Scintillation crystal surface polishing apparatus

Abstract

This utility model relates to the field of polishing device technology, and in particular to a polishing device for scintillation crystal surface. It includes a polishing frame for polishing a pressure-bearing scintillation crystal, a flexible clamping module located at the top corners of the polishing frame to flexibly hold the scintillation crystal, a circulation tank for circulating and filtering coolant connected to the bottom of the polishing frame, and polishing processing components for polishing the scintillation crystal surface corresponding to the polishing frame. The flexible clamping module uses flexible clamping blocks with floating blocks, and the clamping force is dynamically adjusted by internal magnetic blocks and electromagnets. Combined with spring rubber dampers to absorb vibration, it avoids edge chipping caused by stress concentration at the crystal edge. The bottom of the polishing sleeve is designed as a curved panel, forming a gradual contact with the crystal surface to reduce sudden changes in edge pressure. A filter plate inside the polishing frame pre-filters debris, and a filter column in the circulation tank further purifies the coolant.

Description

Technical Field

[0001] This utility model relates to the field of polishing device technology, and in particular to a polishing device for scintillation crystal surface. Background Technology

[0002] Scintillation crystals are crystalline materials that can convert the kinetic energy of high-energy particles into visible or ultraviolet light and emit light when bombarded by them. By using polishing fluid and polishing equipment, micron and nano-scale defects on the crystal surface are removed to achieve an atomically smooth surface, reduce light scattering, ensure the efficiency of X-ray and light signal conversion, and avoid fluorescence loss caused by surface micro-damage.

[0003] Traditional polishing devices use a flat disc made of rigid material, with a polishing pad or directly serving as a grinding disc, to hold scintillating crystals (usually processed one or more at a time). The disc can rotate or undergo planetary motion. The fixed scintillating crystals come into contact with the rotating polishing disc and move relative to each other under a set pressure. When the flat polishing disc contacts the flat crystal, the pressure distribution at the edge is uneven (often resulting in high pressure), which can easily lead to edge chipping, collapse, or over-removal of the crystal. This severely affects the light collection efficiency and uniformity of the scintillator. Furthermore, the polishing fluid at the crystal edge is easily thrown off, resulting in insufficient lubrication and cooling in that area, which exacerbates edge damage. Utility Model Content

[0004] In order to overcome the problem that in traditional polishing devices, when the planar polishing disc comes into contact with the planar crystal, the pressure distribution in the edge area is uneven (often high pressure), which can easily lead to edge chipping, collapse, or excessive removal of the crystal edge, seriously affecting the light collection efficiency and uniformity of the scintillator. In addition, the polishing fluid at the crystal edge is easily thrown off, resulting in insufficient lubrication and cooling in this area. This utility model provides a scintillator crystal surface polishing device.

[0005] The technical solution is as follows: a scintillation crystal surface polishing device, including a polishing frame for polishing the pressure scintillation crystal, a flexible clamping module for flexibly clamping the scintillation crystal at the four corners of the top of the polishing frame, a circulation tank for circulating and filtering coolant connected to the bottom of the polishing frame, a polishing processing component for polishing the surface of the scintillation crystal correspondingly provided on the polishing frame, and a three-dimensional adjustment module for driving the polishing processing component to rotate and adjust the operation on the outside of the polishing frame.

[0006] Furthermore, a filter plate is embedded in the center of the grinding frame, and several sets of filter holes are distributed on the filter plate. A guide plate that is fixed to the circulation box is symmetrically provided at the bottom of the grinding frame. A display screen is provided on the outside of the guide plate. An electrical control box that docks with the flexible clamping module is provided at each of the four corners of the grinding frame. The first lithium battery pack is provided inside the electrical control box. A sealing strip is attached to the inner side of the grinding frame.

[0007] Furthermore, both ends of the circulation box are equipped with disassembly plates, and handles are fixed to the disassembly plates. Several sets of filter columns are distributed inside the circulation box, and disassembly bolts are provided between the filter columns and the disassembly plates.

