An electronic component packaging positioning device

Abstract

The utility model relates to electronic component technical field, and disclose an electronic component packaging positioning device, including support plate and drive assembly, drive assembly sets up at the bottom of support plate, the top of drive assembly is provided with the connecting plate, the top pivoted connection of connecting plate has the guide plate, the utility model discloses through setting up the cylinder can drive connecting seat to remove, makes connecting seat drive connecting plate to rotate, makes connecting plate drive guide seat to remove, makes guide plate drive linkage plate to remove, and then makes linkage plate drive clamping plate to remove to reach the effect of clamping positioning when the electronic component packaging, through setting up the push rod can drive the slide plate to slide, makes the slide plate along the locating plate recess to slide, and then the slide plate drive laser emitter and laser lamp to remove to reach the cleaning path of laser lamp to the electronic component and slide adjustment.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically to an electronic component packaging and positioning device. Background Technology

[0002] Electronic components are the core building blocks of modern electronic systems. Based on their function, they can be divided into two main categories: active components and passive components. Their manufacturing employs precision semiconductor processes, forming microstructures on silicon or other compound materials through steps such as doping, photolithography, and etching. Typical packaging forms include QFN, BGA, and CSP, with pin pitch as small as 0.3mm. Performance parameters cover dimensions such as operating voltage, frequency response, and temperature range. Modern components integrate AI acceleration modules, MEMS sensors, or RF front-ends, and achieve ultra-high-density interconnection through three-dimensional stacking. Quality control follows standards such as AEC-Q100 and JEDEC. They are widely used in communication equipment, industrial automation, and IoT terminals, driving the development of electronic devices towards miniaturization, high frequency, and intelligence.

[0003] Electronic component packaging equipment is a core manufacturing device used to protect and connect chips. It transforms bare wafers into installable independent components through precision processes. This equipment uses a high-precision mounting system and a multi-functional soldering module to achieve electrical interconnection between the chip and the substrate. Key components include a wafer pick-up mechanism, an epoxy resin dispensing system, and an inert gas protection chamber. Existing electronic component packaging equipment often lacks a high-precision positioning system and relies only on mechanical limits or simple guide rails for coarse positioning, resulting in excessive misalignment between the chip and the substrate. This leads to solder joint misalignment during subsequent packaging. Secondly, the laser cleaning module is fixedly installed and cannot dynamically adjust the cleaning path according to the component position. The oxide layer removal coverage is insufficient, and there is a risk of over-cleaning and damaging the solder pads.

[0004] Therefore, it is necessary to provide a new electronic component packaging and positioning device to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide an electronic component packaging and positioning device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an electronic component packaging and positioning device, including a support plate, and further comprising:

[0007] A drive assembly is disposed at the bottom of the support plate, and a connecting plate is disposed at the top of the drive assembly. A guide plate is rotatably connected to the top of the connecting plate.

[0008] A linkage plate is fixed to the top of the guide plate, and a clamping plate for positioning electronic components is rotatably connected to the bottom of the linkage plate.

[0009] A fixing plate is fixed to the top of the support plate. A support frame is fixed to the top of the fixing plate, and a positioning plate is fixed to the top of the support frame.

[0010] A sliding plate is slidably connected to the inner wall of the positioning plate. A laser emitter is fixed to the bottom of the sliding plate, and a laser lamp for cleaning and removing oxide layers from electronic components is fixed to the bottom of the laser emitter.

[0011] Preferably, the drive assembly includes a cylinder fixed to the bottom of the support plate, the piston rod of the cylinder being fixed to a connecting seat, and the top of the connecting seat being rotatably connected to the bottom of the connecting plate.

[0012] Preferably, a positioning seat is fixed to one side of the fixing plate, and a sliding rod is slidably connected to the inner wall of the positioning seat, with one end of the sliding rod fixed to one side of the clamping plate.

[0013] Preferably, the top of the positioning seat is rotatably connected to a connecting plate, the top of the connecting plate is rotatably connected to a transition plate, and the bottom of the transition plate is rotatably connected to the top of the clamping plate.

[0014] Preferably, a fixing plate is fixed to the top of the skateboard, and a push rod for moving the laser light is fixed to the top of the fixing plate.

[0015] Preferably, a support column is fixed to the bottom of the support plate, and a support base for supporting the main body is fixed to the bottom of the support column.

[0016] Preferably, a fixing frame is fixed to the bottom of the guide plate, a fixing column is fixed to the top of the fixing frame, and the outer side of the fixing column is fixed to the inner wall of the linkage plate.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] This invention utilizes a cylinder to move the connecting seat, which in turn rotates the connecting plate, causing the connecting plate to move the guide seat, which in turn moves the connecting plate, which in turn moves the clamping plate. This achieves the effect of clamping and positioning electronic components during packaging. A push rod allows the sliding plate to slide along the groove of the positioning plate, which in turn moves the laser emitter and laser lamp, thus allowing for the adjustment of the cleaning path of the laser lamp on the electronic components. Attached Figure Description

[0019] Figure 1 A schematic diagram of a preferred embodiment of the electronic component packaging and positioning device provided by this utility model;

[0020] Figure 2This is a schematic diagram of the drive component in this utility model;

[0021] Figure 3 This is a schematic diagram of the slide bar in this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the laser lamp in this utility model.

