A BMS topology device

Abstract

The utility model relates to energy storage battery technology field provides a kind of BMS topological device, the device includes multi-channel AI analog input unit, multi-channel DI digital input unit, main control MCU chip, DO digital output unit and RTC real-time clock submodule, wherein: the multi-channel AI analog input unit, multi-channel DI digital input unit and RTC real-time clock submodule are connected with main control MCU chip, and the main control MCU chip is connected with DO digital output unit. The utility model is highly integrated and optimized connection by multi-channel AI analog input unit, multi-channel DI digital input unit, main control MCU chip, DO digital output unit and RTC real-time clock submodule, realizes the integrated processing of battery management system key function, simplifies the redundant problem of the quantity of controller in traditional three-level architecture BMS system, reduces the complexity of hardware configuration and communication network, effectively reduces system total cost and fault point quantity.

Description

Technical Field

[0001] This utility model relates to the field of energy storage battery technology, and in particular to a BMS topology device. Background Technology

[0002] The Battery Management System (BMS) is the core control component of an energy storage system, ensuring its safe and efficient operation by monitoring and managing battery status in real time. Current high-voltage energy storage primarily uses a three-tier BMS topology. In mainstream 5Wh energy storage containers, the BMS consists of: a central controller, several master controllers, and multiple slave controllers. The container contains multiple clusters, each consisting of a high-voltage box and multiple series-connected battery packs. Each high-voltage box contains a master BMS controller responsible for collecting information such as individual cell voltage and stability within the battery pack, calculating SOX-related parameters for each cluster, controlling the high-voltage power-on and power-off processes for each cluster, and uploading individual cell information and fault information to the central controller. Slave controllers mainly collect individual cell voltage and battery pack temperature information within the board and upload this data. Based on the master controller's requirements, they achieve cell balancing, reducing voltage differences between cells and improving cell consistency.

[0003] Chinese patent CN220934165U discloses a high-voltage BMS system employing a BMU combined with a split-type slave control technology structure. This system monitors and manages the battery system by incorporating components such as a main controller, a BMU measurement unit, and acquisition modules. However, this BMS system still uses a traditional multi-level control architecture. While it optimizes the system structure to some extent, it still suffers from significant drawbacks such as communication redundancy between the main controller and slave control units, dispersed acquisition module layout, and complex wiring connections. This results in high installation and maintenance costs, limited system reliability, and insufficient expansion flexibility. Particularly in large-scale multi-cluster energy storage systems, this solution fails to address the cascaded communication problem between the acquisition units and the controller, leading to an exponential increase in system complexity as the number of battery clusters increases, failing to meet market demands for high integration, low cost, and high reliability. Utility Model Content

[0004] In view of this, this utility model proposes a BMS topology device to solve the problem that the existing technology in multi-cluster large-scale energy storage systems has failed to solve the cascade communication problem between the acquisition unit and the controller, which leads to an exponential increase in system complexity as the number of battery clusters increases, and fails to meet the market demand for high integration, low cost and high reliability.

[0005] The technical solution of this utility model is implemented as follows: A BMS topology device, the device comprising a multi-channel AI analog input unit, a multi-channel DI digital input unit, a main control MCU chip, a DO digital output unit, and an RTC real-time clock submodule, wherein:

[0006] The multi-channel AI analog input unit, the multi-channel DI digital input unit, and the RTC real-time clock submodule are all connected to the main control MCU chip, and the main control MCU chip is connected to the DO digital output unit.

[0007] Based on the above technical solutions, preferably, the multi-channel AI analog input unit is used to receive the following signals: 24V DC power supply voltage detection of the module, reference voltage VREF detection of the ADC inside the CPU, battery DC power supply B+ / B- detection, high voltage DC bus V+ detection, high voltage DC bus V- detection, precharge voltage detection, and module internal temperature detection.

[0008] Based on the above technical solutions, preferably, the multi-channel DI digital input unit is used to receive feedback signals from the positive contactor, the negative contactor, and the circuit breaker.

[0009] Based on the above technical solutions, preferably, the RTC real-time clock submodule is used to input the system time reference signal.

[0010] Based on the above technical solutions, preferably, a hardware watchdog is also included, which is electrically connected to the main control MCU chip and is used for system fault monitoring and self-recovery.

[0011] Based on the above technical solutions, preferably, the main control MCU chip is used to process the received analog and digital signals.

[0012] Based on the above technical solutions, preferably, the DO digital output unit is used to output multiple switching signals.

