A multi-band frequency source component

Abstract

This utility model discloses a multi-band frequency source component, belonging to the technical field of frequency source equipment. The multi-band frequency source component includes a housing, with a base plate fixedly installed at the bottom of the housing. Multiple evenly distributed electromagnetic shielding partitions are fixedly installed on the upper end of the base plate, dividing the internal space of the housing into multiple cavities. Multiple frequency synthesis modules corresponding to the cavities are electrically installed on the upper end of the base plate. An inspection port is provided at the upper end of the housing, with a matching quick-release assembly slidably installed at the inspection port. A cooling fan corresponding to the multiple frequency synthesis modules is fixedly installed at the rear end of the housing. The electromagnetic shielding partitions divide the internal space into independent cavities, allowing each frequency synthesis module to operate in a closed environment, effectively blocking signal crosstalk and ensuring that signals of different frequency bands do not interfere with each other, significantly improving signal purity and stability. The quick-release assembly, through a sliding cover and threaded fixing structure, enables independent replacement of the modules.

Description

Technical Field

[0001] This utility model relates to the field of frequency source equipment technology, and more specifically, to a multi-band frequency source component. Background Technology

[0002] With the rapid development of wireless communication technology, from 5G communication to IoT applications, the demand for multi-band signals from devices is growing exponentially. For example, radar systems need to cover multiple frequency bands such as L, S, C, and X to achieve multi-target detection, and testing instruments need to generate continuous signals from low to high frequencies to verify equipment performance. However, traditional frequency source components mostly adopt a single-band design, requiring external switching devices to achieve frequency band conversion, which increases system complexity, raises costs, and limits flexibility.

[0003] Although some existing technologies attempt to meet the requirements by integrating multiple frequency band modules, the problem of electromagnetic interference between modules has not been fundamentally solved. The radiation characteristics of high-frequency signals make it easy for modules of different frequency bands to form mutual coupling, resulting in increased phase noise and aggravated harmonic distortion of the output signal. For example, in a multi-band radar system, the harmonics of the X-band module may fall into the operating range of the L-band, causing false target interference and seriously affecting the reliability of the system.

[0004] As a core component of electronic systems, the maintainability of frequency source modules directly impacts equipment availability. In traditional designs, module replacement requires complete disassembly of the casing, a complex and time-consuming process. For example, in radar systems, replacing a faulty X-band module necessitates disassembling the entire frequency source casing, taking several hours and extending system downtime. Utility Model Content

[0005] 1. Technical problems to be solved

[0006] To address the problems existing in the prior art, the purpose of this utility model is to provide a multi-band frequency source component. It divides the internal space into independent cavities through an electromagnetic shielding partition. Each frequency synthesis module works in a closed environment, effectively blocking signal crosstalk and ensuring that signals of different frequency bands do not interfere with each other, significantly improving signal purity and stability. Furthermore, the component can be quickly disassembled and assembled using a sliding cover and a threaded fixing structure, enabling independent replacement of the modules.

[0007] 2. Technical Solution

[0008] To solve the above problems, the present invention adopts the following technical solution.

[0009] A multi-band frequency source component includes a housing, a base plate fixedly mounted at the bottom of the housing, a plurality of evenly distributed electromagnetic shielding partitions fixedly mounted at the top of the base plate, and the electromagnetic shielding partitions dividing the space inside the housing into a plurality of cavities, a plurality of frequency synthesis modules corresponding to the cavities electrically mounted at the top of the base plate, an inspection port provided at the top of the housing, a matching quick-release assembly slidably mounted at the inspection port, and a cooling fan corresponding to the plurality of frequency synthesis modules fixedly mounted at the rear end of the housing.

[0010] Furthermore, the quick-release assembly includes a cover plate that matches the inspection port. The cover plate has mounting holes, and screws are inserted into the mounting holes. The upper part of the outer casing has multiple threaded grooves that match the screws. A transparent window is embedded in the center of the cover plate. Slider blocks are fixedly connected to both ends of the cover plate. Sliding grooves that match the sliders are opened on both sides of the inspection port. An auxiliary plate is also fixedly connected to the upper part of the cover plate. The cover plate and the outer casing can be quickly disassembled and assembled using screws, thereby enabling independent upgrades and replacements of the frequency synthesis module. The transparent window allows observation of the internal workings without opening, and the sliders can cooperate with the sliding grooves to allow the cover plate to slide stably on the outer casing.