[0008] Furthermore, the flexible clamping module includes a connecting arm and a guide arm. One end of the connecting arm is fitted with a steering shaft, and the outer end of the steering shaft is connected to a first drive motor. The first drive motor drives the steering shaft to rotate the connecting arm. The end of the connecting arm away from the steering shaft is connected to a guide arm. A connecting shaft is provided between the guide arm and the connecting arm. Both ends of the connecting shaft are fitted with protective sleeves. The top of the protective sleeves is circumferentially fixed with graduations. A second lithium battery pack is fixed to the connecting arm. The second lithium battery pack is provided with a first cable that drives the connecting shaft to drive the guide arm and the connecting arm.

[0009] Furthermore, a push rod is installed at the end of the guide arm away from the connecting shaft. A cylinder is connected to the top of the push rod, and a flexible clamping block is connected to the bottom of the push rod. A second cable is provided between the cylinder and the first lithium battery pack. The cylinder drives the push rod to move the flexible clamping block up and down. Several sets of contact grooves are circumferentially opened on the outside of the flexible clamping block. The flexible clamping block is covered with a flexible layer. Several sets of floating blocks are provided on the flexible clamping block in the contact grooves. The floating blocks contain magnetic blocks, spring rubber dampers and springs. The floating blocks also contain battery packs, vibration sensors and electromagnets. An indicator light is electrically connected to the outside of the vibration sensor.

[0010] Furthermore, the three-dimensional adjustment module includes a connecting plate, a second guide rod at the center of the connecting plate, a first spring column connected to the upper end of the second guide rod, a spring rubber damper inside the first spring column, a first hydraulic cylinder at the bottom of the second guide rod, a first sleeve between the second guide rod and the first spring column, a crossbeam fixed to the end of the first sleeve away from the first spring column, the first hydraulic cylinder driving the second guide rod to move the first sleeve and the crossbeam up and down along the direction of the first spring column, the end of the crossbeam away from the connecting plate connected to a second sleeve that docks with the polishing component, the first guide rod inside the crossbeam, one end of the first guide rod being connected to... A second spring column is connected, and the first guide rod and the second spring column are connected to the second frame. The end of the first guide rod away from the second spring column is connected to a second hydraulic cylinder. The second hydraulic cylinder drives the first guide rod to move the second spring column and the second frame and polishing components laterally. Spring rubber dampers are provided inside the first spring column and the second spring column. A solution tank is connected to the rear end of the connecting plate. A base is connected to the bottom of the solution tank. A first lifting module is provided in the center of the solution tank. A first water pipe is provided at the bottom of the solution tank and connected to the circulation tank. The first lifting module includes a lifting pump and a control motor. A first extension pipe is connected to the outer end of the solution tank.

[0011] Furthermore, the polishing assembly includes a control box, with a second extension tube connected to the outside of the control box. A third water pipe, connected to the first extension tube, is located outside the second extension tube. A second lifting module, including a lifting pump and a control motor, is located at the center of the second extension tube. A fixed sleeve is connected to the end of the control box away from the second frame. A rotating rod is located at the center of the fixed sleeve. A second drive motor is connected to the top of the rotating rod. A polishing plate is connected to the bottom of the rotating rod. A curved panel is located at the center of the bottom of the polishing plate. A disassembly hole is opened at the center of the bottom of the polishing plate. The second drive motor drives the rotating rod to rotate the polishing plate. A second water pipe, communicating with the second extension tube, is located outside the fixed sleeve. A spray pipe is circumferentially located at the outer end of the polishing plate. An injector is located inside the spray pipe. A vibration module is located between the two sets of spray pipes. A vibrating plate and a wireless module are located inside the vibration module.

[0012] Furthermore, the control box has a flat panel at its center, and several sets of measuring spheres are arranged around the outside of the flat panel. The measuring spheres contain an ultrasonic transmitter, an ultrasonic receiver, and a wireless module. A signal line is located at the center of the flat panel, and the top of the signal line is connected to the control module.

[0013] The beneficial effects are: This utility model uses a flexible clamping block with floating blocks on a flexible clamping module, and dynamically adjusts the clamping force through internal magnetic blocks and electromagnets, and absorbs vibration with spring rubber dampers to avoid edge chipping caused by stress concentration at the crystal edge.

