A semiconductor laser coupling device

Abstract

This invention provides a semiconductor laser coupling device, belonging to the field of optical engineering technology. It includes a laser body for emitting laser light and serving as the core optical component of the entire coupling device; a splicing mechanism located outside the laser body for aligning and stably connecting multiple lasers; a mounting assembly including a mounting plate and a fixing frame, the mounting plate being disposed on the splicing mechanism and the fixing frame being positioned above the mounting plate and cooperating with the laser body for positioning and stable installation of the lasers; and a control assembly including a controller and an output port. This invention, by incorporating a splicing mechanism, a flexible fixing assembly, and an intelligent control module, improves the alignment accuracy, connection stability, and automated control capabilities between lasers, effectively solving the technical problems of inconvenient adjustment, structural instability, and poor applicability inherent in traditional semiconductor laser coupling devices.

Description

Technical Field

[0001] This utility model belongs to the field of optical engineering technology, and specifically relates to a semiconductor laser coupling device. Background Technology

[0002] In the field of semiconductor laser applications, efficient coupling between the laser and the optical system is a key factor affecting overall performance. Existing laser coupling methods mostly employ fixed installations or manually adjustable structures, which suffer from problems such as low alignment accuracy, unstable connections, and complex operation, making it difficult to meet the requirements of high-precision optical systems for laser transmission efficiency and stability. Furthermore, traditional devices lack convenient splicing and positioning structures in multi-laser integrated applications, resulting in low assembly efficiency and poor repeatability, limiting their widespread application in automated production and precision optical systems.

[0003] In the existing technology, traditional semiconductor laser coupling devices mostly adopt a single fixed structure or manual adjustment method, which has problems such as low alignment accuracy, poor splicing stability, and low installation efficiency. They are difficult to meet the requirements of high-precision optical systems for laser output stability and coupling efficiency. Some devices lack effective locking and buffering designs, and are easily affected by vibration during operation, which can lead to optical path deviation or even device damage. They also have high maintenance frequency and high operating costs. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor laser coupling device, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor laser coupling device, comprising

[0007] The laser body is used to emit laser light and serves as the core optical component of the entire coupling device;

[0008] A splicing mechanism, located outside the laser body, is used to achieve alignment and stable connection between multiple lasers;

[0009] The mounting components include a mounting plate and a fixing frame. The mounting plate is disposed on the splicing mechanism, and the fixing frame is disposed above the mounting plate and cooperates with the laser body to achieve the positioning and stable installation of the laser.

[0010] The control component includes a controller and an output port. The controller is located outside the splicing mechanism, and the output port is located on one side of the controller. It is used to control the working status and signal output of the laser.

[0011] As a preferred embodiment of this utility model, the laser body is packaged with a high-power semiconductor laser chip, which has good beam quality and electro-optical conversion efficiency, and is suitable for various industrial processing and communication application scenarios.

[0012] As a preferred embodiment of this utility model, the splicing mechanism consists of a guide rail structure and a locking component, which can realize rapid alignment and mechanical locking between multiple laser bodies, thereby improving the integration and stability of the overall system.

[0013] As a preferred embodiment of this utility model, the mounting plate is provided with multiple adjusting screw holes, which can be used with bolts to achieve multi-degree-of-freedom fine adjustment, so as to adapt to different assembly errors and improve the alignment accuracy between lasers.

[0014] As a preferred embodiment of this utility model, the fixing frame is an elastic clamping structure with an internal buffer pad layer, which can fix the laser body while avoiding damage to the device due to excessive clamping, thereby improving installation safety and reliability.

[0015] As a preferred embodiment of this utility model, the controller has a built-in digital signal processing module that can automatically adjust the laser output parameters according to external input commands, and achieve efficient coupling with optical fiber or optical system through the output port, thereby improving the intelligence level and application flexibility of the device.

[0016] Compared with the prior art, the beneficial effects of this utility model are: by setting up a splicing mechanism, elastic fixing components and intelligent control module, the alignment accuracy, connection stability and automatic control capability between lasers are improved, thereby effectively solving the technical problems of inconvenient adjustment, unstable structure and poor applicability of traditional semiconductor laser coupling devices. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall structure of this utility model from another perspective;

[0020] Figure 3 This is a side view of the present invention;

[0021] Figure 4This is a top view of the present invention.

