Server chassis and servers

Abstract

This utility model discloses a server chassis and a server. The server chassis includes: a first end and a second end disposed opposite to each other; a fan area configured to accommodate fan components, the fan area being located at the second end; an I / O component area and a computing area, the I / O component area and the computing area being located at the first end and stacked together, the I / O component area being configured to accommodate I / O components, and the computing area being configured to accommodate computing components; the I / O component area includes two first regions and a second region, the second region being located between the two first regions; the second region includes a first sub-region and a second sub-region, at least some of the I / O components disposed within the first sub-region and the second sub-region having a stacking direction perpendicular to each other; and a power supply configuration area configured to supply power to the fan area, the I / O component area, and the computing area. According to the server chassis of this utility model, the heat dissipation structure of independent modules is further optimized, improving the heat dissipation effect of the server.

Description

Technical Field

[0001] This utility model relates to the field of server technology, and more specifically, to a server chassis and a server. Background Technology

[0002] In the context of the rapid development of information technology, especially in the fields of artificial intelligence (AI) and big data analytics, the demand for server hardware performance is soaring. AI technology relies on the training and inference of deep learning models, which often involves the processing of massive amounts of data and complex calculations. This has spurred the need for server architectures with higher computing power, larger storage capacity, and faster data processing speeds. Traditional server designs, particularly in terms of space utilization and ease of maintenance, are gradually revealing their limitations. For example, while high-performance servers increase hardware density to some extent, they also bring maintenance challenges, including inconvenience in component replacement and significant space requirements in data centers. Furthermore, server maintenance often requires complete removal of the entire machine, which not only consumes a lot of time and human resources but may also lead to service interruptions and data risks, negatively impacting the operational efficiency and cost control of data centers.

[0003] Given these challenges, the industry has begun exploring new server design solutions aimed at overcoming the shortcomings of traditional high-U servers, particularly for the needs of AI servers. These designs typically focus on modular design, breaking down different functional components of the server (such as CPU, GPU, storage, and networking) into independent modules. Each module can be maintained, upgraded, or replaced independently without disrupting the entire system. Furthermore, to maximize space utilization and enhance system flexibility, designers are actively exploring more compact and efficient component layout methods, striving to accommodate more high-performance components within the same U height while maintaining good heat dissipation and system stability. Layered architecture, multi-GPU support, and flexible hard drive configurations have become key design elements, collectively forming the foundation of the next generation of AI servers. These not only enhance hardware performance but also significantly improve usability and maintainability, providing strong support for the efficient operation of future data centers.

[0004] After forming independent modules, although each structural module can be maintained independently, the poor optimization of the structural design results in limited heat dissipation performance, which is not conducive to the heat dissipation of highly integrated structural modules. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a server chassis and server, which further optimizes the heat dissipation structure of the independent modules and improves the heat dissipation effect of the server.

[0006] To achieve the above objectives, according to an embodiment of the present invention, a server chassis is provided, comprising:

[0007] The first and second ends are set relative to each other;

[0008] The fan section is configured to house the fan components and is located at the second end.

[0009] The IO component area and the computing area are located at the first end and are stacked together. The IO component area is configured to accommodate IO components, and the computing area is configured to accommodate computing components.

[0010] The IO component area consists of two first areas and one second area, with the second area located between the two first areas;

[0011] The second region includes a first sub-region and a second sub-region, wherein at least some of the IO components configured in the first sub-region and the second sub-region are stacked perpendicularly.

[0012] The power configuration area is configured to supply power to the fan area, I / O component area, and computing area.

[0013] Furthermore, the height of the first region along the first direction is greater than the height of the second sub-region along the first direction. The first direction forms an angle with the direction from the first end to the second end. The computing area and the IO component area are stacked along the first direction. The stacking direction of the IO components configured in the first region is the same as the stacking direction of the IO components configured in the second sub-region.

[0014] Furthermore, at least one of the first and second sub-regions is provided with an optional area, and the type of IO component configured in the optional area can be changed.

[0015] Furthermore, the first sub-region includes an optional area, and the second sub-region includes a second storage area. The optional area is configured to accommodate IO components of the same type as those configured in the second storage area or the first region.

[0016] Furthermore, the first sub-region also includes a first storage area, the first storage area and the optional area are arranged along a second direction, the second direction is at an angle to the first direction, and the second direction is at an angle to the direction from the first end to the second end.

[0017] Furthermore, the second sub-region includes a second storage area and an optional area, which are arranged along a second direction at an angle to the first direction and at an angle to the direction from the first end to the second end. The optional area is configured to accommodate IO components of the same type as those configured in the second storage area or the first region.

[0018] Furthermore, along the first direction, the first sub-region is located on the side of the second sub-region closer to the computing area, and the sum of the widths of the first storage area and the optional area along the second direction is greater than the width of the second sub-region along the second direction.

[0019] Furthermore, the first region is configured to accommodate a full-height, half-length expansion card module. When the optional region is configured to accommodate an IO component of the same type as the IO component configured in the first region, the optional region is configured to accommodate a half-height, half-length expansion card module.

[0020] Furthermore, an input / output board module is provided between the second sub-region and at least one side of the first region.

[0021] Furthermore, the optional area may optionally be equipped with a first module mounting base and a second module mounting base. The first module mounting base is configured to accommodate an IO component of the same type as the IO component configured in the second storage area, and the second module mounting base is configured to accommodate an IO component of the same type as the IO component configured in the first area. The optional area has a U-shaped mounting groove, and a plurality of first threaded holes are provided in the U-shaped mounting groove. The first module mounting base or the second module mounting base is provided with a first connection hole corresponding to the first threaded hole.

[0022] Furthermore, an I-beam is provided on the side of the second sub-region facing the computing area, and a U-shaped groove is provided on the side of the first module mounting base or the second module mounting base facing the second sub-region, with the I-beam being engaged in the U-shaped groove.

[0023] Furthermore, a fixing seat is provided on the side of the second sub-region facing the computing area. The fixing seat is located on the side of the optional area close to the first storage area. A second threaded hole and a first positioning hole are provided on the side of the fixing seat facing the computing area. A second connecting hole is provided on the first module mounting seat or the second module mounting seat corresponding to the second threaded hole, and a first positioning post is provided corresponding to the first positioning hole. The first positioning post is inserted into the first positioning hole.

[0024] Furthermore, the optional area is also provided with a second positioning hole, and the server chassis also includes a mesh screen, which can be optionally installed in the optional area.

[0025] Furthermore, the barrier net includes a net body and baffles disposed on the periphery of the net body. The baffles are provided with a third connecting hole corresponding to the first threaded hole, and a second positioning post is provided on the baffles corresponding to the second positioning hole. The second positioning post is inserted into the second positioning hole.

[0026] Furthermore, the server chassis includes a chassis with a first end and a second end. The chassis includes a mounting plate located on the side of the I / O component area away from the computing area. Handles are respectively provided on both sides of the I / O component area along a second direction. The second direction forms an angle with the first direction and also forms an angle with the direction from the first end to the second end. The handles are located on the side of the I / O component area away from the computing area. A pivot is provided on the mounting plate. An active space is formed between the I / O component area and the mounting plate. The handles have a connecting end and an operating end. The connecting end extends into the inside of the chassis through the active space and is rotatably connected to the pivot. The operating end is located on the outside of the chassis. The handles have a first rotation position and a second rotation position. When the handle is in the first rotation position, the handle is in a retracted state. When the handle is in the second rotation position, the handle is in an extended state.

[0027] Furthermore, the enclosure also includes side plates spaced apart along the second direction, with a fork at the end of the connecting end, and a clearance groove provided on the side plate corresponding to the position of the fork, with the fork extending out of the side plate from the clearance groove.

[0028] According to another aspect of the present invention, a server is provided, including the server chassis described above.

