A quartz crystal resonator base structure adaptable to multiple series of wafers

Abstract

This invention proposes a quartz crystal resonator base structure adaptable to multiple series of wafers, including a base body, a heat sink, and a ventilation switching module. The heat sink is installed at the bottom of the base body, and multiple spaced metal blocks are installed at the bottom of the heat sink. The ventilation switching module is detachably connected to the multiple metal blocks. The ventilation switching module includes a ventilation cylinder, which is detachably connected to the multiple metal blocks. Each of the multiple metal blocks has a heat dissipation channel communicating with the ventilation cylinder and the base body. This invention provides a quartz crystal resonator base structure adaptable to multiple series of wafers. By integrating metal blocks at the bottom of the base body to absorb and conduct heat from the wafers, it overcomes the heat dissipation bottleneck. The ventilation cylinder can be detachably installed, and the metal blocks contain heat dissipation channels. Rotating the switching cylinder controls the opening and closing of the heat dissipation vents, further enhancing the heat dissipation effect, creating a stable working environment for the wafers, improving structural reliability and stability, reducing the failure rate, and increasing production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of quartz crystal resonator technology, specifically to a quartz crystal resonator base structure adaptable to multiple series of wafers. Background Technology

[0002] Quartz crystal resonators, as a widely used high-precision frequency control element, play a crucial role in many fields such as electronic communication, computers, and automotive electronics due to their excellent frequency stability and low aging rate. Their core raw material is quartz oscillators, which are usually made using crystal wafers. However, the thickness of the crystal wafer is closely related to the operating frequency of the resonator. The lower the frequency, the thicker the crystal wafer is required, and vice versa. Thicker wafers have relatively better structural stability and can adapt to large-size designs, while thinner wafers are prone to breakage in large-size applications due to their physical properties. Therefore, they are generally only made in small sizes. In addition, crystal wafers of different sizes cannot be placed on the same base, and the management of different types of bases is more complicated and prone to errors. This increases the production difficulty and quality control risk of quartz crystal resonators to a certain extent, limiting their further optimization and expansion in certain specific application scenarios.

[0003] A search of Chinese Patent CN222464581U reveals a quartz crystal resonator base structure adaptable to multiple series of wafers. The base comprises, from bottom to top, a substrate layer, a resonator electrode layer, and a Kovar ring. A cavity is provided on the resonator electrode layer, communicating with the outside through an opening in the Kovar ring. A lead PAD is also installed within the cavity. A quartz resonator is placed on the lead PAD, which includes several first-layer PADs and several second-layer PADs. Several first-layer PADs are installed in the cavity, and several second-layer PADs are correspondingly installed on the first-layer PADs. One side of each first-layer PAD extends towards the center of the base, so that at least one side of each first-layer PAD protrudes beyond each second-layer PAD. This technical solution, by installing lead PADs within the cavity, allows smaller quartz resonators to be placed on the first-layer PADs and larger quartz resonators to be placed on the second-layer PADs. Thus, a single base can accommodate wafers of different sizes, thereby adapting to the installation of multiple series of wafers.

[0004] Although the quartz crystal resonator base structure in the above scheme can adapt to the installation of crystals of different sizes through the unique lead PAD design, the crystal is in a closed state when it is working because a cover needs to be installed on the base. This makes it impossible for the crystal to dissipate heat effectively in high-temperature environments. High temperature will not only affect the bonding performance of conductive adhesive, but may also reduce the mechanical properties of PAD, leading to the crystal falling off. Utility Model Content

[0005] This invention provides a quartz crystal resonator base structure that is adaptable to multiple series of crystals, solving the problem in related technologies where the crystal is in a closed state during operation, which makes it impossible for the crystal to dissipate heat effectively in high-temperature environments.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a quartz crystal resonator base structure adaptable to multiple series of wafers, including a base body, a heat sink, and a ventilation switching module;

[0007] The heat sink is installed at the bottom of the base body, and multiple spaced metal blocks are installed at the bottom of the heat sink. The ventilation switching module is detachably connected to the multiple metal blocks.

[0008] The ventilation switching module includes a ventilation cylinder, which is detachably connected to multiple metal blocks. Each of the multiple metal blocks has a heat dissipation channel that communicates with the ventilation cylinder and the base body. The ventilation cylinder has a heat dissipation port on its outer periphery. A switching part is provided inside the ventilation cylinder, and the switching part is used to open and close the heat dissipation port.