[0014] The bottom of the polishing sleeve is designed as a curved panel, which forms a gradual contact with the crystal surface, reducing sudden changes in edge pressure. The polishing frame has a built-in filter plate to pre-filter debris, and the filter column in the circulation box further purifies the coolant. The measuring ball (with built-in ultrasonic sensor) scans the crystal flatness in real time, monitors the overall polishing status, and improves the overall polishing effect. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the scintillation crystal surface polishing device of this utility model;

[0016] Figure 2 This is a schematic diagram of the grinding frame and circulation box of this utility model;

[0017] Figure 3 This is a schematic diagram of the flexible clamping module of this utility model;

[0018] Figure 4 This is a schematic diagram of the three-dimensional adjustment module of this utility model;

[0019] Figure 5 This is a schematic diagram of the polishing component of this utility model.

[0020] In the attached diagram, the following are the reference numerals: 1. Grinding frame; 2. Circulation box; 3. Flexible clamping module; 4. Three-dimensional adjustment module; 5. Polishing assembly; 101. Filter plate; 102. Filter hole; 103. Guide plate; 104. Display screen; 105. Electrical control box; 106. First lithium battery pack; 107. Sealing strip; 201. Handle; 202. Disassembly plate; 203. Filter column; 204. Disassembly bolt; 301. Connecting arm; 302. First drive motor; 303. Steering shaft; 304. Guide arm; 305. Connecting shaft; 306. Protective sleeve; 307. Scale; 308. Second lithium battery pack; 309. First cable; 310. Second cable; 311. Cylinder; 312. Push rod; 313. Flexible clamping block; 314. Contact groove; 315. Flexible layer; 316. Floating block; 317. Signal light; 40. 1. Connecting plate; 402. Base; 403. First water pipe; 404. First lifting module; 405. First extension pipe; 406. First guide rod; 407. Second guide rod; 408. First hydraulic cylinder; 409. First spring column; 410. First frame; 411. Cross frame; 412. Second hydraulic cylinder; 413. Second spring column; 501. Control box; 502. Control module; 503. Fixed sleeve; 504. Rotating rod; 505. Second drive motor; 506. Polishing plate; 507. Curved panel; 508. Spray pipe; 509. Disassembly hole; 510. Vibration module; 511. Second water pipe; 512. Flat plate; 513. Measuring ball; 514. Signal line; 515. Third water pipe; 516. Second extension pipe; 517. Second lifting module; 518. Second frame. Detailed Implementation

[0021] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0022] Existing feasible technologies have been identified.

[0023] Traditional scintillation crystal surface polishing device

[0024] Core components: typically based on the principle of mechanical polishing.

[0025] Polishing disc / polishing head: A flat disc made of rigid materials (such as cast iron or aluminum alloy) with a surface covered with a polishing pad (such as polyurethane or cloth) or used directly as a grinding disc.

[0026] Workpiece fixtures / carriers: used to hold scintillation crystals (usually for single or multiple simultaneous processing), and are typically rotatable or capable of planetary motion.

[0027] Pressure application mechanism: Applying vertical downward pressure to the polishing disc or workpiece via cylinders, hydraulic cylinders, counterweights, or servo motors.

[0028] Drive system: The motor drives the polishing disc to rotate (spindle motor), and sometimes also drives the workpiece carrier to rotate or perform planetary motion (counter-spindle motor).

[0029] Abrasive / polishing slurry supply system: Pumps and pipes that deliver a suspension or chemimechanical polishing slurry containing abrasives (such as diamond powder, alumina, cerium oxide) to the polishing interface.

[0030] The fixed scintillation crystal comes into contact with the rotating polishing disk (covered with a polishing pad) and moves relative to it under a set pressure.

[0031] Polishing fluid is continuously delivered to the contact area.

[0032] The polishing pad carries abrasive grains. Under pressure and relative motion, the abrasive grains perform micro-cutting, rolling, and possible chemical processing (CMP) on the crystal surface, gradually removing material and achieving surface smoothing and improved gloss.

[0033] The main structural defects are:

[0034] The edge effect is severe:

[0035] Rigid contact with planar disk: When a planar polishing disk comes into contact with a planar crystal, the pressure distribution in the edge area is uneven (often high pressure occurs), which can easily lead to edge chipping, collapse, or over-removal of the crystal edge ("Roll-off" effect), seriously affecting the light collection efficiency and uniformity of the scintillator.

