A COME board with ECC memory expansion interface

Abstract

The utility model discloses a COME board with ECC memory expansion interface, include: mainboard body, the mainboard body surface panel carries memory one side is equipped with the on -board expansion seat for the memory expansion of mainboard storage and operation, the on -board expansion seat upper end is equipped with the memory pressure plate for the compression of memory combination after expansion switching over through the slot hole of surface both ends, the utility model discloses the cooperation of positioning stand and memory positioning hole, realize the three -dimensional space orientation of memory stick main body on the mainboard body, avoid horizontal or longitudinal displacement, simultaneously, the memory pressure plate is connected through locking screw and the locking slot of on -board expansion seat, forms the even compression force to memory expansion switching over board, ensures the close contact of memory stick main body and memory slot, memory switching over plug and memory expansion slot, significantly improves the connection reliability under the complex environment such as vibration, high temperature, and prevents the data transmission unstable problem caused by poor contact.

Description

Technical Field

[0001] This utility model belongs to the field of computer hardware technology, specifically relating to a COME board with an ECC memory expansion interface. Background Technology

[0002] In the field of computer hardware, the COME board (computer module) is a key component, and the requirements for its memory expansion capabilities are increasing. Currently, COME boards often use direct soldering of memory modules or simple slot insertion for memory expansion. This method is not only complex and makes convenient memory upgrades difficult, but also, due to the lack of effective fixing and positioning structures, memory modules are prone to loosening during long-term use, leading to unstable data transmission and even system malfunctions.

[0003] Traditional COME boards have significant drawbacks in memory expansion methods. On the one hand, while direct soldering of memory modules can ensure a certain level of stability, it cannot flexibly adjust the memory capacity according to actual needs, and repairs and replacements are difficult. On the other hand, while the simple slot insertion method is convenient for installation, it lacks a reliable fixing mechanism. Under vibration or high temperature environments, the connection between the memory module and the slot is prone to loosening, leading to poor contact. Utility Model Content

[0004] The purpose of this invention is to provide a COME board with an ECC memory expansion interface to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a COME board with an ECC memory expansion interface, comprising:

[0006] The motherboard body has an onboard expansion socket on the side of the onboard memory for expanding the motherboard's storage and operation. The upper end of the onboard expansion socket has a memory pressure plate through slots at both ends of the surface for pressing the memory modules after they are connected. The motherboard body surface on the corresponding side of the onboard expansion socket has symmetrical positioning posts for positioning the expanded memory modules.

[0007] A memory expansion adapter board, wherein a memory module body for memory expansion of the motherboard is inserted into the memory expansion adapter board through an opening on one side, and the bottom side of the memory expansion adapter board is assembled onto the onboard expansion socket via an adapter expansion component.

[0008] Preferably, the onboard expansion socket has a memory expansion slot at its end that is plugged into and connected to the memory expansion adapter board and has gold-plated pins.

[0009] Preferably, the onboard expansion mount has locking grooves with internal threads at both ends of its surface, and the locking grooves are provided with locking screws that lock the memory pressure plate onto the memory expansion adapter plate to maintain stability.

[0010] Preferably, the memory pressure plate has through-holes at both ends, allowing locking screws to pass through the memory pressure plate and lock onto the memory module body.

[0011] Preferably, the memory expansion adapter board has a memory assembly cavity on one side, and the memory assembly cavity has limiting grooves on both sides for positioning and sliding the memory module body.

[0012] Preferably, one side wall inside the memory assembly cavity is provided with a data transfer memory slot for inserting one end of the memory module's main pin into the memory slot, and gold-plated pins are evenly embedded on both sides of the memory slot, which are elastically connected to the main pin of the memory module.

[0013] Preferably, the bottom side of the memory expansion adapter board is provided with two memory adapter strips with embedded gold-plated pins on both sides, which are used to connect the main body of the memory module to the motherboard through the insertion of the memory adapter strips and the memory expansion slot to expand the running memory and storage space.

[0014] Preferably, a memory positioning hole is provided through the space between the memory chips on the surface of the memory module body, and the memory positioning hole is positioned by passing through the positioning post after the memory module body is connected and combined with the motherboard body through the memory expansion adapter board.