[0009] Preferably, the switching part includes a switching cylinder and an adjusting member. The switching cylinder is disposed inside the ventilation cylinder and its position is adjusted and rotated by the adjusting member. The switching cylinder has a strip-shaped opening.

[0010] Preferably, the adjusting component includes a rotating shaft, a sleeve, and an elastic limiting member. One end of the switching cylinder is equipped with a rotating shaft that rotates through one end of the ventilation cylinder. The sleeve is fixedly mounted on the rotating shaft. A slot is provided on the side of the sleeve near the ventilation cylinder. The elastic limiting member is installed in the slot and abuts against one end of the ventilation cylinder.

[0011] Preferably, the elastic limiting member includes a spring, which is installed in a slot, and a limiting block is installed at the end of the spring to abut against one end of the ventilation cylinder.

[0012] Preferably, a dustproof mesh is provided inside the heat dissipation vent on the ventilation duct.

[0013] Preferably, a magnetic sheet is installed at the other end of the ventilation duct, and a magnetic block is installed on the outer metal block. The ventilation duct slides through multiple metal blocks and is magnetically connected to the magnetic block through the magnetic sheet.

[0014] Preferably, a multi-layer lead PAD is installed inside the base body.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. In use, the present invention allows the wafer and the housing to be mounted on the base body, with the wafer placed inside the housing. Multiple spaced metal blocks are integrated at the bottom of the base body. The metal blocks can absorb the heat generated by the wafer during operation and conduct it away, so that the heat in the enclosed environment of the wafer can be effectively dissipated. This structural design breaks through the bottleneck of the limited heat dissipation capacity of the traditional base body. Even in high-temperature environments, it can ensure that the temperature of the wafer is maintained within a reasonable range, thereby ensuring the stable operation of the wafer and extending its service life.

[0017] 2. To further improve heat dissipation, ventilation cylinders are detachably installed on multiple metal blocks. Each metal block has a heat dissipation channel communicating with the ventilation cylinder. By rotating a switching cylinder, its slots align with the heat dissipation vents on the ventilation cylinder, opening the vents and allowing heat to pass through the heat dissipation channels within the metal blocks and the slots on the switching cylinder before being expelled through the vents. To close the vents, simply rotate the switching cylinder to misalign its slots with the heat dissipation vents on the ventilation cylinder, further enhancing heat dissipation. This multi-layered heat dissipation mechanism creates a more stable working environment for the wafer, improves the reliability and stability of the wafer mounting structure, reduces equipment failure rates, and increases production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of a quartz crystal resonator base structure adapted to multiple series of wafers proposed in this utility model.

[0020] Figure 2 This is a schematic diagram of the bottom structure of the base body of this utility model;

[0021] Figure 3 This is a schematic diagram of the cooperative structure of the heat sink, metal block and ventilation switching module of this utility model;

[0022] Figure 4 This is a schematic diagram of the ventilation switching module of this utility model;

[0023] Figure 5 This is an internal sectional view of the ventilation duct of this utility model;

[0024] Figure 6This is a schematic diagram of the structure of the adjusting component of this utility model;

[0025] The following are the labeling elements in the diagram: 1. Base body; 101. Lead wire PAD; 2. Heat sink; 3. Metal block; 31. Magnetic block; 4. Ventilation switching module; 41. Ventilation duct; 42. Dustproof net; 43. Switching duct; 431. Strip opening; 44. Adjusting component; 441. Rotating shaft; 442. Sleeve disc; 443. Elastic limiting component; 4331. Spring; 4332. Limiting block; 45. Magnetic sheet. Detailed Implementation

[0026] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] according to Figures 1-6 As shown, a quartz crystal resonator base structure adaptable to multiple series of wafers includes a base body 1, a heat sink 2, and a ventilation switching module 4.

[0028] The heat sink 2 is installed at the bottom of the base body 1, and multiple spaced metal blocks 3 are installed at the bottom of the heat sink 2. The ventilation switching module 4 is detachably connected to the multiple metal blocks 3.

[0029] The ventilation switching module 4 includes a ventilation cylinder 41, which is detachably connected to multiple metal blocks 3. Each of the multiple metal blocks 3 has a heat dissipation channel that communicates with the ventilation cylinder 41 and the base body 1. The ventilation cylinder 41 has a heat dissipation port on its outer periphery. A switching part is provided inside the ventilation cylinder 41, and the switching part is used to open and close the heat dissipation port.