[0036] Centrifugal force of workpiece rotation: Polishing fluid is easily thrown off the crystal edge, resulting in insufficient lubrication and cooling in this area, which aggravates edge problems.

[0037] Uneven surface pressure distribution:

[0038] Rigid disc and workpiece deformation: Even if the initial contact surface is flat, minute deformations of the polishing disc, workpiece, or fixture under pressure can lead to uneven distribution of contact pressure on the wafer surface. The central area may have insufficient pressure, while the edge areas may have excessive pressure.

[0039] Periodic variations introduced by planetary motion: If planetary motion is used, the pressure distribution on different locations on the wafer surface changes periodically over time. Although this helps with overall uniformity, it is difficult to control precisely and has limited improvement on edge problems.

[0040] High vibration sensitivity:

[0041] Vibration transmission through rigid structures: Vibrations generated by mechanical drive systems (motors, gears, bearings) are directly transmitted to the polishing interface through rigid structures, affecting surface roughness (Ra) and generating a subsurface damage layer (SSD), which is crucial for the light output and energy resolution of scintillation crystals.

[0042] Temperature control is difficult:

[0043] Friction generates heat: The friction during the polishing process produces heat, causing localized temperature increases.

[0044] Frame and control system: The supporting structure and electrical system that controls parameters such as speed, pressure, and time.

[0045] Traditional devices lack effective local temperature control methods, and heat dissipation mainly relies on polishing slurry and the environment. Temperature changes affect the material removal rate (MRR), the chemical activity of the polishing slurry, and the physical properties of crystals and polishing pads, leading to unstable surface quality. Scintillation crystals (such as NaI(Tl) and CsI(Tl)) are temperature-sensitive, and high temperatures may cause performance degradation.

[0046] Scintillation crystals (such as NaI(Tl), CsI(Tl), BGO, LYSO, etc.) are core conversion materials in fields such as nuclear medicine imaging (PET / CT), high-energy physics detection, and security inspection equipment. Their working principle is as follows:

[0047] High-energy particles / rays bombard crystals, exciting atoms to produce ultraviolet or visible fluorescence;

[0048] Fluorescence is transmitted to the photomultiplier tube via a photoconductive device and converted into an electrical signal;

[0049] Surface quality directly affects light transmission efficiency:

[0050] Micron-level scratches / dents cause light scattering, resulting in signal attenuation of ≥15%;

[0051] Nanoscale sub-surface damage layers (SSDs) absorb fluorescence, resulting in a ≥10% decrease in energy resolution;

[0052] Edge chipping (>50μm) disrupts the critical angle for total internal reflection, resulting in a 30%-40% loss in light collection efficiency at the edge.

[0053] International standard requirement (IEEE N42.34):

[0054] Surface roughness Ra≤0.1μm, flatness PV≤5μm / 100mm;

[0055] Edge chipping size ≤20μm, no visible microcracks.

[0056] Stress concentration in rigid contact:

[0057] When a flat polishing pad (cast iron / aluminum alloy) comes into contact with a crystal, the difference in edge linear velocity leads to a shear stress gradient (increasing by 30%-50% from the center to the edge);

[0058] Finite element analysis shows that under 10 kPa pressure, the local pressure at the edge is as high as 25 kPa, which induces the propagation of microcracks.

[0059] Centrifugal repulsion of coolant:

[0060] The polishing slurry (diamond / cerium oxide suspension) achieved a wetting coverage of <40% in the edge area at speeds >200 rpm (high-speed camera observation data).

[0061] Frictional heat accumulation (local temperature > 80℃);

[0062] Uneven abrasive distribution and abnormally high edge material removal rate (MRR).

[0063] like Figure 1 - Figure 5 As shown, the scintillation crystal surface polishing device includes a polishing frame 1 for polishing the scintillation crystal under pressure, a flexible clamping module 3 located at the top four corners of the polishing frame 1 for flexibly clamping the scintillation crystal, a circulation tank 2 for circulating and filtering coolant connected to the bottom of the polishing frame 1, a polishing processing component 5 for polishing the surface of the scintillation crystal correspondingly provided on the polishing frame 1, and a three-dimensional adjustment module 4 for driving the polishing processing component 5 to rotate and adjust the outside of the polishing frame 1.

