A die core die bonding apparatus

Abstract

The application relates to a crystal core die bonding device, which comprises a die bonding seat, a die bonding mechanism and a conveying mechanism. The die bonding mechanism is arranged on the die bonding seat and is used for welding and fixing a luminescent wafer on a PET plate. The conveying mechanism comprises a conveying assembly and at least two groups of fixing assemblies. The conveying assembly comprises a conveying seat, and the conveying seat is slidingly matched with the die bonding seat. Each fixing assembly is arranged on the conveying seat and comprises a fixing screw rod and at least two limiting blocks. The fixing screw rod is rotationally arranged on the conveying seat, at least one limiting block is slidingly matched with the conveying seat and is threadedly connected with the fixing screw rod, and when the die bonding jig is placed on the conveying seat, each limiting block is respectively abutted with both sides of the die bonding jig. The application has the effects of making the position of the fixing jig more stable and improving the welding quality of the luminescent wafer.

Description

Technical Field

[0001] This application relates to the field of crystal chip screen production, and in particular to a crystal chip screen die bonding device. Background Technology

[0002] A crystal chip screen is a type of high frame rate LED display. During the production of a crystal chip screen, it is generally necessary to weld and fix the light-emitting wafers (LED chips) on a PET board. In order to achieve a better display effect, it is necessary to ensure that the arrangement of the light-emitting wafers fixed on the PET board is uniform. Generally, a die-bonding fixture is used to precisely position the fixed position of the light-emitting wafers, thereby ensuring that the light-emitting wafers are evenly arranged on the PET board. After the die-bonding fixture has finished clamping the PET board, it is transported to the die-bonding equipment for welding the light-emitting wafers.

[0003] When bonding and fixing light-emitting wafers in existing die bonding equipment, the die bonding fixture is usually placed directly on the surface of the die bonding equipment's conveyor seat without limiting or fixing the die bonding fixture.

[0004] Regarding the aforementioned technologies, when die bonding equipment performs wafer welding and fixing, the position of the die bonding fixture is prone to change, resulting in poor welding quality of the light-emitting wafer. Summary of the Invention

[0005] In order to make the position of the fixing fixture more stable and improve the welding quality of the light-emitting wafer, this application provides a crystal core screen die bonding device.

[0006] The die bonding device for a chip screen provided in this application adopts the following technical solution:

[0007] A die bonding device for a crystal chip screen includes a die bonding base, a die bonding mechanism, and a conveying mechanism. The die bonding mechanism is disposed on the die bonding base and is used to weld and fix the light-emitting wafer to a PET board. The conveying mechanism includes a conveying component and at least two sets of fixing components. The conveying component includes a conveying seat, which is slidably engaged with the die bonding base.

[0008] Each of the aforementioned fixing components is disposed on the conveyor seat. Each fixing component includes a fixing screw and at least two limiting blocks. The fixing screw is rotatably disposed on the conveyor seat. At least one of the limiting blocks is slidably engaged with the conveyor seat and threadedly connected to the fixing screw. When the die bonding fixture is placed on the conveyor seat, each of the limiting blocks abuts against both sides of the die bonding fixture.

[0009] By adopting the above technical solution, when the die bonding fixture completes the clamping and positioning of the PET board and places it on the conveyor seat, the fixing screw is rotated, which causes one or two limiting blocks to slide towards the die bonding fixture until each limiting block abuts against both sides of the die bonding fixture, thereby completing the positioning of the die bonding fixture. This makes the position of the fixing fixture more stable, improves the welding quality of the light-emitting wafer, and improves the problem that the position of the die bonding fixture is prone to change when the die bonding equipment is performing wafer welding and fixing, resulting in poor welding quality of the light-emitting wafer.

[0010] Optionally, the fixing component further includes at least two fixing blocks, each of which slides and engages with each of the limiting blocks. When the die bonding fixture is placed on the conveyor seat, each of the fixing blocks is clamped and fixed with the die bonding fixture.

[0011] Optionally, the fixing assembly further includes at least two fixing cam rods, each fixing cam rod being rotatably connected to each of the limiting blocks, and each fixing cam rod abutting against each of the fixing blocks. When each fixing cam rod rotates toward the direction of the fixing block, each fixing block is clamped and fixed with the die bonding fixture.

