Memory module aging test equipment

Abstract

This utility model discloses a memory module aging test device, including external components and internal components. The external components include an upper sheet metal shell, an electrical box sheet metal back cover installed on one side of the upper sheet metal shell, a lower sheet metal shell installed on the bottom of the inner wall of the upper sheet metal shell, an upper and lower layer partition plate installed on the top of the lower sheet metal shell, a bracket installed on the top of the upper and lower layer partition plate, and a PTC heating element and an exhaust fan installed on the inner wall of the bracket from top to bottom. The memory module aging test device provided by this utility model constructs a high-temperature sealed test environment in which the temperature can be accurately directed to the memory module body. The high-temperature cover module is enclosed by FR4 fiberglass board on four sides. The excellent insulation, heat resistance and flame retardancy of this material effectively prevent heat loss and ensure the stability of the cavity structure, overcoming the two core defects of uneven temperature and the reference temperature not being the temperature of the memory body in the prior art.

Description

Technical Field

[0001] This utility model specifically relates to memory module aging test equipment and belongs to the field of memory module testing. Background Technology

[0002] As a crucial component of a computer, the reliability of memory modules is a key factor in the stable operation of a system. However, different applications running on the system can cause changes in external factors during memory use. For example, high-load applications can lead to increased temperature, resulting in decreased memory performance and a reduced lifespan, potentially posing a risk of system crashes.

[0003] Currently, most memory aging test platforms on the market perform stress coupling tests by heating the memory modules. However, these existing devices suffer from temperature instability, specifically uneven heat dissipation and the reference temperature being more of the cavity temperature than the memory module temperature. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a memory module aging test device to achieve accurate test results.

[0005] Memory module aging test equipment, including external and internal components;

[0006] The external components include an upper sheet metal shell, an electrical box sheet metal back cover mounted on one side of the upper sheet metal shell, a lower sheet metal shell mounted on the bottom of the inner wall of the upper sheet metal shell, an upper and lower layer partition plate mounted on the top of the lower sheet metal shell, a bracket mounted on the top of the upper and lower layer partition plate, a PTC heating element and an exhaust fan mounted on the inner wall of the bracket from top to bottom, a memory slot cavity mounted at the bottom of the upper and lower layer partition plate, a memory module installed inside the memory slot cavity, a heating box mounted on the top, a sealing strip installed between the heating box and the upper shell, two high-temperature covers slidably connected to the top of the heating box via a track, a rack mounted on the top of the high-temperature covers, two motor bases mounted on the top of the heating box, a motor mounted on the top of the motor bases, and a gear fixedly connected to the output end of the motor via a connecting rod, the gear meshing with the rack.

[0007] Furthermore, a heat dissipation vent is provided on the sheet metal rear cover of the electrical box, and a heat dissipation vent is provided on one side of the upper sheet metal outer shell.

[0008] Furthermore, a cooling fan for the electrical box is installed on one side of the upper sheet metal shell.

[0009] Furthermore, a partition plate is installed on the inner wall of the upper sheet metal shell, and a temperature-sensing PCB is installed on one side of the partition plate.

[0010] Furthermore, three relays are installed on one side of the partition plate.

[0011] Furthermore, a handle is installed on one side of the upper sheet metal shell.

[0012] Furthermore, a main control board is installed on the inner bottom wall of the upper sheet metal shell.

[0013] Furthermore, a high-temperature cover switch, a main control board reset switch, and a power switch are installed on one side of the sheet metal rear cover of the electrical box.

[0014] Furthermore, an indicator light PCB board is installed at the bottom of the upper and lower partition plates, and an EMR motherboard and accessories are installed on the inner bottom wall of the lower sheet metal shell.

[0015] Furthermore, a number of heat dissipation holes are provided on one side of the lower sheet metal shell, a water-cooled fan is installed on one side of the lower sheet metal shell, an isolation plate is installed on the inner bottom wall of the lower sheet metal shell, and three lower cooling fans are installed on one side of the lower sheet metal shell.

[0016] Beneficial effects:

[0017] The memory module aging test equipment provided by this utility model constructs a high-temperature sealed test environment in which the temperature can be accurately directed to the memory module body. The high-temperature cover module is enclosed by FR4 fiberglass board on four sides. The excellent insulation, heat resistance and flame retardancy of this material effectively block heat loss and ensure the stability of the cavity structure, overcoming the two major defects of uneven temperature and the fact that the reference temperature is not the temperature of the memory body in the prior art. Attached Figure Description

[0018] Figure 1 This is a top view of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the bow structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the present invention;

[0021] Figure 4 This is a top view of the internal structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the internal structure of this utility model from below;

[0023] Figure 6 This is a schematic diagram of the internal structure of the bracket of this utility model.