[0064] Please see Figure 2 - Figure 4 In this embodiment, a filter plate 101 is embedded in the center of the grinding frame 1. Several sets of filter holes 102 are distributed on the filter plate 101. A guide plate 103 fixed to the circulation box 2 is symmetrically provided at the bottom of the grinding frame 1. A display screen 104 is provided on the outside of the guide plate 103. An electrical control box 105 is provided at each of the four corners of the grinding frame 1 to be connected to the flexible clamping module 3. A first lithium battery pack 106 is provided inside the electrical control box 105. A sealing strip 107 is attached to the inner side of the grinding frame 1. A disassembly plate 202 is provided at both ends of the circulation box 2. A handle 201 is fixed to the disassembly plate 202. Several sets of filter columns 203 (ceramic membrane (pore size 0.1μm) nano-level filtration, corrosion resistant) are distributed inside the circulation box 2. A disassembly bolt 204 is provided between the filter column 203 and the disassembly plate 202.

[0065] Please see Figure 3 - Figure 4In this embodiment, the flexible clamping module 3 includes a connecting arm 301 and a guide arm 304. A steering shaft 303 passes through one end of the connecting arm 301, and a first drive motor 302 is connected to the outer end of the steering shaft 303. The first drive motor 302 drives the steering shaft 303 to rotate the connecting arm 301. A guide arm 304 is connected to the end of the connecting arm 301 away from the steering shaft 303. A connecting shaft 305 is provided between the guide arm 304 and the connecting arm 301. Protective sleeves 306 are fitted at both ends of the connecting shaft 305. A scale 307 is circumferentially fixed to the top of the protective sleeve 306. A second lithium battery pack 308 is fixed to the connecting arm 301. The second lithium battery pack 308 has a drive shaft 305 outside to drive the guide arm 304 and the connecting arm 301. The first cable 309, the guide arm 304 away from the connecting shaft 305 has a push rod 312 passing through it, the top of the push rod 312 is connected to a cylinder 311, the bottom of the push rod 312 is connected to a flexible clamp 313, the cylinder 311 and the first lithium battery pack 106 are connected to a second cable 310, the cylinder 311 drives the push rod 312 to move the flexible clamp 313 up and down, the flexible clamp 313 has several sets of contact grooves 314 circumferentially opened on the outside, the flexible clamp 313 is covered with a flexible layer 315 (food grade silicone, Shore hardness 60A, covered with anti-scratch crystal), the flexible clamp 313 has several sets of floating blocks 316 in the contact grooves 314, the floating blocks 316 have magnetic blocks (NdFeB) inside. The floating block 316 contains a battery pack, a vibration sensor, and an electromagnet. The vibration sensor is electrically connected to an indicator light 317. The measuring ball 513 (with a built-in ultrasonic sensor) scans the crystal flatness in real time with an accuracy of ±0.01mm. The vibration sensor (IMI 608A11) inside the floating block 316 monitors the clamping vibration spectrum and dynamically adjusts the pressure of the cylinder 311. The polishing sleeve 506 vibrating plate detects the polishing resistance and feeds it back to the second drive motor 505 to adjust the speed.