[0013] Based on the above technical solutions, preferably, the DO digital output unit includes multiple output channels, including positive contactor drive, negative contactor drive, precharge contactor drive, operation drive, fault drive and circuit breaker shunt drive channels.

[0014] Based on the above technical solutions, preferred options also include a daisy-chain communication interface and a CAN bus communication interface;

[0015] The daisy-chain communication interface includes a high-voltage daisy-chain port and a slave daisy-chain port; the high-voltage daisy-chain port is electrically connected to the main control MCU chip, and multiple high-voltage processing modules are cascaded through multiple communication conversion chips, each high-voltage processing module is used to collect the voltage / current / temperature signal of a battery cluster; the slave daisy-chain port is electrically connected to the main control MCU chip, and multiple slave devices are cascaded through multiple communication conversion chips.

[0016] The CAN bus communication interface is electrically connected to the main control MCU chip and is used for data interaction with the bus.

[0017] Based on the above technical solutions, preferably, the communication conversion chip adopts a chip cascade structure, and adjacent chips are connected by an isolation circuit;

[0018] The high-voltage processing module and the communication conversion chip are connected using LVDS differential signal transmission, and the high-voltage processing modules are arranged sequentially in cluster order.

[0019] The main control MCU chip is equipped with a timer circuit to trigger data acquisition requests from the daisy-chain communication interface at regular intervals, and to process the data communication between the high-voltage daisy chain and the slave control daisy chain according to preset priorities.

[0020] The main control MCU chip is used to send all the collected battery cluster data to the advanced control system via the CAN bus.

[0021] The BMS topology device provided by this utility model has the following advantages compared with the prior art:

[0022] (1) By highly integrating and optimizing the connection of the multi-channel AI analog input unit, the multi-channel DI digital input unit, the main control MCU chip, the DO digital output unit and the RTC real-time clock sub-module, the key functions of the battery management system are integrated, which simplifies the problem of redundant controllers in the traditional three-level architecture BMS system, reduces the complexity of hardware configuration and communication network, and effectively reduces the total system cost and the number of fault points.

[0023] (2) By combining the daisy-chain communication interface (including the high-voltage daisy link port and the slave control daisy link port) with the CAN bus communication interface, the efficient cascading connection between the main control MCU chip and the multi-channel high-voltage processing module and slave control device is realized. This fundamentally solves the communication bottleneck problem of multi-cluster battery management in traditional BMS systems, significantly reduces the system wiring complexity, reduces the number of signal transmission interfaces, and enables one main control unit to manage multiple battery clusters at the same time. This effectively replaces the redundant design of multiple independent main control units in the traditional architecture. The daisy-chain signal transmission improves the anti-interference capability and communication reliability, and enables the system to significantly reduce hardware costs and system failure rate while maintaining high-speed data interaction capability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a system architecture diagram of a BMS topology device according to the present invention;

[0026] Figure 2 This is a schematic diagram of the integrated high-voltage box structure in the battery compartment of a BMS topology device according to this utility model;

[0027] Figure 3 This is a schematic diagram of the integration of the acquisition board and FPC in a BMS topology device according to this utility model;

[0028] Figure 4 This is a schematic diagram of daisy-chain communication between acquisition boards in a BMS topology device according to this utility model. Detailed Implementation

[0029] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0030] Please see Figure 1 This utility model provides a BMS topology device. The internal architecture of the BMS topology device is divided into high-voltage and low-voltage sections. The low-voltage section increases the number of external input / output ports through component selection, while maintaining compatibility with the original 12-cluster master control function. Each high-voltage processing module is responsible for independently collecting information such as the total voltage and current within the cluster, performing relay diagnosis, and controlling the opening and closing of the main circuit relays. High-voltage acquisition modules between clusters are connected to the low-voltage side via daisy-chain communication. Slave controllers are connected to the master control low-voltage side via bidirectional daisy-chain communication. The device includes a multi-channel AI analog input unit, a multi-channel DI digital input unit, a master control MCU chip, a DO digital output unit, and an RTC real-time clock submodule, wherein:

[0031] The multi-channel AI analog input unit, the multi-channel DI digital input unit, and the RTC real-time clock submodule are all connected to the main control MCU chip, and the main control MCU chip is connected to the DO digital output unit.

[0032] The multi-channel AI analog input unit is used to receive the following signals: 24V DC power supply voltage detection, reference voltage VREF detection of the ADC inside the CPU, battery DC power supply B+ / B- detection, high voltage DC bus V+ detection, high voltage DC bus V- detection, precharge voltage detection, and module internal temperature detection.

