A silicon carbide wafer thickness sorting mechanism
By designing a silicon carbide wafer thickness sorting mechanism with adjustable limit plates and dust collection components, the problems of limited applicability and impurity influence of traditional equipment have been solved, thereby improving the equipment's versatility and detection accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG SHENGNUO IND CO LTD
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional silicon carbide wafer thickness sorting mechanisms cannot be flexibly adjusted according to silicon carbide wafers of different sizes, resulting in a limited range of adaptability. Furthermore, particulate impurities are easily attached during transportation, affecting the accuracy of thickness detection.
A silicon carbide wafer thickness sorting mechanism was designed, comprising a support platform, a conveying mechanism, a sorter, an adjustment component, a dust collection component, and a feeding component. The position of the limit plate is adjusted by an electric push rod, and impurities on the wafer surface are removed by a fan and a suction head, achieving flexible adjustment and cleaning.
This enhances the equipment's versatility, meets diverse production needs, ensures the accuracy and cleanliness of thickness detection, and improves product yield.
Smart Images
Figure CN224449295U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon carbide wafers, and more particularly to a silicon carbide wafer thickness sorting mechanism. Background Technology
[0002] In the semiconductor field, silicon carbide wafers, with their superior performance, have become an ideal material for manufacturing high-power, high-frequency, and high-temperature electronic devices. They are regarded as the forefront and future direction of power semiconductor device development. In the production process of silicon carbide wafers, precise thickness control and efficient sorting are key links to ensure the consistency of device performance and improve product yield. Their importance is self-evident.
[0003] Currently, traditional thickness sorting mechanisms are usually equipped with limiting structures during the feeding process to prevent accidental displacement of silicon carbide wafers. However, these limiting structures have shortcomings: they are mostly rigid structures fixed on the equipment and cannot be flexibly adjusted according to different sizes of silicon carbide wafers, which limits the adaptability of the device and makes it difficult to meet diverse production needs. They also have limitations when dealing with the processing of wafers of multiple specifications.
[0004] To address the above problems, a silicon carbide wafer thickness sorting mechanism is proposed. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a silicon carbide wafer thickness sorting mechanism, which aims to improve the problem that the limiting structure in the prior art cannot be properly adjusted according to silicon carbide wafers of different sizes, and that some particulate impurities will adhere to the surface of the silicon carbide wafers during transportation.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A silicon carbide wafer thickness sorting mechanism includes a support platform, a conveying mechanism fixedly connected to the top of the support platform, a sorter fixedly connected to the left side of the top of the support platform, an adjustment component provided on the top of the support platform, a dust suction component provided in the middle of the top of the support platform, and a feeding component provided on the right side of the top of the support platform.
[0008] The adjustment assembly includes two housings. The bottom of the housing is fixedly connected to the top of the support platform. An electric push rod is fixedly connected inside the housing. The output end of the electric push rod is fixedly connected to a support plate. Multiple connecting rods are rotatably connected to the top of the support plate. The ends of the multiple connecting rods away from the support plate are rotatably connected to sliders. A limit plate is fixedly connected to the top of the sliders.
[0009] As a further description of the above technical solution:
[0010] The dust collection assembly includes a second outer shell, the bottom of which is fixedly connected to the middle of the top of the support platform. A fan is installed inside the second outer shell, a connecting pipe is fixedly connected to the top of the second outer shell, and a suction head is fixedly connected to the end of the connecting pipe away from the second outer shell. A second support frame is fixedly connected to the top of the support platform, a filter screen is slidably connected inside the second outer shell, and a collection frame is slidably connected to the bottom inner wall of the second outer shell.
[0011] As a further description of the above technical solution:
[0012] The feeding assembly includes a support frame 1, the bottom of which is fixedly connected to the top right side of the support platform. Two connecting blocks are fixedly connected to the outside of the support frame 1, and a reciprocating screw is rotatably connected between the two connecting blocks. A motor is fixedly connected to the outside of one of the connecting blocks, and the output end of the motor is fixedly connected to the inside of the reciprocating screw. A slider 1 is threadedly connected to the outer circumference of the reciprocating screw. A support plate 1 is fixedly connected to the outside of the slider 1. Two cylinders are fixedly connected to the bottom of the support plate 1, and a vacuum suction cup is fixedly connected to the output end of each of the two cylinders.
[0013] As a further description of the above technical solution:
[0014] A guide rod is fixedly connected between the two connecting blocks, and the middle part of the slider is slidably connected to the outer periphery of the guide rod;
[0015] As a further description of the above technical solution:
[0016] The outer side of the second slider is slidably connected to the inside of the first outer shell, and the bottom of the limiting plate is slidably connected to the top of the first outer shell;
[0017] As a further description of the above technical solution:
[0018] The end of the connecting pipe away from the outer casing is fixedly connected to the inside of the support frame.