[0023] In the diagram: 1. Support plate; 2. Drive assembly; 201. Cylinder; 202. Connecting seat; 3. Connecting plate; 4. Guide plate; 5. Linkage plate; 6. Clamping plate; 7. Fixing plate; 8. Support frame; 9. Positioning plate; 10. Slide plate; 11. Laser emitter; 12. Laser light; 13. Positioning seat; 14. Slide rod; 15. Connecting plate; 16. Adapter plate; 17. Fixing plate; 18. Push rod; 19. Support column; 20. Support seat; 21. Fixing frame; 22. Fixing column. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-4 As shown, an electronic component packaging and positioning device includes a support plate 1 and a drive assembly 2. The drive assembly 2 is disposed at the bottom of the support plate 1, and a connecting plate 3 is disposed at the top of the drive assembly 2. A guide plate 4 is rotatably connected to the top of the connecting plate 3. The support plate 1 can fix the drive assembly 2, enabling the drive assembly 2 to stably drive the connecting plate 3 to rotate, and the connecting plate 3 to drive the guide plate 4 to move, which facilitates the subsequent clamping and positioning of electronic components and improves the stability of the device.

[0026] The connecting plate 5 is fixed to the top of the guide plate 4, and the bottom of the connecting plate 5 is rotatably connected to a clamping plate 6 for positioning electronic components. The guide plate 4 can drive the connecting plate 5 to move, so that the connecting plate 5 drives the clamping plate 6 to move, thereby achieving the effect of clamping and positioning the electronic components.

[0027] The fixing plate 7 is fixed to the top of the support plate 1. The top of the fixing plate 7 is fixed with a support frame 8. The top of the support frame 8 is fixed with a positioning plate 9. The support plate 1 can fix the fixing plate 7, the fixing plate 7 can fix the support frame 8, and the support frame 8 can fix the positioning plate 9. The positioning plate 9 has a sliding groove inside to improve the stability of subsequent laser cleaning of electronic components.

[0028] The slide plate 10 is slidably connected to the inner wall of the positioning plate 9. A laser emitter 11 is fixed at the bottom of the slide plate 10, and a laser lamp 12 for cleaning and removing oxide layers from electronic components is fixed at the bottom of the laser emitter 11. The slide plate 10 can slide along the groove of the positioning plate 9, so that the slide plate 10 can move the laser emitter 11 and the laser lamp 12, which is convenient for adjusting the position during subsequent laser cleaning of electronic components. The laser emitter 11 is existing technology. The laser emitter 11 uses semiconductor pump electro-optic conversion efficiency and generates laser through rare earth element-doped optical fiber. It outputs a collimated beam divergence angle with a QBH interface. The laser lamp 12 is existing technology. The laser lamp 12 uses DPSS diode pump solid-state laser technology. The crystal frequency doubling generates visible light. The laser emitter 11 generates a high-energy beam, which is precisely focused onto the surface of the electronic component by a galvanometer system. Its instantaneous energy causes the contaminants to thermally expand, vaporize, or photochemically decompose. The synchronously working laser lamp 12 projects a positioning spot, and the cleaning area is visualized and calibrated by a CCD camera. During the cleaning process, the plasma spectrum provides real-time feedback on the cleanliness level, and the pulse frequency and scanning speed are automatically matched to the type of contaminants, achieving submicron-level cleaning without damaging the substrate.

[0029] The drive assembly 2 includes a cylinder 201 fixed to the bottom of the support plate 1. The piston rod of the cylinder 201 is fixed to a connecting seat 202, and the top of the connecting seat 202 is rotatably connected to the bottom of the connecting plate 3. The support plate 1 can fix the cylinder 201, which enables the cylinder 201 to stably drive the connecting seat 202 to move, and the connecting seat 202 to drive the connecting plate 3 to rotate, which facilitates clamping and positioning during the subsequent packaging of electronic components.

[0030] A positioning seat 13 is fixed on one side of the fixing plate 7. A slide rod 14 is slidably connected to the inner wall of the positioning seat 13, and one end of the slide rod 14 is fixed to one side of the clamping plate 6. The fixing plate 7 can fix the positioning seat 13, so that the clamping plate 6 drives the slide rod 14 to slide along the inner wall of the positioning seat 13, and cooperates with the linkage plate 5 to drive the clamping plate 6 to clamp and position the electronic components.

