A high thermal conductivity graphene-copper composite heat sink

Abstract

This invention provides a high thermal conductivity graphene-copper composite heat sink, including a passive heat dissipation mechanism and an active heat dissipation mechanism disposed inside the passive heat dissipation mechanism. The passive heat dissipation mechanism includes: a heat-conducting plate, a copper pillar disposed on the top of the heat-conducting plate, a secondary heat-conducting pillar disposed on the outer wall of the copper pillar, fins disposed on the outer wall of the copper pillar, a foamed copper composite core disposed inside the copper pillar, and graphene aerogel disposed inside the copper pillar. When in use, the heat-conducting plate, copper pillar, secondary heat-conducting pillar, and fins form a highly efficient heat dissipation network, expanding the heat dissipation area and accelerating heat conduction and diffusion. The foamed copper composite core and graphene aerogel fill the interior of the copper pillar; the former's porous structure enhances air convection, while the latter, with its ultra-high thermal conductivity, enables rapid heat transfer. The two work together to improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a high thermal conductivity graphene-copper composite heat sink. Background Technology

[0002] As electronic devices develop towards high performance and miniaturization, the heat generated during their operation increases dramatically, placing higher demands on heat dissipation efficiency. Traditional heat sinks are unable to meet the heat dissipation needs under complex operating conditions. Graphene has excellent thermal conductivity and mechanical properties, while copper has good thermal conductivity and processing performance. Combining the two in a heat sink can effectively integrate their advantageous characteristics, achieving efficient heat dissipation and structural optimization.

[0003] When existing graphene-copper composite heat sinks are in use, there are shortcomings such as insufficient synergy of heat dissipation structure and the need to improve internal heat conduction efficiency.

[0004] To address this, a high thermal conductivity graphene-copper composite heat sink is proposed. Utility Model Content

[0005] In view of this, the present invention aims to provide a high thermal conductivity graphene-copper composite heat sink to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial alternative.

[0006] The technical solution of this utility model embodiment is implemented as follows: A high thermal conductivity graphene copper composite heat sink includes a passive heat dissipation mechanism and an active heat dissipation mechanism disposed inside the passive heat dissipation mechanism. The passive heat dissipation mechanism includes: a heat-conducting plate, a copper pillar disposed on the top of the heat-conducting plate, a secondary heat-conducting pillar disposed on the outer wall of the copper pillar, fins disposed on the outer wall of the copper pillar, a foamed copper composite core disposed inside the copper pillar, and graphene aerogel disposed inside the copper pillar.

[0007] In some embodiments, a fixing ring is provided on the outer wall of the heat-conducting plate, and a base is provided at one end of the copper pillar.

[0008] In some embodiments, the active heat dissipation mechanism includes a fixed shell disposed inside the heat-conducting plate and a copper sheet disposed inside the fixed shell.

[0009] In some embodiments, a cooling plate is provided inside the fixed shell, a cooling chip is provided on the top of the cooling plate, a heat sink is provided on the top of the cooling chip, and a cooling fan is provided on the top of the heat sink.

[0010] In some embodiments, a copper cylinder is provided on the top of the heat sink, and a graphene patch is provided on the outer wall of the copper cylinder.

[0011] In some embodiments, an air outlet plate is provided on one side of the fixed shell, and an air outlet groove is provided inside the air outlet plate.

[0012] The present invention has the following advantages due to the adoption of the above technical solution:

[0013] A high thermal conductivity graphene-copper composite heat sink is disclosed. In use, the heat-conducting plate, copper pillars, secondary heat-conducting pillars, and fins form a highly efficient heat dissipation network, expanding the heat dissipation area and accelerating heat conduction and diffusion. The interior of the copper pillars is filled with a foamed copper composite core and graphene aerogel. The former's porous structure enhances air convection, while the latter, with its ultra-high thermal conductivity, enables rapid heat transfer. The two work together to improve heat dissipation efficiency. The combination of passive and active heat dissipation mechanisms meets the heat dissipation requirements of different operating conditions, and combines high thermal conductivity, structural stability, and adaptability to provide reliable heat dissipation for electronic devices.

[0014] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural diagram of the passive heat dissipation mechanism of this utility model;

[0017] Figure 2 This is an overall structural diagram of the present invention;

[0018] Figure 3 This is a cross-sectional structural diagram of the copper column of this utility model;

[0019] Figure 4 This is a cross-sectional view of the active heat dissipation mechanism of this utility model.

