacity and poor adjustment flexibility, significantly improving the pressing quality and product consistency of the nano-silver wire conductive film. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.
[0015] Figure 1 This is a schematic diagram of the overall main view structure of an embodiment of this utility model.
[0016] Figure 2 This is a schematic diagram of the inner structure of the frame in an embodiment of this utility model.
[0017] Figure 3 This is a rear view structural schematic diagram of an embodiment of the present utility model.
[0018] Figure 4 This is a top view of an embodiment of the present invention.
[0019] Figure 5 This is a schematic diagram of the side frame and its structure according to an embodiment of the present utility model.
[0020] 1. Frame; 2. Bearing frame; 3. Top plate; 4. Hydraulic cylinder; 5. Rotating rod; 6. Pressing sleeve; 7. Bottom plate; 8. Side frame; 9. Bearing rod; 10. Scraper; 11. Soft pad; 12. Side groove; 13. Slider; 14. Slide groove; 15. Pulley; 16. Belt; 17. Drive motor; 18. Cleaning roller. Detailed Implementation
[0021] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.
[0022] Please see Figure 1-5 .
[0023] A pressing device for improving the overlap of silver nanowires includes a frame 1, and a support frame 2 is slidably connected to the inner side of the frame 1, and a base plate 7 is fixedly connected to the lower inner side of the frame 1.
[0024] Several rotating rods 5 are rotatably connected to one side of the inner side of the bearing frame 2 and one side of the bottom plate 7. All rotating rods 5 are fitted with pressing sleeves 6. The rotating rods 5 on the inner side of the bearing frame 2 and the rotating rods 5 on the side of the bottom plate 7 are distributed in a one-to-one correspondence. The top of the frame 1 is fixedly connected to the top plate 3. A hydraulic cylinder 4 is fixedly connected to one side of the top of the top plate 3 by bolts. The output shaft of the hydraulic cylinder 4 passes through the top plate 3 and is fixedly connected to the top of the bearing frame 2. Both sides of the frame 1 are connected to side frames 8. The inner sides of the two side frames 8 are rotatably connected to bearing rods 9. One end of the two bearing rods 9 is connected by a belt 16. Several scrapers 10 are fixedly connected to one of the two bearing rods 9. A cleaning roller 18 is fitted onto the other bearing rod 9.
[0025] First, the nano-silver wire conductive film material to be pressed is fed in from one side frame 8, passes through the area between the pressing sleeve 6 on the inner side of the bearing frame 2 and the pressing sleeve 6 on the base plate 7, and finally is sent out from the other side frame 8. During this process, the material can be moved continuously by manual means or by the winding and unwinding equipment in the prior art to achieve stable feeding and discharging. Before the material enters the pressing area, the hydraulic cylinder 4 fixed to the top of the top plate 3 is activated. Its output shaft passes through the top plate 3 and is fixedly connected to the top of the support frame 2, driving the support frame 2 to slide up and down along the inner wall of the frame 1. This adjusts the distance between the rotating rod 5 inside the support frame 2 and the rotating rod 5 on the bottom plate 7, so that the gap between the pressing sleeves 6 can be adaptively adjusted according to the conductive film material of different thicknesses, ensuring that the pressing pressure is evenly distributed and controllable. At the same time, the side frames 8 set on both sides of the frame 1 are equipped with a support rod 9 structure. The two support rods 9 are connected by a belt 16 and driven to rotate by a drive motor 17. Several scrapers 10 are fixedly connected to one support rod 9, and a cleaning roller 18 is sleeved on the other support rod 9. During the rotation of the support rod 9, the scrapers 10 initially scrape off dust, particles and other impurities on the surface of the conductive film. Then the cleaning roller 18 further cleans the material surface, ensuring that the nano-silver wires are in a clean state before pressing, thus improving the pressing effect.
[0026] Furthermore, one side of one of the two side frames 8 is fixedly connected to a drive motor 17 by bolts, and one end of one of the two support rods 9 passes through the side wall of the side frame 8 and is connected to the output shaft of the drive motor 17 for transmission. One end of each of the two support rods 9 is rotatably connected to the inner wall of the two side frames 8 through a rotating shaft, and the other end of each of the two support rods 9 passes through the side wall of the two side frames 8 through a bearing sleeve. During the operation of the pressing device, after the drive motor 17 starts, it drives one of the support rods 9 to rotate, and then drives the other support rod 9 to rotate synchronously through the belt 16, thereby realizing the linkage work of the scraper 10 and the cleaning roller 18, achieving the effect of improving the consistency of cleaning action, enhancing the automation level of the equipment and the transmission stability.
