A flip chip bonder swing plate structure and a flip chip bonder using the same

Abstract

The utility model relates to the field of fixed crystal production discloses a kind of fixed crystal machine rocker plate structure and its application's fixed crystal machine, the rocker plate structure includes vibration disc, conveying track, material blocking piece, electric slide rail and pusher, conveying track includes receiving track, vertical oblique track and horizontal straight track, material blocking piece includes fixed seat and material blocking head, electric slide rail is located below horizontal straight track, pusher includes sliding seat and pusher head, sliding seat is driven to slip by electric slide rail, material blocking piece blocks wafer material flow to make conveying track be covered with single wafer, when pusher head pushes wafer material flow on horizontal straight track to move to straight track end, material blocking head needs to be separated from working condition, the cooperation of pusher and material blocking piece realizes the quantitative wafer material flow conveying of horizontal straight track end, improves feeding efficiency while reducing the control complexity of carrier disc cooperation operation, and wafer material flow feeding is more stable and reliable by pusher.

Description

Technical Field

[0001] This utility model relates to the field of die bonding production, specifically to a die bonding machine swivel structure and its application in a die bonding machine. Background Technology

[0002] With the rapid development of semiconductor packaging and microelectronic assembly technologies, die bonders, as high-precision automated equipment, play a crucial role in chip packaging processes. The main functions of a die bonder include picking up bare wafers from the wafer and precisely mounting them onto a substrate (such as a lead frame, PCB board, or ceramic substrate), subsequently fixing the chip through eutectic bonding, conductive adhesive curing, or solder paste soldering.

[0003] In the die bonding process, the swivel tray (or swivel plate) is a key component affecting the overall packaging efficiency and accuracy. Its main function is to precisely position and feed disordered bare wafers. Traditional swivel tray structures typically use a combination of vibration and mechanical guidance to arrange scattered bare wafers into an ordered wafer flow with a unified direction. However, in existing technologies, the movement of the ordered wafer flow mainly relies on the pushing action of subsequently entering bare wafers, resulting in low material flow efficiency. Furthermore, because the movement of the tray must be strictly synchronized with the movement of the wafer flow, the system requires high precision in automation control, increasing equipment complexity and debugging difficulty.

[0004] Therefore, existing rocker disk structures face the following technical challenges in high-speed, high-precision die bonding processes:

[0005] 1. Low material flow efficiency: The reliance on subsequent chip pushing methods limits the material supply speed, making it difficult to meet the high-efficiency production requirements of modern packaging;

[0006] 2. High control complexity: The movement of the carrier disk needs to be precisely matched with the wafer material flow, which places high demands on the servo system and motion control algorithm;

[0007] 3. Insufficient stability: Mechanical pushing can easily cause wafer jamming or misalignment, affecting the subsequent die bonding accuracy and yield. Utility Model Content

[0008] In view of the above-mentioned deficiencies or defects in the prior art, this utility model provides a die bonder swivel structure and a die bonder application thereof, which efficiently and accurately transfers an ordered wafer material flow to the carrier disk.

[0009] To achieve the above objectives, this utility model provides a die bonder swivel structure, including a vibrating plate and a conveying track. The conveying track includes a receiving track, a vertical inclined track, and a horizontal straight track arranged sequentially along the wafer material flow direction.

[0010] The chuck structure also includes:

[0011] The material stopper includes a fixed base and a material stopper head. The material stopper head slides relative to the fixed base to switch states. When the material stopper head is in the working state, it is used to block the wafer material flow at the end of the horizontal straight track.

[0012] Electric slide rail, which is located below the horizontal straight track, and the guide extension direction of the electric slide rail is parallel to the length direction of the horizontal straight track;

[0013] The pusher includes a sliding seat and a pusher head. The sliding seat is driven to slide by an electric slide rail. The pusher head switches states by sliding relative to the sliding seat. When the pusher head is in working state, it can push the wafer material flow on the horizontal straight track to move to the end of the horizontal straight track.