[0012] Optionally, the fixing component further includes at least two fixing springs, each fixing spring being located between each fixing block and each limiting block, with one end of each fixing spring abutting against each fixing block and the other end of each fixing spring abutting against each limiting block.

[0013] Optionally, each of the limiting blocks includes a sliding part and a limiting part, each of the limiting parts is rotatably connected to the sliding part and abuts against the die bonding fixture, and each of the fixing blocks is slidably engaged with each of the limiting parts.

[0014] Optionally, the conveying assembly further includes a conveying screw, which is rotatably connected to the die bonder and threadedly connected to the conveying seat.

[0015] Optionally, the conveying assembly also includes a conveying motor, a main conveying wheel, a slave conveying wheel, and a conveyor belt. The conveying motor is fixedly mounted on the die bonder, the main conveying wheel is coaxially fixedly mounted on the conveying motor, the slave conveying wheel is coaxially fixedly mounted on the conveying screw, and the conveyor belt is wound around the main conveying wheel and the slave conveying wheel.

[0016] Optionally, the die bonding mechanism includes a first linear module, a second linear module, and a die bonding module. The first linear module is disposed on the die bonding seat, the second linear module is disposed on the slider of the first linear module, and the die bonding module is disposed on the slider of the second linear module.

[0017] The first linear module can drive the die bonding module to move along the X-axis, and the second linear module can drive the die bonding module to move along the Y-axis. The die bonding module is used to weld and fix the light-emitting wafer to the PET board.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] When the die-bonding fixture has finished clamping and positioning the PET board and placed it on the conveyor seat, the fixing screw is rotated, which causes one or two limiting blocks to slide towards the die-bonding fixture until each limiting block abuts against both sides of the die-bonding fixture. This completes the positioning of the die-bonding fixture, making its position more stable, improving the welding quality of the light-emitting wafer, and addressing the problem that the position of the die-bonding fixture is prone to change during wafer welding and fixing in the die-bonding equipment, resulting in poor welding quality of the light-emitting wafer. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the die-bonding mechanism structure according to an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the conveying mechanism structure according to an embodiment of this application;

[0023] Figure 4 yes Figure 3 Enlarged view of part A;

[0024] Figure 5 This is a schematic diagram of the fixed component structure in an embodiment of this application. Figure 1 ;

[0025] Figure 6 This is a schematic diagram of the fixed component structure in an embodiment of this application. Figure 2 ;

[0026] Figure 7 This is a schematic diagram of the limiting block structure according to an embodiment of this application;

[0027] Figure 8 This is a cross-sectional view of the limiting block structure according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached drawings: 1. Die bonder; 2. Die bonder mechanism; 21. First linear module; 22. Second linear module; 23. Die bonder module; 3. Conveying mechanism; 31. Conveying assembly; 311. Conveying seat; 312. Conveying screw; 313. Conveying motor; 314. Main conveying wheel; 315. Slave conveying wheel; 316. Conveying belt; 32. Fixing assembly; 321. Fixing screw; 322. Rotating handle; 323. Limiting block; 3231. Sliding part; 3232. Limiting part; 324. Fixing block; 325. Fixing spring; 326. Fixing cam rod. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0030] This application discloses a die bonding device for a chip screen. (Refer to...) Figure 1 A die bonding device for a crystal chip screen includes a die bonding seat 1, a die bonding mechanism 2, and a conveying mechanism 3. The die bonding mechanism 2 is disposed on the die bonding seat 1 and is used to weld and fix the light-emitting wafer to a PET board. The conveying mechanism 3 is disposed on the die bonding seat 1 and is used to convey the die bonding fixture with the PET board clamped to the die bonding mechanism 2 for light-emitting wafer welding. The die bonding seat 1 is rectangular. In the embodiments of this application, the width direction of the die bonding seat 1 is set as the X-axis direction, the length direction of the die bonding seat 1 is set as the Y-axis direction, and the height direction of the die bonding seat 1 is set as the Z-axis direction.