[0029] The server chassis provided by this utility model has the following beneficial effects:

[0030] By optimizing the server chassis structure, the chassis is divided into multiple areas. The I / O component area, containing the I / O components, and the computing area, containing the computing components, are located at the first end, while the fan area, which provides the cooling airflow, is located at the second end. These areas are spaced apart, forming multiple independent airflow structures. During server chassis operation, heat dissipation and recirculation can enter the server chassis from these independent airflow structures, participating in heat exchange within the chassis. Because the airflow enters the server chassis from each independent airflow, the mutual influence between the airflows entering the server chassis is minimal. Furthermore, the independence of the airflow and the constraint on the airflow path improve the airflow efficiency and speed, further enhancing the heat exchange performance between the airflow and the heat-generating components inside the server chassis, thus improving the overall heat exchange effect. Since the I / O components and computing units that generate a lot of heat are located at the first end, when the airflow enters the server chassis under the action of the fan components in the fan area, it will first flow through the I / O component area and computing area. This allows the air with the lowest temperature to exchange heat with the I / O components and computing units that generate a lot of heat first, achieving the maximum cooling effect on the I / O components and computing units. This optimizes the internal heat dissipation structure of the server chassis, effectively improves the heat dissipation effect of the entire server chassis, and enhances the working performance of the server. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the front window structure of the server chassis according to an embodiment of the present utility model;

[0033] Figure 2 This is a schematic diagram of the structure of a server chassis according to an embodiment of the present invention. Figure 1 ;

[0034] Figure 3 This is a schematic diagram of the structure of a server chassis according to an embodiment of the present invention. Figure 2 ;

[0035] Figure 4 This is a schematic diagram of the structure of a server chassis according to an embodiment of the present invention. Figure 3 ;

[0036] Figure 5 This is an exploded view of the I / O component area of ​​the server chassis according to an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the assembly structure of the I / O component area of ​​the server chassis according to an embodiment of the present invention;

[0038] Figure 7 This is a partial internal structural diagram of the server chassis according to an embodiment of the present invention;

[0039] Figure 8 This is a three-dimensional structural diagram of the server chassis according to an embodiment of the present utility model;

[0040] Figure 9 This is a partial internal assembly structure diagram of the server chassis according to an embodiment of the present utility model;

[0041] Figure 10 This is a partial three-dimensional structural diagram of the I / O component area of ​​the server chassis according to an embodiment of the present utility model;

[0042] Figure 11 This is a first isometric structural diagram of the first module mounting base according to an embodiment of the present utility model;

[0043] Figure 12 This is a second isometric structural diagram of the first module mounting base according to an embodiment of the present utility model;

[0044] Figure 13This is an isometric structural diagram of the second module mounting base according to an embodiment of the present utility model;

[0045] Figure 14 This is a first isometric structural diagram of the barrier net according to an embodiment of the present invention;

[0046] Figure 15 This is a second isometric structural diagram of the barrier net according to an embodiment of the present invention;

[0047] Figure 16 This is a three-dimensional structural diagram of the handle of the server chassis according to an embodiment of the present utility model;

[0048] Figure 17 This is a schematic diagram of the assembly structure of the handle of the server chassis inside the chassis according to an embodiment of the present utility model.

[0049] Figure 18 This is a schematic diagram of the hinge structure of the server chassis according to an embodiment of the present utility model;

[0050] Figure 19 This is a schematic diagram of the server chassis with the handle removed from the front window according to an embodiment of the present utility model.

[0051] Figure 20 This is a schematic diagram of the internal structure of the server chassis according to an embodiment of the present utility model;

[0052] Figure 21 This is a schematic diagram of the front partition structure of the server chassis according to an embodiment of the present invention. Figure 1 ;

[0053] Figure 22 This is a schematic diagram of the front partition structure of the server chassis according to an embodiment of the present invention. Figure 2 ;

[0054] Figure 23 This is a schematic diagram of the front partition structure of the server chassis according to an embodiment of the present invention. Figure 3 ;

[0055] Figure 24 This is a schematic diagram of the front partition structure of the server chassis according to an embodiment of the present invention. Figure 4 .

[0056] Figure label:

[0057] 1. Front window; 2. Cabinet; 3. First area; 4. First hard drive module enclosure; 5. Second hard drive module enclosure; 6. First functional area; 7. First module mounting base; 8. Second module mounting base; 9. U-shaped mounting groove; 10. Input / output board module; 11. First threaded hole; 12. First connecting hole; 13. H-bolt; 14. U-shaped groove; 15. Fixing base; 16. Second threaded hole; 17. First positioning hole; 18. Second connecting hole; 19. First positioning post; 20. Second positioning hole; 21. Baffle; 22. Baffle plate; 23. Third connecting hole; 24. Second positioning post; 25. Handle; 26. Spindle; 27. Movement space; 28. Shift fork; 29. ​​Clearance groove; 30. Server chassis; 31. Full-height half-length expansion card module; 32. Half-height half-length expansion card module; 33. Hard drive module; 34. Top cover; 35. Rear window; 36. Slide rail; 37. Locking screw; 38. Groove; 39. Third positioning hole; 40. Shaft hole; 41. Fourth connecting hole; 42. Third positioning post; 43. Box ear; 44. Riser module; 45. Second area; 46. First sub-area; 47. Second sub-area; 48. First storage area; 49. Fan area; 50. Fan component; 51. Calculation area; 52. Second storage area; 53. Second functional area; 54. First partition; 55. Second partition; 56. First power supply component; 57. Second power supply component; 58. Mainboard; 59. Switching circuit board; 60. Central processing unit; 61. Main power board; 62. Back panel; 63. Limiting edge; 64. Mounting plate; 65. Side panel; 66. Optional area; 67. Mesh; 68. Power configuration area. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0059] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0060] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0061] The core of this invention is to provide a server chassis. Another core aspect of this invention is to provide a server that includes the aforementioned server chassis.

[0062] Please refer to Figures 1 to 24 As shown, according to an embodiment of the present invention, the server chassis includes:

[0063] The first and second ends are set relative to each other;

[0064] Fan section 49 is configured to accommodate fan component 50, and fan section 49 is located at the second end;

[0065] The IO component area and the computing area 51 are located at the first end and are stacked together. The IO component area is configured to accommodate IO components, and the computing area 51 is configured to accommodate computing components.

[0066] The IO component area includes two first areas 3 and one second area 45, with the second area 45 located between the two first areas 3;

[0067] The second region 45 includes a first sub-region 46 and a second sub-region 47, wherein at least some of the IO components configured in the first sub-region 46 and the second sub-region 47 are stacked perpendicularly.

[0068] The power configuration area 68 is configured to supply power to the fan area 49, the I / O component area, and the computing area 51.

[0069] In this embodiment, the stacking direction of IO components refers to the stacking direction of multiple individual IO components of the same type located in the same area.

[0070] By optimizing the server chassis structure, the chassis is divided into multiple areas. The I / O component area (containing I / O components) and the computing area 51 (containing computing components) are located at the first end, while the fan area 49 (containing fan components 50, which provides cooling airflow) is located at the second end. These multiple areas (I / O component area, computing area 51, fan components 50, etc.) are spaced apart, forming multiple independent airflow structures. During server chassis operation, heat dissipation and recirculation can enter the server chassis from these independent airflow structures, participating in heat exchange within the chassis. Because the airflow enters the server chassis from each independent airflow path, the mutual influence between the airflows within each airflow path is minimal. Furthermore, the independence of the airflow paths and the constraints on the airflow path improve airflow efficiency and speed, further enhancing the heat exchange performance between the airflow and the heat-generating components inside the server chassis, thus improving the overall heat exchange effect. Since the I / O components and computing units that generate a lot of heat are located at the first end, when the airflow enters the server chassis under the action of the fan component 50 in the fan area 49, it will first flow through the I / O component area and computing area 51. This allows the air with the lowest temperature to exchange heat with the I / O components and computing units that generate a lot of heat first, thus achieving the maximum cooling effect on the I / O components and computing units that generate a lot of heat. This optimizes the internal heat exchange structure of the server chassis, effectively improves the heat exchange effect of the entire server chassis, and enhances the working performance of the server.

[0071] The airflow direction is constrained by the air duct structure of each region, and the airflow is also affected by the installation direction of the IO components. The stacking direction of at least some of the IO components configured in the first sub-region 46 and the second sub-region 47 is perpendicular, so that the airflow entering the first sub-region 46 can form a flow path along the air duct formed by the first sub-region 46, and the airflow entering the second sub-region 47 can form a different flow path along the air duct formed by the second sub-region 47. For example, at least some of the airflow entering the first sub-region 46 flows horizontally, and at least some of the airflow entering the second sub-region 47 flows vertically. Thus, the airflow path can be planned by utilizing the structural design of different regions, so that the airflow is more targeted according to the structural design of different regions, and can be adapted to the structural layout of the heat-generating components inside the server chassis, further improving the heat exchange efficiency between the airflow and the heat-generating components inside the server chassis.