[0033] Specifically, this embodiment achieves integrated processing of key functions of the battery management system by highly integrating and optimizing the connection of multi-channel AI analog input units, multi-channel DI digital input units, main control MCU chip, DO digital output unit and RTC real-time clock submodule. This simplifies the problem of redundant controllers in traditional three-level architecture BMS systems, reduces the complexity of hardware configuration and communication network, and effectively reduces the total system cost and the number of failure points.

[0034] The multi-channel DI digital input unit is used to receive feedback signals from the positive contactor, the negative contactor, and the circuit breaker.

[0035] The RTC real-time clock submodule is used to input the system time reference signal.

[0036] It also includes a hardware watchdog, which is electrically connected to the main control MCU chip and is used for system fault monitoring and self-recovery.

[0037] The main control MCU chip is used to process the received analog and digital signals.

[0038] The DO digital output unit is used to output multiple switching signals.

[0039] The DO digital output unit includes multiple output channels, including positive contactor drive, negative contactor drive, precharge contactor drive, operation drive, fault drive and circuit breaker shunt drive channels.

[0040] Specifically, this embodiment integrates comprehensive safety monitoring and control modules. It monitors the status of key contactors and circuit breaker feedback in real time through multi-channel DI digital input units, and combines this with a high-precision time base provided by the RTC real-time clock submodule to construct a complete battery system operation status tracking mechanism. Simultaneously, the introduction of a hardware watchdog significantly enhances the system's fault diagnosis and self-recovery capabilities, effectively preventing safety risks caused by system crashes and program errors. The main control MCU chip's unified processing of multi-channel analog and digital signals eliminates signal processing delays and inconsistencies found in traditional multi-controller solutions. The DO digital output unit is configured with six dedicated drive channels (including positive / negative contactor drive, pre-charge contactor drive, etc.), achieving precise control of the battery system under all operating conditions and improving the system's emergency handling capabilities for abnormal conditions and the accuracy of battery protection.

[0041] It also includes a daisy-chain communication interface and a CAN bus communication interface;

[0042] The daisy-chain communication interface includes a high-voltage daisy-chain port and a slave daisy-chain port; the high-voltage daisy-chain port is electrically connected to the main control MCU chip, and multiple high-voltage processing modules are cascaded through multiple communication conversion chips, each high-voltage processing module is used to collect the voltage / current / temperature signal of a battery cluster; the slave daisy-chain port is electrically connected to the main control MCU chip, and multiple slave devices are cascaded through multiple communication conversion chips.

[0043] The CAN bus communication interface is electrically connected to the main control MCU chip and is used for data interaction with the bus.

[0044] Specifically, this embodiment combines a daisy-chain communication interface (including a high-voltage daisy link port and a slave daisy link port) with a CAN bus communication interface to achieve efficient cascading connection between the main control MCU chip and multiple high-voltage processing modules and slave control devices. This fundamentally solves the communication bottleneck problem of multi-cluster battery management in traditional BMS systems, significantly reduces system wiring complexity, reduces the number of signal transmission interfaces, and enables one main control unit to manage multiple battery clusters simultaneously. It effectively replaces the redundant design of multiple independent main controllers in traditional architectures. The daisy-chain signal transmission improves anti-interference capability and communication reliability, enabling the system to maintain high-speed data interaction capability while significantly reducing hardware costs and system failure rate.

[0045] The communication conversion chip is arranged in a cascaded chip structure, with adjacent chips connected by an isolation circuit.

[0046] The high-voltage processing module and the communication conversion chip are connected using LVDS differential signal transmission, and the high-voltage processing modules are arranged sequentially in cluster order.

[0047] The main control MCU chip is equipped with a timer circuit to trigger data acquisition requests from the daisy-chain communication interface at regular intervals, and to process the data communication between the high-voltage daisy chain and the slave control daisy chain according to preset priorities.

[0048] The main control MCU chip is used to send all the collected battery cluster data to the advanced control system via the CAN bus.

[0049] Specifically, this embodiment achieves safe electrical isolation in the high-voltage battery system through the cascaded structure design of the communication conversion chip and the isolation circuit connection method, effectively preventing high-voltage fault transmission and common-mode interference. Simultaneously, the use of LVDS differential signal transmission technology to connect the high-voltage processing module and the communication conversion chip enhances the anti-interference capability and signal integrity of data transmission, solving the signal attenuation and distortion problems of traditional BMS under high-voltage environments. The cluster-order arrangement of the high-voltage processing module in this embodiment, combined with the timer triggering mechanism of the main control MCU chip, establishes a structured data acquisition system. Through a preset priority data processing strategy, it achieves reasonable allocation of system resources and efficient processing of multi-cluster battery data. The daisy-chain and CAN bus combined two-layer communication architecture in this embodiment not only simplifies system expansion and improves the flexibility of modular design but also reduces signal conversion steps.