[0019] As a further description of the above technical solution:
[0020] Two limiting blocks are fixedly connected to the outer side of the second slider, and the outer sides of the two limiting blocks are slidably connected to the inside of the first outer shell.
[0021] As a further description of the above technical solution:
[0022] The outer casing has multiple grooves inside, and the slider is slidably connected to the outside of the grooves.
[0023] This utility model has the following beneficial effects:
[0024] 1. In this utility model, the support plate is moved vertically by an electric push rod. Since the two ends of the connecting rod are rotatably connected to the support plate and the slider respectively, the movement of the support plate will cause the connecting rod to change angle, thereby pushing the slider to slide smoothly inside the shell under the constraint of the limiting block. At this time, the sliding of the slider directly drives the limiting plate to move synchronously, thereby achieving the effect of adjusting the position of the limiting plate according to silicon carbide wafers of different sizes, thus enhancing the versatility of the equipment and meeting diverse production needs.
[0025] 2. In this utility model, by starting the fan, the fan will discharge the air inside the shell to the outside, creating a negative pressure area near the suction head. Under the action of negative pressure, dust and other particulate impurities on the surface of the wafer are sucked away. These impurities enter the shell through the connecting pipe, are intercepted and filtered by the filter screen, and finally fall into the collection frame, thereby achieving the cleaning treatment of the wafer surface, thus avoiding the interference of impurity residue on the subsequent thickness detection accuracy and ensuring the accuracy of the sorting results. Attached Figure Description
[0026] Figure 1 This is a three-dimensional schematic diagram of a silicon carbide wafer thickness sorting mechanism proposed in this utility model;
[0027] Figure 2 This is a three-dimensional schematic diagram of the feeding component of a silicon carbide wafer thickness sorting mechanism proposed in this utility model;
[0028] Figure 3 This is a cross-sectional view of the outer shell of a silicon carbide wafer thickness sorting mechanism proposed in this utility model;
[0029] Figure 4 This is a three-dimensional schematic diagram of the dust collection component of a silicon carbide wafer thickness sorting mechanism proposed in this utility model;
[0030] Figure 5 This is a cross-sectional view of the outer shell of the silicon carbide wafer thickness sorting mechanism proposed in this utility model.
[0031] Legend:
[0032] 1. Support platform; 2. Support frame one; 3. Motor; 4. Connecting block; 5. Slider one; 6. Reciprocating lead screw; 7. Support plate one; 8. Cylinder; 9. Vacuum suction cup; 10. Guide rod; 11. Conveying mechanism; 12. Sorter; 13. Outer shell one; 14. Limiting plate; 15. Electric push rod; 16. Support plate two; 17. Connecting rod; 18. Slider two; 19. Outer shell two; 20. Fan; 21. Filter screen; 22. Collection frame; 23. Connecting pipe; 24. Suction head; 25. Support frame two; 26. Slide groove; 27. Limiting block. Detailed Implementation
[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0034] Reference Figure 1 and Figure 3 The present invention provides an embodiment of a silicon carbide wafer thickness sorting mechanism, including a support platform 1, which serves as the basic load-bearing component of the entire mechanism and provides a stable mounting platform for each component. A conveying mechanism 11 is fixedly connected to the top of the support platform 1, which is used to transport silicon carbide wafers to subsequent processes. A sorter 12 is fixedly connected to the top left side of the support platform 1, which is used to sort wafers of different thicknesses. An adjustment component is provided on the top of the support platform 1, a dust suction component is provided in the middle of the top of the support platform 1, and a feeding component is provided on the top right side of the support platform 1.
[0035] The adjustment assembly includes two outer shells 13. The bottom of the outer shell 13 is fixedly connected to the top of the support platform 1. The outer shell 13 is used to protect its internal structure and ensure its stable operation. An electric push rod 15 is fixedly connected inside the outer shell 13. The electric push rod 15 serves as the power source of the adjustment assembly and can provide stable driving force. The output end of the electric push rod 15 is fixedly connected to a support plate 16. Multiple connecting rods 17 are rotatably connected to the top of the support plate 16. Each connecting rod 17 is rotatably connected to a slider 18 at the end away from the support plate 16. A limit plate 14 is fixedly connected to the top of the slider 18. When adjustment is required according to the size of the silicon carbide wafer, the electric push rod 15 is activated, causing the support plate 16 to move up and down. The movement of the support plate 16 causes the connecting rods 17 to change angle, thereby pushing the slider 18 to slide inside the outer shell 13. The sliding of the slider 18 causes the limit plate 14 to move synchronously, thereby achieving the effect of adjusting the position of the limit plate 14.