[0027] Furthermore, each of the two support rods 9 is fitted with a pulley 15 at one end, and the two pulleys 15 are connected by a belt 16. When the drive motor 17 drives one of the support rods 9 to rotate, the other support rod 9 is driven to rotate synchronously through the transmission action between the belt 16 and the pulley 15. This ensures that the scraper 10 and the cleaning roller 18 work together to complete the surface cleaning operation before the material enters the pressing area, thereby improving cleaning efficiency, ensuring the synchronization of cleaning actions and the compactness of the structure.
[0028] Furthermore, soft pads 11 are fixedly connected to the bottom inner sides of both side frames 8, and the soft pads 11 are located at the bottom of the bearing rod 9. When the conductive film material passes through the inside of the side frame 8, the soft pads 11 play a buffering and supporting role for the material, preventing scratches or surface damage caused by the bearing rod 9 contacting the material too tightly or unevenly. At the same time, they can also absorb some vibration, thus achieving the effects of protecting the integrity of the material, improving processing quality and extending the service life of the equipment.
[0029] Furthermore, a slider 13 is fixedly connected to one side of the support frame 2, and the slider 13 is slidably connected to the side wall of the frame 1 through the slide groove 14. During the process of the hydraulic cylinder 4 driving the support frame 2 to move up and down to adjust the pressing gap, the slider 13 slides along the slide groove 14 to provide good guiding support for the support frame 2, preventing it from deviating or getting stuck during the lifting process, thus achieving the effects of improving the pressing adjustment accuracy, enhancing the structural operation stability, and ensuring the uniform distribution of pressing pressure.
[0030] Furthermore, one side of each of the two side frames 8 is connected to the inner side of the frame 1 through the side groove 12, and one end of each of the rotating rods 5 is rotatably connected to the inner wall of the bearing frame 2 and one side of the bottom plate 7 through the rotating shaft, so that the side frame 8 and the frame 1 form a complete material conveying channel, which facilitates the smooth entry and exit of the conductive film material into and out of the pressing area; at the same time, the rotating rod 5 realizes the flexible rotation of the pressing sleeve 6 through the rotating shaft, which improves the material adaptability and pressing contact stability during the pressing process, and achieves the effect of enhancing the overall structural continuity, improving pressing consistency and operation convenience.
[0031] In summary:
[0032] First, the nano-silver wire conductive film material to be pressed is fed into the frame 8 from one side and enters the frame 1 through the side groove 12. It then passes through the area between the pressing sleeve 6 on the inner side of the bearing frame 2 and the pressing sleeve 6 on the bottom plate 7, and finally exits from the other side frame 8. During this process, the material can be moved continuously by manual means or by the winding and unwinding equipment in the prior art to achieve stable feeding and discharging. Before the material enters the pressing area, the hydraulic cylinder 4 fixed to the top of the top plate 3 is activated. Its output shaft passes through the top plate 3 and is fixedly connected to the top of the support frame 2, driving the support frame 2 to slide up and down along the inner wall of the frame 1. During this process, a slider 13 is fixedly connected to one side of the support frame 2. The slider 13 is slidably connected to the side wall of the frame 1 through the slide groove 14, providing good guiding support for the support frame 2 and preventing it from deviating or jamming during the lifting process. This ensures that the distance between the rotating rod 5 inside the support frame 2 and the rotating rod 5 on the bottom plate 7 can be adaptively adjusted according to the conductive film material of different thicknesses, so that the gap between the pressing sleeves 6 is uniform and controllable, ensuring reasonable pressing pressure distribution and improving pressing consistency. Meanwhile, a support rod 9 structure is provided inside the side frames 8 on both sides of the frame 1. One side of one of the two side frames 8 is fixedly connected to a drive motor 17 by bolts. One end of one of the two support rods 9 passes through the side wall of the side frame 8 and is connected to the output shaft of the drive motor 17. One end of each of the two support rods 9 is rotatably connected to the inner wall of the two side frames 8 by a rotating shaft, and the other end of each of the two support rods 9 passes through the side wall of the two side frames 8 by a bearing sleeve. In addition, a pulley 15 is sleeved on one end of each of the two support rods 9, and the two pulleys 15 are connected by a belt 16. When the drive motor 17 starts and drives one of the support rods 9 to rotate, the other support rod 9 is driven to rotate synchronously through the transmission action between the belt 16 and the pulley 15, thereby realizing the linkage operation of the scraper 10 and the cleaning roller 18. Several scrapers 10 are fixedly connected to one of the support rods 9, and a cleaning roller 18 is sleeved on the other support rod 9. During the rotation of the support rod 9, the scrapers 10 initially scrape off dust, particles and other impurities on the surface of the conductive film. Then the cleaning roller 18 further cleans the material surface to ensure that the nano-silver wires are in a clean state before pressing, thereby improving the pressing effect. At the same time, soft pads 11 are fixedly connected to the bottom of the inner side of both side frames 8, located at the bottom of the support rod 9. When the conductive film material passes through the inside of the side frame 8, the soft