[0022] In the diagram: 100, laser body; 200, splicing mechanism; 201, mounting component; 2011, mounting plate; 2012, fixing frame; 202, control component; 2021, controller; 2022, output port. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0026] Example

[0027] Reference Figures 1-4 This is an embodiment of the present invention, which provides a semiconductor laser coupling device, comprising:

[0028] The laser body 100 is used to emit laser light and serves as the core optical component of the entire coupling device;

[0029] The splicing mechanism 200 is located outside the laser body 100 and is used to achieve alignment and stable connection between multiple lasers.

[0030] The mounting component 201 includes a mounting plate 2011 and a fixing frame 2012. The mounting plate 2011 is mounted on the splicing mechanism 200, and the fixing frame 2012 is mounted above the mounting plate 2011 and cooperates with the laser body 100 to achieve the positioning and stable installation of the laser.

[0031] The control component 202 includes a controller 2021 and an output port 2022. The controller 2021 is located outside the splicing mechanism 200, and the output port 2022 is located on one side of the controller 2021. It is used to control the working status of the laser and the signal output.

[0032] Specifically, the laser body 100 is packaged with a high-power semiconductor laser chip, which has good beam quality and electro-optical conversion efficiency, and is suitable for a variety of industrial processing and communication applications.

[0033] It should be noted that the laser body 100 is packaged using a high-power semiconductor laser chip, which has excellent beam quality and electro-optical conversion efficiency, making it suitable for various industrial processing and communication applications. While ensuring stable output power, the laser body 100 also boasts a long service life and excellent thermal management performance, enabling it to withstand continuous high-intensity working environments and meet the high standards of light source quality required by precision optical systems.

[0034] Specifically, the splicing mechanism 200 consists of a guide rail structure and locking components, which can achieve rapid alignment and mechanical locking between multiple laser bodies 100, thereby improving the integration and stability of the overall system.

[0035] It should be noted that the splicing mechanism 200 consists of a guide rail structure and locking components, enabling rapid alignment and mechanical locking between multiple laser bodies 100, thus improving the integration and stability of the overall system. This structure is rationally designed and easy to operate. In multi-laser collaborative operation, it effectively reduces assembly errors, ensures the consistency of spatial position and precise alignment of optical paths between lasers, and improves coupling efficiency and system reliability.

[0036] Specifically, the mounting plate 2011 is equipped with multiple adjustment screw holes, which can be used with bolts to achieve multi-degree-of-freedom fine adjustment to adapt to different assembly errors and improve the alignment accuracy between lasers.

[0037] It should be noted that the mounting plate 2011 is equipped with multiple adjustment screw holes, which, together with the bolts, enable multi-degree-of-freedom fine-tuning to accommodate different assembly errors and improve the alignment accuracy between lasers. This adjustment function allows for flexible adjustment of the laser's spatial attitude during on-site installation, ensuring that its emission direction is precisely matched with the target optical system, thereby optimizing laser transmission performance and enhancing the overall applicability and practicality of the device.

[0038] Specifically, the fixing frame 2012 is an elastic clamping structure with an internal buffer pad, which can prevent damage to the device due to excessive clamping while fixing the laser body 100, thereby improving installation safety and reliability.

[0039] It should be noted that the fixing frame 2012 is an elastic clamping structure with an internal buffer layer. This prevents damage to the device due to excessive clamping while securing the laser body 100, thus improving installation safety and reliability. This structure not only possesses good clamping force but also provides shock absorption, effectively resisting the impact of external vibrations on the laser and ensuring its stable operation under complex conditions.

[0040] Specifically, the controller 2021 has a built-in digital signal processing module that can automatically adjust the laser output parameters according to external input commands. It can achieve efficient coupling with fiber optic or optical systems through the output port 2022, thereby improving the intelligence level and application flexibility of the device.

[0041] It should be noted that the controller 2021 has a built-in digital signal processing module, which can automatically adjust the laser output parameters according to external input commands. Through the output port 2022, it achieves efficient coupling with fiber optic or optical systems, enhancing the device's intelligence and application flexibility. This control method features fast response speed, high adjustment accuracy, supports remote control and automation integration, and is easy to link with host computers or industrial control systems. It is widely applicable to high-end technology fields such as intelligent manufacturing, optical communication, and laser processing.

