A vibrating plate with positive and negative electrode conductive structure
By designing a fixed bracket and a conductive glue injection ring on the vibrating plate, the problems of unstable wire bonding and complex riveting in traditional vibrating plates are solved, achieving stable conductivity and low-cost production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XIAOFEI NIU TECH CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-06-30
AI Technical Summary
Traditional vibratory plates have poor stability in their wire-connected circuits, and the riveting process is complex, resulting in high production costs and easy damage. Furthermore, short circuits are prone to occur at the riveting joints.
The design employs a first and second fixed bracket. Conductive circuits are set on the thin film, and an immersion gold groove is opened on the circuit board. The positive and negative electrodes are riveted by injecting a conductive adhesive hole ring. Anti-slip pads and fixing holes are combined to ensure a stable connection.
Stable conduction between the positive and negative poles of the vibrating plate was achieved, simplifying the riveting and welding process, improving production efficiency and circuit stability, and reducing production costs.
Smart Images
Figure CN224439288U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of positive and negative electrode conduction structure design for a vibrating plate, specifically a positive and negative electrode conduction structure for a vibrating plate. Background Technology
[0002] Traditional planar magnetic diaphragms: ① A riveting process is used to connect the diaphragm panel to the base shell using conductive metal rivets. Due to the complexity of the riveting process, it requires relatively high skill levels from technicians and is prone to damage, resulting in low first-pass yield. ② In addition to the riveting process, another traditional method for planar magnetic diaphragms is to directly solder wires onto the diaphragm to achieve circuit continuity. Conductivity refers to the state where a valve or arm exhibits low resistance and allows forward current to flow. Conductivity describes the smoothness with which current flows through a conductor; for example, a high conductor resistance results in low conductivity, while low resistance results in high conductivity.
[0003] Traditional conduction methods have the following problems: 1. The solder joints at the riveting points are difficult to handle, resulting in high circuit instability and occasional short circuits; 2. The riveting process is complex, increasing the technical difficulty and thus affecting mass production, leading to increased production costs. Therefore, a vibration plate positive and negative pole conduction structure is proposed. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a conductive structure for the positive and negative poles of a vibrating plate, thereby solving the problems mentioned in the background art, such as poor stability of traditional wire bonding circuits, drop during riveting processes, breakage and damage of the metal conductive film during collisions, and the complex process of welding wires to the positive and negative poles of the diaphragm circuit.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model provides the following technical solution: a positive and negative electrode conductive structure for a vibrating plate, comprising a first fixed bracket, a second fixed bracket at the lower end of the first fixed bracket, a thin film between the first fixed bracket and the second fixed bracket, a conductive circuit at the upper end of the thin film, fixed inner grooves on both sides of the upper end of the first fixed bracket, the fixed inner grooves being integrally formed with the first fixed bracket, a first circuit board and a second circuit board respectively installed inside the two fixed inner grooves, the first circuit board and the second circuit board being bonded and fixed to the first fixed bracket, a positive electrode riveting groove on one side of the upper end of the first circuit board, a negative electrode riveting groove on one side of the upper end of the second circuit board, a first conductive glue injection ring installed inside the positive electrode riveting groove, and a second conductive glue injection ring installed inside the negative electrode riveting groove.
[0008] Preferably, the first conductive adhesive injection ring is fixedly connected to the positive electrode riveting groove by a fixing bracket, and the second conductive adhesive injection ring is fixedly connected to the negative electrode riveting groove by a fixing bracket.
[0009] Preferably, six fixing holes are provided on one side of the upper end of the first fixing bracket, and the fixing holes are integrally formed with the first fixing bracket.
[0010] Preferably, six fixing columns evenly distributed in a ring are installed on one side of the upper end of the second fixing bracket, and the fixing columns are fixedly connected to the second fixing bracket.
[0011] Preferably, anti-slip inner grooves are provided on both sides of the lower outer end of the first fixed bracket, and anti-slip pads are provided on both sides of the upper end of the second fixed bracket.
[0012] Preferably, the anti-slip inner groove is integrally formed with the first fixed bracket.
[0013] Preferably, the anti-slip pad is fixedly connected to the second fixed bracket.
[0014] Preferably, the anti-slip pad is adapted to the anti-slip inner groove.
[0015] (III) Beneficial Effects
[0016] Compared with the prior art, this utility model provides a vibrating plate with a positive and negative electrode conductive structure, which has the following beneficial effects:
[0017] 1. The first circuit board and the second circuit board are installed in the fixed inner groove at the upper end of the first fixed bracket. The upper end of the first circuit board and the second circuit board is provided with an immersion gold groove. Conductive adhesive is injected through the first conductive adhesive injection ring and the second conductive adhesive injection ring, so that the conductive circuit is connected to the circuit of the first circuit board and the second circuit board. The solder joint is positioned by the positive and negative riveting grooves, which makes the riveting work more convenient and faster. The first circuit board and the second circuit board are bonded to the first fixed bracket. After power is applied, the current flows from the positive pole to the conductive circuit and is conducted to the negative pole output, thus forming a complete circuit. This realizes the positive and negative pole conduction design of the vibrating plate.