[0072] In one embodiment, the enclosure 2 has a first end and a second end. The fan area, I / O component area, computing area 51, and power configuration area are all located inside the enclosure 2. The first end of the enclosure 2 is the front end, i.e., the airflow inlet end, and the second end of the enclosure 2 is the rear end, i.e., the airflow outlet end. A fan area 49 is provided at the second end of the enclosure 2, and a fan component 50 is provided in the fan area 49. The air ducts formed by various areas at the first end of the enclosure 2 can communicate with the fan area 49 where the fan component 50 is located, forming a front-to-back air duct structure. When the fan component 50 is running, it can create negative pressure in various areas at the first end of the enclosure 2, allowing cold air to enter the enclosure 2 through various areas at the first end of the enclosure 2, dissipate heat from the heat-generating components inside the enclosure 2, and then be discharged from the second end of the enclosure 2 through the fan component 50, achieving an effective heat dissipation effect. When cold air enters housing 2 through the first end, it first flows through the I / O components located in various areas of the first end of housing 2. At this time, the lower temperature air significantly cools the I / O components that generate a lot of heat, improving the cooling effect. After exchanging heat with the I / O components at the first end of housing 2, the air continues to exchange heat with other heat-generating components, ensuring efficient airflow and cooling effect within housing 2. The fan component 50 is located at the second end of housing 2, which can create negative pressure in various areas of the first end of housing 2, resulting in better air intake, lower resistance, higher gas flow efficiency, and better heat exchange effect.

[0073] See also Figure 1 , Figures 21 to 24As shown, in one embodiment, the height of the first region 3 along the first direction is greater than the height of the second sub-region 47 along the first direction. The first direction forms an angle with the direction from the first end to the second end. The computing region 51 and the IO component region are stacked along the first direction. The stacking direction of the IO components configured in the first region 3 is the same as the stacking direction of the IO components configured in the second sub-region 47.

[0074] In one embodiment, the first direction is the height direction of the box 2, the second direction is the width direction of the box 2, and the direction from the first end to the second end is the front-to-back direction of the box 2.

[0075] In this embodiment, the two first regions 3 are independent regions, each occupying the entire height of the IO component area. The second region 45 is divided into a first sub-region 46 and a second sub-region 47. Therefore, by setting the height of the first region 3 to be greater than the height of the second sub-region 47, and ensuring that the stacking direction of the IO components configured in the first region 3 is the same as that of the IO components configured in the second sub-region 47, the space of the first region 3 can be fully utilized to install the IO components. At the same time, the height difference between the first region 3 and the second sub-region 47 can be used to set up the first sub-region 46. This allows for a more reasonable arrangement of the various sub-regions within the second region 45, while also enabling the second sub-region 47 to fully utilize its own height to set up the IO components. Furthermore, since the stacking direction of the IO components configured in the first sub-region 46 is perpendicular to that of the IO components configured in the second sub-region 47, the first sub-region 46 can more reasonably and effectively utilize the limited space formed by the height difference between the first region 3 and the second sub-region 47.

[0076] See also Figures 1 to 4 As shown, in one embodiment, the IO components configured in the first region 3 are placed vertically and stacked along the width direction of the housing 2, i.e., the second direction. The IO components configured in the second sub-region 47 are placed vertically and stacked along the width direction of the housing 2, i.e., the second direction. The IO components configured in the first sub-region 46 are placed horizontally and stacked along the height direction of the housing 2, i.e., the first direction. This allows the airflow through the first region 3 and the second sub-region 47 to enter the server chassis vertically for heat exchange, and the airflow through the first sub-region 46 to enter the server chassis horizontally for heat exchange. By utilizing the difference between the airflow patterns in the first region 3 and the second sub-region 47 and the first sub-region 46, a better heat exchange effect can be achieved.

[0077] In one embodiment, at least one of the first sub-region 46 and the second sub-region 47 is provided with an optional area 66, and the type of IO component configured in the optional area 66 can be changed.

[0078] In this embodiment, the optional area 66 is a replaceable area, and the required IO components can be selectively configured within the optional area 66 as needed, thereby achieving effective use of space and flexible coordination of components.

[0079] The above solution addresses the inconvenience of assembly and maintenance, as well as the low space utilization caused by the high-U design of existing AI server nodes. Through the optional installation area 66 set in the first sub-region 46 and / or the second sub-region 47, users can choose to install additional I / O components according to actual needs, enhancing the server's functionality and adaptability. The selective installation mechanism of the optional installation area 66 allows the server to quickly adjust its storage or computing capabilities without changing the overall structure, meeting the needs of different application scenarios. Furthermore, this design simplifies the server node maintenance process, allowing component replacement or upgrades without removing the entire machine, improving maintenance efficiency and server availability. The technical solution of this application not only enhances the flexibility of server component configuration but also optimizes its maintenance process, significantly improving the assembly and maintenance experience of AI server nodes while increasing space utilization, providing a new solution for server design.

[0080] In one embodiment, the first sub-region 46 includes an optional area 66, and the second sub-region 47 includes a second storage area 52. The optional area 66 is configured to accommodate an IO component of the same type as the IO component configured in the second storage area 52 or the first region 3.

[0081] In this embodiment, the optional area 66 is located within the first sub-region 46. The I / O component configured in the first region 3 is an expansion card module, and the I / O component configured in the second storage region 52 is a hard disk module 33. The optional area 66 can be configured with an expansion card module of the same type as the I / O component configured in the first region 3, or with a hard disk module 33 of the same type as the I / O component configured in the second storage region 52. The specifications of the expansion card module configured in the optional area 66 can be the same as or different from those of the expansion card module configured in the first region 3. For example, both the optional area 66 and the first region 3 can be configured with full-height, half-length expansion card modules 31, or the first region 3 can be configured with full-height, half-length expansion card modules 31, and the optional area 66 can be configured with half-height, half-length expansion card modules 32. Similarly, the specifications of the hard disk module 33 configured in the optional area 66 can be the same as or different from those of the expansion card module configured in the second storage region 52.

[0082] In this embodiment, the structure of the second sub-region 47 is not limited. Therefore, the second sub-region 47 can be set as needed. An optional area 66 can be set in the second sub-region 47, or an optional area 66 can be omitted.

[0083] In one embodiment, the first sub-region further includes a first storage area 48, the first storage area 48 and the optional area 66 are arranged along a second direction, the second direction is at an angle to the first direction, and the second direction is at an angle to the direction from the first end to the second end.

[0084] In this embodiment, a hard disk module 33 is configured in the first storage area 48.

[0085] The first storage area 48 and the optional area 66 are arranged along the second direction, which can make full use of the characteristics of the first sub-area 46, which is smaller along the first direction and larger along the second direction, and further rationally plan the first sub-area 46. This can make full use of the space of the first sub-area 46 and meet the setting requirements of different IO components.

[0086] In one embodiment, the second sub-region 47 includes a second storage area 52 and an optional area 66, which are arranged along a second direction at an angle to the first direction and at an angle to the direction from the first end to the second end. The optional area 66 is configured to accommodate an IO component of the same type as the IO component configured in the second storage area 52 or the first region 3.

[0087] In this embodiment, the optional area 66 is located within the second sub-region 47. The I / O component configured in the first region 3 is an expansion card module, and the I / O component configured in the second storage region 52 is a hard disk module 33. The optional area 66 can be configured with an expansion card module of the same type as the I / O component configured in the first region 3, or with a hard disk module 33 of the same type as the I / O component configured in the second storage region 52. The specifications of the expansion card module configured in the optional area 66 can be the same as or different from those of the expansion card module configured in the first region 3. Similarly, the specifications of the hard disk module 33 configured in the optional area 66 can be the same as or different from those of the expansion card module configured in the second storage region 52.

[0088] In this embodiment, the structure of the first sub-region 46 is not limited. Therefore, the first sub-region 46 can be set as needed. An optional area 66 can be set in the first sub-region 46, or an optional area 66 can be omitted.

[0089] In this embodiment, as Figure 24 As shown, the second sub-region 47 is further functionally divided into a second storage area 52 and an optional area 66, so that the second storage area 52 and the optional area 66 can install different types of IO components respectively, which further expands the functionality of the server chassis and can better meet the diverse functional needs of the server.

[0090] See also Figure 22As shown, in one embodiment, the first sub-region 46 includes a first storage area 48 and an optional area 66, and the second sub-region 47 includes a second storage area 52. The first storage area 48 is used to install the hard disk module 33, the optional area 66 in the first sub-region 46 is used to install the hard disk module or the expansion card module, the second storage area 52 is used to install the hard disk module 33, and the second sub-region 47 is not partitioned and is used as the second storage area as a whole.

