A2B bus-based in-vehicle audio transmission device and in-vehicle audio equipment
By employing multiple slave modules in the vehicle audio equipment and using the A2B chip of one slave as the clock signal source, multi-channel data synchronization is achieved, expanding the number of audio channels and solving the problems of insufficient bandwidth and poor synchronization in the existing technology.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU SONAVOX ELECTRONICS CO LTD
- Filing Date
- 2025-07-04
- Publication Date
- 2026-07-03
AI Technical Summary
In the existing technology, the insufficient bandwidth of a single A2B bus and the problem of data asynchrony on multiple A2B buses result in a limited number of audio channels and poor synchronization of in-vehicle audio equipment.
Multiple slave modules are used, each receiving signals from the master module via the A2B bus. One slave A2B chip is selected as the clock signal source to ensure that other devices in the slave module use the same clock signal, thereby achieving multi-channel data synchronization.
The number of audio channels has been increased, ensuring data synchronization across multiple channels and resolving the data asynchrony issue on multiple A2B buses.
Smart Images
Figure CN224459820U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an in-vehicle audio transmission device and in-vehicle audio equipment based on the A2B bus. Background Technology
[0002] Energy issues have led to the rise of electric vehicles, intensifying competition among manufacturers. For in-vehicle audio equipment, the number of audio input / output channels for amplifiers is also increasing. These channels handle the transmission of multimedia or non-multimedia audio, as well as data transmission from the microphone, accelerometer, and speaker current. Previously, in-vehicle audio equipment used a single-channel A2B bus, which resulted in insufficient bandwidth. While using a multi-channel A2B bus to expand the number of channels could lead to data synchronization issues across multiple A2B buses.
[0003] The information disclosed in the background section is only intended to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0004] The purpose of this invention is to provide an in-vehicle audio transmission device and in-vehicle audio equipment based on the A2B bus, which expands the number of audio channels and ensures data synchronization on multiple channels.
[0005] The first aspect of this utility model provides an in-vehicle audio transmission device based on an A2B bus, including a slave module. The slave module includes multiple slaves corresponding to multiple audio channels, and the multiple slaves are configured to each receive signals from a master module via an A2B bus.
[0006] The plurality of slave devices includes at least a first slave device and a second slave device. The first slave device includes a first A2B chip and a first DSP chip. The second slave device includes a second A2B chip and a second DSP chip. The first A2B chip includes a clock signal output port. The first DSP chip, the second A2B chip, and the second DSP chip each include a clock signal receiving port. Each clock signal receiving port is electrically connected to the clock signal output port of the first A2B chip.
[0007] In a preferred embodiment, the in-vehicle audio transmission device is characterized in that the clock signal receiving ports of the first DSP chip, the second A2B chip, or the second DSP chip are electrically connected via a BCLK signal line or an FS signal line, respectively.
[0008] In a more preferred embodiment, the clock signal output port includes a BCLK signal output port and an FS signal output port, each of the signal receiving ports includes a BCLK signal receiving port and an FS signal receiving port, each of the BCLK signal receiving ports is electrically connected to the BCLK signal output port via a BCLK signal line, and each of the FS signal receiving ports is electrically connected to the FS signal output port.
[0009] In a preferred embodiment, the data output port of the first A2B chip is electrically connected to the data receiving port of the first DSP chip via a first data signal line to send audio data corresponding to the first audio channel; the data output port of the second A2B chip is electrically connected to the data receiving port of the second DSP chip via a second data signal line to send audio data corresponding to the second audio channel.
[0010] In a preferred embodiment, the host module includes a plurality of A2B chips, and the plurality of A2B chips correspond to the plurality of slave devices; the plurality of A2B chips include a third A2B chip and a fourth A2B chip, the third A2B chip is electrically connected to the first A2B chip through a first A2B bus, and the fourth A2B chip is electrically connected to the second A2B chip through a second A2B bus.
[0011] In a more preferred embodiment, the host module further includes a main DSP chip, which has a clock signal transmission port and a data transmission port. The clock signal transmission port is electrically connected to the third A2B chip and the fourth A2B chip, respectively, and the data transmission port is electrically connected to the third A2B chip and the fourth A2B chip, respectively.