[0018] 2. The conductive circuit is set on the film. The first fixing bracket is attached to the upper end of the film, and the second fixing bracket is attached to the lower end of the film. The anti-slip inner groove at the lower end of the first fixing bracket and the anti-slip pad at the upper end of the second fixing bracket are aligned. When the anti-slip pad and the anti-slip inner groove are combined, the film between them is pulled. The anti-slip pad keeps the film in a tight and fixed state. At the same time, the first fixing bracket and the second fixing bracket are connected to the fixing post through fixing holes to make the connection more stable. Attached Figure Description
[0019] Figure 1 This is a perspective view of the overall structure of this utility model;
[0020] Figure 2 This is a perspective view of the first fixed bracket structure of this utility model;
[0021] Figure 3 This is a perspective view of the second fixed bracket structure of this utility model;
[0022] Figure 4 This is a three-dimensional view of the thin film and conductive circuit structure of this utility model;
[0023] Figure 5 This is a schematic diagram of the anti-slip inner groove structure at the bottom of the first fixed bracket of this utility model.
[0024] In the figure: 1. First fixing bracket; 2. Fixing hole; 3. First circuit board; 4. Positive electrode riveting groove; 5. First conductive adhesive injection ring; 6. Thin film; 7. Conductive circuit; 8. Second fixing bracket; 9. Fixing post; 10. Fixing inner groove; 11. Anti-slip pad; 12. Anti-slip inner groove; 13. Second circuit board; 14. Negative electrode riveting groove; 15. Second conductive adhesive injection ring. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] This utility model provides a technical solution: a positive and negative electrode conductive structure for a vibrating plate. (See also...) Figure 1 , Figure 2 , Figure 3 and Figure 4The system includes a first fixed bracket 1, a second fixed bracket 8 at the lower end of the first fixed bracket 1, a thin film 6 between the first fixed bracket 1 and the second fixed bracket 8, a conductive circuit 7 at the upper end of the thin film 6, and two fixing inner grooves 10 on both sides of the upper end of the first fixed bracket 1, which are integrally formed with the first fixed bracket 1. A first circuit board 3 and a second circuit board 13 are respectively installed inside the two fixing inner grooves 10, and the first circuit board 3 and the second circuit board 13 are bonded and fixed to the first fixed bracket 1. A positive electrode riveting groove 4 is provided on one side of the upper end of the first circuit board 3, and a negative electrode riveting groove 14 is provided on one side of the upper end of the second circuit board 13. A first conductive glue injection ring is installed inside the positive electrode riveting groove 4. 5. A second conductive adhesive injection ring 15 is installed inside the negative electrode riveting groove 14. Immersion gold grooves are opened at the upper ends of the first circuit board 3 and the second circuit board 13. Conductive adhesive is injected through the first conductive adhesive injection ring 5 and the second conductive adhesive injection ring 15, thereby connecting the conductive circuit 7 with the circuits of the first circuit board 3 and the second circuit board 13. The solder joints are positioned by the positive electrode riveting groove 4 and the negative electrode riveting groove 14, making the riveting work more convenient and faster. The first circuit board 3 and the second circuit board 13 are bonded to the first fixed bracket 1. After power is applied, the current is introduced from the positive electrode, conducted to the conductive circuit 7, and then conducted to the negative electrode output, thereby forming a complete circuit. This realizes the positive and negative electrode conduction design of the vibrating plate.
[0027] Furthermore, the first conductive adhesive injection ring 5 is fixedly connected to the positive electrode riveting groove 4 through a fixing bracket, and the second conductive adhesive injection ring 15 is fixedly connected to the negative electrode riveting groove 14 through a fixing bracket.
[0028] Furthermore, six fixing holes 2 are evenly distributed in a ring on one side of the upper end of the first fixing bracket 1, and the fixing holes 2 are integrally formed with the first fixing bracket 1.
[0029] Furthermore, six fixing posts 9 evenly distributed along a ring are installed on one side of the upper end of the second fixing bracket 8, and the fixing posts 9 are fixedly connected to the second fixing bracket 8. The first fixing bracket 1 and the second fixing bracket 8 are stably connected through the combination of the fixing posts 9 and the fixing holes 2.
[0030] For further information, please refer to [link / reference]. Figure 1 , Figure 3 and Figure 5 The first fixed bracket 1 has anti-slip inner grooves 12 on both sides of its lower outer end, and the second fixed bracket 8 has anti-slip pads 11 on both sides of its upper end.
[0031] Furthermore, the anti-slip inner groove 12 is integrally formed with the first fixed bracket 1.
[0032] Furthermore, the anti-slip mat 11 is fixedly connected to the second fixed bracket 8.
