Printed Circuit Board

Abstract

This application discloses a printed circuit board, comprising: an insulating board including a first surface and a second surface disposed opposite to each other; a first circuit and a second circuit respectively disposed on the first surface and the second surface; two first pads and two second pads respectively disposed on the first surface and the second surface, wherein the first pads are electrically connected to the first circuit and the second pads are electrically connected to the second circuit; a component electrically connected to the first circuit between the two first pads and / or the second circuit between the two second pads; and a test hole penetrating the first pads, the insulating board, and the second pads, wherein a conductive layer is provided on the inner wall of the test hole, and the conductive layer is electrically connected to the first pads and the second pads. This invention allows the first pads and the second pads to be directly electrically connected to the first circuit and the second circuit respectively, without additional wiring, enabling simultaneous transmission of signals on multiple high-speed signal lines, avoiding noise generation, and facilitating accurate capture of real signal waveforms.

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