[0031] The top of the positioning base 13 is rotatably connected to a connecting plate 15, and the top of the connecting plate 15 is rotatably connected to a transition plate 16. The bottom of the transition plate 16 is rotatably connected to the top of the clamping plate 6. The clamping plate 6 can drive the transition plate 16 to rotate, so that the transition plate 16 drives the connecting plate 15 to rotate around the top of the positioning base 13, which facilitates the subsequent use of the linkage plate 5 to drive the clamping plate 6 to clamp and position electronic components.

[0032] A fixed plate 17 is fixed to the top of the slide plate 10. A push rod 18 for moving the laser lamp 12 is fixed to the top of the fixed plate 17. The push rod 18 can drive the fixed plate 17 to move, so that the fixed plate 17 drives the slide plate 10 to slide along the groove of the positioning plate 9, which facilitates the subsequent adjustment of the position of the laser lamp 12 for laser cleaning of electronic components.

[0033] A support column 19 is fixed to the bottom of the support plate 1, and a support seat 20 for supporting the main body is fixed to the bottom of the support column 19. The support seat 20 can fix the support column 19, and the support column 19 can fix the support plate 1, which facilitates subsequent support of the main body.

[0034] A fixing frame 21 is fixed to the bottom of the guide plate 4, and a fixing column 22 is fixed to the top of the fixing frame 21. The outer side of the fixing column 22 is fixed to the inner wall of the connecting plate 5. The fixing column 22 can fix the connecting plate 5, so that the guide plate 4 drives the fixing frame 21 and the connecting plate 5 to move, which facilitates the subsequent clamping of the clamping plate 6.

[0035] Working Principle: When using this device, firstly, the electronic components to be packaged are placed on the support plate 1. Then, the cylinder 201 is activated, causing the connecting seat 202 to move. This causes the connecting seat 202 to rotate the connecting plate 3, which in turn causes the connecting plate 3 to move the guide plate 4. The guide plate 4 then moves the fixing frame 21, which in turn moves the connecting plate 5. This, in turn, causes the connecting plate 5 to move the clamping plate 6. The clamping plate 6, in conjunction with the sliding rod 14, slides along the inner wall of the positioning seat 13, causing the adapter plate 16 to rotate around the top of the positioning seat 13. This achieves the effect of clamping and positioning the electronic components during packaging. Next, the laser emitter 11 and laser lamp 12 are activated. The operator adjusts the push rod 18, causing the push rod 18 to slide the slide plate 10. The slide plate 10 slides along the groove of the positioning plate 9, which in turn causes the laser emitter 11 and laser lamp 12 to move, thereby adjusting the cleaning path of the electronic components.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic component packaging and positioning device, comprising a support plate (1), characterized in that, Also includes: A drive assembly (2) is disposed at the bottom of a support plate (1), and a connecting plate (3) is disposed at the top of the drive assembly (2), and a guide plate (4) is rotatably connected to the top of the connecting plate (3). A linkage plate (5) is fixed to the top of the guide plate (4), and a clamping plate (6) for positioning electronic components is rotatably connected to the bottom of the linkage plate (5). A fixing plate (7) is fixed to the top of the support plate (1), and a support frame (8) is fixed to the top of the fixing plate (7), and a positioning plate (9) is fixed to the top of the support frame (8). The slide plate (10) is slidably connected to the inner wall of the positioning plate (9). A laser emitter (11) is fixed at the bottom of the slide plate (10). A laser lamp (12) for cleaning and removing oxide layers from electronic components is fixed at the bottom of the laser emitter (11).

2. The electronic component packaging and positioning device according to claim 1, characterized in that: The drive assembly (2) includes a cylinder (201) fixed to the bottom of the support plate (1), the piston rod of the cylinder (201) is fixed to a connecting seat (202), and the top of the connecting seat (202) is rotatably connected to the bottom of the connecting plate (3).

3. The electronic component packaging and positioning device according to claim 1, characterized in that: A positioning seat (13) is fixed on one side of the fixing plate (7), and a slide rod (14) is slidably connected to the inner wall of the positioning seat (13), and one end of the slide rod (14) is fixed to one side of the clamping plate (6).

4. The electronic component packaging and positioning device according to claim 3, characterized in that: The top of the positioning seat (13) is rotatably connected to a connecting plate (15), the top of the connecting plate (15) is rotatably connected to a transition plate (16), and the bottom of the transition plate (16) is rotatably connected to the top of the clamping plate (6).

5. The electronic component packaging and positioning device according to claim 1, characterized in that: The top of the slide plate (10) is fixed with a fixed plate (17), and the top of the fixed plate (17) is fixed with a push rod (18) for moving the laser lamp (12).

6. The electronic component packaging and positioning device according to claim 1, characterized in that: The bottom of the support plate (1) is fixed with a support column (19), and the bottom of the support column (19) is fixed with a support seat (20) for supporting the main body.

7. The electronic component packaging and positioning device according to claim 1, characterized in that: The bottom of the guide plate (4) is fixed with a fixing frame (21), and the top of the fixing frame (21) is fixed with a fixing column (22), and the outer side of the fixing column (22) is fixed to the inner wall of the connecting plate (5).

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