pads 11 provide buffer support for the material, preventing scratches or surface damage caused by the support rod 9 contacting the material too tightly or unevenly. They can also absorb some vibration, extend the service life of the material and improve the processing quality.By integrating a composite cleaning module consisting of a scraper 10 and a cleaning roller 18 before and after the pressing structure, combined with a drive motor 17, belt 16, pulley 15, support rod 9, and soft pad 11, an automatic surface cleaning function for the conductive film material of silver nanowires before pressing is achieved. This avoids the effective overlap between silver nanowires due to impurities adsorbed on the material surface, significantly improving the consistency and stability of conductivity, reducing sheet resistance, and enhancing adhesion. This solves the problems of decreased conductivity and unstable product quality caused by the lack of a cleaning mechanism in existing technologies. Simultaneously, the hydraulic cylinder 4 drives the support frame 2 to move up and down, and combined with the guiding structure of the slider 13 and the groove 14, as well as the paired rotating rods 5 and pressing sleeve 6 on the support frame 2 and the base plate 7, the pressing gap can be flexibly adjusted according to different types, thicknesses, and widths of conductive film materials. This greatly improves the versatility and applicability of the equipment, overcomes the limitations of traditional pressing devices with fixed structures and inconvenient adjustments, reduces the workload of changing equipment or frequently adjusting parameters, and improves production efficiency and process adaptability. Furthermore, one side of each side frame 8 is connected to the inner side of the frame 1 via a side groove 12. One end of each rotating rod 5 is rotatably connected to the inner wall of the bearing frame 2 and one side of the base plate 7 via a rotating shaft, forming a complete material conveying channel between the side frame 8 and the frame 1. This facilitates the smooth entry and exit of the conductive film material into and out of the pressing area, improving the overall smoothness and ease of operation. Simultaneously, the rotating rod 5 enables the flexible rotation of the pressing sleeve 6 via the rotating shaft, improving material adaptability and pressing contact stability during the pressing process, and ensuring the uniformity and consistency of the pressing action. By introducing a material surface cleaning function, a hydraulic adjustment mechanism for the pressing gap, and a multi-specification material adaptability structure, the shortcomings of existing pressing equipment in terms of insufficient cleaning ability and poor adjustment flexibility have been successfully overcome. This not only significantly improves the pressing quality and product consistency of the nano-silver wire conductive film but also enhances the automation level and applicability of the equipment, demonstrating good engineering application prospects and promotional value.
[0033] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.
Claims
1. A pressing device for improving the overlap of silver nanowires, comprising a frame, characterized in that, It also includes a load-bearing frame that slides inside the frame, and a base plate that is fixedly connected to one side of the lower inner side of the frame; The inner side of the support frame and the bottom plate are rotatably connected to several rotating rods, and each rotating rod is fitted with a pressing sleeve. The rotating rods on the inner side of the support frame and the rotating rods on the bottom plate are distributed in a one-to-one correspondence. The top of the frame is fixedly connected to a top plate, and a hydraulic cylinder is fixedly connected to the top of the top plate by bolts. The output shaft of the hydraulic cylinder passes through the top plate and is fixedly connected to the top of the support frame. Both sides of the frame are connected to side frames, and the inner sides of the two side frames are rotatably connected to support rods. One end of the two support rods is connected by a belt. Several scrapers are fixedly connected to one of the two support rods, and a cleaning roller is fitted onto the other support rod.
2. The pressing device for improving the overlap of silver nanowires as described in claim 1, characterized in that, One side of one of the two side frames is fixedly connected to a drive motor by bolts, and one end of one of the two support rods passes through the side wall of the side frame and is connected to the output shaft of the drive motor. One end of each of the two support rods is rotatably connected to the inner wall of the two side frames by a rotating shaft, and the other end of each support rod passes through the side wall of the two side frames by a bearing sleeve.
3. The pressing device for improving the overlap of silver nanowires as described in claim 1, characterized in that, Each of the two bearing rods has a pulley fitted onto one end, and the two pulleys are connected by a belt winding around each other.
4. The pressing device for improving the overlap of silver nanowires as described in claim 1, characterized in that, Both of the inner bottom of the two side frames are fixedly connected with soft pads, and the soft pads are located at the bottom of the support rod.
5. The pressing device for improving the overlap of silver nanowires as described in claim 1, characterized in that, A slider is fixedly connected to one side of the support frame, and the slider is slidably connected to the side wall of the frame through a groove.
6. The pressing device for improving the overlap of silver nanowires as described in claim 1, characterized in that, One side of each of the two side frames is connected to the inner side of the frame body through a side groove, and one end of each of the rotating rods is rotatably connected to the inner wall of the supporting frame and one side of the bottom plate through a rotating shaft.