[0050] Please see Figure 2 This is a schematic diagram of the integrated high-voltage box structure within the battery compartment of a BMS topology device according to this utility model. This embodiment of the BMS topology device requires implementation based on an integrated high-voltage box. Inside the integrated high-voltage box, the original BMS master controller in each high-voltage box is integrated and optimized into a single BMS master domain controller, reducing the number from 12 to one. The internal structure diagram of the container is shown below. Figure 2 As shown;

[0051] The BMS acquisition board is designed to be integrated with the FPC, eliminating the need for a casing and external adapter cables. Figure 3 The diagram shown is a schematic of the integration of the acquisition board and FPC in a BMS topology device according to this utility model.

[0052] Within a single battery cluster, data acquisition boards communicate with each other via daisy-chain, reducing costs. Data acquisition boards also communicate between battery packs in different clusters via daisy-chain. The final data acquisition board is connected to the BMS main control domain controller via a bidirectional daisy-chain. Figure 4 The diagram shown is a schematic of daisy-chain communication between acquisition boards in a BMS topology device according to this utility model.

[0053] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A BMS topology device, characterized in that, The device includes a multi-channel AI analog input unit, a multi-channel DI digital input unit, a main control MCU chip, a DO digital output unit, and an RTC real-time clock submodule, wherein: The multi-channel AI analog input unit, the multi-channel DI digital input unit, and the RTC real-time clock submodule are all connected to the main control MCU chip, and the main control MCU chip is connected to the DO digital output unit.

2. The BMS topology device as described in claim 1, characterized in that, The multi-channel AI analog input unit is used to receive the following signals: 24V DC power supply voltage detection, reference voltage VREF detection of the ADC inside the CPU, battery DC power supply B+ / B- detection, high voltage DC bus V+ detection, high voltage DC bus V- detection, precharge voltage detection, and module internal temperature detection.

3. A BMS topology device as described in claim 1, characterized in that, The multi-channel DI digital input unit is used to receive feedback signals from the positive contactor, the negative contactor, and the circuit breaker.

4. A BMS topology device as described in claim 1, characterized in that, The RTC real-time clock submodule is used to input the system time reference signal.

5. A BMS topology device as described in claim 4, characterized in that, It also includes a hardware watchdog, which is electrically connected to the main control MCU chip and is used for system fault monitoring and self-recovery.

6. A BMS topology device as described in claim 1, characterized in that, The main control MCU chip is used to process the received analog and digital signals.

7. A BMS topology device as described in claim 1, characterized in that, The DO digital output unit is used to output multiple switching signals.

8. A BMS topology device as described in claim 1, characterized in that, The DO digital output unit includes multiple output channels, including positive contactor drive, negative contactor drive, precharge contactor drive, operation drive, fault drive and circuit breaker shunt drive channels.

9. A BMS topology device as described in claim 1, characterized in that, It also includes a daisy-chain communication interface and a CAN bus communication interface; The daisy-chain communication interface includes a high-voltage daisy-chain port and a slave daisy-chain port; the high-voltage daisy-chain port is electrically connected to the main control MCU chip, and multiple high-voltage processing modules are cascaded through multiple communication conversion chips, each high-voltage processing module is used to collect the voltage / current / temperature signal of a battery cluster; the slave daisy-chain port is electrically connected to the main control MCU chip, and multiple slave devices are cascaded through multiple communication conversion chips. The CAN bus communication interface is electrically connected to the main control MCU chip and is used for data interaction with the bus.

10. A BMS topology device as described in claim 9, characterized in that, The communication conversion chip is arranged in a cascaded chip structure, with adjacent chips connected by an isolation circuit. The high-voltage processing module and the communication conversion chip are connected using LVDS differential signal transmission, and the high-voltage processing modules are arranged sequentially in cluster order. The main control MCU chip is equipped with a timer circuit to trigger data acquisition requests from the daisy-chain communication interface at regular intervals, and to process the data communication between the high-voltage daisy chain and the slave control daisy chain according to preset priorities. The main control MCU chip is used to send all the collected battery cluster data to the advanced control system via the CAN bus.

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