[0030] The heat sink 2 is installed at the bottom of the base body 1, which can conduct the heat generated by the chip to the bottom. Multiple spaced metal blocks 3 are installed at the bottom of the heat sink 2, which can absorb heat and conduct it through the heat dissipation channel. The ventilation tube 41 is detachably connected to the metal blocks 3, and its outer heat dissipation vents can be opened or closed under the action of the switching part. When the heat dissipation vents are open, the heat can be discharged through the heat dissipation channel and the heat dissipation vents. The metal blocks 3 enhance the heat conduction and dissipation capabilities, so that the heat in the closed environment of the chip can be effectively dissipated, ensuring the stable operation of the chip and extending its service life. The ventilation tube 41 works in conjunction with the heat dissipation channel, and the opening and closing of the heat dissipation vents can be controlled as needed to achieve flexible heat dissipation.

[0031] In a specific embodiment, the switching part includes a switching cylinder 43 and an adjusting member 44. The switching cylinder 43 is disposed inside the ventilation cylinder 41 and its position is adjusted and rotated by the adjusting member 44. A strip opening 431 is provided on the switching cylinder 43.

[0032] When the strip opening 431 on the switching cylinder 43 corresponds to the heat dissipation port of the ventilation cylinder 41, the heat dissipation port opens, and heat can be discharged through the strip opening 431 and the heat dissipation port. When the strip opening 431 is misaligned with the heat dissipation port, the heat dissipation port closes, thus achieving precise control over the opening and closing of the heat dissipation port. The heat dissipation can be flexibly adjusted according to the temperature of the chip during operation, improving the targeting and effectiveness of heat dissipation.

[0033] In a specific embodiment, the adjusting component 44 includes a rotating shaft 441, a sleeve 442, and an elastic limiting component 443. One end of the switching cylinder 43 is equipped with a rotating shaft 441 that rotates through one end of the ventilation cylinder 41. The sleeve 442 is fixedly fitted onto the rotating shaft 441. A slot is provided on the side of the sleeve 442 near the ventilation cylinder 41. The elastic limiting component 443 is installed in the slot and abuts against one end of the ventilation cylinder 41. Rotating the sleeve 442 can drive the rotating shaft 441 and the switching cylinder 43 to rotate. The position of the switching cylinder 43 can be limited by the elastic limiting component 443, thereby limiting the position of the switching cylinder 43. This makes the rotation adjustment of the switching cylinder 43 more convenient and stable, and can be accurately fixed in the required position, ensuring the reliability of the opening and closing state of the heat dissipation vent.

[0034] In a specific embodiment, the elastic limiting member 443 includes a spring 4331, which is installed in a slot. A limiting block 4332 that abuts against one end of the ventilation tube 41 is installed at the end of the spring 4331. When the rotating sleeve 442 is rotated, the limiting block 4332 is squeezed by the ventilation tube 41, and the spring 4331 is compressed. When the switching tube 43 rotates to the target position, the spring 4331 recovers its elasticity and pushes the limiting block 4332 to abut tightly against the ventilation tube 41, thus limiting the switching tube 43. Through the cooperation of the spring 4331 and the limiting block 4332, the automatic limiting of the position of the switching tube 43 is realized, making the opening and closing state of the heat dissipation vent more stable and less prone to change due to external interference.

[0035] In a specific embodiment, a dustproof net 42 is provided inside the heat dissipation vent on the ventilation duct 41. When the heat dissipation vent is opened, air flows through the dustproof net 42 to enter or exit. Dust and other impurities are blocked by the dustproof net 42, preventing dust and other impurities from entering the base and avoiding contamination and damage to components such as chips, thus ensuring the normal operation and service life of the equipment.

[0036] In a specific embodiment, a magnetic sheet 45 is installed at the other end of the ventilation duct 41, and a magnetic block 31 is installed on the outer metal block 3. The ventilation duct 41 slides through multiple metal blocks 3 and is magnetically connected to the magnetic block 31 through the magnetic sheet 45. The magnetic sheet 45 and the magnetic block 31 are magnetically connected to realize the detachable connection between the ventilation duct 41 and the metal block 3, which facilitates the installation and disassembly of the ventilation duct 41 and makes it convenient to maintain and repair the equipment. At the same time, the magnetic connection has a certain stability, ensuring that the position of the ventilation duct 41 is fixed during the operation.

[0037] In a specific embodiment, a multilayer lead PAD101 is installed inside the base body 1. The height of the multilayer lead PAD101 decreases sequentially. When the wafer size is small, the wafer can be placed on the lower layer lead PAD101. When the wafer size is large, it can be placed on the higher layer lead PAD101.

