A high pass filter and radar receiver
By using a high thermal conductivity substrate and a metal heat dissipation layer in the radar receiver filter, combined with high-quality factor capacitors and inductors, the problem of poor heat dissipation was solved, resulting in better heat dissipation performance and filtering effect, and promoting the miniaturization of radar receivers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI JUSTIMING ELECTRONIC TECH CO LTD
- Filing Date
- 2025-03-24
- Publication Date
- 2026-07-03
Smart Images
Figure CN224460303U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of filter technology, and in particular to a high-pass filter and a radar receiver. Background Technology
[0002] While receiving echo signals, radar receivers inevitably encounter noise and various interferences, such as clutter from various distributed objects and noise modulation interference from the enemy. In order to select useful targets and suppress various noises and interferences, filters are needed to perform frequency selection.
[0003] When a filter experiences poor heat dissipation, its internal components can overheat and degrade in performance, affecting the filter's filtering effectiveness. This effectiveness directly impacts crucial radar receiver parameters such as sensitivity and waveform distortion. Therefore, improving the filter's heat dissipation is of paramount importance. Utility Model Content
[0004] This invention provides a high-pass filter and a radar receiver, solving the technical problem in the prior art where poor heat dissipation of filters in radar receivers affects the accuracy of received signals.
[0005] This utility model embodiment provides a high-pass filter, which includes a substrate and a metal heat dissipation layer;
[0006] The thermal conductivity of the substrate is greater than a first preset value;
[0007] The metal heat dissipation layer is disposed on one side surface of the substrate, and the metal heat dissipation layer has a groove of a predetermined shape.
[0008] Furthermore, the substrate is provided with a preset number of slots, dividing the substrate into a preset number of rectangular structures with a preset area.
[0009] Furthermore, the high-pass filter also includes at least four capacitors with a quality factor higher than a second preset value;
[0010] At least four of the capacitors are connected in series and disposed above the groove of the metal heat dissipation layer, and integrated on the side of the substrate away from the metal heat dissipation layer.
[0011] Furthermore, the high-pass filter also includes at least four inductors with a quality factor higher than a third preset value;
[0012] At least four of the inductors are integrated on the side of the substrate away from the metal heat dissipation layer, and one of the inductors is connected in parallel across the two ends of the capacitor.
[0013] Furthermore, the surface of the metal heat dissipation layer is plated with a gold layer.
[0014] Furthermore, the thermal conductivity of the substrate is in the range of 50 to 300 W / (m·K).
[0015] Furthermore, the metal heat dissipation layer is a copper layer.
[0016] Furthermore, the substrate is an aluminum nitride substrate.
[0017] This utility model embodiment also provides a radar receiver, which includes the high-pass filter described in any of the above embodiments.
[0018] This utility model discloses a high-pass filter and a radar receiver, including a substrate and a metal heat dissipation layer; the thermal conductivity of the substrate is greater than a first preset value; the metal heat dissipation layer is disposed on one side surface of the substrate, and grooves of a predetermined shape are provided on the metal heat dissipation layer. This application solves the technical problem in the prior art where poor heat dissipation of filters in radar receivers affects the accuracy of the received signal, by using a substrate made of a high thermal conductivity material and adding a metal heat dissipation layer on one side of the substrate, while also utilizing the grooves on the metal heat dissipation layer to increase heat dissipation. This achieves the technical effect of increasing the heat dissipation of the filter and ensuring the filtering performance of the filter. Attached Figure Description
[0019] Figure 1 This is a structural diagram of a high-pass filter provided in an embodiment of the present invention;
[0020] Figure 2 This is a thermal diagram of a filter with a common structure provided in this embodiment of the present invention;
[0021] Figure 3 This is a thermal diagram of the high-pass filter provided in this embodiment of the utility model;
[0022] Figure 4 This is a schematic diagram of the slotted substrate on the filter provided in this embodiment of the utility model;
[0023] Figure 5 This is a front view of the high-pass filter provided in this embodiment of the utility model;
[0024] Figure 6 This is a top view of the high-pass filter provided in this embodiment of the utility model. Detailed Implementation
[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this utility model are used to distinguish different objects, not to limit a specific order. The various embodiments of this utility model described below can be performed individually, or they can be combined with each other; this utility model does not impose specific limitations in this regard.