[0014] In some embodiments, the horizontal linear track has two parallel tracks for conveying wafer material flow, and a through slot is formed between the two tracks.

[0015] When the baffle head is in working condition, it passes through the through slot to block the wafer material flow;

[0016] When the pusher head is in operation, it passes through the slot and can push the wafer material flow.

[0017] In some embodiments, the pusher head is located at the beginning and end of the horizontal linear track for state switching and the pusher head is conical in shape.

[0018] In some embodiments, the end of the horizontal straight track is a downward-sloping ramp.

[0019] In some embodiments, a clearance groove is provided on the vertically inclined track to avoid the pusher head.

[0020] In some embodiments, the angle between the vertically inclined track and the extended section of the horizontal straight track is 20° to 30°.

[0021] In some embodiments, the chuck structure further includes a material carrier located at the end of a horizontal linear track.

[0022] A die bonder swivel structure applying the above-described technical solution of this utility model has the following advantages:

[0023] The blocking component obstructs the wafer material flow, causing the conveying track to be filled with single wafers. When the pusher component pushes the wafer material flow on the horizontal linear track to move towards the end of the linear track, the blocking component needs to be disengaged. The combination of the pusher component and the blocking component enables the quantitative delivery of wafer material flow at the end of the horizontal linear track, improving the feeding efficiency while reducing the control complexity of the tray operation. Furthermore, the wafer material flow is more stable and reliable when fed through the pusher component.

[0024] The second aspect of this utility model provides a die bonder, including the die bonder rocker structure described above.

[0025] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the die bonder swivel disk structure according to one embodiment of the present invention;

[0027] Figure 2 This is a three-dimensional structural diagram of the die bonder swivel structure according to another embodiment of the present invention;

[0028] Figure 3 This is a structural schematic diagram of the conveying track, electric slide rail, material stop, and material pusher according to one embodiment of this utility model;

[0029] Figure 4 This is a schematic diagram of the state during step a of the implementation process of the die bonder swivel disk structure according to one embodiment of this utility model;

[0030] Figure 5 This is a schematic diagram of the state during step b of the implementation process of the die bonder swivel structure according to one embodiment of this utility model;

[0031] Figure 6 This is a schematic diagram of the state during step c of the implementation process of the die bonder swivel disk structure according to one embodiment of this utility model;

[0032] Figure 7 This is a schematic diagram of the state during step d of the implementation process of the die bonder swivel structure according to one embodiment of this utility model;

[0033] Figure 8 This is a schematic diagram of the state during step e of the implementation process of the die bonder swivel structure according to one embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures

[0035] 1. Vibratory feeder; 2. Conveying track; 21. Receiving track; 22. Vertical inclined track; 23. Horizontal straight track; 24. Clearance groove; 25. Through groove; 26. Inclined surface; 3. Electric slide rail; 4. Material stop; 41. Material stop head; 42. Fixed base; 5. Material pusher; 51. Material pusher head; 52. Sliding base; 6. Material carrier; 10. Single wafer; 20. Gap; 100. Wafer material flow. Detailed Implementation

[0036] The specific embodiments of this utility model are described in detail below. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0037] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the orientation in the assembled and used state. "Inner" and "outer" refer to the inner and outer sides relative to the outline of each component itself.

[0038] The first aspect of this utility model provides a die bonder swivel structure, combined with the attached... Figure 1 To be continued Figure 4 As shown, the chuck structure includes a vibratory feeder 1, a conveying track 2, a stopper 4, an electric slide rail 3, and a pusher 5. Specifically, the conveying track 2 includes a receiving track 21, a vertically inclined track 22, and a horizontal straight track 23, which are arranged sequentially along the direction of movement of the wafer material flow 100. The receiving track 21 is used to receive the wafer material flow 100 formed after being vibrated and sorted by the vibratory feeder 1. The inclined state of the vertically inclined track 22 allows the wafer material flow 100 to move along the vertically inclined track 22 under the action of gravity. The horizontal straight track 23 is horizontal and delivers the wafer material flow 100 at its end.