[0011] Furthermore, the cover plate has multiple arrays of heat dissipation holes, and multiple arrays of heat dissipation fins are fixedly connected to the left and right side walls of the outer shell. Together with the cooling fan, they form a convection heat dissipation channel, which can achieve a good heat dissipation effect.

[0012] Furthermore, the lower end of the outer casing is provided with four evenly distributed adjustment grooves, and matching threaded support feet are threadedly installed in the adjustment grooves. Anti-slip pads are fixedly installed at the lower end of the threaded support feet to adjust the level of the outer casing and prevent slippage, thereby improving stability during operation.

[0013] Furthermore, the substrate integrates a power supply unit and a frequency switching control unit, which is electrically connected to multiple frequency synthesis modules and is used to select and switch one or more outputs of the multiple frequency synthesis modules according to an external input signal.

[0014] Furthermore, the output terminal of the frequency switching control unit is connected to a power amplifier module for amplifying the selected frequency signal. The power amplifier module is connected to a filter for filtering out stray signals and improving the purity of the output signal.

[0015] Furthermore, the frequency switching control unit includes:

[0016] A microcontroller is used to receive and interpret external control signals;

[0017] A switching matrix, connected to the microcontroller, switches the output paths of the multiple frequency synthesis modules according to the instructions of the microcontroller.

[0018] Furthermore, the frequency synthesis module includes:

[0019] A phase-locked loop (PLL) circuit is used to lock in and generate a stable reference frequency signal;

[0020] A frequency extension unit, connected to the phase-locked loop circuit, is used to extend the reference frequency signal to the target frequency band.

[0021] 3. Beneficial Effects

[0022] Compared with existing technologies, the advantages of this utility model are:

[0023] (1) This scheme divides the internal space into independent cavities by electromagnetic shielding partitions. Each frequency synthesis module works in a closed environment, effectively blocking signal crosstalk and ensuring that signals in each frequency band do not interfere with each other, significantly improving signal purity and stability.

[0024] (2) The quick-release assembly designed in this solution uses a sliding cover and a threaded fixing structure to achieve independent replacement of the module. Maintenance personnel only need to slide the cover to the inspection port, loosen the screws to remove the target module, and then re-fix the screws and reset the cover after replacement, which significantly reduces maintenance costs. At the same time, it supports online upgrade of frequency band modules and improves the expandability of the equipment. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ;

[0027] Figure 3 This is a schematic diagram of the quick-assembly and disassembly component in this utility model;

[0028] Figure 4 This is a cross-sectional view of the present invention;

[0029] Figure 5 This is a flowchart of the present invention.

[0030] Explanation of the labels in the diagram:

[0031] 1. Outer shell; 2. Quick-release assembly; 21. Cover plate; 22. Transparent window; 23. Screws; 24. Auxiliary plate; 25. Slider; 26. Heat dissipation holes; 3. Cooling fan; 4. Threaded support feet; 5. Base plate; 6. Frequency synthesis module; 7. Heat dissipation fins; 8. Electromagnetic shielding plate. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0033] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] Example 1:

[0036] Please see Figure 1-4 A multi-band frequency source component includes a housing 1 made of aluminum alloy with anodized surface to enhance corrosion resistance. A substrate 5 is fixedly installed at the bottom of the housing 1. The substrate 5 is a multilayer FR4 circuit board with gold plating to reduce signal loss. Multiple evenly distributed electromagnetic shielding partitions 8 are fixedly installed on the upper end of the substrate 5, and the electromagnetic shielding partitions 8 divide the space inside the housing 1 into multiple cavities. Multiple frequency synthesis modules 6 corresponding to the cavities are electrically installed on the upper end of the substrate 5. An inspection port is provided on the upper end of the housing 1, and a matching quick-release assembly 2 is slidably installed at the inspection port. A cooling fan 3 corresponding to the multiple frequency synthesis modules 6 is fixedly installed at the rear end of the housing 1.

[0037] The quick-release assembly 2 includes a cover plate 21 that matches the access panel. The cover plate 21 has mounting holes, and screws 23 are inserted into the mounting holes. The upper part of the outer casing 1 has multiple threaded grooves that match the screws 23. A transparent window 22 is embedded in the center of the cover plate 21. Slider 25 is fixedly connected to both ends of the cover plate 21. Slider grooves that match the slider 25 are opened on both sides of the access panel. An auxiliary plate 24 is also fixedly connected to the upper end of the cover plate 21. The cover plate 21 and the outer casing 1 can be quickly disassembled and assembled using the screws 23, thereby enabling independent upgrades and replacements of the frequency synthesis module 6. The transparent window 22 allows observation of the internal working conditions without opening. The slider 25 can cooperate with the slide grooves to allow the cover plate 21 to slide stably on the outer casing 1.