[0020] Figure label:

[0021] 100. Passive heat dissipation mechanism; 101. Fixing ring; 102. Heat-conducting plate; 103. Copper pillar; 104. Secondary heat-conducting pillar; 105. Fin; 106. Graphene aerogel; 107. Foamed copper composite core; 108. Base; 200. Active heat dissipation mechanism; 201. Fixing shell; 202. Copper sheet; 203. Cold-conducting plate; 204. Cooling chip; 205. Heat sink; 206. Copper cylinder; 207. Graphene patch; 208. Cooling fan; 209. Exhaust plate; 210. Exhaust duct. Detailed Implementation

[0022] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0024] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0025] Example:

[0026] like Figure 1-4 As shown, a high thermal conductivity graphene-copper composite heat sink includes a passive heat dissipation mechanism 100 and an active heat dissipation mechanism 200 installed inside the passive heat dissipation mechanism 100. The passive heat dissipation mechanism 100 includes: a heat-conducting plate 102, a copper pillar 103 installed on the top of the heat-conducting plate 102, a secondary heat-conducting pillar 104 installed on the outer wall of the copper pillar 103, and fins 105 installed on the outer wall of the copper pillar 103. The heat-conducting plate 102, copper pillar 103, secondary heat-conducting pillar 104 and fins 105 constitute a high-efficiency heat dissipation network. A foamed copper composite core 107 is installed inside the copper pillar 103, and graphene aerogel 106 is filled inside the copper pillar 103. The foamed copper composite core 107 and graphene aerogel 106 fill the interior of the copper pillar 103. The former enhances air convection with its porous structure, while the latter benefits from its ultra-high thermal conductivity.

[0027] In this embodiment, a fixing ring 101 is installed on the outer wall of the heat-conducting plate 102 to facilitate installation and docking, and a base 108 is installed at one end of the copper column 103.

[0028] In this embodiment, the active heat dissipation mechanism 200 includes a fixed shell 201 installed inside the heat conduction plate 102, and a copper sheet 202 installed inside the fixed shell 201. A cold conduction plate 203 is installed inside the fixed shell 201. A cooling chip 204 is installed on the top of the cold conduction plate 203. A heat dissipation plate 205 is installed on the top of the cooling chip 204. A cooling fan 208 is installed on the top of the heat dissipation plate 205.

[0029] In this embodiment, a copper cylinder 206 is installed on the top of the heat sink 205, and a graphene patch 207 is installed on the outer wall of the copper cylinder 206 to improve heat dissipation and heat conduction efficiency.

[0030] In this embodiment, an air outlet plate 209 is installed on one side of the fixed shell 201. An air outlet groove 210 is opened inside the air outlet plate 209, and the cooling fan 208 blows hot air through the air outlet groove 210 inside the air outlet plate 209.

[0031] In this embodiment: When in use, the heat-conducting plate 102, copper pillar 103, secondary heat-conducting pillar 104, and fins 105 form a high-efficiency heat dissipation network, expanding the heat dissipation area and accelerating heat conduction and diffusion. A copper foam composite core 107 and graphene aerogel 106 fill the interior of the copper pillar 103. The former's porous structure enhances air convection, while the latter, with its ultra-high thermal conductivity, enables rapid heat transfer. Together, they improve heat dissipation efficiency. The combination of passive and active heat dissipation mechanisms meets the heat dissipation needs of different operating conditions, possessing high thermal conductivity, structural stability, and adaptability, providing reliable heat dissipation for electronic equipment.

[0032] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A high thermal conductivity graphene-copper composite heat sink, comprising a passive heat dissipation mechanism (100) and an active heat dissipation mechanism (200) disposed inside the passive heat dissipation mechanism (100), characterized in that: A passive heat dissipation mechanism (100) includes: a heat-conducting plate (102), a copper pillar (103) disposed on the top of the heat-conducting plate (102), a secondary heat-conducting pillar (104) disposed on the outer wall of the copper pillar (103), fins (105) disposed on the outer wall of the copper pillar (103), a foamed copper composite core (107) disposed inside the copper pillar (103), and graphene aerogel (106) disposed inside the copper pillar (103).

2. The high thermal conductive graphene copper composite heat spreader of claim 1, wherein: The outer wall of the heat-conducting plate (102) is provided with a fixing ring (101), and one end of the copper pillar (103) is provided with a base (108).

3. The high thermal conductive graphene copper composite heat spreader of claim 2, wherein: The active heat dissipation mechanism (200) includes a fixed shell (201) disposed inside the heat-conducting plate (102) and a copper sheet (202) disposed inside the fixed shell (201).

4. The high thermal conductive graphene copper composite heat spreader of claim 3, wherein: The fixed shell (201) is provided with a cooling plate (203) inside, a cooling chip (204) is provided on the top of the cooling plate (203), a heat sink (205) is provided on the top of the cooling chip (204), and a heat sink fan (208) is provided on the top of the heat sink (205).

5. The high thermal conductive graphene copper composite heat spreader of claim 4, wherein: A copper cylinder (206) is provided on the top of the heat sink (205), and a graphene patch (207) is provided on the outer wall of the copper cylinder (206).

6. A high thermal conductivity graphene-copper composite heat sink according to claim 5, characterized in that: An air outlet plate (209) is provided on one side of the fixed shell (201), and an air outlet groove (210) is provided inside the air outlet plate (209).

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