[0031] Reference Figure 2 The die bonding mechanism 2 includes a first linear module 21, a second linear module 22, and a die bonding module 23. The first linear module 21 is disposed on the die bonding base 1, and the slider of the first linear module 21 can move along the X-axis. The second linear module is disposed on the slider of the first linear module 21, and the slider of the second linear module can move along the Y-axis. The die bonding module 23 is disposed on the slider of the second linear module, and the die bonding module 23 can move along the Z-axis. The die bonding module 23 is used to weld and fix the light-emitting wafer to the PET board.

[0032] Reference Figure 3 and Figure 4 The conveying mechanism 3 includes a conveying assembly 31, which includes a conveying seat 311, a conveying screw 312, a conveying motor 313, a main conveying wheel 314, a secondary conveying wheel 315, and a conveying belt 316. The conveying seat 311 is rectangular and slides along the Y-axis to fit the die bonder 1. The conveying screw 312 is rotatably connected to the die bonder 1 and threadedly connected to the conveying seat 311. The conveying motor 313 is fixedly mounted on the die bonder 1. The main conveying wheel 314 is coaxially fixedly mounted on the conveying motor 313. The secondary conveying wheel 315 is coaxially fixedly mounted on the conveying screw 312. The conveying belt 316 is wound around the main conveying wheel 314 and the secondary conveying wheel 315.

[0033] When the conveyor seat 311 needs to move along the Y-axis, the conveyor motor 313 drives it. The output shaft of the conveyor motor 313 drives the main conveyor wheel 314, which in turn drives the secondary conveyor wheel 315 to rotate. The rotation of the secondary conveyor wheel 315 drives the conveyor screw 312 to rotate, and the rotation of the conveyor screw 312 drives the conveyor seat 311 to move along the Y-axis, thereby achieving the driving of the conveyor seat 311 to move along the Y-axis.

[0034] Reference Figures 5 to 8 The conveying mechanism 3 also includes two sets of fixing components 32. The two fixing components 32 are symmetrically distributed along the center plane of the conveying seat 311 along its length. The fixing components 32 include a fixing screw 321, a rotating handle 322, and two limiting blocks 323. The fixing screw 321 is rotatably mounted on the conveying seat 311. The rotating handle 322 is coaxially fixed on the fixing screw 321 and is used to drive the fixing screw 321 to rotate. Each of the two limiting blocks 323 includes a sliding part 3231 and a limiting part 3232. The limiting part 3232 is rotatably connected to the sliding part 3231. One sliding part 3231 is slidably fitted on the conveying seat 311 and threadedly connected to the fixing screw 321. The other sliding part 3231 is fixedly mounted on the conveying seat 311. The two limiting blocks 323 are arranged opposite each other. When the die bonding fixture is placed on the conveying seat 311, the two limiting parts 3232 abut against the two sides of the die bonding fixture respectively.

[0035] Reference Figures 5 to 8 The fixing assembly 32 also includes two fixing blocks 324, two fixing springs 325, and two fixing cam rods 326. The two fixing blocks 324 are slidably engaged with the two limiting parts 3232, and the two fixing springs 325 are located between the two fixing blocks 324 and the two limiting parts 3232. One end of the two fixing springs 325 abuts against the two fixing blocks 324, and the other end of the two fixing springs 325 abuts against the two limiting parts 3232. The two fixing cam rods 326 are rotatably connected to the two limiting parts 3232, and the two fixing cam rods 326 abut against the two fixing blocks 324. When the two fixing cam rods 326 rotate toward the direction closer to the two fixing blocks 324, the two fixing cam rods 326 push the two fixing blocks 324 toward the direction closer to the fixing fixture, so that the two fixing blocks 324 are clamped and fixed with the die bonding fixture.

[0036] The implementation principle of the die bonding equipment for a PET chip screen according to this application embodiment is as follows: When the die bonding fixture completes the clamping and positioning of the PET board and places it on the conveyor seat 311, the rotating handle 322 rotates, causing the fixing screw 321 to rotate. The rotation of the fixing screw 321 causes one limiting block 323 to move closer to the other limiting block 323, so that the two limiting parts 3232 respectively abut against the two sides of the die bonding fixture. Then, the fixing cam rod 326 rotates towards the fixing block 324, so that the fixing cam rod 326 pushes the fixing block 324 towards the die bonding fixture until the fixing block 324 is tightly fixed against one side of the die bonding fixture, thereby completing the die bonding process. The positioning of the die bonding fixture makes its position more stable, improving the welding quality of the light-emitting wafer. It also addresses the problem that the position of the die bonding fixture is prone to change during wafer welding and fixing, which can lead to poor welding quality of the light-emitting wafer. After the die bonding equipment completes the welding and fixing of the light-emitting wafer, the fixing cam rod 326 rotates away from the fixing block 324, causing the fixing spring 325 to push the fixing block 324 away from the die bonding fixture. This causes the fixing block 324 to release its clamping and fixing of the die bonding fixture, thereby enabling the conveying mechanism 3 to quickly clamp and fix or release the fixing fixture.