[0039] The electric slide rail 3 is located below the horizontal linear track 23, and the guiding extension direction of the electric slide rail 3 is parallel to the length direction of the horizontal linear track 23. Specifically, during installation, the electric slide rail 3 can be installed below the horizontal linear track via a frame or other means, or it can be directly fixed below the horizontal linear track 23.

[0040] The baffle 4 includes a fixed base 42 and a baffle head 41. The baffle head 41 slides relative to the fixed base 42 to switch states. When the baffle head 41 is in the working state, it is used at the end of the horizontal linear track 23 to block the wafer material flow 100, preventing the wafer material flow 100 from being pushed out by the subsequent wafers. In this embodiment, the fixed base 42 is fastened to the electric slide rail 3 by bolts or other means. The baffle head 41 and the fixed base 42 can be switched between states by electromagnetic adsorption and elastic elements. For example, when energized, an attractive force is applied to the baffle head 41, causing the baffle head 41 to slide relative to the fixed base 42 and disengage from the working state. At this time, the elastic element stores force. When the power is off, the adsorption force disappears, and the baffle 4 switches to the working state under the action of the elastic element. The working state of the baffle head 41, which switches states in this way, is the normal working state. Of course, other existing technologies can also be used to drive the baffle head 41 to slide relative to the fixed base 42 to achieve the purpose of switching the state of the baffle head 41.

[0041] The pusher component 5 includes a sliding seat 52 and a pusher head 51. The sliding seat 52 is driven to slide by the electric slide rail 3, and the pusher head 51 switches states by sliding relative to the sliding seat 52. When the pusher head 51 is in the working state, it can push the wafer material flow 100 on the horizontal linear track 23 to move towards the end of the horizontal linear track 23. The sliding seat 52 serves as the driving force of the electric slide rail 3, and its moving speed and moving mode (uniform speed or variable speed) can be controlled by the electric slide rail 3. In addition, the pusher head 51 slides relative to the sliding seat 52 to achieve state switching. The way in which the pusher head 51 slides relative to the sliding seat 52 is consistent with the way the stop head 41 slides relative to the fixed seat 42, which will not be described in detail here.

[0042] As attached Figure 4 As shown, due to the configuration of the vertical inclined track 22 and the horizontal straight track 23, a certain angle is formed between the two single wafers 10 at the intersection of the vertical inclined track 22 and the horizontal straight track 23, and a gap 20 is formed between the two single wafers 10. When the pusher head 51 slides relative to the sliding seat 52 to switch to the working state, it can be inserted into the gap 20. At this time, the sliding seat 52 in the pusher 5 moves with the electric slide rail 3, and the pusher head 51 can push the wafer material flow 100 on the horizontal straight track 23 to move. During the process of the pusher head 51 pushing the wafer material flow 100 to move, the stop head 41 needs to switch from the working state to the non-working state to avoid blocking the wafer material flow 100, so that the wafer material flow 100 can be delivered from the end of the horizontal straight track 23. The length of the delivered wafer material flow 100 is consistent with the length of the horizontal straight track 23, thereby ensuring that the number of single wafers 10 delivered by the pusher head 51 each time is the same. There is no need for the carrier to perform complex control operations to receive the wafers, reducing the control complexity of the carrier's operation. Furthermore, the feeding of the wafer material flow 100 through the pusher 5 is more efficient, stable, and reliable.