[0027] Figure 1 This is a structural diagram of a high-pass filter provided in an embodiment of the present invention.
[0028] like Figure 1 As shown, the high-pass filter includes a substrate 10 and a metal heat dissipation layer 20.
[0029] The thermal conductivity of the substrate 10 is greater than a first preset value; a metal heat dissipation layer 20 is disposed on one side surface of the substrate 10, and a groove 21 of a predetermined shape is disposed on the metal heat dissipation layer 20.
[0030] The first preset value can be set to 50W / (m·K) as needed, meaning that the substrate 10 needs to be made of a material with a thermal conductivity higher than 50W / (m·K).
[0031] For high-power electronic devices, a significant amount of heat is generated during operation. If this heat cannot be dissipated in a timely manner, it can lead to performance degradation or even damage. See [link to relevant documentation]. Figure 1 In this embodiment of the invention, a substrate 10 is made of a material with a high thermal conductivity. The substrate 10 with a high thermal conductivity can conduct heat more effectively, thereby providing a better heat dissipation effect.
[0032] Based on the selection of a substrate 10 with high thermal conductivity, a metal heat dissipation layer 20 is added to one side of the substrate 10. When the electronic devices on the substrate 10 are working, heat is generated. This heat is quickly conducted to a larger area through the metal heat dissipation layer 20 and then dissipated through air convection or other heat dissipation methods. By setting the metal heat dissipation layer 20, the heat dissipation area is effectively increased and the heat dissipation rate is improved.
[0033] In this embodiment of the invention, a groove 21 of a predetermined shape is added to the metal heat dissipation layer 20. Figure 1 The diagram illustrates, for example, a metal heat dissipation layer 20 with an elongated elliptical groove. The groove 21 increases the heat dissipation area, allowing heat to be dissipated more quickly through the metal heat dissipation layer 20.
[0034] Optionally, grounding is also added to the metal heat dissipation layer 20. On the one hand, grounding helps to maintain the potential stability of the metal heat dissipation layer 20 and prevents heat accumulation or local overheating caused by potential fluctuations, thereby further improving the heat dissipation effect. On the other hand, grounding can provide a stable potential reference point, which helps to suppress electromagnetic interference. When the electronic devices on the substrate 10 are working, electromagnetic radiation or electromagnetic induction may be generated. These electromagnetic phenomena may interfere with the surrounding electronic devices. By adding grounding to the metal heat dissipation layer 20, these electromagnetic interferences can be guided to the ground or other grounded bodies, thereby reducing the impact on the surrounding electronic devices and improving the stability and reliability of the entire system.
[0035] Figure 2 This is a thermal diagram of a filter with a common structure provided in this embodiment of the present invention. Figure 3 This is a thermal diagram of the high-pass filter provided in this embodiment of the present invention, wherein the redder the color, the higher the heat. Figure 2 The white boxes in the image mark the main heat dissipation areas of the entire filter circuit board. Figure 3 The white box in the image marks the heat dissipation area of an inductor integrated on the high-pass filter. Figure 2 and Figure 3 As can be seen from the comparison, the ordinary filter generates more heat during operation, and the heat-generating area is relatively large, almost occupying most of the circuit board. However, the high thermal conductivity substrate 10 of this application, combined with the metal heat dissipation layer 20 with grooves 21, significantly reduces the heat generation during operation, and the heat-generating area is also significantly reduced, concentrated only near a single electronic device. Therefore, the heat dissipation performance of the high-pass filter provided by this utility model embodiment is higher than that of the ordinary filter, and the heat-generating area is smaller.