[0037] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A die bonding device for a crystal core screen, characterized in that: The device includes a die bonder (1), a die bonder mechanism (2), and a conveying mechanism (3). The die bonder mechanism (2) is disposed on the die bonder (1) and is used to weld and fix the light-emitting wafer to the PET board. The conveying mechanism (3) includes a conveying component (31) and at least two sets of fixing components (32). The conveying component (31) includes a conveying seat (311), which is slidably fitted to the die bonder (1). Each of the fixing components (32) is disposed on the conveying seat (311). Each fixing component (32) includes a fixing screw (321) and at least two limiting blocks (323). The fixing screw (321) is rotatably disposed on the conveying seat (311). At least one of the limiting blocks (323) is slidably engaged with the conveying seat (311) and threadedly connected to the fixing screw (321). When the die bonding fixture is placed on the conveying seat (311), each of the limiting blocks (323) abuts against both sides of the die bonding fixture.

2. The crystal core bonding device according to claim 1, characterized in that: The fixing component (32) further includes at least two fixing blocks (324), each fixing block (324) slidingly engaging with each limiting block (323). When the die bonding fixture is placed on the conveying seat (311), each fixing block (324) is clamped and fixed with the die bonding fixture.

3. The crystal core bonding device according to claim 2, characterized in that: The fixing component (32) further includes at least two fixing cam rods (326), each fixing cam rod (326) being rotatably connected to each limiting block (323), and each fixing cam rod (326) abutting against each fixing block (324). When each fixing cam rod (326) rotates toward each fixing block (324), each fixing block (324) is clamped and fixed with the die bonding fixture.

4. The crystal core screen die bonding device according to claim 3, characterized in that: The fixing component (32) further includes at least two fixing springs (325), each fixing spring (325) being located between each fixing block (324) and each limiting block (323), with one end of each fixing spring (325) abutting against each fixing block (324) and the other end of each fixing spring (325) abutting against each limiting block (323).

5. The crystal core bonding device according to claim 2, characterized in that: Each of the limiting blocks (323) includes a sliding part (3231) and a limiting part (3232). Each of the limiting parts (3232) is rotatably connected to the sliding part (3231) and abuts against the die bonding fixture. Each of the fixing blocks (324) is slidably engaged with each of the limiting parts (3232).

6. The crystal chip bonding device according to claim 1, characterized in that: The conveying assembly (31) also includes a conveying screw (312), which is rotatably connected to the die holder (1) and threadedly connected to the conveying seat (311).

7. The crystal chip bonding device according to claim 6, characterized in that: The conveying assembly (31) also includes a conveying motor (313), a main conveying wheel (314), a secondary conveying wheel (315), and a conveyor belt (316). The conveying motor (313) is fixedly mounted on the die bonder (1). The main conveying wheel (314) is coaxially fixedly mounted on the conveying motor (313). The secondary conveying wheel (315) is coaxially fixedly mounted on the conveying screw (312). The conveyor belt (316) is wound around the main conveying wheel (314) and the secondary conveying wheel (315).

8. The crystal chip bonding device according to claim 1, characterized in that: The die bonding mechanism (2) includes a first linear module (21), a second linear module (22), and a die bonding module (23). The first linear module (21) is disposed on the die bonding seat (1), the second linear module (22) is disposed on the slider of the first linear module (21), and the die bonding module (23) is disposed on the slider of the second linear module (22). The first linear module (21) can drive the die bonding module (23) to move along the X-axis direction, and the second linear module (22) can drive the die bonding module (23) to move along the Y-axis direction. The die bonding module (23) is used to weld and fix the light-emitting wafer to the PET board.

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