An aging test device for thin-film capacitor modules

Abstract

An aging test device for a thin-film capacitor module includes a test chamber and test components. Multiple test components are disposed within the test chamber, and conductive probes of the test components are electrically connected to conductive interfaces on the test chamber. Each test component includes a base plate and test pieces, each test piece comprising a connecting pin assembly and conductive probes. The connecting pin assembly includes multiple connecting pins. The connecting pins and conductive probes are respectively disposed on the base plate. The positions of the connecting pin assembly correspond to the external terminals of the thin-film capacitor module, and the positions of the conductive probes correspond to the electrical terminals of the thin-film capacitor module. This invention uses two sets of test pieces on the test component, allowing for simultaneous aging tests on two thin-film capacitors, thereby improving the efficiency of the aging test.

Description

Technical Field

[0001] This utility model relates to a testing device for thin-film capacitors, and more particularly to an aging testing device for thin-film capacitor modules. Background Technology

[0002] Film capacitors are metallized films made by forming a metal layer on the surface of polypropylene or polyester (PET) film using vacuum deposition technology. Two metallized films are overlapped with a certain degree of misalignment and then wound into a cylindrical shape. Depending on the type of plastic film used, they are also called polyethylene terephthalate capacitors (also known as Mylar capacitors), polypropylene capacitors (also known as PP capacitors), polystyrene capacitors (also known as PS capacitors), and polycarbonate capacitors. Film capacitors possess many excellent properties, making them a high-performance type of capacitor.

[0003] Aging tests are required during the production of film capacitors. Currently, aging test kits can only test one film capacitor at a time. However, each film capacitor needs to undergo aging tests before leaving the factory, and the testing efficiency of the current test kits cannot meet production needs. Utility Model Content

[0004] The technical problem to be solved by this invention is to overcome the shortcomings of the prior art and provide an aging test device for thin film capacitor modules with high testing efficiency.

[0005] To solve the above-mentioned technical problems, the present invention proposes the following technical solution: an aging test device for a thin-film capacitor module, comprising a test chamber and test components. Multiple test components are disposed within the test chamber, and the conductive probes of the test components are electrically connected to conductive interfaces on the test chamber. Each test component includes a base plate and test pieces, and each test piece includes a connecting pin group and conductive probes. The connecting pin group includes multiple connecting pins. The connecting pins and conductive probes are respectively disposed on the base plate. The positions of the connecting pin group correspond to the external terminals of the thin-film capacitor module, and the positions of the conductive probes correspond to the electrical terminals of the thin-film capacitor module.

[0006] Preferably, in the above-mentioned aging test device for thin-film capacitor modules, two sets of test pieces are provided on the base plate, namely a first test piece and a second test piece; the first test piece and the second test piece are staggered, and the height of the connecting pin group and the conductive probe of the second test piece is greater than that of the connecting pin group and the conductive probe of the first test piece; the connecting pin group of the second test piece includes at least one irregularly shaped connecting pin.

[0007] In the aforementioned aging test device for thin-film capacitor modules, preferably, the irregularly shaped connecting pin includes a 7-shaped connecting frame and a connecting post, wherein the bottom end of the 7-shaped connecting frame is connected to the base plate and the other end is provided with a connecting post.

[0008] In the aforementioned aging test device for thin-film capacitor modules, preferably, the irregular connecting pin includes a 7-shaped connecting frame, a connecting pin, and a connecting plate. The connecting plate is fixedly connected to the lower part of the connecting pin corresponding to the irregular connecting pin of the first test piece. The bottom end of the 7-shaped connecting frame is connected to the connecting plate, and the other end is provided with a connecting pin.

[0009] In the aforementioned aging test device for thin-film capacitor modules, preferably, the bottom end of the 7-shaped connecting frame is connected to the connecting plate via a pin, and a top buckle is provided above the pin on the 7-shaped connecting frame.

[0010] Preferably, in the aging test device for the above-mentioned film capacitor module, the top of the side wall of the test chamber is provided with a stacking skirt barrier, and the inner side of the skirt barrier is provided with an anti-falling baffle.