[0038] The cover plate 21 has multiple arrays of heat dissipation holes 26, and multiple arrays of heat dissipation fins 7 are fixedly connected to the left and right side walls of the outer shell 1. Together with the cooling fan 3, they form a convection heat dissipation channel, which can achieve a good heat dissipation effect.

[0039] The lower end of the outer casing 1 has four evenly distributed adjustment slots. Matching threaded support feet 4 are threadedly installed in the adjustment slots. Anti-slip pads are fixedly installed at the lower end of the threaded support feet 4 to adjust the level of the outer casing 1 and prevent slippage, thereby improving the stability during operation.

[0040] The substrate 5 integrates a power supply unit and a frequency switching control unit. The frequency switching control unit is electrically connected to multiple frequency synthesis modules 6 and is used to select and switch one or more outputs of the multiple frequency synthesis modules according to the external input signal.

[0041] The output of the frequency switching control unit is connected to a power amplifier module, which amplifies the selected frequency signal. The power amplifier module is connected to a filter, which filters out stray signals and improves the purity of the output signal.

[0042] The frequency switching control unit includes:

[0043] A microcontroller is used to receive and interpret external control signals;

[0044] The switch matrix, connected to the microcontroller, switches the output paths of multiple frequency synthesis modules according to the microcontroller's instructions. The switch matrix is ​​an RF switch array that can quickly respond to and switch high-frequency signal paths, ensuring the stability and low loss of signal transmission.

[0045] The frequency synthesis module includes:

[0046] A phase-locked loop (PLL) circuit is used to lock in and generate a stable reference frequency signal;

[0047] A frequency extension unit, connected to a phase-locked loop circuit, is used to extend a reference frequency signal to a target frequency band. The frequency extension unit is one or more combinations of a frequency multiplier, frequency divider, or frequency mixer, used to multiply, reduce, or modulate the frequency.

[0048] It should be noted that in this embodiment:

[0049] Frequency synthesis module 6 is connected to substrate 5 via a standardized interface:

[0050] Phase-locked loop circuit: uses ADF4351 chip, built-in VCO, frequency range 35MHz-4.4GHz;

[0051] Frequency spreading unit:

[0052] Frequency multiplier: AMK-2-13;

[0053] Frequency divider: HMC7044, frequency division ratio 1-16;

[0054] Mixer: HMC557, supports local oscillator-RF mixing.

[0055] Frequency switching control unit:

[0056] Microcontroller: STM32F4 series, 168MHz clock speed, integrated SPI / I2C interface;

[0057] Switching matrix: HMC1114LP4E, 16-channel RF switches, insertion loss 0.8dB, isolation 60dB.

[0058] Power amplifier module model: HMC453ST89, gain 20dB, output power +23dBm;

[0059] Filter: SAW filter, out-of-band rejection ≥40dB.

[0060] The working principle of this utility model is as follows:

[0061] 1. Signal generation and switching

[0062] External input signals, such as SPI commands, are parsed by the microcontroller to generate frequency switching control signals;

[0063] The switching matrix selects the corresponding frequency synthesis module according to the control signal, and the phase-locked loop circuit in the module generates the reference frequency signal.

[0064] The frequency extension unit extends the reference signal to the target frequency band, amplifies it through the power amplifier module, filters out stray signals, and finally outputs a clean frequency signal.

[0065] 2. Modular collaborative work

[0066] Multiple frequency synthesis modules 6 on substrate 5 operate independently, and electromagnetic interference is isolated by electromagnetic shielding partition 8.

[0067] The cooling fan 3 and the heat sink 7 form a convection channel, which, together with the heat dissipation holes 26 on the cover plate 21, quickly dissipates the heat from the module.

[0068] Quick assembly and disassembly supports independent module replacement: slide the cover 21 to the access port, loosen the screws 23, and remove the target module. After replacing the new module, re-tighten the screws and slide the cover 21 back to its original position.

[0069] Example 2:

[0070] See Figure 5 A temperature-controlled crystal oscillator (not shown) is integrated on substrate 5 to generate a highly stable reference frequency signal. The reference signal is split into two paths by power divider 1:

[0071] The first path: The signal passes through the attenuation amplification unit and harmonic generator (such as HMC-C055) in sequence to generate multiple X-band harmonic signals; the required frequency points are selected by the switching filter group (including SAW filter), and after being amplified by the power amplifier (HMC453ST89), they are input to the mixer (HMC557) as the local oscillator signal.