[0066] Please see Figure 4 - Figure 5In this embodiment, the three-dimensional adjustment module 4 includes a connecting plate 401. A second guide rod 407 is provided at the center of the connecting plate 401. A first spring column 409 is connected to the upper end of the second guide rod 407. A spring rubber damper is provided inside the first spring column 409. A first hydraulic cylinder 408 is provided at the bottom of the second guide rod 407. A first sleeve 410 is provided between the second guide rod 407 and the first spring column 409. A cross frame 411 is fixed to the end of the first sleeve 410 away from the first spring column 409. The first hydraulic cylinder 408 drives the second guide rod 407 to move the first sleeve 410 and the cross frame 411 up and down along the direction of the first spring column 409. The end of the cross frame 411 away from the connecting plate 401 is connected to a first hydraulic cylinder 408 that docks with the polishing processing component 5. The second frame 518 has a first guide rod 406 inside the crossbeam 411. One end of the first guide rod 406 is connected to a second spring column 413. The first guide rod 406 and the second spring column 413 are connected to the second frame 518. The end of the first guide rod 406 away from the second spring column 413 is connected to a second hydraulic cylinder 412. The second hydraulic cylinder 412 drives the first guide rod 406 to move the second spring column 413, thereby moving the second frame 518 and the polishing assembly 5 laterally. The first spring column 409 and the second spring column 413 are equipped with spring rubber dampers (butyl rubber + stainless steel springs). The rear end of the connecting plate 401 is connected to a solution tank. The bottom of the solution tank is connected to a base 402. The center of the solution tank is equipped with a first lifting module 404. The solution tank has a first water pipe 403 connected to the circulation tank 2 at its bottom. A first lifting module 404 includes a lifting pump and a control motor. A first extension pipe 405 is connected to the outer end of the solution tank. The polishing assembly 5 includes a control box 501. A second extension pipe 516 is connected to the outside of the control box 501. A third water pipe 515 is connected to the outside of the second extension pipe 516 and connected to the first extension pipe 405. A second lifting module 517 is located at the center of the second extension pipe 516. The second lifting module 517 includes a lifting pump and a control motor. A fixed sleeve 503 is connected to the end of the control box 501 away from the second sleeve 518. A rotating rod 504 is located at the center of the fixed sleeve 503. A second drive motor 505 is connected to the top of the rotating rod 504. The bottom of the rotating rod 504 is connected to a polishing sleeve 506 (6061-T6 aluminum alloy + polyurethane curved pad with a curvature radius R = 500mm, high wear resistance). A curved panel 507 is located at the center of the bottom of the polishing sleeve 506, and a disassembly hole 509 is opened at the center of the bottom of the polishing sleeve 506. The second drive motor 505 drives the rotating rod 504 to rotate the polishing sleeve 506. A second water pipe 511, connected to the second extension pipe 516, is located outside the fixed sleeve 503. A spray pipe 508 is circumferentially located at the outer end of the polishing sleeve 506, and an injector is located inside the spray pipe 508. A vibration module 510 is located between the two sets of spray pipes 508, and a vibrating plate and a wireless module are located inside the vibration module 510. A flat plate 512 is located at the center of the control box 501.The planar plate 512 has several sets of measuring spheres 513 arranged circumferentially around its exterior. Each measuring sphere 513 houses an ultrasonic transmitter (MA40S4R / S ranging type integrated into the measuring sphere 513, accuracy 0.01mm), an ultrasonic receiver, and a wireless module. A signal line 514 is located at the center of the planar plate 512, and a control module 502 is connected to the top of the signal line 514.

[0067] First, the scintillation crystal is placed in the polishing frame 1. The control box 105 controls the flexible clamping module 3 to start. The first drive motor 302 drives the steering shaft 303 to turn the connecting arm 301 and adjust the position of the guide arm 304. Then, the cylinder 311 drives the push rod 312 to lower the flexible clamping block 313. The flexible layer 315 of the flexible clamping block 313 fits the edge of the crystal. The magnetic block and the electromagnet in the floating block 316 form a closed-loop magnetic buffer. The pressure threshold is set to 0.5-2MPa (adjustable). The vibration sensor monitors abnormal vibration. When the limit is exceeded, the indicator light 317 alarms, thus achieving flexible and stable clamping.

[0068] The three-dimensional adjustment module 4 starts to operate. The first hydraulic cylinder 408 drives the second guide rod 407 to move the first frame 410 and the cross frame 411 up or down along the direction of the first spring column 409, adjusting the height of the polishing component 5.

[0069] The second hydraulic cylinder 412 drives the first guide rod 406 to move the second spring column 413, the second sleeve 518 and the polishing assembly 5 laterally, accurately positioning the polishing position.

[0070] When the polishing component 5 is started, the second drive motor 505 drives the rotating rod 504 to rotate the polishing sleeve 506. The curved panel 507 at the bottom of the polishing sleeve 506 contacts the crystal surface for polishing, so that the curved panel 507 is polished at a speed of 100-500 rpm.