[0012] In a further preferred embodiment, the clock signal transmission port includes a BCLK signal transmission port, which is electrically connected to the third A2B chip and the fourth A2B chip respectively via BCLK signal lines. In another preferred embodiment, the clock signal transmission port further includes an FS signal transmission port, which is electrically connected to the third A2B chip and the fourth A2B chip respectively via FS signal lines. In a specific and preferred embodiment, the clock signal transmission port includes a BCLK signal transmission port and an FS signal transmission port, with the BCLK signal transmission port electrically connected to the third A2B chip and the fourth A2B chip respectively via BCLK signal lines, and the FS signal transmission port electrically connected to the third A2B chip and the fourth A2B chip respectively via FS signal lines.
[0013] In a further preferred embodiment, the main DSP chip includes multiple data transmission ports corresponding to multiple audio channels. The multiple data transmission ports include a first data transmission port for transmitting audio data corresponding to a first audio channel and a second data transmission port for transmitting audio data corresponding to a second audio channel. The first data transmission port is electrically connected to the third A2B chip via a third data signal line, and the second data transmission port is electrically connected to the fourth A2B chip via a fourth data signal line.
[0014] A second aspect of this utility model provides an in-vehicle audio device, which includes the aforementioned in-vehicle audio transmission device.
[0015] In a preferred embodiment, the host module is located in the vehicle's infotainment system.
[0016] In a preferred embodiment, the slave module is located in the vehicle infotainment system or in the vehicle's speaker modules. There are multiple speaker modules, each corresponding to one slave module. Each speaker module includes interconnected speakers and amplifier modules. The second DSP chip of the slave module is electrically connected to the amplifier module. Optionally, the speakers include headrest speakers, door panel speakers in the doors, subwoofers or bass speakers in the vehicle's trunk, ceiling speakers on the vehicle's roof, speakers in the vehicle's dashboard, or speakers in the vehicle's armrest box, etc. The vehicle has multiple speakers. The aforementioned in-vehicle audio transmission device sends audio source data for multiple audio channels to the amplifier modules of the multiple speakers. The amplifier modules then drive the corresponding speakers according to the corresponding audio data to achieve sound reproduction for multiple audio channels.
[0017] The present invention adopts the above solution and has the following advantages compared with the prior art:
[0018] This utility model discloses an in-vehicle audio transmission device based on the A2B bus. Multiple slave devices are configured to receive signals from the master module via the A2B bus, thereby expanding the number of audio channels. Furthermore, the clock signal of the A2B chip of one slave device is selected as the clock signal source for the slave module. Other devices in the slave module use this clock signal source to ensure data synchronization on multiple channels, thus solving the problem of data asynchrony on multiple A2B buses. Attached Figure Description
[0019] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a block diagram of an in-vehicle audio device according to an embodiment of the present utility model.
[0021] Figure 2 This is a circuit diagram of an in-vehicle audio transmission device according to an embodiment of the present utility model.
[0022] In the above attached figures,
[0023] 1. Main module; 11. Main DSP chip; 12. Third A2B chip; 13. Third A2B chip;
[0024] 2. Slave module; 20a. First slave; 20b. Second slave; 21. First A2B chip; 22. First DSP chip; 23. Second A2B chip; 24. Second DSP chip;
[0025] 3. Power amplifier module;
[0026] 4. Speaker;
[0027] 501, First A2B bus; 502, Second A2B bus. Detailed Implementation
[0028] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding the present invention, but does not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0029] The embodiments relate to an in-vehicle audio transmission device based on an A2B bus, which can send in-vehicle audio source signals to slave devices with multiple audio channels, thereby realizing the transmission of multi-channel audio signals. The embodiments also relate to an in-vehicle audio device that can be installed in a vehicle to achieve multi-channel sound playback inside or outside the vehicle.