[0015] Preferably, the onboard memory chips on the motherboard surface are provided with heat sinks, and the heat sinks are attached to the lower end face of the memory module body after the memory module body is extended and installed to provide spaced support and protection.

[0016] Preferably, the motherboard body includes a CPU, a bridge chip, onboard memory chips, PCIe, USB and other control chip modules, and mounting holes for mounting and fixing the motherboard body in the housing are provided through the four corners of the motherboard body surface.

[0017] Compared with the prior art, the technical effects and advantages of this utility model are as follows:

[0018] This invention achieves three-dimensional spatial positioning of the memory module body on the motherboard by cooperating with the positioning column and the memory positioning hole, avoiding lateral or longitudinal displacement. At the same time, the memory pressure plate is connected to the locking slot of the onboard expansion socket through locking screws, forming a uniform clamping force on the memory expansion adapter board, ensuring tight contact between the memory module body and the memory slot, and between the memory adapter and the memory expansion slot. This significantly improves the connection reliability under complex environments such as vibration and high temperature, and eliminates the problem of unstable data transmission caused by poor contact.

[0019] This invention employs a pluggable combination structure of a memory expansion adapter board and an onboard expansion socket: the memory module body slides into the memory assembly cavity via a limiting groove, and its pins elastically engage with the gold-plated pins of the memory slot. The gold-plated pins at the bottom of the adapter board connect to the memory expansion slot, forming a modular architecture of "memory module body - adapter board - motherboard". This design supports rapid upgrades to memory capacity without soldering, significantly reducing maintenance difficulty and meeting flexible configuration needs in different scenarios.

[0020] This invention embeds gold-plated pins inside the memory slot, which elastically fit with the pins of the memory module body. At the same time, both the memory adapter and the memory expansion slot adopt a gold-plated pin design. By utilizing the high conductivity and oxidation resistance of the gold plating layer, contact resistance and signal attenuation are reduced. Combined with the clamping force of the memory pressure plate, it ensures that the interface always maintains a stable electrical connection, thereby improving the reliability of data transmission from a structural level. It is especially suitable for fields with stringent stability requirements, such as industrial control and medical equipment.

[0021] This invention features a heat sink on the surface of the onboard memory chips on the motherboard. After the memory module body is installed, its upper end face is in close contact with the lower end face of the memory module to form a heat conduction path, effectively dissipating the heat generated during memory operation and avoiding performance degradation or shortened lifespan due to overheating. At the same time, the heat sink also serves as a spacer support, providing additional mechanical support for the memory module body, further enhancing the stability of the overall structure and achieving dual optimization of heat dissipation and mechanical support. Attached Figure Description

[0022] Figure 1 This is a top view of the present invention;

[0023] Figure 2 This is an exploded top view of the motherboard body and memory module body of this utility model;

[0024] Figure 3 This is a side view of the combination of the onboard expansion dock and the memory expansion adapter board of this utility model;

[0025] Figure 4 This is a partial front view of the COME board with an ECC memory expansion interface according to this utility model;

[0026] Figure 5 This is a side view of the main body of the memory module and the memory expansion adapter board of this utility model.

[0027] In the diagram: 1. Motherboard body; 2. Onboard expansion socket; 3. Memory pressure plate; 4. Positioning post; 5. Memory expansion adapter board; 6. Memory module body; 7. Memory expansion slot; 8. Locking slot; 9. Locking screw; 10. Through lock hole; 11. Memory assembly cavity; 12. Limiting slide; 13. Memory slot; 14. Memory adapter strip; 15. Memory positioning hole; 16. Heatsink. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-5 This utility model provides a technical solution: a COME board with an ECC memory expansion interface, comprising:

[0030] The motherboard body 1 has an onboard expansion socket 2 on the side of the onboard memory for expanding the motherboard's storage and operation. The upper end of the onboard expansion socket 2 has a memory pressure plate 3 through slots at both ends of the surface for pressing the memory modules after expansion. The motherboard body 1 surface on the corresponding side of the onboard expansion socket 2 has positioning posts 4 for positioning the expanded memory modules.