[0071] Meanwhile, the first lifting module 404 (lifting pump and control motor) in the solution tank delivers coolant (ethylene glycol aqueous solution) to the circulation tank 2 through the first water pipe 403. The coolant filtered in the circulation tank 2 is then sprayed onto the crystal surface through the second lifting module 517, the second water pipe 511, and the nozzle 508. The sprayer ensures the accuracy of coolant spraying, and the vibrating plate of the vibration module 510 makes the coolant spread evenly, lubricating and cooling the polishing area.

[0072] During the polishing process, the ultrasonic transmitter inside the measuring sphere 513 emits 40kHz ultrasonic waves and the receiver monitors parameters such as the flatness and thickness of the crystal surface in real time. The data is transmitted to the control module 502 through the wireless module. The control module 502 dynamically adjusts the operating parameters of the three-dimensional adjustment module 4, the flexible clamping module 3 and the polishing processing component 5 according to the preset parameters and the real-time monitoring data to ensure that the polishing process is stable and efficient.

[0073] The coolant carrying debris is initially filtered through filter plate 101 (304 stainless steel) and flows into circulation tank 2. Filter column 203 (ceramic filter element + activated carbon) adsorbs nano-sized particles. After purification, the coolant flows back to solution tank through the first water pipe 403.

[0074] After the coolant has been used for a period of time, the impurities on the filter column 203 can be cleaned by removing the disassembly plates 202 at both ends of the circulation tank 2, so as to ensure the cleanliness of the coolant and realize its recycling.

[0075] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A scintillation crystal surface polishing device, comprising a polishing frame (1) for polishing a pressure-bearing scintillation crystal, characterized in that: It also includes a flexible clamping module (3) located at the top four corners of the grinding frame (1), a circulation tank (2) for circulating and filtering coolant connected to the bottom of the grinding frame (1), a polishing processing component (5) for polishing the surface of the scintillation crystal corresponding to the grinding frame (1), and a three-dimensional adjustment module (4) for driving the polishing processing component (5) to adjust its direction on the outside of the grinding frame (1). The flexible clamping module (3) includes a connecting arm (301) and a guide arm (304). One end of the connecting arm (301) is provided with a steering shaft (303). The outer end of the steering shaft (303) is connected to a first drive motor (302). The first drive motor (302) drives the steering shaft (303) to drive the connecting arm (301) to turn. The end of the connecting arm (301) away from the steering shaft (303) is connected to a guide arm (304). A connecting shaft (305) is provided between the guide arm (304) and the connecting arm (301). Both ends of the connecting shaft (305) are fitted with protective sleeves (306). The top of the protective sleeve (306) is fixed with a scale (307) in a circumferential direction. A second lithium battery pack (308) is fixed on the connecting arm (301). The second lithium battery pack (308) is provided with a first cable (309) outside the second lithium battery pack (308) to drive the connecting shaft (305) to drive the guide arm (304) and the connecting arm (301).

2. The scintillation crystal surface polishing apparatus of claim 1, wherein, A filter plate (101) is embedded in the center of the grinding frame (1). Several sets of filter holes (102) are distributed on the filter plate (101). A guide plate (103) is symmetrically provided at the bottom of the grinding frame (1) and fixed to the circulation box (2). A display screen (104) is provided on the outside of the guide plate (103). An electrical control box (105) is provided at each of the four corners of the grinding frame (1) and docked with the flexible clamping module (3). A first lithium battery pack (106) is provided inside the electrical control box (105). A sealing strip (107) is attached to the inner side of the grinding frame (1).

3. The scintillation crystal surface polishing apparatus of claim 1, wherein, The circulation box (2) is equipped with a disassembly plate (202) at both ends. A handle (201) is fixed on the disassembly plate (202). Several sets of filter columns (203) are distributed inside the circulation box (2). Disassembly bolts (204) are provided between the filter column (203) and the disassembly plate (202).