[0030] Figure 1 An in-vehicle audio device is shown. Figure 2 It shows Figure 1 The specific components of the in-vehicle audio transmission device in the vehicle audio equipment. (Refer to...) Figure 1 As shown, the in-vehicle audio equipment includes an in-vehicle audio transmission device, which specifically includes a host module 1 and a slave module 2 connected via a multi-channel A2B audio bus. The in-vehicle audio transmission device can be installed in the vehicle's infotainment system or is a component of the infotainment system. The slave module 2 is installed in the infotainment system or in the vehicle's speaker module.
[0031] The in-vehicle audio equipment has multiple audio channels, each corresponding to a speaker module. Each speaker module's speaker 4 is electrically connected to an amplifier module 3, and is driven to produce sound by the amplifier module 3 corresponding to the audio channel. The output of the slave module 2 is connected to the amplifier module 3 of each audio channel. The vehicle can have multiple speakers 4. The in-vehicle audio transmission device sends audio source data for multiple audio channels to the amplifier modules 3 of the multiple speakers 4. The amplifier modules 3 then drive the corresponding speakers 4 according to the corresponding audio data to achieve sound reproduction from multiple audio channels. The speakers 4 may include headrest speakers, door panel speakers in the doors, subwoofers or woofers in the trunk, ceiling speakers on the roof, speakers in the dashboard, or speakers in the armrest box, etc. The in-vehicle audio transmission device of this embodiment enables various sound effects, such as stereo and zoned sound playback within the vehicle.
[0032] Slave module 2 includes multiple slave units corresponding to multiple audio channels, each configured to receive signals from master module 1 via corresponding A2B buses. Although Figure 2 Only two slave units are shown, namely the first slave unit 20a and the second slave unit 20b. However, it should be understood that slave unit module 2 may also include a third slave unit, a fourth slave unit, a fifth slave unit, etc., depending on the number of audio channels configured in the vehicle. Figure 2 In the example shown, the first slave device 20a includes a first A2B chip 21 and a first DSP chip 22, and the second slave device 20b includes a second A2B chip 23 and a second DSP chip 24.
[0033] The host module 1 includes a main DSP chip 11 and multiple A2B chips, with each A2B chip corresponding to a multiple slave device. The main DSP chip 11 and each of the A2B chips are connected in a one-to-one correspondence to send clock signals and audio signals corresponding to each audio channel. For example, each A2B chip in the host module 1 is connected to one of the slave devices in the slave module 2 via a corresponding A2B bus. Although... Figure 2 The host module 1 only shows two A2B chips, namely the third A2B chip 12 and the fourth A2B chip 13. However, it should be understood that the slave module 2 may include more A2B chips, depending on the number of audio channels configured in the vehicle. Figure 2 In the example shown, multiple A2B chips include a third A2B chip 12 and a fourth A2B chip 13. The third A2B chip 12 is electrically connected to the first A2B chip 21 via a first A2B bus 501, and the fourth A2B chip 13 is electrically connected to the second A2B chip 23 via a second A2B bus 502.
[0034] A DSP chip is a microprocessor capable of high-speed digital signal processing, implementing audio digital signal processing through digital algorithms. The A2B bus (Automotive Audio Bus) is a high-bandwidth digital audio bus designed specifically for automotive audio systems, transmitting audio, control signals, clock, and power over a single unshielded twisted-pair (UTP) cable. A2B chips support this proprietary A2B audio bus technology for signal transmission, reception, and processing, and can be programmed via the control bus for configuration and readback.
[0035] The specific connection structure of the master module 1 and slave module 2 will be described in detail below according to the signal transmission path.
[0036] The main DSP chip 11 has a clock signal transmission port and a data transmission port. The clock signal transmission port is electrically connected to the third A2B chip 12 and the fourth A2B chip 13, respectively, and the data transmission port is also electrically connected to the third A2B chip 12 and the fourth A2B chip 13, respectively. The clock signal transmission port includes a BCLK signal (time-domain mite signal) transmission port, which is electrically connected to the BCLK ports of the third A2B chip 12 and the fourth A2B chip 13 via BCLK signal lines. The clock signal transmission port also includes an FS signal (frame synchronization signal) transmission port, which is electrically connected to the FS ports of the third A2B chip 12 and the fourth A2B chip 13 via FS signal lines.