[0042] In use, the laser body 100 is first installed as the core optical component of the entire system. This laser body 100 is packaged using a high-power semiconductor laser chip, possessing excellent beam quality and electro-optical conversion efficiency, making it suitable for various industrial processing and communication applications. It achieves alignment and stable connection between multiple lasers through a splicing mechanism 200. The splicing mechanism 200 consists of a guide rail structure and locking components, enabling rapid mechanical docking of multiple lasers. The locking structure ensures the consistency of spatial position and precise alignment of optical paths between the lasers, thereby improving the overall system's integration and operational stability. The mounting component 201 includes a mounting plate 2011 and a fixing frame 2012. The mounting plate 2011 is mounted on the splicing mechanism 200 and has multiple adjusting screw holes, allowing for multi-degree-of-freedom fine-tuning with bolts to accommodate different assembly errors and improve the alignment accuracy between lasers. The fixed frame 2012 is an elastic clamping structure with an internal buffer layer. While clamping the laser body 100, it avoids damage to the device due to excessive clamping, improving the safety and reliability of the installation. It also has a certain shock absorption function, which can effectively resist the influence of external vibration on the laser output. The control component 202 includes a controller 2021 and an output port 2022. The controller 2021 is located on the outside of the splicing mechanism 200 and has a built-in digital signal processing module. It can automatically adjust the laser output parameters, such as power, frequency and pulse width, according to external input commands. The output port 2022 is located on one side of the controller 2021 and is used to transmit the laser signal to the optical fiber or target optical system to achieve efficient optical path coupling. This control method has a fast response speed, high adjustment accuracy, supports remote operation and automation integration, and is easy to link with industrial control systems. It is widely applicable to fields such as intelligent manufacturing, laser processing, and optical communication.

[0043] In summary, by setting up the splicing mechanism 200, the flexible fixing component 2012, and the intelligent control module 2021, the alignment accuracy, connection stability, and automated control capability between lasers are improved, thereby effectively solving the technical problems of inconvenient adjustment, unstable structure, and poor applicability of traditional semiconductor laser coupling devices.

[0044] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0045] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0046] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A semiconductor laser coupling device, characterized by: include, The laser body (100) is used to emit laser light and serves as the core optical component of the entire coupling device; A splicing mechanism (200) is located outside the laser body (100) and is used to achieve alignment and stable connection between multiple lasers; The mounting assembly (201) includes a mounting plate (2011) and a fixing frame (2012). The mounting plate (2011) is mounted on the splicing mechanism (200), and the fixing frame (2012) is located above the mounting plate (2011) and cooperates with the laser body (100) to achieve the positioning and stable installation of the laser. The control component (202) includes a controller (2021) and an output port (2022). The controller (2021) is located outside the splicing mechanism (200), and the output port (2022) is located on one side of the controller (2021) for controlling the working state and signal output of the laser.

2. A semiconductor laser coupling device according to claim 1, characterized in that: The laser body (100) is packaged with a high-power semiconductor laser chip, which has good beam quality and electro-optical conversion efficiency, and is suitable for a variety of industrial processing and communication application scenarios.

3. A semiconductor laser coupling device according to claim 2, characterized in that: The splicing mechanism (200) consists of a guide rail structure and a locking component, which can realize rapid alignment and mechanical locking between multiple laser bodies (100), thereby improving the integration and stability of the overall system.

4. A semiconductor laser coupling device according to claim 3, characterized in that: The mounting plate (2011) is provided with multiple adjustment screw holes, which can be used with bolts to achieve multi-degree-of-freedom fine adjustment to adapt to different assembly errors and improve the alignment accuracy between lasers.

5. A semiconductor laser coupling device according to claim 4, characterized in that: The fixing frame (2012) is an elastic clamping structure with a buffer pad inside, which can prevent damage to the device due to excessive clamping while fixing the laser body (100), thereby improving installation safety and reliability.

6. A semiconductor laser coupling device according to claim 5, characterized in that: The controller (2021) has a built-in digital signal processing module that can automatically adjust the laser output parameters according to external input commands. It can achieve efficient coupling with optical fiber or optical system through the output port (2022), thereby improving the intelligence level and application flexibility of the device.

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