[0091] In one embodiment, the first sub-region 46 includes a first storage area 48 and an optional area 66, and the second sub-region 47 includes a second storage area 52 and an optional area 66. The first storage area 48 is used to install a hard disk module 33, the optional area 66 in the first sub-region 46 is used to install a hard disk module or an expansion card module, the second storage area 52 is used to install a hard disk module 33, and the optional area 66 in the second sub-region 47 is used to install a hard disk module or an expansion card module. The IO component type configured in the first sub-region 46 and the optional area 66 in the second sub-region 47 is the same as the type of the hard disk module 33 in the first storage area 48 or the expansion card module in the first sub-region 3.

[0092] In one embodiment, the first sub-region 46 includes a first storage area 48 and an optional area 66, and the second sub-region 47 includes a second storage area 52 and a second functional area 53, wherein the first storage area 48 is used to install a hard disk module, the optional area 66 is used to install a hard disk module or an expansion card module, the second storage area 52 is used to install a hard disk module, and the second functional area 53 is used to install an expansion card module.

[0093] In one embodiment, the first sub-region 46 includes a first storage area 48 and an optional area 66, and the second sub-region 47 includes a second storage area 52 and a second functional area 53. The first storage area 48 is used to install hard disk modules, the optional area 66 is used to install hard disk modules or expansion card modules, the second storage area 52 is used to install hard disk modules, and the second functional area 53 is used to install hard disk modules with different specifications than the hard disk modules in the second storage area 52.

[0094] In one embodiment, the first sub-region 46 includes a first storage area 48 and a first functional area 6, and the second sub-region 47 includes a second storage area 52 and an optional area 66, wherein the first storage area 48 is used to install a hard disk module 33, the first functional area 6 is used to install a hard disk module 33, the second storage area 52 is used to install a hard disk module 33, and the optional area 66 is used to install a hard disk module 33 or an expansion card module.

[0095] In one embodiment, the first sub-region 46 includes a first storage area 48 and a first functional area 6, and the second sub-region 47 includes a second storage area 52 and an optional area 66, wherein the first storage area 48 is used to install a hard disk module 33, the first functional area 6 is used to install an expansion card module, the second storage area 52 is used to install a hard disk module 33, and the optional area 66 is used to install either a hard disk module 33 or an expansion card module.

[0096] In one embodiment, the first sub-region 46 includes an expansion card installation area and a first functional area 6, wherein the expansion card installation area is used to install an expansion card module, the first functional area 6 is used to install an expansion card module, and the second sub-region 47 includes a second storage area 52 and an optional area 66.

[0097] With the above Figure 21 The difference between the embodiments is that, in one embodiment, the first sub-region 46 includes an expansion card installation area and an optional area 66, wherein the expansion card installation area is used to install an expansion card module, and the optional area 66 is used to install an expansion card module. The structure of the second sub-region 47 is the same as that in the aforementioned embodiment where the first sub-region 46 includes a first storage area 48 and an optional area 66, and can be selected as needed.

[0098] In other embodiments, the installations in the first functional area 6 and the second functional area 53 can also be adjusted as needed.

[0099] In one embodiment, along the first direction, the first sub-region 46 is located on the side of the second sub-region 47 close to the computing area 51, and the sum of the widths of the first storage area 48 and the optional area 66 along the second direction is greater than the width of the second sub-region 47 along the second direction.

[0100] In one embodiment, an input / output board module 10 is disposed between the second sub-region 47 and at least one side of the first region 3.

[0101] In this embodiment, the IO component further includes an input / output board module 10 disposed at the first end, the input / output board module 10 being disposed between the second sub-region 47 and at least one side of the first region 3.

[0102] This layout optimizes the rationality of the server chassis layout and the efficiency of space utilization, allowing the I / O board module 10 to be tightly integrated without occupying too much space. This enables it to work collaboratively with other components such as hard drive modules and expansion card modules, forming a compact and orderly system architecture. By placing the I / O board module 10 in this position, not only is a reasonable allocation of functional modules achieved, but also good line management and ease of maintenance and upgrades are ensured. When the server chassis needs to connect external devices or expand interfaces, the I / O board module 10 can quickly respond to the demand without affecting the normal operation of other important components. Furthermore, this design enhances the overall stability of the server chassis, as the I / O board module 10 acts as a support and isolation mechanism, helping to prevent damage to the internal structure due to overload or improper operation. Of course, in other embodiments not shown in the figures, the position of the I / O board module 10 can be adjusted according to specific functional requirements and space constraints to adapt to different usage scenarios and configuration requirements.

[0103] In one embodiment, the server chassis further includes a front window 1 and a rear window 35. The front window 1 is located at the first end of the chassis 2, and the rear window 35 is located at the second end of the chassis 2. The I / O component area extends from the front window 1 into the chassis 2.

[0104] In one embodiment, the housing 2 includes a mounting plate 64 and side plates 65 located on both sides of the mounting plate 64. The mounting plate 64 and the two side plates 65 form a U-shaped structure. The mounting plate 64 and the two side plates 65 can be integrally formed or processed separately and then fixedly connected. The fixed connection can be by bolt connection, welding, etc.

[0105] The first area 3 is equipped with an expansion card module bracket for installing expansion card modules. The first storage area 48 is equipped with a second hard disk module box 5. The second storage area 52 is equipped with a first hard disk module box 4. The optional area 66 can selectively install a first module mounting bracket 7 or a second module mounting bracket 8. The first module mounting bracket 7 is used to install hard disk modules, and the second module mounting bracket 8 is used to install expansion card modules.

[0106] In this embodiment, by setting the first hard disk module box 4 in the second storage area 52 and the second hard disk module box 5 in the first storage area 48, the installation of the hard disk module in these two areas can be facilitated. The structure of the optional area 66 can be adapted to the installation of the first module mounting base 7 or the second module mounting base 8. The hard disk module can be installed in the first module mounting base 7 and then installed as a whole in the first functional area 6, or the expansion card module can be installed in the second module mounting base 8 and then installed as a whole in the optional area 66.

[0107] The input / output board module 10 is first fixed to the input / output board tray with I-beams and screws. The input / output board tray is then fixed to the right side of the first hard disk module box 4 with I-beams and hand-tightened screws, thereby maximizing the use of the front window space and making the server chassis structure more compact.

[0108] In one embodiment, the front window 1 is designed with a symmetrical structure, with first areas 3 on the left and right respectively. Each first area 3 is used to install 6 full-height half-length expansion card modules 31. The lower part of the middle second area 45 is a second sub-area 47, which houses a first hard disk module box 4. The first hard disk module box 4 and the front window 1 are riveted and fixed to the housing 2. The first hard disk module box 4 is compatible with 8 E3.S hard disk modules or 8 2.5-inch hard disk modules. The backplanes of the E3.S hard disks and the 2.5-inch hard disks are identical in shape, so they can be fixed in the same hard disk module box. The upper left side of the first hard disk module box 4 is the first storage area 48 of the first sub-area 46, which houses a second hard disk module box 4. The second hard drive module box 5 houses two 2.5-inch hard drive modules. It is riveted to the front window 1 and the first hard drive module box 4. On the upper right side of the first hard drive module box 4, which is also the right side of the second hard drive module box 5, there is a selection area 66. This selection area 66 is designed to accommodate either the first module mounting bracket 7 or the second module mounting bracket 8. In other words, it can accommodate either the first module mounting bracket 7 or the second module mounting bracket 8. Therefore, different modules can be installed in the selection area 66 according to different functional requirements; it can accommodate two 2.5-inch hard drive modules or one half-height, half-length expansion card module 32. The half-height, half-length expansion card module can accommodate two half-height, half-length expansion cards. This design facilitates interconnection and cable management, ensuring neatness and rationality of the cable routing within the server chassis.

[0109] See also Figure 6 , Figure 7 and Figure 9As shown, in one embodiment, the two first regions 3 located on both sides of the first hard disk module box 4 are arranged in a mirror image and form a symmetrical structure. Riser supports are respectively provided on both sides of the front window 1, and each riser support is equipped with a riser module 44. Each riser module 44 is equipped with an expansion card slot connector for easy connection with expansion cards. Through the symmetrical module layout and standardized connection interfaces, efficient data transmission and power management are achieved, improving the overall system efficiency and reliability. In practical applications, this well-defined and highly compatible design enables the server to exhibit superior performance when processing large-scale datasets and complex computing tasks, while simplifying maintenance and upgrade processes and reducing operating costs. Of course, in other embodiments not shown, the selection and installation position of the expansion card modules can be adjusted according to specific hardware requirements, further demonstrating the adaptability and expandability of the design scheme.