[0043] It should be noted that, in order to ensure that the gap 20 formed by the two single wafers 10 at the intersection of the vertically inclined track 22 and the horizontally straight track 23 is exactly at the intersection of the two tracks, the following condition must be met:

[0044] Assuming the length of the single wafer 10 along the conveying direction of the conveying track 2 is d, and the length of the horizontal straight track 23 is D, then: D = n × d, where n is an integer value not less than 1. In this embodiment, each wafer material stream 100 delivered from the end of the horizontal straight track 23 contains eight single wafers 10, and n is 8. Of course, in other embodiments, a suitable value of n can be selected according to the actual feeding requirements, and a suitable length of horizontal straight track 23 can be selected based on the size d of the single wafer 10.

[0045] Combined with appendix Figure 4 To be continued Figure 8 As shown, the operating steps of this chuck structure are as follows:

[0046] a. The baffle head 41 is in working condition, the push head 51 is in non-working condition, a wafer material flow 100 is formed on the conveying track 2, and a gap 20 is formed between two single wafers 10 at the intersection of the vertical inclined track 22 and the horizontal straight track 23.

[0047] b. The stop head 41 remains in working state, the push head 51 switches to working state, and the push head 51 is inserted into the gap 20.

[0048] c. The stop head 41 switches to the non-working state, while the push head 51 remains in the working state. Due to the insertion action of the push head 51, the wafer material flow 100 on the horizontal linear track 23 will not be pushed by subsequent wafers.

[0049] d. The baffle head 41 remains in a non-working state, the pusher head 51 remains in a working state, the electric slide rail 3 drives the sliding seat 52 to move to the end of the horizontal straight track 23, and the pusher head 51 pushes the quantitative wafer material flow 100 on the horizontal straight track 23 out at a constant speed from the end.

[0050] During the process of the pusher head 51 moving the wafer material flow 100 on the horizontal linear track 23, the wafer material flow 100 on the vertical inclined track 22 continues to move along the horizontal linear track 23 under the action of gravity and the subsequent pushing action of the wafers. The moving speed of the wafer material flow 100 pushed by the pusher head 51 is generally greater than the traveling speed of the subsequent wafer material flow 100. This means that after the pusher head 51 has completely pushed and delivered the original wafer material flow 100 on the horizontal linear track 23 from the end, the subsequent wafer material flow 100 has not yet reached the end of the horizontal linear track 23, giving the pusher head 51 and the stop head 41 time to switch states.

[0051] e. After the stop head 41 switches to the working state and the push head 51 switches to the non-working state, the sliding seat 52 is driven by the electric slide rail 3 and resets at the intersection of the vertical inclined track 22 and the horizontal straight track 23.

[0052] In some preferred embodiments, the horizontal linear track 23 has two parallel tracks for conveying the wafer material flow 100, with a through groove 25 forming between the two tracks. When the baffle head 41 is in the working state, it passes through the through groove 25 to block the wafer material flow 100. When the push head 51 is in the working state, it passes through the through groove 25 and can push the wafer material flow 100. The two tracks surround the through groove 25, allowing the push head 51 and the baffle head 41 to move inside the horizontal linear track 23, providing a certain degree of concealment, aesthetics, and protection.

[0053] In some preferred embodiments, the pusher head 51 is located at the beginning and end of the horizontal straight track 23 for state switching and the pusher head 51 is conical in shape to avoid collision and interference between the pusher head 51 and the subsequent wafer material flow 100 during the reset stage in step e above. The conical shape of the pusher head 51 is also more suitable for the gap 20.

[0054] In some preferred embodiments, the end of the horizontal linear track 23 is a downwardly sloping ramp 26 so that the wafer material flow 100 is delivered more smoothly from the end of the horizontal linear track 23.

[0055] In some preferred embodiments, a clearance groove 24 is provided on the vertical inclined track 22 to avoid the pusher head 51. When the pusher head 51 switches from a non-working state to a working state at the intersection of the vertical inclined track 22 and the horizontal straight track 23, it will move. In order to avoid the vertical inclined track 22 interfering with the movement of the pusher head 51, a clearance groove 24 is provided on the vertical inclined track 22 to avoid the pusher head 51.