[0033] Furthermore, the anti-slip pad 11 is adapted to the anti-slip inner groove 12. Through the combination of the anti-slip pad 11 and the anti-slip inner groove 12, not only is the connection between the first fixed bracket 1 and the second fixed bracket 8 more stable, but the membrane 6 between them is also pulled, and the membrane 6 is kept in a tight and fixed state by the anti-slip pad 11.
[0034] The working principle of this device is as follows: A conductive circuit 7 is installed on a thin film 6. A first fixing bracket 1 is attached to the upper end of the thin film 6, and a second fixing bracket 8 is attached to the lower end of the thin film 6. The anti-slip inner groove 12 at the lower end of the first fixing bracket 1 and the anti-slip pad 11 at the upper end of the second fixing bracket 8 are aligned. The anti-slip pad 11 and the anti-slip inner groove 12 simultaneously pull the thin film 6 between them, keeping the thin film 6 taut and fixed. At the same time, the first fixing bracket 1 and the second fixing bracket 8 are further stabilized by the fixing hole 2 and the fixing post 9. A first circuit board 3 and a second circuit board 13 are installed in the fixing inner groove 10 at the upper end of the first fixing bracket 1. Immersion gold grooves are formed at the upper ends of the first circuit board 3 and the second circuit board 13. Conductive ports are respectively set at the positions corresponding to the first conductive glue injection ring 5 and the second conductive glue injection ring 15 in the conductive circuit 7. Conductive glue is injected through the first conductive glue injection ring 5 and the second conductive glue injection ring 15, so that the conductive ports of the conductive circuit 7 are connected to the circuits of the first circuit board 3 and the second circuit board 13 respectively. The solder joints are positioned by the positive riveting groove 4 and the negative riveting groove 14, making the riveting work more convenient and faster. The first circuit board 3 and the second circuit board 13 are bonded to the first fixed bracket 1. After power is applied, the current flows from the positive terminal to the conductive circuit 7 and is conducted to the negative terminal output, thus forming a complete circuit. This realizes the positive and negative terminal conduction design of the vibrating plate.
[0035] The thin film 6 and the conductive circuit 7 can be connected by riveting. The polarity riveting groove 4 and the negative polarity riveting groove 14 facilitate the positioning of the welding point and the riveting process. For specific riveting connection methods, please refer to CN218387865U, which will not be elaborated here.
[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A vibrating plate with positive and negative electrodes in a conductive structure, characterized in that: The system includes a first fixed bracket (1), a second fixed bracket (8) at the lower end of the first fixed bracket (1), a thin film (6) between the first fixed bracket (1) and the second fixed bracket (8), a conductive circuit (7) at the upper end of the thin film (6), a fixed inner groove (10) on both sides of the upper end of the first fixed bracket (1), and the fixed inner groove (10) is integrally formed with the first fixed bracket (1). A first circuit board (3) and a second circuit board (13) are respectively installed inside the two fixed inner grooves (10), and the first circuit board (3) and the second circuit board (13) are bonded and fixed to the first fixed bracket (1). A positive electrode riveting groove (4) is provided on one side of the upper end of the first circuit board (3), and a negative electrode riveting groove (14) is provided on one side of the upper end of the second circuit board (13). A first conductive glue hole injection ring (5) is installed inside the positive electrode riveting groove (4), and a second conductive glue hole injection ring (15) is installed inside the negative electrode riveting groove (14).
2. The vibrating plate positive and negative electrode conductive structure according to claim 1, characterized in that: The first conductive adhesive injection ring (5) is fixedly connected to the positive electrode riveting groove (4) by a fixing bracket, and the second conductive adhesive injection ring (15) is fixedly connected to the negative electrode riveting groove (14) by a fixing bracket.
3. The vibrating plate positive and negative electrode conductive structure according to claim 1, characterized in that: The first fixed bracket (1) has six fixed holes (2) evenly distributed in a ring on one side of its upper end, and the fixed holes (2) are integrally formed with the first fixed bracket (1).
4. The positive and negative electrode conductive structure of the vibrating plate according to claim 1, characterized in that: Six fixed posts (9) evenly distributed along a ring are installed on one side of the upper end of the second fixed bracket (8), and the fixed posts (9) are fixedly connected to the second fixed bracket (8).
5. The positive and negative electrode conductive structure of the vibrating plate according to claim 1, characterized in that: The first fixed bracket (1) has anti-slip inner grooves (12) on both sides of the lower outer end, and the second fixed bracket (8) has anti-slip pads (11) on both sides of the upper end.
6. The positive and negative electrode conductive structure of the vibrating plate according to claim 5, characterized in that: The anti-slip inner groove (12) is integrally formed with the first fixed bracket (1).
7. The positive and negative electrode conductive structure of the vibrating plate according to claim 5, characterized in that: The anti-slip pad (11) is fixedly connected to the second fixed bracket (8).
8. The positive and negative electrode conductive structure of the vibrating plate according to claim 5, characterized in that: The anti-slip pad (11) is adapted to the anti-slip inner groove (12).