[0110] See also Figure 21 As shown, in one embodiment, the server chassis includes a front window 1 and a chassis 2. The front window 1 is installed at the first end of the chassis 2 and projected along the direction from the first end to the second end. The I / O component area is located within the projection area of ​​the front window 1. The I / O component area is divided into a first region 3 located on both sides and a second region 45 located in the middle along a second direction. The two first regions 3 are configured with the same I / O components. The second region 45 is divided into a first sub-region 46 and a second sub-region 47. The stacking direction of the I / O components configured in the first sub-region 46 is perpendicular to the stacking direction of the I / O components configured in the second storage area 52 of the second sub-region 47. The first sub-region 46 includes a first storage area 48 and an optional area 66. The arrangement direction of the first storage area 48 and the optional area 66 is consistent with the width direction of the second sub-region 47, both being the second direction. The sum of the widths of the first storage area 48 and the optional area 66 along the second direction is greater than the width of the second sub-region 47.

[0111] See also Figure 22 As shown, it is similar to Figure 21 The embodiments shown are basically the same, except that in this embodiment, the second sub-region 47 includes a second storage area 52 and a second functional area 53, the first storage area 48 and the optional area 66 are arranged along the second direction, the second storage area 52 and the second functional area 53 are arranged along the second direction, the second storage area 52 is located below the first storage area 48, and the second functional area 53 is located below the optional area 66.

[0112] See also Figure 23 As shown, it is similar to Figure 21The embodiments shown are basically the same, except that in this embodiment, the server chassis also includes a computing area 51. Along the first direction, the computing area 51 is located on the side of the first sub-region 46 away from the second sub-region 47, and the computing area 51 is equipped with computing components.

[0113] See also Figure 24 As shown, it is similar to Figure 22 The embodiments shown are basically the same, except that in this embodiment, the second sub-region 47 includes a second storage area 52 and a second functional area 53, the first storage area 48 and the optional area 66 are arranged along the second direction, the second storage area 52 and the second functional area 53 are arranged along the second direction, the second storage area 52 is located below the first storage area 48, and the second functional area 53 is located below the optional area 66.

[0114] See also Figure 5 , Figure 8 and Figure 20 As shown, in one embodiment, the fan area 49 inside the server chassis is located at the second end of the chassis 2, forming a heat dissipation area. By setting up the heat dissipation area, it can connect with the air ducts located in multiple areas at the first end, thereby allowing the airflow entering through the multiple areas of the front window to enter the heat dissipation area to effectively dissipate heat from the various heat-generating components inside the server chassis, improving the heat dissipation effect.

[0115] See also Figure 23 and Figure 24 As shown, in one embodiment, the server chassis also includes a computing area 51, which is located on the side of the IO component area away from the second sub-region 47.

[0116] In this embodiment, computing components can be set in computing area 51, which is far from the second sub-area 47 in the IO component area, thereby further expanding the functionality of the server chassis, making the server chassis more scalable and better meeting the needs of current AI servers.

[0117] In one embodiment, each first area 3 is an expansion card module installation area for installing at least four expansion card modules, the second storage area 52 of the second sub-area 47 is for installing at least six hard disk modules, the first storage area 48 is for installing at least one hard disk module, and the optional area 66 is for installing at least one hard disk module or expansion card module.

[0118] In one embodiment, the expansion card module is, for example, a PCIe card module.

[0119] See also Figure 20As shown, in one embodiment, a back plate 62 is provided inside the housing 2, positioned between the front window 1 and the rear window 35. The back plate 62 has a gap between itself and the housing 2 on the side closest to the computing area 51, ensuring sufficient airflow area to form a heat dissipation channel between the front window 1 and the rear window 35. The back plate 62 can be directly mounted on the mounting plate 64 of the housing 2, facilitating its installation and fixation. A limiting edge 63 is provided on the back plate 62 to limit and stop the installation of other components.

[0120] The enclosure 2 also includes a first power supply component 56 and a second power supply component 57. Both the first power supply component 56 and the second power supply component 57 are located in the power configuration area 68. The first power supply component 56 is located on the side of the enclosure 2 near the front window 1, and the second power supply component 57 is located on the side of the enclosure 2 near the rear window 35. Both the first power supply component 56 and the second power supply component 57 are connected to the back panel 62, and the voltage of the first power supply component 56 is greater than the voltage of the second power supply component 57. The first power supply component 56 and the second power supply component 57 constitute a power supply unit assembly. In the above configuration, since the voltage of the first power supply component 56 is greater than that of the second power supply component 57, the first power supply component 56 occupies more space. By placing the first power supply component 56 on the side of the housing 2 closer to the front window 1 and arranging the second power supply component 57 on the side of the housing 2 closer to the rear window 35, more space can be freed up for the rear window 35, making it easier to install the fan component 50, thereby ensuring the heat dissipation capacity of the cooling system. Specifically, the first power supply component 56 can be a 54V PSU and the second power supply component 57 can be a 12V PSU. In actual applications, the voltage of the first power supply component 56 and the second power supply component 57 can be selected as needed.

[0121] In one embodiment, there are multiple first power supply components 56 and multiple second power supply components 57. Each first power supply component 56 is arranged in the front-to-back direction, and each second power supply component 57 is arranged in the height direction. Each first power supply component 56 is connected in sequence. The first power supply component 56 located on the rear side is connected to the front side of the back plate 62, and each second power supply component 57 is connected in sequence to the rear side of the back plate 62. Specifically, the number of the first power supply component 56 and the second power supply component 57 needs to be selected according to the actual heat dissipation requirements of the electronic device. When there are multiple first power supply components 56 and second power supply components 57, a modular design can be adopted, with each first power supply component 56 made into a first power supply component module and each second power supply component 57 made into a second power supply component module. Since the size of the first power supply component 56 is relatively large, in order to avoid the first power supply component 56 being too tall and affecting the layout of other devices at the front window 1, the first power supply components 56 are connected sequentially in the horizontal direction, that is, the first power supply components 56 are arranged in the front-to-back direction. Of course, they can also be arranged in the left-to-right direction. As for the second power supply component 57, since the size of the rear window 35 is relatively small compared to the size of the front window 1, the second power supply components 57 are arranged in the height direction, that is, the second power supply components 57 are arranged by stacking. Of course, while the second power supply components 57 are stacked in the height direction, they can also be arranged in the left-to-right direction.

[0122] In one embodiment, the enclosure 2 further includes a motherboard 58, a switching circuit board 59, a central processing unit 60, and a main power supply board 61, as well as a first partition 54 and a second partition 55 arranged along the height direction. Both the first partition 54 and the second partition 55 are located on the side of the enclosure 2 closest to the front window 1 and extend horizontally. The motherboard 58, the switching circuit board 59, the central processing unit 60, and the main power supply board 61 are located within the spaced area formed by the first partition 54 and the second partition 55.

[0123] In one embodiment, the central processing unit 60 is mounted on the motherboard 58, and the motherboard 58 and the switching circuit board 59 are arranged along the height direction; specifically, the switching circuit board 59 can be a switch board. With this configuration, by integrating the motherboard 58, the switching circuit board 59, and the central processing unit 60 within the computing unit housing, the installation of the motherboard 58, the switching circuit board 59, and the central processing unit 60 can be completed simultaneously by removing and installing the computing unit housing. Simultaneously, the central processing unit 60 is mounted on the motherboard 58, and the connection between the motherboard 58 and the backplane 62 enables communication between the central processing unit 60 and other devices. Furthermore, by arranging the motherboard 58 and the switching circuit board 59 along the height direction, the cables between the motherboard 58 and the switching circuit board 59 can extend vertically. Compared to a horizontal arrangement of the motherboard 58 and the switching circuit board 59, the connectors on the side of the motherboard 58 furthest from the switching circuit board 59 need to cross... The graphics processor and memory on the motherboard 58 are connected to the switching board 59. Due to the layout limitations of the motherboard 58, the connectors cannot all be placed on one side of the switching board 59. The cable length between the motherboard 58 and the switching board 59 is relatively long. By placing the motherboard 58 and the switching board 59 vertically, the connectors on both sides of the motherboard 58 can be connected to the switching board 59 from both sides downwards through shorter high-speed cables. In other words, compared with the horizontal extension of the cable, the vertical arrangement of the motherboard 58 and the switching board 59 can effectively reduce the cable length. Moreover, the vertical cable management method helps to reduce wind resistance and ensure the heat dissipation effect of the motherboard 58 and the switching board 59.