[0011] Compared with the prior art, the advantages of this utility model are: in this utility model, two sets of test pieces are set on the test component, so that two film capacitors can be aged at the same time, thereby improving the efficiency of aging test. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the aging test device for the thin-film capacitor module in Example 1.

[0013] Figure 2 This is a schematic diagram of the test component in Example 1.

[0014] Figure 3 This is a schematic diagram of the structure of the test component in Example 1, which is equipped with a thin-film capacitor module.

[0015] Figure 4 This is a schematic diagram of the irregular connecting pin in Example 1.

[0016] Figure 5 This is a schematic diagram of the irregular connecting column in Example 2.

[0017] Legend

[0018] 1. Test chamber; 11. Skirt guard; 12. Anti-fall baffle; 2. Conductive interface; 3. Test assembly; 31. Base plate; 32. Connecting pin; 33. Conductive probe; 34. First test piece; 35. Second test piece; 36. Irregularly shaped connecting pin; 361. L-shaped connecting frame; 362. Connecting post; 363. Connecting plate; 364. Top buckle; 4. Film capacitor module. Detailed Implementation

[0019] To facilitate understanding of this utility model, it will be described more comprehensively and in detail below with reference to the accompanying drawings and preferred embodiments. However, the scope of protection of this utility model is not limited to the following specific embodiments.

[0020] It should be noted that when a component is described as being "fixed to, attached to, connected to or connected to" another component, it can be directly fixed to, attached to, connected to or connected to the other component, or it can be indirectly fixed to, attached to, connected to or connected to the other component through other intermediate connectors.

[0021] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of protection of this invention. Example 1

[0022] like Figure 1 An aging test device for a thin-film capacitor module 4 is shown, comprising a test chamber 1 and test components 3. Eight test components 3 are disposed within the test chamber 1, and the conductive probes 33 of the test components 3 are electrically connected to conductive interfaces 2 on the test chamber 1. In this embodiment, the test chamber 1 is square, and a stacking skirt guard 11 is provided on the top of the side wall of the test chamber 1. Anti-fall baffles 12 are provided at the four corners of the inner side of the skirt guard 11. This allows the test chambers 1 to be stacked, saving space. The anti-fall baffles 12 prevent one side of the upper test chamber 1 from falling into the lower test chamber 1 after stacking.

[0023] like Figure 2 and Figure 3 As shown, the test assembly 3 includes a base plate 31 and a test piece. The test piece includes a set of connecting posts 362 and pins 32, and a conductive probe 33. The set of connecting posts 362 and pins 32 includes multiple connecting posts 362 and pins 32. The connecting posts 362 and pins 32 and the conductive probe 33 are respectively disposed on the base plate 31. The positions of the connecting posts 362 and pins 32 in the set of connecting posts 362 and pins 32 correspond to the external holes of the thin-film capacitor module 4, and the positions of the conductive probes 33 correspond to the electrical terminals of the thin-film capacitor module 4. Figure 3 As shown, the external connection hole of the thin film capacitor module 4 is placed on the connecting post 362 pin 32 and is supported by the connecting post 362 pin 32.

[0024] like Figure 2 and Figure 3 As shown, two sets of test pieces are set on the base plate 31, namely the first test piece 34 and the second test piece 35; as Figure 2As shown, a thin-film capacitor module 4 is placed on the first test piece 34 for testing, and a thin-film capacitor module 4 is also placed on the second test piece 35 for testing. The thin-film capacitor module 4 on the second test piece 35 is positioned on top, and the thin-film capacitor module 4 on the first test piece 34 is positioned on the bottom. Since the two thin-film capacitor modules 4 are stacked, with one on top and the other on the bottom, the height of the connecting post 362 pin 32 group and the conductive probe 33 of the second test piece 35 is greater than that of the connecting post 362 pin 32 group and the conductive probe 33 of the first test piece 34. Since the two thin-film capacitors need to be stacked, they need to be staggered to expose the external holes, so the first test piece 34 and the second test piece 35 also need to be staggered.

[0025] Because the two thin-film capacitor modules 4 are misaligned, at least one external hole of the upper thin-film capacitor module 4 will be blocked by the lower thin-film capacitor module 4. Therefore, the connecting post 362 pin 32 group of the second test piece 35 includes at least one irregular connecting post 362 pin 36; the irregular connecting post 362 pin 36 is connected to the blocked external hole of the upper thin-film capacitor module 4.