[0031] The motherboard body 1 employs a multi-layer PCB design, integrating the CPU, bridge chip, onboard memory chips, PCIe and USB control chip modules to form a complete computing and control unit. Aluminum heatsinks 16 are attached to the surface of the onboard memory chips using thermally conductive silicone. The upper surface of the heatsink is machined into a flat structure, ensuring a tight fit with the lower surface of the memory module after installation on the memory module body 6, thus maximizing heat dissipation contact area while preventing excessive compression of the memory chips. M3 mounting holes are provided at the four corners of the motherboard body 1 for securing it to the device housing using countersunk screws.

[0032] The integrated structure of the onboard expansion socket 2 is soldered to the onboard memory side of the motherboard body 1 using a surface mount process. The memory expansion slot 7 at its end adopts an L-shaped plug-in guide structure. The two sides of the slot are generally equipped with 0.3mm thick gold-plated pins, and the pin spacing is generally 1.27mm, forming a mirror-symmetrical plug-in structure with the gold-plated pins of the memory adapter strip 14. The locking slots 8 at both ends of the expansion socket surface are designed as blind holes for mating with locking screws 9.

[0033] The memory pressure plate 3 and the positioning post 4 are designed to work together. The memory pressure plate 3 is made of 6061-T6 aluminum alloy and is formed by stamping. Both ends have through-holes 10, which form a clearance fit with the locking screws 9. The positioning post 4 is a cylindrical structure and is symmetrically distributed on the surface of the motherboard body 1 on the same side as the onboard expansion bracket 2. Its top is rounded and forms an interference fit with the memory positioning hole 15 of the memory module body 6.

[0034] The memory expansion adapter board 5 has a memory module body 6 inserted into it through an opening on one side. The bottom side of the memory expansion adapter board 5 is assembled onto the onboard expansion socket 2 via an adapter expansion component.

[0035] The memory expansion adapter board 5 is a double-layer FR-4 circuit board. The memory assembly cavity 11 on one side is 5mm deep, and the limiting grooves 12 on both sides adopt a dovetail structure, forming a sliding guide fit with the flanges on both sides of the memory module body 6. The gold-plated pins embedded in the memory slot 13 are made of beryllium bronze with a 10μm thick gold plating layer. The front end of the pin has a 0.5mm curved elastic contact part, forming a contact pressure of 150g±20g with the memory module pins. The memory adapter strip 14 at the bottom of the adapter board is 1.6mm thick, with gold-plated pins evenly distributed on both sides. The pins are 2mm long and form a 3mm deep insertion fit with the pins of the memory expansion slot 7.

[0036] The onboard expansion socket 2 has a memory expansion slot 7 at one end that is connected to the memory expansion adapter board 5 and has gold-plated pins.

[0037] The onboard expansion mount 2 has locking grooves 8 with internal threads at both ends of its surface. The locking grooves 8 are provided with locking screws 9 that lock the memory pressure plate 3 onto the memory expansion adapter plate 5 to keep it stable.

[0038] The memory pressure plate 3 has through-holes 10 at both ends, which allow the locking screws 9 to pass through the memory pressure plate 3 and be pressed and locked onto the memory module body 6.

[0039] The memory expansion adapter board 5 has a memory assembly cavity 11 on one side, and the memory assembly cavity 11 has limiting grooves 12 on both sides for positioning and sliding the memory module body 6. The memory assembly cavity 11 has a side wall with a data transfer memory slot 13 for inserting one end of the PIN of the memory module body 6. The memory slot 13 has gold-plated pins that are evenly embedded on both sides and are elastically connected to the PIN of the memory module body 6. The bottom side of the memory expansion adapter board 5 has two memory adapter strips 14 with embedded gold-plated pins on both sides. These strips are used to connect the memory module body 6 to the motherboard body 1 through the memory adapter strips 14 and the memory expansion slot 7 to expand the running memory and storage space.

[0040] The memory module body 6 is installed and positioned. The memory module body 6 adopts the standard SO-DIMM specification, and the memory positioning hole 15 is located at the center of the chip gap. When the memory module body 6 slides into the memory assembly cavity 11 along the limiting slide groove 12, its pins contact the gold-plated pins of the memory slot 13 at an insertion speed of 0.5mm / s until the memory positioning hole 15 completely passes through the positioning post 4, forming a physical limit.

[0041] A memory positioning hole 15 is provided through the space between the memory chips on the surface of the memory module body 6. After the memory module body 6 is connected and combined with the motherboard body 1 through the memory expansion adapter 5, the memory positioning hole 15 is positioned through the positioning post 4 for positioning.