[0056] In some preferred embodiments, the angle between the extended sections of the vertically inclined track 22 and the horizontal straight track 23 is 20° to 30°, and the angle between the gaps 20 formed by the two single wafers 10 at the intersection of the vertically inclined track 22 and the horizontal straight track 23 is approximately the same as this angle. If the angle is too small, it will hinder the insertion of the pusher head 51 into the gap 20; if the angle is too large, it will easily cause the wafer material flow 100 to move too fast on the vertically inclined track 22, resulting in the wafer material falling off the transport track 2.

[0057] In some preferred embodiments, the chuck structure further includes a material carrier 6 located at the end of the horizontal linear track 23. (See attached diagram) Figure 1 and attached Figure 2 As shown, in addition to the existing pallet structure, the material carrier 6 can also adopt a linear conveyor belt or a rotary conveyor disk structure. When a linear conveyor belt is used, the wafer material flow 100 delivered from the end of the horizontal linear track 23 forms an equidistant linear conveying flow on the linear conveyor belt; when a rotary conveyor disk is used, the wafer material flow 100 delivered from the end of the horizontal linear track 23 forms an equiangularly distributed circumferential conveying flow on the rotary conveyor disk.

[0058] In a second aspect, this utility model provides a die bonder, including a die bonder rocker structure as described in any of the above embodiments.

[0059] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0060] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

[0061] Furthermore, various different embodiments of this utility model can be combined in any way, as long as they do not violate the spirit of this utility model, they should also be regarded as the content disclosed by this utility model.

Claims

1. A flip chip bonder turntable structure, comprising a vibration disc (1) and a conveying track (2), characterized in that, The conveying track (2) includes a receiving track (21), a vertical inclined track (22), and a horizontal straight track (23) arranged sequentially along the direction of wafer material flow (100). The clapper structure also includes: The material stop (4) includes a fixed base (42) and a material stop head (41). The material stop head (41) switches states by sliding relative to the fixed base (42). When the material stop head (41) is in the working state, it is used to block the wafer material flow (100) at the end of the horizontal straight track (23). Electric slide rail (3), the electric slide rail (3) is located below the horizontal straight track (23), and the guiding extension direction of the electric slide rail (3) is parallel to the length direction of the horizontal straight track (23); The pusher (5) includes a sliding seat (52) and a pusher head (51). The sliding seat (52) is driven to slide by the electric slide rail (3). The pusher head (51) switches states by sliding relative to the sliding seat (52). When the pusher head (51) is in working state, it can push the wafer material flow (100) on the horizontal straight track (23) to move towards the end of the horizontal straight track (23).

2. The flip chip bonder according to claim 1, wherein, The horizontal linear track (23) has two parallel tracks for conveying the wafer material flow (100), and a through groove (25) is formed between the two tracks. When the baffle head (41) is in working condition, the baffle head (41) passes through the through slot (25) to block the wafer material flow (100). When the pusher head (51) is in working condition, the pusher head (51) passes through the through slot (25) and can push the wafer material flow (100).

3. The flipper structure of claim 1, wherein, The pusher head (51) is located at the beginning and end of the horizontal straight track (23) and switches states, and the pusher head (51) is conical in shape.

4. The flip chip bonder of claim 1, wherein the rotation shaft is formed in the center of the rotation plate. The end of the horizontal straight track (23) is a downward sloping surface (26).

5. The flipper structure of claim 1, wherein, The vertical inclined track (22) is provided with a clearance groove (24) for avoiding the pusher head (51).

6. The die bonder rocker structure according to claim 1, characterized in that, The angle between the vertical inclined track (22) and the extended section of the horizontal straight track (23) is 20°~30°.

7. The crystal picker carousel structure of any one of claims 1 to 6, wherein, The rocker structure also includes a material carrier (6) located at the end of the horizontal linear track (23).

8. A die bonder, characterized by comprising: It includes the die bonder swivel structure as described in any one of claims 1 to 7.

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