[0036] This application solves the technical problem in the prior art where poor heat dissipation of filters in radar receivers affects the accuracy of radar receiver signals. By selecting a substrate with high thermal conductivity and adding a metal heat dissipation layer on one side of the substrate, and by utilizing slots on the metal heat dissipation layer to increase heat dissipation, this application achieves the technical effect of increasing the heat dissipation of the filter and ensuring the filtering performance of the filter.
[0037] Figure 4 This is a schematic diagram of the slotted substrate on the filter provided in this embodiment of the present invention.
[0038] Optionally, such as Figure 4 As shown, a preset number of slots 11 are provided on the substrate 10, dividing the substrate 10 into a preset number of rectangular structures 12 with a preset area.
[0039] Specifically, by setting slots 11 on the substrate 10, the substrate 10 is divided into several rectangular structures 12. A substrate capacitor is formed between the rectangular structure 12 and the metal heat dissipation layer 20. The set area of the rectangular structure 12 can reflect the capacitance value of the substrate capacitor. By setting slots 11 to divide the substrate 10 into rectangular structures 12 of a set area, the effective area of the substrate 10 is reduced, thereby reducing its ability to store charge, that is, reducing the junction capacitance, and further improving the overall anti-interference capability of the circuit board.
[0040] Optionally, such as Figure 1 and Figure 4 As shown, the high-pass filter also includes at least four capacitors 30 with a quality factor higher than the second preset value.
[0041] At least four capacitors 30 are connected in series and disposed above the groove 21 of the metal heat dissipation layer 20, and integrated on the side of the substrate 10 away from the metal heat dissipation layer 20.
[0042] Specifically, the quality factor Q is a dimensionless unit that measures the performance of a component or resonant circuit. In filters, it reflects the filter's resolution. For high-pass filters, a higher quality factor Q indicates a higher resolution, better filtering effect, and lower active power consumption. Therefore, to ensure the performance of the high-pass filter, this application selects capacitors with a high quality factor. The second preset value can be set according to the required capacitor quality factor, for example, set to 1.
[0043] like Figure 1 and Figure 4 As shown, for easier observation, the substrate 10 has been transparently processed, clearly revealing the elongated elliptical groove 21 in the metal heat dissipation layer 20, and four series-connected capacitors 30 on the other side of the substrate 10 opposite the groove 21. By placing the capacitors 30 above the groove 21, the groove 21 effectively improves the heat dissipation of the capacitors 30, thereby enhancing the overall heat dissipation performance of the high-pass filter.
[0044] Optionally, such as Figure 1 As shown, the high-pass filter also includes at least four inductors 40 with a quality factor higher than a third preset value; at least four inductors 40 are integrated on the side of the substrate 10 away from the metal heat sink 20, and one inductor 40 is connected in parallel across a capacitor 30.
[0045] Specifically, the quality factor Q, as an important parameter of inductors, measures the ratio of inductor energy storage to losses. A high quality factor means lower inductor losses, enabling more efficient signal transmission and reducing energy loss in the inductor. This embodiment of the invention, by using inductors with a high quality factor, helps improve the performance stability of the high-pass filter. The third preset value can be set according to the required inductor quality factor, for example, set to 1.
[0046] Optionally, inductor 40 is a spiral inductor, which is typically formed by winding a conductor (such as copper wire) into a spiral shape. This structure allows the inductor to provide a large inductance value in a small volume.
[0047] Optionally, the surface of the metal heat dissipation layer 20 is plated with a gold layer.
[0048] Specifically, gold plating on the surface of the metal heat dissipation layer 20 not only prevents product oxidation but also facilitates product mounting. It should be noted that the surface of the metal heat dissipation layer 20 can also be plated with other metals as needed or to reduce costs, as long as the plating metal exhibits relatively stable performance and is not easily oxidized; no specific restrictions are imposed here.