[0024] In the diagram: 100, External component; 101, Upper sheet metal casing; 102, Electrical box sheet metal rear cover; 103, Vent 1; 104, High-temperature cover switch; 105, Main control board reset switch; 106, Power switch; 107, Partition plate; 108, Temperature-sensing PCB; 109, Relay; 110, Main control board; 111, Handle; 112, Vent 2; 113, Electrical box cooling fan; 200, Internal component; 201 202. Lower sheet metal casing; 203. Heat dissipation holes; 204. Lower cooling fan; 205. Water cooling fan; 206. EMR motherboard and accessories; 207. Isolation plate; 208. Upper and lower layer partition plate; 209. Motor; 210. Gear; 211. Memory slot cavity; 212. Bracket; 213. High temperature cover; 214. Exhaust fan; 215. PTC heating element; 216. Indicator light PCB board; 217. Heating chamber. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-6 As shown, the memory module aging test equipment includes an external component 100 and an internal component 200;

[0027] The external component 100 includes an upper sheet metal shell 101, an electrical box sheet metal back cover 102 mounted on one side of the upper sheet metal shell 101, a lower sheet metal shell 201 mounted on the bottom of the inner wall of the upper sheet metal shell 101, an upper and lower layer partition plate 207 mounted on the top of the lower sheet metal shell 201, a bracket 212 mounted on the top of the upper and lower layer partition plate 207, a PTC heating element 215 and an exhaust fan 214 mounted from top to bottom on the inner wall of the bracket 212, and a memory slot cavity 21 mounted at the bottom of the upper and lower layer partition plate 207. 0. The memory slot cavity 210 is equipped with a memory module. A heating box 217 is installed on the top of the partition plate 107. A sealing strip is installed between the heating box 217 and the partition plate 107. Two high-temperature covers 213 are slidably connected to the top of the heating box 217 via a rail. A rack is installed on the top of the high-temperature cover 213. Two motor bases are installed on the top of the heating box 217. A motor 208 is installed on the top of the motor base. The output end of the motor 208 is fixedly connected to a gear 209 via a connecting rod. The gear 209 meshes with the rack.

[0028] As a technical optimization of this utility model, a heat dissipation vent 103 is provided on the sheet metal back cover 102 of the electrical box, and a heat dissipation vent 112 is provided on one side of the upper sheet metal shell 101.

[0029] As a technical optimization of this utility model, an electrical box cooling fan 113 is installed on one side of the upper sheet metal shell 101.

[0030] As a technical optimization of this utility model, a partition plate 107 is installed on the inner side wall of the upper sheet metal shell 101, and a temperature sensing PCB 108 is installed on one side of the partition plate 107.

[0031] As a technical optimization of this utility model, three relays 109 are installed on one side of the partition plate 107.

[0032] As a technical optimization of this utility model, a handle 111 is installed on one side of the upper sheet metal shell 101.

[0033] As a technical optimization of this utility model, a main control board 110 is installed on the inner bottom wall of the upper sheet metal shell 101.

[0034] As a technical optimization of this utility model, a high-temperature cover switch 104, a main control board reset switch 105 and a power switch 106 are installed on one side of the sheet metal back cover 102 of the electrical box.

[0035] As a technical optimization of this utility model, an indicator light PCB board 216 is installed at the bottom of the upper and lower partition plates 207, and an EMR motherboard and accessories 205 are installed on the inner bottom wall of the lower sheet metal shell 201.

[0036] As a technical optimization of this utility model, a plurality of heat dissipation holes 202 are provided on one side of the lower sheet metal shell 201, a water-cooled fan 204 is installed on one side of the lower sheet metal shell 201, an isolation plate 206 is installed on the inner bottom wall of the lower sheet metal shell 201, and three lower cooling fans 203 are installed on one side of the lower sheet metal shell 201.