[0026] In this embodiment, the irregularly shaped connecting post 362 pin 36 includes a 7-shaped connecting frame 361, a connecting post 362, and a connecting plate 363. The connecting plate 363 is fixedly connected to the lower part of the connecting post 362 pin 32 group corresponding to the irregularly shaped connecting post 362 pin 36 on the first test piece 34. The bottom end of the 7-shaped connecting frame 361 is connected to the connecting plate 363, and the other end is provided with a connecting post 362. The connecting post 362 is connected to the external hole on the thin film capacitor module 4. In this embodiment, the bottom end of the 7-shaped connecting frame 361 is connected to the connecting plate 363 by a pin, and a top buckle 364 is provided above the pin on the 7-shaped connecting frame 361. In this embodiment, when installing the film capacitor module 4 on the first test piece 34, the 7-shaped connecting bracket 361 can be opened on the connecting plate 363 to make room for the installation of the film capacitor module 4; when installing the film capacitor module 4 on the second test piece 35, the 7-shaped connecting bracket 361 is straightened on the connecting plate 363, the top buckle 364 is pressed against the connecting plate 363, and the external holes on the film capacitor module 4 are installed on the connecting post 362 and other connecting post 362 pins 32.

[0027] In this embodiment, two sets of test pieces are set on the test component 3, so that two film capacitors can be aged at the same time, thereby improving the efficiency of aging test. Example 2

[0028] In this embodiment, the irregularly shaped connecting post 362 pin 36 includes a 7-shaped connecting bracket 361 and a connecting post 362, as shown below. Figure 5As shown, the bottom end of the 7-shaped connector 361 can be directly connected to the base plate 31, and the other end is provided with a connecting post 362, which is connected to the external hole on the film capacitor module 4. The other parts of this embodiment are the same as those in embodiment 1.

Claims

1. An aging test apparatus for a thin film capacitor module, characterized by: The device includes a test chamber and test components. Multiple test components are housed within the test chamber, and the conductive probes of each test component are electrically connected to conductive interfaces on the test chamber. Each test component includes a base plate and test pieces. Each test piece includes a connecting pin assembly and conductive probes. The connecting pin assembly includes multiple connecting pins. The connecting pins and conductive probes are respectively disposed on the base plate. The positions of the connecting pin assembly correspond to the external terminals of the thin-film capacitor module, and the positions of the conductive probes correspond to the electrical terminals of the thin-film capacitor module.

2. The thin film capacitor module burn-in test apparatus according to claim 1, wherein: The base plate is provided with two sets of test pieces, namely the first test piece and the second test piece; the first test piece and the second test piece are staggered, and the height of the connecting pin group and the conductive probe of the second test piece is greater than that of the connecting pin group and the conductive probe of the first test piece; The connecting pin assembly of the second test piece includes at least one irregularly shaped connecting pin.

3. The thin film capacitor module burn-in test apparatus of claim 2, wherein: The irregular connecting pin includes a 7-shaped connecting frame and a connecting column. The bottom end of the 7-shaped connecting frame is connected to the base plate, and the other end is provided with a connecting column.

4. The aging test apparatus for thin-film capacitor modules according to claim 2, characterized in that: The irregular connecting pin includes a 7-shaped connecting frame, a connecting post, and a connecting plate. The connecting plate is fixedly connected to the lower part of the connecting pin group corresponding to the irregular connecting pin on the first test piece. The bottom end of the 7-shaped connecting frame is connected to the connecting plate, and the other end is provided with a connecting post.

5. The thin film capacitor module burn-in test apparatus of claim 4, wherein: The bottom end of the 7-shaped connecting frame is connected to the connecting plate by a pin, and a top buckle is provided above the pin on the 7-shaped connecting frame.

6. The thin film capacitor module burn-in test apparatus of claim 1, wherein: The top of the side wall of the test chamber is provided with a stacking skirt barrier, and the inner side of the skirt barrier is provided with an anti-falling baffle.

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