[0049] Optionally, the thermal conductivity of the substrate 10 is between 50 and 300 W / (m·K). Optionally, the substrate 10 is an aluminum nitride substrate.
[0050] Specifically, the substrate 10 with high thermal conductivity can be made of a material with a thermal conductivity of 50 to 300 W / (m·K), such as aluminum nitride (AlN).
[0051] Optionally, the metal heat dissipation layer 20 is a copper layer.
[0052] Specifically, the metal heat dissipation layer 20 can be made of copper, which has good thermal conductivity, low price, and is easy to process, or other metal materials that meet the above conditions can be selected.
[0053] In this embodiment of the invention, heat dissipation is increased by using a substrate 10 with high thermal conductivity, and a metal heat dissipation layer 20 with a groove 21 is provided on one side of the substrate 10 to further increase heat dissipation. At the same time, a slot 11 is provided on the substrate 10 to reduce the junction capacitance, and a high-Q capacitor and a high-Q inductor are provided on the side of the substrate 10 away from the metal heat dissipation layer 20 to ensure the performance of the high-pass filter, so that the size of the high-pass filter is significantly reduced compared with the filter of ordinary structure. Figure 5 This is a front view of the high-pass filter provided in this embodiment of the present invention. Figure 6 This is a top view of the high-pass filter provided in this embodiment of the utility model, as shown below. Figure 5 and Figure 6As shown, the high-pass filter provided in this embodiment of the present invention has a size of 11*5.5*3.7mm, while the size of a filter with a common structure is usually 20*10*10mm. It can be concluded that the size of the high-pass filter provided in this application is greatly reduced, and it occupies less space when integrated into a radar receiver, which is conducive to the miniaturization of radar receivers.
[0054] This utility model embodiment also provides a radar receiver, which includes a high-pass filter in any of the above embodiments.
[0055] The radar receiver provided in this embodiment includes the high-pass filter described in the above embodiment. Therefore, the radar receiver provided in this embodiment also has the beneficial effects described in the above embodiment, which will not be repeated here.
[0056] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0057] Finally, it should be noted that the above are merely preferred embodiments and the technical principles applied in this utility model. Those skilled in the art will understand that this utility model is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of this utility model. Therefore, although the utility model has been described in detail through the above embodiments, this utility model is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of this utility model, and the scope of this utility model is determined by the scope of the appended claims.
Claims
1. A high-pass filter, characterized by The high-pass filter includes a substrate and a metal heat dissipation layer; The thermal conductivity of the substrate is greater than a first preset value; The metal heat dissipation layer is disposed on one side surface of the substrate, and the metal heat dissipation layer has a groove of a predetermined shape.
2. The high-pass filter of claim 1, wherein, The substrate has a preset number of slots, which divide the substrate into a preset number of rectangular structures with a preset area.
3. The high-pass filter of claim 1, wherein, The high-pass filter also includes at least four capacitors with a quality factor higher than a second preset value; At least four of the capacitors are connected in series and disposed above the groove of the metal heat dissipation layer, and integrated on the side of the substrate away from the metal heat dissipation layer.
4. The high-pass filter of claim 3, wherein, The high-pass filter also includes at least four inductors with a quality factor higher than a third preset value; At least four of the inductors are integrated on the side of the substrate away from the metal heat dissipation layer, and one of the inductors is connected in parallel across the two ends of the capacitor.
5. The high-pass filter of claim 1, wherein, The surface of the metal heat dissipation layer is plated with a gold layer.
6. The high-pass filter of claim 1, wherein, The thermal conductivity of the substrate is between 50 and 300 W / (m·K).
7. The high-pass filter of claim 1, wherein, The metal heat dissipation layer is a copper layer.
8. The high-pass filter of claim 1, wherein, The substrate is an aluminum nitride substrate.
9. A radar receiver, characterized by The radar receiver includes a high-pass filter as described in any one of claims 1 to 8.