[0037] Working principle: First, the memory module under test is securely installed in the memory slot cavity 210 below the upper and lower partition plates 207. It is electrically connected to the lower EMR motherboard to ensure electrical signal interaction during testing. When starting the test, the equipment is started via the power switch 106 on the sheet metal back cover 102 of the electrical box. The operation of the high-temperature cover switch 104 is controlled by the logic of the main control board 110, which starts the motor 208. The output shaft of the motor 208 drives the gear 209 to rotate through the connecting rod, which meshes with the rack fixed to the top of the high-temperature cover 213, driving the high-temperature cover 213 to slide smoothly out along the track at the bottom of the fixed plate, completely covering and sealing the memory slot cavity 210 and the heating box 217 below. The core testing space is then established. Subsequently, the aging test program is initiated. The main control board 110, based on a preset temperature curve, activates the PTC heating element 215 located inside the support 212 at the top of the high-temperature enclosure 213 by controlling the relay 109 mounted on the partition plate 107. Simultaneously, the exhaust fan 214 on the support 212 starts, forcibly blowing the heat generated by the PTC downwards, evenly flowing over the surface of the memory modules within the FR4 fiberglass-coated cavity. The hot airflow, blocked at the bottom of the cavity, naturally flows upwards back to the top area, forming a closed-loop hot air circulation. This active forced convection mode, combined with the excellent thermal insulation performance of the FR4 fiberglass-coated board, ensures the heat within the cavity is effectively controlled. The temperature is rapidly and evenly distributed, eliminating uneven heating and cooling. The temperature sensor on the temperature-sensing PCB 108 directly senses the area near the memory module's working area and feeds this real temperature signal back to the main control board 110. The main control board 110 compares this measurement value with the preset target aging temperature and dynamically adjusts the power of the PTC heating element 215 via the relay 109 based on the deviation value, forming a closed-loop precise temperature control system based on the temperature of the memory module itself. The upper and lower layer partition plates 207 and their sealing strips effectively prevent the heat from the upper high-temperature cavity from being transferred to the lower layer. When the temperature-sensing PCB 108 detects that the temperature near the memory module inside the high-temperature cover 213 is higher than the set value, the main control board 110... 0. The heat dissipation program is immediately started, and the motor 208 is controlled to run. Through the gear and rack transmission mechanism 209, the left and right baffles are driven to move outward synchronously and open. After the baffles are opened, the overheated air accumulated in the temperature cavity is quickly flowed to the reserved outer cavity space outside the temperature cavity through the open air outlet under the residual pressure of the internal circulating fan and natural convection. The outer cavity space of the electrical box exhausts the hot air through the heat dissipation port 103, the heat dissipation port 212 and the electrical box cooling fan 113. The lower water cooling fan 204, the lower cooling fan 203 and the heat dissipation hole 202 work together to provide necessary cooling for the server motherboard. The operating status of the equipment can be displayed by the lights on the indicator PCB board 216.

[0038] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A memory module aging test device, comprising an external component (100) and an internal component (200); characterized in that: The external component (100) includes an upper sheet metal shell (101), on one side of which is a sheet metal back cover (102) for an electrical box. A lower sheet metal shell (201) is installed on the bottom of the inner wall of the upper sheet metal shell (101). An upper and lower layer partition plate (207) is installed on the top of the lower sheet metal shell (201). A bracket (212) is installed on the top of the upper and lower layer partition plate (207). A PTC heating element (215) and an exhaust fan (214) are installed on the inner wall of the bracket (212) from top to bottom. A memory slot cavity (210) is installed at the bottom of the upper and lower layer partition plate (207). The memory slot cavity (210) is equipped with a memory module. A heating box (217) is installed on the top of the partition plate (107). A sealing strip is installed between the heating box (217) and the partition plate (107). Two high-temperature covers (213) are slidably connected to the top of the heating box (217) via a track. A rack is installed on the top of the high-temperature cover (213). Two motor bases are installed on the top of the heating box (217). A motor (208) is installed on the top of the motor base. A gear (209) is fixedly connected to the output end of the motor (208) via a connecting rod. The gear (209) meshes with the rack.

2. The memory module burn-in test apparatus of claim 1, wherein: A heat dissipation vent (103) is provided on the sheet metal back cover (102) of the electrical box, and a heat dissipation vent (112) is provided on one side of the upper sheet metal outer shell (101).

3. The memory bank burn-in test apparatus of claim 1, wherein: A cooling fan (113) for the electrical box is installed on one side of the upper sheet metal shell (101).

4. The memory bank burn-in test apparatus of claim 1, wherein: A partition plate (107) is installed on the inner wall of the upper sheet metal shell (101), and a temperature-sensitive PCB (108) is installed on one side of the partition plate (107).

5. The memory module burn-in test apparatus of claim 1, wherein: Three relays (109) are installed on one side of the partition plate (107).

6. The memory module burn-in test apparatus of claim 1, wherein: A handle (111) is installed on one side of the upper sheet metal shell (101).

7. The memory bank burn-in test apparatus of claim 1, wherein: The main control board (110) is installed on the inner bottom wall of the upper sheet metal shell (101).

8. The memory bank burn-in test apparatus of claim 1, wherein: A high-temperature cover switch (104), a main control board reset switch (105), and a power switch (106) are installed on one side of the sheet metal back cover (102) of the electrical box.

9. The memory bank burn-in test apparatus of claim 1, wherein: The bottom of the upper and lower partition plates (207) is equipped with an indicator light PCB board (216), and the inner bottom wall of the lower sheet metal shell (201) is equipped with an EMR motherboard and accessories (205).

10. The memory module burn-in test apparatus of claim 1, wherein: The lower sheet metal shell (201) has several heat dissipation holes (202) on one side, a water cooling fan (204) is installed on one side of the lower sheet metal shell (201), an isolation plate (206) is installed on the inner bottom wall of the lower sheet metal shell (201), and three lower cooling fans (203) are installed on one side of the lower sheet metal shell (201).

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