[0124] See also Figures 2 to 5 As shown, in this embodiment, each first region 3 has six expansion card modules installed, the second sub-region 47 has eight hard disk modules installed, the first storage region 48 has two hard disk modules installed, and the optional region is used to install two hard disk modules or two expansion card modules. In other embodiments, the number of expansion card modules installed in the first region 3, the number of hard disk modules installed in the second sub-region 47, the number of hard disk modules installed in the first storage region 48, and the number of hard disk modules or expansion card modules installed in the optional region 66 can all be adjusted according to actual needs.

[0125] In one embodiment, the first region 3 is configured to accommodate a full-height half-length expansion card module 31, and when the optional region 66 is configured to accommodate an IO component of the same type as the IO component configured in the first region 3, the optional region 66 is configured to accommodate a half-height half-length expansion card module 32.

[0126] In this embodiment, first areas 3 are respectively provided on both sides of the second area 45. The first area 3 is an expansion card module installation area for installing full-height, half-length expansion card modules 31, which allows the device to flexibly expand high-performance computing resources. At the same time, the second module mounting base 8 located in the optional area 66 is used to install half-height, half-length expansion card modules 32. This layout design not only optimizes space utilization but also enhances the system's configuration flexibility, allowing for the selection of appropriate expansion card types according to different application scenarios to meet diverse needs.

[0127] In one embodiment, a first module mounting base 7 and a second module mounting base 8 may be selectively configured in the optional area 66. The first module mounting base 7 is configured to accommodate an IO component of the same type as the IO component configured in the second storage area 52, and the second module mounting base 8 is configured to accommodate an IO component of the same type as the IO component configured in the first area 3. The optional area 66 has a U-shaped mounting groove 9, in which a plurality of first threaded holes 11 are provided. The first module mounting base 7 or the second module mounting base 8 is provided with a first connecting hole 12 corresponding to the first threaded hole 11.

[0128] In this embodiment, the optional area 66 has a U-shaped mounting slot 9, within which multiple first threaded holes 11 are arranged. Correspondingly, the first module mounting base 7 or the second module mounting base 8 is equipped with first connecting holes 12 that match these first threaded holes 11. The first module mounting base 7 or the second module mounting base 8 is fixedly connected to the optional area 66 by screws located within the first threaded holes 11 and the first connecting holes 12. This design allows users to flexibly choose to install hard disk modules or expansion card modules in the optional area 66 according to actual needs. By aligning the first connecting holes 12 on the hard disk module housing with the first threaded holes 11 in the optional area 66 and fixing them with screws, rapid replacement and assembly of different functional modules are achieved, greatly enhancing the functional diversity and maintenance convenience of the server node. The U-shaped mounting slot 9 further reduces the installation difficulty of the first module mounting base 7 or the second module mounting base 8 in the optional area 66, improves installation efficiency, and allows for easy observation from the top of the server chassis, providing more operating space and making operation simpler and faster. The above design not only provides a solid installation foundation but also optimizes the module box installation process, enabling efficient hardware addition and removal even in confined spaces, thereby improving the overall operating efficiency and scalability of the server. Furthermore, the precise matching of the first threaded hole 11 and the first connecting hole 12 ensures a tight connection between hardware components, thus guaranteeing data transmission stability and system reliability. In other embodiments not shown, the design of the U-shaped mounting slot 9 and the layout of the threaded holes may differ, but their core purpose remains the same: to facilitate flexible installation and replacement of hardware components and maintain high-performance operation of the device.

[0129] In one embodiment, an I-beam nail 13 is provided on the side of the second sub-region 47 facing the calculation area 51, and a U-shaped groove 14 is provided on the side of the first module mounting base 7 or the second module mounting base 8 facing the second sub-region 47, with the I-beam nail 13 being engaged in the U-shaped groove 14.

[0130] In this embodiment, a first hard disk module enclosure 4 is configured within the second sub-region 47. The first hard disk module enclosure 4 is used to assemble hard disk modules. An I-beam 13 is positioned on the top of the first hard disk module enclosure 4, while a U-shaped groove 14 is provided at the bottom of the first module mounting base 7 or the second module mounting base 8. The I-beam 13 can be precisely engaged within the U-shaped groove 14. This design enables a stable connection and rapid positioning between different functional modules. The combined use of the I-beam 13 and the U-shaped groove 14 not only simplifies the assembly process and improves assembly efficiency but also ensures the stability and reliability of the hard disk modules and expansion card modules within the chassis. Especially in high-density server environments, this precise mechanical fixing method reduces connection loosening caused by vibration, ensuring continuous device operation and data transmission integrity. Furthermore, this design allows for flexible selection and expansion of storage or computing resources within limited space, adapting to the needs of different application scenarios and enhancing the server's versatility and user customization capabilities.

[0131] In one embodiment, the combination of the I-beam 13 and the U-shaped groove 14 enables the modules to be positioned along the first direction, allowing the multi-layer hard drive module or expansion card module to form a stable whole during assembly. This helps optimize thermal management because the stable module structure reduces airflow obstruction and improves cooling efficiency. Simultaneously, this design facilitates later maintenance. When a module needs to be replaced or upgraded, it can be easily separated without disassembling the entire server node, thus reducing maintenance costs and time. In subsequent embodiments not shown, a similar design approach can be used with other types of connectors, such as clips or pins, to achieve the same purpose. Regardless of the method used, the core objective is to achieve efficient assembly, reliable connection, and convenient maintenance of equipment in high-density server environments. This modular assembly method is not only applicable to the server chassis in this embodiment but also to chassis designs in other situations.

[0132] In this embodiment, the H-shaped pin 13 and the U-shaped groove 14 are used to limit the first module mounting base 7 or the second module mounting base 8 and the optional area 66 in the first direction. The screws in the first threaded hole 11 and the first connecting hole 12 can be used to connect and fix the first module mounting base 7 or the second module mounting base 8 and the optional area 66. The first threaded hole 11 is located on the side of the optional area 66 near the front window 1, and the H-shaped pin 13 is located on the side of the optional area 66 away from the front window 1. The screws and the snap-fit ​​structure can be used to achieve a stable and reliable fit between the first module mounting base 7 or the second module mounting base 8 and the optional area 66.

[0133] See also Figures 10 to 15 As shown, in one embodiment, a fixing seat 15 is provided on the side of the second sub-region 47 facing the computing area 51. The fixing seat 15 is located on the side of the optional area 66 near the first storage area 48. The fixing seat 15 is provided with a second threaded hole 16 and a first positioning hole 17 on the side facing the computing area. The first module mounting seat 7 or the second module mounting seat 8 is provided with a second connecting hole 18 corresponding to the second threaded hole 16, and a first positioning post 19 is provided corresponding to the first positioning hole 17. The first positioning post 19 is inserted into the first positioning hole 17.

[0134] In this embodiment, a first hard disk module box 4 is disposed in the second sub-region 47, and a second hard disk module box 5 is disposed in the first storage area 48 of the first sub-region 46. A mounting base 15 is located on the side of the first hard disk module box 4 facing the computing area 51 and is positioned close to the second hard disk module box 5. The mounting base 15 has a second threaded hole 16 and a first positioning hole 17 on the side facing the computing area 51. The first module mounting base 7 or the second module mounting base 8 is correspondingly equipped with a second connecting hole 18 and a first positioning post 19, wherein the first positioning post 19 is adapted to the first positioning hole 17 to achieve precise positioning. When the first module mounting base 7 or the second module mounting base 8 is installed onto the mounting base 15, initial positioning is completed by inserting the first positioning post 19 into the first positioning hole 17. Then, the second connecting hole 18 and the second threaded hole 16 are engaged, and screws are used to tighten the screws to complete the final fixation. This design ensures a stable connection between the hard drive module enclosure or expansion card module enclosure and the mounting bracket 15, allowing modules with different functions to be quickly replaced on the same mounting bracket 15, enhancing system flexibility and maintainability. Simultaneously, precise positioning and a robust connection help improve signal integrity during device operation, reducing data transmission errors caused by unstable connections, thereby ensuring the overall performance and reliability of the server. Furthermore, this standardized installation method reduces production and maintenance costs, simplifies operation procedures, and improves work efficiency. In other embodiments not shown in the figures, the shape and position of the mounting bracket 15 can be adjusted according to actual needs to accommodate more diverse module installation requirements, further optimizing the layout and management of internal server components.