[0037] The main DSP chip 11 includes multiple data transmission ports corresponding to multiple audio channels, which also corresponds to the number of A2B chips in the host module 1. Although Figure 2 Only two data transmission ports are shown, namely the first data transmission port and the second data transmission port; however, it should be understood that the main DSP chip 11 may also include a third data transmission port, a fourth data transmission port, a fifth data transmission port, and other multiple data transmission ports. Figure 2 In the example shown, multiple data transmission ports include a first data transmission port for transmitting audio data DATA1 corresponding to the first audio channel and a second data transmission port for transmitting audio data DATA2 corresponding to the second audio channel. The first data transmission port is electrically connected to the third A2B chip 12 via a third data signal line, and the second data transmission port is electrically connected to the fourth A2B chip 13 via a fourth data signal line.
[0038] Each A2B chip in the host module 1 is electrically connected to the A2B chip in the slave module 2 via an independent A2B bus. Specifically, the output of the third A2B chip 12 is electrically connected to the input of the first A2B chip 21 via the first A2B bus 501 to send the clock signals BCLK and FS and the audio data DATA1 corresponding to the first audio channel to the first A2B chip 21. The output of the fourth A2B chip 13 is electrically connected to the input of the second A2B chip 23 via the second A2B bus 502 to send the audio data DATA2 corresponding to the second audio channel to the second A2B chip 23.
[0039] The first A2B chip 21 includes a clock signal output port. The first DSP chip 22, the second A2B chip 23, and the second DSP chip 24 each include a clock signal receiving port. Each clock signal receiving port is electrically connected to the clock signal output port of the first A2B chip 21. The clock signal receiving ports of the first DSP chip 22, the second A2B chip 23, or the second DSP chip 24 are electrically connected via a BCLK signal line or an FS signal line. Specifically, the clock signal output port of the first A2B chip 21 includes a BCLK signal output port and an FS signal output port. The signal receiving ports of the other chips in the slave module 2 each include a BCLK signal receiving port and an FS signal receiving port. The BCLK signal receiving ports of the other chips in the slave module 2 are electrically connected to the BCLK signal output port of the first A2B chip 21 via BCLK signal lines. The FS signal receiving ports of the other chips in the slave module 2 are electrically connected to the FS signal output port of the first A2B chip 21.
[0040] The first A2B chip 21 includes a data output port, which is electrically connected to the data receiving port of the first DSP chip 22 via a first data signal line to send audio data DATA1 corresponding to the first audio channel to the first DSP chip 22, thereby feeding it to the corresponding speaker 4 for playback through the power amplifier module 3 of the first audio channel. The data output port of the second A2B chip 23 is electrically connected to the data receiving port of the second DSP chip 24 via a second data signal line to send audio data DATA2 corresponding to the second audio channel to the second DSP chip 24, thereby feeding it to the corresponding speaker 4 for playback through the power amplifier module 3 of the second audio channel.
[0041] refer to Figure 2On the host side, the clock signal from the master DSP chip 11 needs to be split in two, being sent to the third A2B chip 12 and the fourth A2B chip 13 respectively. On the slave side, only one of the two A2B chips, the first A2B chip 21 and the second A2B chip 23, can be selected as the master clock. That is, the first A2B chip 21 is used as the source of the clock (BCLK and FS), while other devices (including the other A2B chip and the two DSP chips) act as slaves in the TDM, using the clock signal instead of sending their own. Data synchronization across multiple A2B buses is achieved by sharing a clock signal source between the host and slave sides.
[0042] The vehicle audio transmission device based on the A2B bus in this embodiment is configured with multiple slave units, each receiving signals from the master module 1 via the A2B bus, thus expanding the number of audio channels. Furthermore, the clock signal of the A2B chip of one slave unit is selected as the clock signal source of the slave module 2, and other devices in the slave module 2 use this clock signal source to ensure data synchronization on multiple channels, thus solving the problem of data asynchrony on multiple A2B buses.