[0036] Reference Figure 1 , Figure 4 and Figure 5The dust collection assembly includes a second outer casing 19, the bottom of which is fixedly connected to the middle of the top of the support platform 1. A fan 20 is installed inside the second outer casing 19. A connecting pipe 23 is fixedly connected to the top of the second outer casing 19. A suction head 24 is fixedly connected to the end of the connecting pipe 23 away from the second outer casing 19. A support frame 25 is fixedly connected to the top of the support platform 1. The support frame 25 supports and fixes the connecting pipe 23 and the suction head 24, ensuring the stability of the suction head 24. A filter screen 21 is slidably connected inside the second outer casing 19. The filter screen 21 is used to intercept dust and particulate impurities. To prevent these impurities from being directly discharged into the outside air, a collection frame 22 is slidably connected to the bottom wall of the inner shell 19. The impurities will eventually fall into the collection frame 22, thus completing the collection of impurities. By starting the fan 20, the suction head 24 is made to form a negative pressure. Under the action of negative pressure, dust and particulate impurities will be sucked into the connecting pipe 23. After being intercepted by the filter screen 21, they will finally fall into the collection frame 22. The sliding connection design of the filter screen 21 and the collection frame 22 makes it easy to clean and maintain the impurities. The filter screen 21 can be replaced regularly, ensuring the long-term stable operation of the dust collection component.
[0037] Reference Figure 1 and Figure 2 The feeding assembly includes a support frame 2, whose bottom is fixedly connected to the top right side of the support platform 1. The support frame 2 provides stable support for other components of the feeding assembly. Two connecting blocks 4 are fixedly connected to the outside of the support frame 2, and a reciprocating screw 6 is rotatably connected between the two connecting blocks 4. A motor 3 is fixedly connected to the outside of one of the connecting blocks 4, and the output end of the motor 3 is fixedly connected inside the reciprocating screw 6. A slider 5 is threadedly connected to the outer circumference of the reciprocating screw 6, and a support plate 7 is fixedly connected to the outside of the slider 5. Two cylinders 8 are fixedly connected to the bottom of the support plate 7, and the output of the two cylinders 8... Vacuum chucks 9 are fixedly connected to each end. Motor 3 serves as the power source for the feeding assembly, converting electrical energy into mechanical kinetic energy. This drives the reciprocating screw 6 to rotate, which in turn moves the slider 5 around the reciprocating screw 6. This, in turn, moves the support plate 7, cylinder 8, and vacuum chucks 9 to the unloading position. Then, cylinder 8 extends to make vacuum chucks 9 contact the wafer. Vacuum chucks 9 starts to generate negative pressure to hold the wafer. Then, cylinder 8 retracts to lift the wafer and drives vacuum chucks 9 to move above the conveyor belt. Finally, cylinder 8 extends and vacuum chucks 9 releases negative pressure to place the wafer on the conveyor belt.
[0038] Reference Figure 2 A guide rod 10 is fixedly connected between the two connecting blocks 4. The middle part of the slider 5 is slidably connected to the outer periphery of the guide rod 10. The guide rod 10 plays a guiding and limiting role in the movement of the slider 5. When the slider 5 moves, the guide rod 10 can ensure that the slider 5 can only move stably along the direction of the guide rod 10.
[0039] Reference Figure 3The outer side of slider 18 is slidably connected to the inside of housing 13, and the bottom of limiting plate 14 is slidably connected to the top of housing 13. When slider 18 is driven, it will drive limiting plate 14 to slide on the surface of housing 13, thereby adapting to silicon carbide wafers of different sizes.
[0040] Reference Figure 4 The end of the connecting pipe 23 away from the outer casing 2 19 is fixedly connected to the inside of the support frame 2 25. The support frame 2 25 is used to fix the connecting pipe 23 and ensure that the connecting pipe 23 remains stable.
[0041] Reference Figure 3 Two limiting blocks 27 are fixedly connected to the outside of slider 2 18. Both limiting blocks 27 are slidably connected to the inside of the outer shell 1 13. The setting of the limiting blocks 27 plays a limiting role in the sliding of slider 2 18, which can prevent slider 2 18 from detaching from the inside of the outer shell 1 13 during the sliding process, thus ensuring the safety and stability of the adjustment component operation.
[0042] Reference Figure 3 The outer shell 19 has multiple grooves 26 inside. The outer side of the slider 18 is slidably connected to the inside of the grooves 26. The grooves 26 provide a guide track for the slider 18 to slide, so that the slider 18 can only slide along the direction of the grooves 26, ensuring the linearity and stability of the slider 18's movement.