[0135] In one embodiment, the front window 1 has a first threaded hole 11 on each side of the optional area 66. During assembly, the hard drive backplate and the 2.5-inch hard drive module are first installed into the first module mounting base 7. The 2.5-inch hard drive module and the first module mounting base 7 are then assembled onto the front window 1. The U-shaped groove 14 on the first module mounting base is engaged with the I-beam 13 on the top of the first hard drive module box 4. The first positioning post 19 is inserted into the first positioning hole 17 on the fixing base 15, thereby aligning the two first connecting holes 12 on the first module mounting base 7 with the two first threaded holes on the front window 1. A second connecting hole 18 is aligned with a second threaded hole 16 on the fixing base 15. Then, it is fixed with screws. Alternatively, a second module mounting base 8 can be used here. The two expansion cards are first assembled onto the second module mounting base 8, and then the entire module is assembled onto the chassis. The first positioning post 19 is inserted into the first positioning hole 17. The two first connecting holes 12 on the second module mounting base 8 are aligned with the two first threaded holes on the front window 1. One second connecting hole 18 is aligned with one second threaded hole 16 on the fixing base 15. Then, it can be fixed with screws.

[0136] In one embodiment, the first connection hole 12 and the second connection hole 18 on the first module mounting base 7 and the second module mounting base 8 are both slotted holes.

[0137] In one embodiment, the mounting base 15 is located on the side of the optional area away from the front window 1, and is in the shape of an inverted T (i.e., T-shaped). Its bottom is fixedly connected to the first hard disk module box 4. The first module mounting base 7 and the second module mounting base 8 are both supported and fixed on the left rear side by the mounting base 15, which ensures the stability and reliability of the mounting structure of the first module mounting base 7 and the second module mounting base 8.

[0138] In one embodiment, the optional area 66 is further provided with a second positioning hole 20, and the server chassis also includes a baffle 21, which can be selectively mounted on the optional area 66.

[0139] In one embodiment, the baffle 21 includes a mesh body 67 and a baffle plate 22 disposed on the periphery of the mesh body 67. The baffle plate 22 is provided with a third connecting hole 23 corresponding to the first threaded hole 11, and a second positioning post 24 is provided with the baffle plate 22 corresponding to the second positioning hole 20. The second positioning post 24 is inserted into the second positioning hole 20.

[0140] In this embodiment, the front window 1 of the server chassis has a second positioning hole 20 at the position corresponding to the optional area 66, introducing a baffle 21 as an optional assembly component to close off unused extended areas and prevent dust from entering the chassis. The baffle 21 consists of a mesh body 67 and a baffle plate 22. The baffle plate 22 is located on the periphery of the mesh body 67, and the extension direction of the baffle plate 22 is perpendicular to the setting direction of the mesh body 67. A third connecting hole 23 is provided on the periphery of the baffle plate 22, corresponding to the first threaded hole 11 and the second positioning post 24. The second positioning post 24 can be accurately inserted into the second positioning hole 20 to achieve a stable assembly of the baffle 21 on the first functional area 6. This design allows users to choose whether to install the baffle 21 according to actual needs, protecting the internal environment of the chassis and providing flexible functional configuration options, enhancing the adaptability and maintainability of the system. The cooperation between the second positioning post 24 and the second positioning hole 20 ensures the accuracy and stability of the baffle 21 assembly, thereby effectively closing off unused space, protecting internal components from external environmental influences, and improving the overall reliability and durability of the equipment.

[0141] This mesh enclosure assembly mechanism not only simplifies component replacement during maintenance but also ensures proper protection of the chassis's internal structure under different usage scenarios, preventing issues such as reduced heat dissipation efficiency and poor electrical contact caused by dust accumulation. The flexible assembly characteristics of the mesh enclosure 21, coupled with the precise fit between its baffle 22 and the optional area 66, constitute a practical and efficient solution, improving server performance in complex environments. Of course, the assembly of the mesh enclosure 21 is not limited to this method; in other embodiments not shown in the figure, similar protection and functional expansion purposes can be achieved through different connection mechanisms.

[0142] In this embodiment, the baffle 21 is fixed only to the front window 1 and not to the mounting base 15, and is used to provide protection for the optional area from the first end of the server chassis.

[0143] In one embodiment, the housing 2 includes a mounting plate 64 located on the side of the IO component area away from the computing area 51. Handles 25 are respectively provided on both sides of the IO component area along a second direction. The second direction forms an angle with the first direction and also forms an angle with the direction from the first end to the second end. The handles 25 are located on the side of the IO component area away from the computing area 51. The mounting plate 64 is provided with a pivot 26. An active space 27 is formed between the IO component area and the mounting plate 64. The handles 25 have a connecting end and an operating end. The connecting end extends into the inner side of the housing 2 through the active space 27 and is rotatably connected to the pivot 26. The operating end is located on the outer side of the housing 2. The handles 25 have a first rotation position and a second rotation position. When the handles 25 are in the first rotation position, the handles 25 are in a retracted state. When the handles 25 are in the second rotation position, the handles 25 are in an extended state.

[0144] In one embodiment, the housing 2 further includes side plates 65 spaced apart along the second direction, with a fork 28 at the end of the connecting end, and a clearance groove 29 provided on the side plate 65 corresponding to the position of the fork 28, with the fork 28 extending out of the side plate 65 through the clearance groove 29.

[0145] In this embodiment, a movable space 27 is formed between the front window 1 and the mounting plate 64 of the housing 2. The handle 25 can rotate through the movable space 27 between the front window 1 and the mounting plate 64 of the housing 2. The structural design of the handle 25 allows it to flexibly switch between a first rotation position and a second rotation position. The first rotation position corresponds to the retracted state, and the second rotation position corresponds to the extended state. The connecting end of the handle 25 is rotatably connected to the mounting plate 64 of the housing 2 via a pivot 26 on the housing 2. The operating end is located on the outside of the front window 1 for easy user operation. A fork 28 is provided at the end of the connecting end of the handle 25. A clearance groove 29 is provided on the side plate 65 of the housing 2 corresponding to the fork 28, allowing the fork 28 to extend out of the housing 2 through the clearance groove 29. A cabinet is installed outside the enclosure 2. The cabinet has a positioning block at the position of the corresponding fork. The fork 28 has a groove 38. When the server chassis 30 is installed in the cabinet, the handle 25 is initially in the second rotation position in the unfolded state. As the server chassis 30 enters, the fork 28 on the handle 25 will contact the positioning block on the cabinet and be squeezed by the positioning block. At the same time, the positioning block enters the groove 38 of the fork 28. At this time, under the action of the positioning block, the fork 28 is limited. Under the limiting action of the positioning block, the fork 28 drives the operating end of the handle 25 to rotate around the pivot 26 and retract to the side where the front window 1 is located. When the handle 25 reaches the assembly position on the front window 1, the handle 25 is in the first rotation position, and the server chassis 30 is also assembled in place.

[0146] When the server chassis 30 is removed from the rack, the handle 25 is opened, and the handle 25 is rotated from the first rotation position to the second rotation position. At this time, the operating end of the handle 25 unfolds, and the fork 28 at the tail of the handle 25 presses against the positioning block on the rack. The positioning block provides a reaction force to the fork 28, pushing the server chassis 30 out of the rack. This provides sufficient torque for the removal of the server chassis 30, making it easy for users to push or pull the node during maintenance, achieving quick installation and removal of the node. This device not only enhances the maintainability of the server but also simplifies the physical operation difficulty during maintenance, significantly improving the daily operation and maintenance efficiency of the server. In other embodiments not shown, the design and function of the handle 25 can be appropriately adjusted according to actual usage scenarios and needs, such as changing the thickness of the handle 25 to accommodate nodes of different weights, or optimizing the geometry of the fork 28 and the clearance groove 29 to enhance mechanical strength or reduce production costs, but its core function still revolves around the convenient assembly and maintenance of the node.