[0043] As indicated in this specification and claims, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.
[0044] It can be further understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar.
[0045] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.
[0046] The above embodiments are only for illustrating the technical concept and features of this utility model, and are preferred embodiments. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly, and they cannot be used to limit the protection scope of this utility model.
Claims
1. A vehicle-mounted audio transmission device based on an A2B bus, comprising a slave module, characterized in that, The slave module includes multiple slave units corresponding to multiple audio channels, and the multiple slave units are configured to each receive signals from the master module via an A2B bus; The plurality of slave devices includes at least a first slave device and a second slave device. The first slave device includes a first A2B chip and a first DSP chip. The second slave device includes a second A2B chip and a second DSP chip. The first A2B chip includes a clock signal output port. The first DSP chip, the second A2B chip, and the second DSP chip each include a clock signal receiving port. Each clock signal receiving port is electrically connected to the clock signal output port of the first A2B chip.
2. The in-vehicle audio transmission apparatus according to claim 1, characterized by, The clock signal receiving ports of the first DSP chip, the second A2B chip, or the second DSP chip are electrically connected via the BCLK signal line or the FS signal line, respectively.
3. The in-vehicle audio transmission apparatus according to claim 2, characterized by, The clock signal output port includes a BCLK signal output port and an FS signal output port. Each of the signal receiving ports includes a BCLK signal receiving port and an FS signal receiving port. Each of the BCLK signal receiving ports is electrically connected to the BCLK signal output port via a BCLK signal line. Each of the FS signal receiving ports is electrically connected to the FS signal output port.
4. The in-vehicle audio transmission apparatus according to claim 1, characterized by, The data output port of the first A2B chip is electrically connected to the data receiving port of the first DSP chip via a first data signal line to send audio data corresponding to the first audio channel; the data output port of the second A2B chip is electrically connected to the data receiving port of the second DSP chip via a second data signal line to send audio data corresponding to the second audio channel.
5. The in-vehicle audio transmission apparatus according to any one of claims 1 to 4, characterized by, The host module includes multiple A2B chips, and the multiple A2B chips correspond to the multiple slave devices. The multiple A2B chips include a third A2B chip and a fourth A2B chip. The third A2B chip is electrically connected to the first A2B chip through a first A2B bus, and the fourth A2B chip is electrically connected to the second A2B chip through a second A2B bus.
6. The in-vehicle audio transmission apparatus according to claim 5, characterized by The host module also includes a main DSP chip, which has a clock signal transmission port and a data transmission port. The clock signal transmission port is electrically connected to the third A2B chip and the fourth A2B chip, respectively, and the data transmission port is electrically connected to the third A2B chip and the fourth A2B chip, respectively.
7. The vehicle-mounted audio transmission device according to claim 6, characterized in that, The clock signal transmission port includes a BCLK signal transmission port, which is electrically connected to the third A2B chip and the fourth A2B chip respectively via BCLK signal lines; the clock signal transmission port also includes an FS signal transmission port, which is electrically connected to the third A2B chip and the fourth A2B chip respectively via FS signal lines.
8. The in-vehicle audio transmission apparatus according to claim 6, characterized by The main DSP chip includes multiple data transmission ports corresponding to multiple audio channels. The multiple data transmission ports include a first data transmission port for transmitting audio data corresponding to a first audio channel and a second data transmission port for transmitting audio data corresponding to a second audio channel. The first data transmission port is electrically connected to the third A2B chip through a third data signal line, and the second data transmission port is electrically connected to the fourth A2B chip through a fourth data signal line.
9. A car audio apparatus characterized by comprising: Includes the vehicle audio transmission device as described in any one of claims 1 to 8.
10. The vehicle-mounted audio device according to claim 9, characterized by, The host module is installed in the vehicle's infotainment system, and the slave module is installed in the infotainment system or in the vehicle's speaker module. There are multiple speaker modules, and each speaker module corresponds to one slave module. Each speaker module includes a speaker and a power amplifier module that are connected to each other. The second DSP chip of the slave module is electrically connected to the power amplifier module.