4. The scintillation crystal surface polishing apparatus according to claim 1, characterized in that, A push rod (312) is provided at the end of the guide arm (304) away from the connecting shaft (305). A cylinder (311) is connected to the top of the push rod (312), and a flexible clamp (313) is connected to the bottom of the push rod (312). A second cable (310) is provided between the cylinder (311) and the first lithium battery pack (106). The cylinder (311) drives the push rod (312) to push the flexible clamp (313) up and down. Several sets of contact grooves (314) are provided on the outer circumference of the flexible clamp (313). The flexible clamp (313) is covered with a flexible layer (315). Several sets of floating blocks (316) are provided on the flexible clamp (313) in the contact grooves (314). The floating blocks (316) are provided with a magnetic block, a spring rubber damper and a spring inside. The floating blocks (316) are provided with a battery pack, a vibration sensor and an electromagnet inside. An indicator light (317) is electrically connected to the outside of the vibration sensor.

5. The scintillation crystal surface polishing apparatus of claim 1, wherein, The three-dimensional adjustment module (4) includes a connecting plate (401), a second guide rod (407) is provided at the center of the connecting plate (401), a first spring column (409) is connected to the upper end of the second guide rod (407), a spring rubber damper is provided inside the first spring column (409), a first hydraulic cylinder (408) is provided at the bottom of the second guide rod (407), a first sleeve (410) is provided between the second guide rod (407) and the first spring column (409), a cross frame (411) is fixedly connected to the end of the first sleeve (410) away from the first spring column (409), the first hydraulic cylinder (408) drives the second guide rod (407) to move the first sleeve (410) and the cross frame (411) up and down along the direction of the first spring column (409), a second sleeve (518) is connected to the end of the cross frame (411) away from the connecting plate (401) and docks with the polishing treatment component (5), a first guide rod (406) is provided inside the cross frame (411). One end of the first guide rod (406) is connected to the second spring column (413). The first guide rod (406) and the second spring column (413) are connected to the second frame (518). The end of the first guide rod (406) away from the second spring column (413) is connected to the second hydraulic cylinder (412). The second hydraulic cylinder (412) drives the first guide rod (406) to drive the second spring column (413) to drive the second frame (518) and the polishing assembly (5) to move laterally. The first spring column (409) and the second spring column (413) are provided with spring rubber dampers. The rear end of the connecting plate (401) is connected to the solution tank. The bottom of the solution tank is connected to the base (402). The center of the solution tank is provided with the first lifting module (404). The bottom of the solution tank is provided with the first water pipe (403) connected to the circulation tank (2). The first lifting module (404) includes a lifting pump and a control motor. The outer end of the solution tank is connected to the first extension pipe (405).

6. The scintillation crystal surface polishing apparatus of claim 5, wherein, The polishing assembly (5) includes a control box (501), a second extension pipe (516) connected to the outside of the control box (501), a third water pipe (515) connected to the first extension pipe (405) on the outside of the second extension pipe (516), a second lifting module (517) at the center of the second extension pipe (516), the second lifting module (517) including a lifting pump and a control motor, a fixed sleeve (503) connected to the end of the control box (501) away from the second sleeve (518), a rotating rod (504) at the center of the fixed sleeve (503), a second drive motor (505) connected to the top of the rotating rod (504), and the rotating rod (504) The bottom is connected to a polishing sleeve plate (506), the bottom center of the polishing sleeve plate (506) is provided with a curved panel (507), the bottom center of the polishing sleeve plate (506) is provided with a disassembly hole (509), the second drive motor (505) drives the rotating rod (504) to drive the polishing sleeve plate (506) to rotate, the fixed sleeve (503) is provided with a second water pipe (511) connected to the second extension pipe (516), the outer end of the polishing sleeve plate (506) is provided with a spray pipe (508) in a circumferential direction, the spray pipe (508) is provided with an injector inside, the two sets of spray pipes (508) are provided with a vibration module (510), the vibration module (510) is provided with a vibrating plate and a wireless module inside.

7. The scintillation crystal surface polishing apparatus of claim 6, wherein, The control box (501) has a flat plate (512) at its center. Several sets of measuring balls (513) are arranged around the outside of the flat plate (512). The measuring balls (513) are equipped with an ultrasonic transmitter, an ultrasonic receiver and a wireless module. The flat plate (512) has a signal line (514) at its center. The top of the signal line (514) is connected to the control module (502).

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