[0072] Second path: Input power divider 2, further split into two signals:

[0073] Path A: The signal is input to the ADF4351 phase-locked loop chip via the attenuation and amplification unit. It is then programmed and controlled by the microcontroller (STM32F4) to generate a variable intermediate frequency signal (e.g., 1GHz-2GHz). After spurious emissions are filtered out by the switching filter bank 4, the signal is boosted to the target power by the amplifier and input as the intermediate frequency signal to the mixer (HMC557).

[0074] Path B: Input to power divider 3, split into two signals:

[0075] Sub-path 1: The signal is input to the HMC7044 frequency divider via the attenuation and amplification unit. The low-frequency signal (e.g., 100MHz-500MHz) is generated by controlling the division ratio. After the spurious signals are filtered out by the switching filter group 2, the signal is output as signal 2 by the amplifier.

[0076] Sub-path 2: Input to the AMK-2-13 frequency multiplier, multiply the reference frequency to the target frequency band (such as C-band), and output signal 3 after passing through the filtering and amplification unit (including bandpass filter);

[0077] The mixer (HMC557) mixes the local oscillator signal with the intermediate frequency signal to generate the target radio frequency signal (such as the X-band); the mixer output is filtered by the switching filter group 1 (including the adjustable filter) to remove spurious components, and finally outputs a clean frequency band signal (output 1) through the power amplifier.

[0078] The frequency switching control unit parses external instructions through a microcontroller and dynamically controls the switching matrix (HMC1114LP4E) to switch the paths of each frequency band, thereby realizing the rapid switching and synthesis of multi-frequency band signals.

[0079] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A multi-band frequency source component, comprising a housing (1), characterized in that: A base plate (5) is fixedly installed at the bottom of the outer shell (1). Multiple electromagnetic shielding partitions (8) are fixedly installed at the upper end of the base plate (5), and the electromagnetic shielding partitions (8) divide the space inside the outer shell (1) into multiple cavities. Multiple frequency synthesis modules (6) corresponding to the cavities are electrically installed at the upper end of the base plate (5). An inspection port is opened at the upper end of the outer shell (1). A matching quick disassembly assembly (2) is slidably installed at the inspection port. A cooling fan (3) corresponding to the multiple frequency synthesis modules (6) is fixedly installed at the rear end of the outer shell (1). The quick-release assembly (2) includes a cover plate (21) that matches the access port. The cover plate (21) has mounting holes and screws (23) inserted into the mounting holes. The upper part of the outer shell (1) has multiple threaded grooves that match the screws (23). A transparent window (22) is embedded in the center of the cover plate (21). Slider (25) is fixedly connected to both the left and right ends of the cover plate (21). Sliding grooves that match the sliders (25) are opened on both sides of the access port. An auxiliary plate (24) is also fixedly connected to the upper end of the cover plate (21).

2. The multi-band frequency source component according to claim 1, characterized in that: The cover plate (21) has multiple arrays of heat dissipation holes (26), and multiple arrays of heat dissipation fins (7) are fixedly connected to the left and right side walls of the outer shell (1).

3. A multi-band frequency source component according to claim 1, characterized in that: The lower end of the outer shell (1) is provided with four evenly distributed adjustment grooves, and the adjustment grooves are threaded with matching threaded support feet (4), and the lower end of the threaded support feet (4) is fixedly installed with anti-slip pads.

4. A multi-band frequency source component according to claim 1, characterized in that: The substrate (5) integrates a power supply unit and a frequency switching control unit. The frequency switching control unit is electrically connected to multiple frequency synthesis modules (6) and is used to select and switch one or more outputs of the multiple frequency synthesis modules according to the external input signal.

5. A multi-band frequency source component according to claim 4, characterized in that: The output of the frequency switching control unit is connected to a power amplifier module for amplifying the selected frequency signal. The power amplifier module is connected to a filter for filtering out stray signals and improving the purity of the output signal.

6. A multi-band frequency source component according to claim 5, characterized in that: The frequency switching control unit includes: A microcontroller is used to receive and interpret external control signals; A switching matrix, connected to the microcontroller, switches the output paths of the multiple frequency synthesis modules according to the instructions of the microcontroller.

7. A multi-band frequency source component according to claim 6, characterized in that: The frequency synthesis module includes: A phase-locked loop (PLL) circuit is used to lock in and generate a stable reference frequency signal; A frequency extension unit, connected to the phase-locked loop circuit, is used to extend the reference frequency signal to the target frequency band.

Images