[0042] The motherboard body 1 has a heat sink 16 on the surface of the onboard memory chips. After the memory module body 6 is extended and installed, the heat sink 16 is attached to the lower end of the memory module body 6 for spaced support and protection.

[0043] The motherboard body 1 includes a CPU, bridge chip, onboard memory chips, PCIe, USB and other control chip modules, and mounting holes for mounting and fixing the motherboard body 1 in the housing are provided at the four corners of the surface of the motherboard body 1.

[0044] In the overall assembly, the memory expansion adapter board 5 is connected to the memory expansion slot 7 of the onboard expansion socket 2 via the adapter plate 7. During the insertion process, the gold-plated pins form a self-calibrating guide to ensure alignment accuracy within 0.1mm. The memory pressure plate 3 is fitted onto the locking screw 9 through the through-hole 10. When the screw is tightened, a torque of 0.5 N·m is applied to press the pressure plate down, creating a compression of 0.2mm between the adapter board 5 and the expansion socket 2 surface, ensuring the mechanical stability and electrical conductivity of the contact interface.

[0045] The COME board with an ECC memory expansion interface provided by this utility model is positioned as a highly reliable and flexibly expandable embedded computing module, and is mainly suitable for the following scenarios:

[0046] In the field of industrial control: In equipment such as CNC machine tools and automated production lines, it is necessary to cope with complex environments such as vibration, dust and temperature fluctuations. Through modular memory expansion design, the memory capacity can be upgraded as needed. At the same time, the anti-vibration characteristics of positioning columns, memory pressure plates and gold-plated interfaces ensure long-term stable operation.

[0047] Medical devices, such as medical imaging processing equipment and vital sign monitors, have extremely high requirements for the accuracy of data transmission and the reliability of hardware. The error correction function of ECC memory (combined with the physical stability design of this structure) can reduce the risk of data distortion, and the integrated heat sink design effectively controls the memory temperature, ensuring the device can operate continuously for a long time.

[0048] Embedded Systems and Edge Computing: In scenarios such as smart terminals and IoT gateways, it is necessary to balance compact space with performance expansion requirements. This COME board adopts a three-level modular architecture of mainboard 1 + adapter board + memory module, which enables flexible configuration of memory capacity within a limited space, and the standardized interface supports quick disassembly and maintenance.

[0049] Aerospace and military equipment: Requirements for hardware's shock resistance and electromagnetic interference resistance are stringent. The high conductivity and oxidation resistance of gold-plated interfaces, combined with a dual-positioning clamping structure, effectively resist contact failures in extreme environments, meeting the application needs of high-reliability scenarios.

[0050] Specifically, during use, the memory module body 6 is pre-installed: the memory module body 6 is slid into the memory assembly cavity 11 along the limiting slide groove 12 of the memory expansion adapter plate 5, so that its pins are aligned with the gold-plated pins inside the memory slot 13 and inserted to form an initial electrical connection. The elastic design of the gold-plated pins ensures a tight fit with the memory module pins, providing stable contact.

[0051] Connecting the adapter board to the motherboard: Align the memory adapter strip 14 at the bottom of the pre-installed memory module on the memory expansion adapter board 5 with the memory expansion slot 7 on the onboard expansion socket 2, and insert it vertically downwards. The gold-plated pins not only guide precise alignment but also reduce contact resistance through the gold plating layer, improving signal transmission reliability.

[0052] Three-dimensional positioning and fixing: The memory positioning hole 15 of the memory module body 6 is aligned with and passes through the positioning post 4 on the surface of the motherboard body 1 to achieve positioning of the memory module in the X and Y axis directions; the memory expansion adapter board 5 cooperates with the slot of the onboard expansion socket 2 to restrict displacement in the Z axis direction, forming a three-dimensional spatial constraint.

[0053] Align the memory pressure plate 3 with the locking slot 8 through the through lock hole 10, screw in the locking screw 9 and tighten it, so that the pressure plate presses down evenly on the memory expansion adapter plate 5, ensuring that the connection between the memory module body 6, the memory expansion adapter plate 5, the memory expansion adapter plate 5 and the motherboard body 1 is tight and without looseness.