[0043] Working principle: When the position of the limiting plate 14 needs to be adjusted according to the size of the silicon carbide wafer, the electric push rod 15 is activated. The electric push rod 15 will drive the support plate 16 to move vertically. Since the two ends of the connecting rod 17 are rotatably connected to the support plate 16 and the slider 18 respectively, the movement of the support plate 16 will cause the connecting rod 17 to change angle, thereby pushing the slider 18 to slide inside the outer shell 13 under the constraint of the limiting block 27. At this time, the sliding of the slider 18 directly drives the limiting plate 14 to move synchronously, thereby achieving the effect of flexibly adjusting the position of the limiting plate 14 according to the silicon carbide wafer of different sizes.
[0044] When the silicon carbide wafer is being transported, the fan 20 is activated, which exhausts the air inside the outer casing 19 to the outside, creating a negative pressure area near the suction head 24. Under the action of negative pressure, dust and other particulate impurities on the surface of the silicon carbide wafer are successfully sucked away. These impurities enter the interior of the outer casing 19 through the connecting pipe 23. Subsequently, under the interception and filtration of the filter screen 21, the impurities are effectively blocked and finally fall into the collection frame 22, thereby achieving the cleaning treatment of the surface of the silicon carbide wafer.
[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A silicon carbide wafer thickness sorting mechanism comprising a support table (1), characterized in that: The top of the support platform (1) is fixedly connected to a conveying mechanism (11), the left side of the top of the support platform (1) is fixedly connected to a sorter (12), the top of the support platform (1) is provided with an adjustment component, the top center of the support platform (1) is provided with a dust suction component, and the top right side of the support platform (1) is provided with a feeding component. The adjustment assembly includes two outer shells (13). The bottom of the outer shell (13) is fixedly connected to the top of the support platform (1). An electric push rod (15) is fixedly connected inside the outer shell (13). The output end of the electric push rod (15) is fixedly connected to a support plate (16). Multiple connecting rods (17) are rotatably connected to the top of the support plate (16). The ends of the multiple connecting rods (17) away from the support plate (16) are rotatably connected to sliders (18). A limit plate (14) is fixedly connected to the top of sliders (18).
2. A silicon carbide wafer thickness sorting mechanism as defined in claim 1, wherein: The dust collection assembly includes a second outer shell (19), the bottom of which is fixedly connected to the middle of the top of the support platform (1). A fan (20) is installed inside the second outer shell (19). A connecting pipe (23) is fixedly connected to the top of the second outer shell (19). A suction head (24) is fixedly connected to the end of the connecting pipe (23) away from the second outer shell (19). A second support frame (25) is fixedly connected to the top of the support platform (1). A filter screen (21) is slidably connected inside the second outer shell (19). A collection frame (22) is slidably connected to the bottom wall of the second outer shell (19).
3. A silicon carbide wafer thickness sorting mechanism as defined in claim 1, wherein: The feeding assembly includes a support frame (2), the bottom of which is fixedly connected to the top right side of the support platform (1). Two connecting blocks (4) are fixedly connected to the outside of the support frame (2). A reciprocating screw (6) is rotatably connected between the two connecting blocks (4). A motor (3) is fixedly connected to the outside of one of the connecting blocks (4). The output end of the motor (3) is fixedly connected inside the reciprocating screw (6). A slider (5) is threadedly connected to the outer circumference of the reciprocating screw (6). A support plate (7) is fixedly connected to the outside of the slider (5). Two cylinders (8) are fixedly connected to the bottom of the support plate (7). Vacuum suction cups (9) are fixedly connected to the output ends of the two cylinders (8).
4. A silicon carbide wafer thickness sorting mechanism as defined in claim 3, wherein: A guide rod (10) is fixedly connected between the two connecting blocks (4), and the middle part of the slider (5) is slidably connected to the outer periphery of the guide rod (10).
5. A silicon carbide wafer thickness sorting mechanism as defined in claim 1, wherein: The outer side of the second slider (18) is slidably connected to the inside of the first outer shell (13), and the bottom of the limiting plate (14) is slidably connected to the top of the first outer shell (13).
6. A silicon carbide wafer thickness sorting mechanism as defined in claim 2, wherein: The end of the connecting pipe (23) away from the outer shell (19) is fixedly connected to the inside of the support frame (25).
7. A silicon carbide wafer thickness sorting mechanism as defined in claim 1 wherein: Two limiting blocks (27) are fixedly connected to the outside of the second slider (18), and the two limiting blocks (27) are slidably connected to the inside of the first outer shell (13).
8. A silicon carbide wafer thickness sorting mechanism as defined in claim 2, wherein: The outer shell (19) has multiple grooves (26) inside, and the outer side of the slider (18) is slidably connected to the grooves (26).