[0147] In one embodiment, a shaft hole 40 is provided at the connecting end of the handle 25, and a rotating shaft 26 is installed in the shaft hole 40 to achieve a rotatable connection between the handle 25 and the rotating shaft 26. The handle 25 includes a horizontal section and a vertical section, which are fixedly connected and can be formed by sheet metal bending. The fork 28 and the shaft hole 40 are both provided on the horizontal section, which is rotatably disposed within the movable space 27. The vertical section is located on the outside of the server chassis 30, and a third positioning hole 39 is provided on the vertical section. A locking screw 37 is provided at the end of the vertical section away from the shaft hole 40. The locking screw 37 is rotatably disposed on the vertical section and is a manual screw. A fourth connecting screw is provided on the front window 1 at the position corresponding to the locking screw 37. The connection hole 41 has a third positioning post 42 at the position corresponding to the third positioning hole 39 on the front window 1. The third positioning post 42 is inserted into the third positioning hole 39, and the locking screw 37 is threaded into the fourth connection hole 41. This allows the handle 25 to be installed and fixed after the server chassis 30 is installed in the rack. On the one hand, the cooperation between the handle 25 and the positioning block on the rack ensures the stability and reliability of the connection between the server chassis 30 and the rack. On the other hand, the handle 25 occupies less space and is less likely to interfere with other structures.

[0148] In one embodiment, the rotating shaft 26 is formed by a stud mounted on the housing 2.

[0149] In one embodiment, the handle is designed as a 3mm thick die-cast part. The handle thickness can also be changed according to the actual weight and space to meet the requirements of heavier servers and high-density connectors with high clamping force.

[0150] In one embodiment, the server chassis 30 further includes a top cover 34 and a slide rail 36, wherein the slide rail 36 is disposed on the side wall of the chassis 2 to facilitate guidance and positioning when the server chassis 30 is installed into the rack.

[0151] In one embodiment, the server chassis 30 is provided with earpieces 43 on both sides of the front window 1 to facilitate operation of the server chassis 30.

[0152] According to an embodiment of this application, the server includes the server chassis described above.

[0153] This application also provides a server that uses the aforementioned server chassis and offers the following technical advantages: First, the overall assembly of the server becomes more flexible and efficient because the server chassis employs a layered design and possesses independent maintenance capabilities. Second, by rationally distributing the switch board, motherboard, and various modules such as expansion card modules and hard drive modules within the server chassis, the server can better handle high-load computing demands, such as AI computing tasks, while ensuring good heat dissipation and line management. Furthermore, this design allows server administrators to dynamically adjust the storage and computing resources within the nodes according to actual business needs, achieving optimized resource configuration without additional complex operations. Finally, by designing handles and positioning mechanisms on the front window of the nodes, the installation and removal of nodes become simple and quick, enabling easy maintenance even in high-density rack environments, greatly improving the server's operability and maintenance efficiency.

[0154] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0155] The embodiments provided by this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A server chassis, characterized by, include: The first and second ends are set relative to each other; A fan section (49) is configured to accommodate a fan component (50), the fan section (49) being located at the second end; An IO component area and a computing area (51) are located at the first end and are stacked together. The IO component area is configured to accommodate IO components, and the computing area (51) is configured to accommodate computing components. The IO component area includes two first regions (3) and one second region (45), with the second region (45) located between the two first regions (3); The second region (45) includes a first sub-region (46) and a second sub-region (47), wherein at least some of the IO components configured in the first sub-region (46) and the second sub-region (47) are stacked perpendicularly. The power configuration area (68) is configured to supply power to the fan area (49), the IO component area, and the computing area (51).

2. The server chassis of claim 1, wherein, The height of the first region (3) along the first direction is greater than the height of the second sub-region (47) along the first direction. The first direction forms an angle with the direction from the first end to the second end. The computing area (51) and the IO component area are stacked along the first direction. The stacking direction of the IO components configured in the first region (3) is the same as the stacking direction of the IO components configured in the second sub-region (47).

3. The server chassis of claim 2, wherein, At least one of the first sub-region (46) and the second sub-region (47) is provided with an optional area (66), and the type of IO component configured in the optional area (66) can be changed.

4. The server chassis of claim 3, wherein, The first sub-region (46) includes the optional area (66), and the second sub-region (47) includes a second storage area (52). The optional area (66) is configured to accommodate IO components of the same type as those configured in the second storage area (52) or the first region (3).

5. The server chassis of claim 4, wherein, The first sub-region further includes a first storage area (48), the first storage area (48) and the optional area (66) are arranged along a second direction, the second direction is at an angle to the first direction, and the second direction is at an angle to the direction from the first end to the second end.

6. The server chassis according to claim 3, characterized in that, The second sub-region (47) includes a second storage area (52) and the optional area (66), the second storage area (52) and the optional area (66) are arranged along a second direction, the second direction is at an angle to the first direction and at an angle to the direction from the first end to the second end, the optional area (66) is configured to accommodate IO components of the same type as those configured in the second storage area (52) or the first region (3).

7. The server chassis according to claim 5, characterized in that, Along the first direction, the first sub-region (46) is located on the side of the second sub-region (47) close to the computing area (51), and the sum of the widths of the first storage area (48) and the optional area (66) along the second direction is greater than the width of the second sub-region (47) along the second direction.

8. The server chassis according to claim 4 or 6, characterized in that, The first region (3) is configured to accommodate a full-height half-length expansion card module (31). When the optional region (66) is configured to accommodate an IO component of the same type as the IO component configured in the first region (3), the optional region (66) is configured to accommodate a half-height half-length expansion card module (32).

9. The server chassis according to claim 7, characterized in that, An input / output board module (10) is provided between the second sub-region (47) and the first region (3) on at least one side.

10. The server chassis according to claim 5, characterized in that, The optional area (66) may be configured with a first module mounting base (7) and a second module mounting base (8). The first module mounting base (7) is configured to accommodate an IO component of the same type as the IO component configured in the second storage area (52). The second module mounting base (8) is configured to accommodate an IO component of the same type as the IO component configured in the first area (3). The optional area (66) has a U-shaped mounting groove (9). The U-shaped mounting groove (9) is provided with a plurality of first threaded holes (11). The first module mounting base (7) or the second module mounting base (8) is provided with a first connecting hole (12) corresponding to the first threaded hole (11).

11. The server chassis according to claim 10, characterized in that, The second sub-region (47) is provided with an I-shaped pin (13) on the side facing the calculation area (51), and the first module mounting base (7) or the second module mounting base (8) is provided with a U-shaped groove (14) on the side facing the second sub-region (47), and the I-shaped pin (13) is engaged in the U-shaped groove (14).

12. The server chassis according to claim 10, characterized in that, The second sub-region (47) is provided with a fixing seat (15) on the side facing the computing area (51). The fixing seat (15) is provided on the side of the optional area (66) near the first storage area (48). The fixing seat (15) is provided with a second threaded hole (16) and a first positioning hole (17) on the side facing the computing area. The first module mounting seat (7) or the second module mounting seat (8) is provided with a second connecting hole (18) corresponding to the second threaded hole (16). A first positioning post (19) is provided corresponding to the first positioning hole (17). The first positioning post (19) is inserted into the first positioning hole (17).

13. The server chassis according to claim 10, characterized in that, The optional area (66) is also provided with a second positioning hole (20), and the server chassis also includes a baffle (21), which can be selectively installed in the optional area (66).

14. The server chassis according to claim 13, characterized in that, The baffle (21) includes a mesh body (67) and baffles (22) disposed on the periphery of the mesh body (67). The baffle (22) is provided with a third connecting hole (23) corresponding to the first threaded hole (11). The baffle (22) is provided with a second positioning post (24) corresponding to the second positioning hole (20). The second positioning post (24) is inserted into the second positioning hole (20).

15. The server chassis according to any one of claims 2 to 4, characterized in that, The server chassis includes a chassis (2) having a first end and a second end. The chassis (2) includes a mounting plate (64) located on the side of the IO component area away from the computing area (51). The IO component area is provided with handles (25) on both sides along a second direction. The second direction forms an angle with the first direction and with the direction from the first end to the second end. The handles (25) are located on the side of the IO component area away from the computing area (51). The mounting plate (64) is provided with a pivot (26). An active space (27) is formed between the IO component area and the mounting plate (64). The handle (25) has a connecting end and an operating end. The connecting end extends into the inner side of the housing (2) through the active space (27) and is rotatably connected to the rotating shaft (26). The operating end is located on the outer side of the housing (2). The handle (25) has a first rotation position and a second rotation position. When the handle (25) is in the first rotation position, the handle (25) is in a retracted state. When the handle (25) is in the second rotation position, the handle (25) is in an extended state.

16. The server chassis according to claim 15, characterized in that, The housing (2) also includes side plates (65) spaced apart along the second direction. A fork (28) is provided at the end of the connecting end. A clearance groove (29) is provided on the side plate (65) corresponding to the position of the fork (28). The fork (28) extends out of the side plate (65) through the clearance groove (29).

17. A server, characterized in that, The server chassis included in any one of claims 1 to 16.

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