[0054] Heat dissipation and support integration: After installation, the upper surface of the heat sink 16 on the motherboard body 1 naturally fits against the lower surface of the memory module body 6, forming a heat conduction path to assist heat dissipation and providing additional mechanical support to enhance the overall structural stability.

[0055] Release the fixed constraint: unscrew the locking screw 9 counterclockwise, remove the memory pressure plate 3, and release the pressure constraint on the memory expansion adapter board 5.

[0056] Separate the adapter board from the motherboard body 1: Pull the memory expansion adapter board 5 vertically upward to separate the memory adapter strip 14 from the memory expansion slot 7, and at the same time, the memory positioning hole 15 of the memory strip body 6 is released from the constraint of the positioning post 4.

[0057] Remove the memory module body 6: Slide the memory module body 6 out along the limiting slide groove 12 in the opposite direction to separate its pins from the memory slot 13, thus completing the disassembly process.

[0058] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A COME board with ECC memory expansion interface, characterized in that, include: The motherboard body (1) has an onboard expansion socket (2) on one side of the onboard memory surface for expanding the motherboard storage and operation memory. The upper end of the onboard expansion socket (2) has a memory pressure plate (3) for pressing the memory after the expansion adapter is connected through slots at both ends of the surface. The motherboard body (1) surface on the corresponding side of the onboard expansion socket (2) has a positioning post (4) for positioning the expanded memory module. The memory expansion adapter board (5) has a memory module body (6) for expanding the memory of the motherboard body (1) inserted into it from one side opening. The bottom side of the memory expansion adapter board (5) is assembled on the onboard expansion socket (2) through an adapter expansion component.

2. The COME board with ECC memory expansion interface according to claim 1, characterized in that: The onboard expansion socket (2) has a memory expansion slot (7) at its end that is connected to the memory expansion adapter board (5) and has gold-plated pins.

3. The COME board with ECC memory expansion interface according to claim 1, wherein: The onboard expansion mount (2) has locking grooves (8) with internal threads at both ends. The locking grooves (8) are provided with locking screws (9) that lock the memory pressure plate (3) onto the memory expansion adapter plate (5) to keep it stable.

4. The COME board with ECC memory expansion interface according to claim 3, characterized in that: The memory pressure plate (3) has through-holes (10) at both ends, which allow locking screws (9) to pass through the memory pressure plate (3) and be locked onto the memory module body (6).

5. The COME board with ECC memory expansion interface according to claim 1, wherein: The memory expansion adapter board (5) has a memory combination cavity (11) on one side, and the memory combination cavity (11) has a limiting groove (12) on both sides for positioning and sliding the memory module body (6).

6. The COME board with ECC memory expansion interface according to claim 5, wherein: The memory assembly cavity (11) has a memory slot (13) on one side wall for inserting one end of the PIN of the memory module body (6) into the data transfer and transmission, and gold-plated PIN pins that are elastically attached to the PIN of the memory module body (6) are evenly embedded on both sides of the memory slot (13).

7. The COME board with ECC memory expansion interface according to claim 2, wherein: The memory expansion adapter board (5) has two memory adapter strips (14) with embedded gold-plated pins on one side of its bottom. These strips are used to connect the main body (6) of the memory module to the motherboard body (1) through the memory adapter strips (14) and the memory expansion slot (7) to expand the running memory and storage space.

8. The COME board with ECC memory expansion interface according to claim 2, wherein: The memory module body (6) has a memory positioning hole (15) through the space between the memory chips on its surface. After the memory module body (6) is connected and combined with the motherboard body (1) through the memory expansion adapter (5), the memory positioning hole (15) is positioned through the positioning column (4) for positioning.

9. The COME board with ECC memory expansion interface of claim 1, wherein: The motherboard body (1) has a heat sink (16) on the surface of the onboard memory chip. After the memory module body (6) is extended and installed, the heat sink (16) is attached to the lower end face of the memory module body (6) for spaced support and protection.

10. The COME board with ECC memory expansion interface of claim 1, wherein: The motherboard body (1) includes a CPU, a bridge chip, onboard memory chips, PCIE, USB and other control chip modules, and mounting holes for mounting and fixing the motherboard body (1) in the housing are provided through the four corners of the surface of the motherboard body (1).

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