[0038] The specific working principle of this utility model is as follows:

[0039] First, the chip is mounted on the multilayer lead PAD101 inside the base body 1. The appropriate lead PAD101 layer is selected according to the chip size. Then, the cover is installed to enclose the chip inside the cover. The heat generated by the chip during operation is transferred to the base body 1 and conducted to the heat sink 2 at the bottom through the base body 1. The heat sink 2 conducts the heat to multiple metal blocks 3 installed at its bottom. After absorbing the heat, the metal blocks 3 conduct the heat through the heat dissipation channel connected to the ventilation cylinder 41 inside.

[0040] When heat dissipation is required, the rotating sleeve 442 drives the rotating shaft 441 and the switching cylinder 43 to rotate inside the ventilation cylinder 41. At this time, the limiting block 4332 of the elastic limiting member 443 compresses the spring 4331. When the strip opening 431 on the switching cylinder 43 corresponds to the heat dissipation port on the outer periphery of the ventilation cylinder 41, the rotating sleeve 442 stops, the spring 4331 returns to its elasticity, pushes the limiting block 4332 to abut against the ventilation cylinder 41, and fixes the position of the switching cylinder 43. At this time, the heat dissipation port opens, and the heat is discharged through the heat dissipation channel in the metal block 3 and the strip opening 431 of the switching cylinder 43 through the heat dissipation port of the ventilation cylinder 41. The dustproof net 42 inside the heat dissipation port blocks dust and other impurities from entering.

[0041] When heat dissipation is not required or needs to be reduced, the sleeve 442 is rotated in the reverse direction, causing the strip-shaped opening 431 of the switching cylinder 43 to misalign with the heat dissipation opening, thus closing the heat dissipation opening. The ventilation cylinder 41 is magnetically connected to the magnetic block 31 on the outer metal block 3 via the magnetic sheet 45, enabling detachable installation for easy maintenance and repair.

[0042] Through the coordinated work of the above components, the quartz crystal resonator base structure can adapt to crystals of different sizes. At the same time, through the cooperation of components such as metal block 3, heat sink 2, and ventilation switching module 4, the heat dissipation problem of the crystal in a closed environment is effectively solved, ensuring the stable operation of the crystal.

[0043] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A quartz crystal resonator base structure adaptable to multiple series of wafers, characterized in that... It includes a base body (1), a heat sink (2) and a ventilation switching module (4); The heat sink (2) is installed at the bottom of the base body (1), and multiple spaced metal blocks (3) are installed at the bottom of the heat sink (2). The ventilation switching module (4) is detachably connected to the multiple metal blocks (3). The ventilation switching module (4) includes a ventilation cylinder (41), which is detachably connected to multiple metal blocks (3). Each of the multiple metal blocks (3) has a heat dissipation channel that communicates with the ventilation cylinder (41) and the base body (1). The ventilation cylinder (41) has a heat dissipation port on its outer periphery. The ventilation cylinder (41) has a switching part inside, which is used to open and close the heat dissipation port.

2. The quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 1, characterized in that, The switching part includes a switching cylinder (43) and an adjusting member (44). The switching cylinder (43) is disposed inside the ventilation cylinder (41) and its position is adjusted and rotated by the adjusting member (44). A strip-shaped opening (431) is provided on the switching cylinder (43).

3. The quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 2, characterized in that, The adjusting component (44) includes a rotating shaft (441), a sleeve (442), and an elastic limiting component (443). One end of the switching cylinder (43) is equipped with a rotating shaft (441) that rotates through one end of the ventilation cylinder (41). The sleeve (442) is fixedly mounted on the rotating shaft (441). A slot is provided on the side of the sleeve (442) near the ventilation cylinder (41). The elastic limiting component (443) is installed in the slot and abuts against one end of the ventilation cylinder (41).

4. The quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 3, characterized in that, The elastic limiting member (443) includes a spring (4331) which is installed in a slot and has a limiting block (4332) installed at the end of the spring (4331) that abuts against one end of the ventilation tube (41).

5. The quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 4, characterized in that, A dustproof net (42) is installed inside the heat dissipation vent on the ventilation duct (41).

6. The quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 5, characterized in that, A magnetic sheet (45) is installed at the other end of the ventilation duct (41), and a magnetic block (31) is installed on the outer metal block (3). The ventilation duct (41) slides through multiple metal blocks (3) and is magnetically connected to the magnetic block (31) through the magnetic sheet (45).

7. A quartz crystal resonator base structure adaptable to multiple series of wafers according to claim 6, characterized in that, The base body (1) is equipped with a multi-layer lead PAD (101).

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