A clamping ring, a lapping head and a lapping apparatus

Abstract

The utility model provides a kind of snap ring, grinding head and grinding equipment, snap ring has the first section and the second section of axial connection;Snap ring is equipped with the inner hole of the extension of the axial direction of its own through-penetration, the aperture of the part of inner hole on the first section is uniform, the aperture of the part of inner hole on the second section increases along the direction away from the first section.Snap ring is applied to grinding head, grinding head further includes base, and snap ring is connected on base, and the first section is located in the end of second section close to the base.When grinding head and grinding pad cooperate to grind target object, the end of second section away from the first section is contacted with grinding pad, so that the deformation of the part of grinding pad inside snap ring is smaller, which is conducive to improve the grinding effect of the edge area of wafer, and then improve the overall planarization effect of wafer.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a buckle, a grinding head, and a grinding device. Background Technology

[0002] The general steps for performing chemical mechanical polishing on a wafer are as follows: the wafer is attached to the polishing head, with the wafer positioned in the inner hole of the polishing head's retaining ring; the surface of the wafer to be polished is brought into contact with the polishing pad, and pressure is applied to the polishing pad by the polishing head; the polishing pad is rotated to polish the wafer.

[0003] When the grinding head applies pressure to the grinding pad, the area of ​​the grinding pad near the retaining ring deforms, which means that the grinding effect of the edge area of ​​the wafer cannot be guaranteed, affecting the overall planarization of the wafer. Utility Model Content

[0004] The purpose of this invention is to provide a buckle, a grinding head, and a grinding device to reduce the deformation of the grinding pad during grinding and improve the grinding effect.

[0005] To achieve the above objectives, the present invention provides a buckle having a first segment and a second segment connected axially; the buckle has an inner hole extending through it along its own axial direction; the portion of the inner hole on the first segment has a uniform diameter, and the portion of the inner hole on the second segment has a diameter that increases in the direction away from the first segment.

[0006] To achieve the above objectives, the present invention also provides a grinding head, including a base and a retaining ring as described above, the retaining ring being disposed on the base, and the first segment being located at the end of the second segment near the base.

[0007] To achieve the above objectives, this utility model also provides a grinding device, including a base, a grinding table, a robotic arm, and a grinding head as described above; the grinding table and the robotic arm are both disposed on the base; the grinding head is connected to the robotic arm, and the retaining ring is closer to the grinding table than the base; the grinding head can move under the drive of the robotic arm to move closer to or away from the grinding table.

[0008] Optionally, the grinding apparatus further includes a first detection element configured to detect the amount of wear on the bore wall of the portion of the inner bore on the second segment.

[0009] Optionally, the grinding table is rotatably mounted on the base, and the axis of rotation of the grinding table is parallel to the axis of the retaining ring;

[0010] The first detection element is an angle sensor, configured to detect the rotation angle of the grinding table to detect the amount of wear on the bore wall of the inner hole on the second segment; or,

[0011] The first detection element is a timer, which is used to detect the working time of the buckle in order to detect the amount of wear on the hole wall of the inner hole on the second segment.

[0012] Optionally, the grinding device further includes a second detection element disposed on the base and configured to measure the acute angle formed by the hole wall of the portion of the inner hole on the second segment and the axis of the retaining ring;

[0013] The robotic arm is configured to move the grinding head closer to or further away from the second detection element.

[0014] Optionally, the second detection element includes a laser transceiver capable of emitting and receiving two laser beams, the transmission directions of which are both perpendicular to the axis of the buckle, and the two laser beams are arranged along the extension direction of the axis of the buckle.

[0015] When measuring the acute angle formed by the wall of the inner hole in the second segment and the axis of the buckle, the laser transceiver is located within the portion of the inner hole in the second segment.

[0016] Optionally, the grinding equipment further includes a grinding device, which is disposed on the base and is used to grind the hole wall of the portion of the inner hole on the second segment;

[0017] The robotic arm is configured to move the grinding head closer to or away from the grinding device.

[0018] Optionally, the acute angle formed by the portion of the inner hole on the second segment and the axis of the buckle has a reference angle;

[0019] The grinding device has a grinding section that is inclined relative to the axis of the retaining ring, and the acute angle formed by the grinding section and the axis of the retaining ring is the reference angle.

[0020] Optionally, the grinding device is rotatably mounted on the base, and the axis of rotation of the grinding device is perpendicular to the axis of the retaining ring; and / or,

[0021] The grinding device is detachably mounted on the base; and / or,

[0022] The reference angle is greater than 0° and less than 90°.

[0023] Compared with the prior art, the buckle, grinding head and grinding equipment of this utility model have the following advantages:

[0024] The aforementioned retaining ring has a first segment and a second segment connected axially. The retaining ring has an inner hole extending through it along its own axial direction. The portion of the inner hole on the first segment has a uniform diameter, while the portion on the second segment has a diameter that increases in the direction away from the first segment. The retaining ring is applied to a grinding head, which also includes a base. The retaining ring is connected to the base, and the first segment is located at the end of the second segment near the base. When the grinding head is used in conjunction with a grinding pad to grind a target object, the end of the second segment away from the first segment contacts the grinding pad, resulting in less deformation of the portion of the grinding pad inside the retaining ring. This improves the grinding effect on the edge region of the wafer, thereby improving the overall planarization effect of the wafer. Attached Figure Description

[0025] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:

[0026] Figure 1 This is a schematic diagram of the structure of a grinding device provided according to an embodiment of the present invention;

[0027] Figure 2 This is a partial cross-sectional view of the grinding head of the grinding device provided by this utility model according to an embodiment;

[0028] Figure 3 This is a schematic diagram of the retaining ring of the grinding head of the grinding equipment provided according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the retaining ring of the grinding head of the grinding apparatus provided by the present invention according to an alternative embodiment;

[0030] Figure 5 This is a schematic diagram of the grinding equipment provided in one embodiment of the present invention performing chemical mechanical grinding on a target object;

[0031] Figure 6 This is a schematic diagram of the grinding equipment provided in the first comparative example performing chemical mechanical grinding on the target material;

[0032] Figure 7 This is a schematic diagram of the grinding equipment provided in the second comparative example performing chemical mechanical grinding on the target material;

[0033] Figure 8 As shown in a), Figure 5 The enlarged schematic diagram at point A in the diagram, shown in b) is as follows: Figure 6 The enlarged schematic diagram at point B in the diagram, shown in c), is as follows: Figure 7 Enlarged diagram of point C in the diagram;

[0034] Figure 9 This utility model presents schematic diagrams showing the variation curves of the amount of material removed from different parts of a target object when the grinding equipment provided in one embodiment, the grinding equipment provided in the first comparative example, and the grinding equipment provided in the second comparative example are used to grind the target object respectively.

[0035] Figure 10 yes Figure 9 Enlarged diagram of point D in the diagram;

[0036] Figure 11 This is a schematic diagram of the second detection element of the grinding equipment provided according to an embodiment of the present invention measuring the acute angle formed by the hole wall of the second hole section of the inner hole and the axis of the retaining ring.

[0037] Figure 12 This is a schematic diagram of the grinding device of the grinding equipment provided in one embodiment of the present invention grinding the hole wall of the festival hole segment.

[0038] [The following are explanations of the reference numerals in the attached drawings]: 10-base, 20-grinding table, 30-robotic arm, 40-grinding head, 50-second detection element, 60-grinding device, 61-grinding section, 100-ring, 101-first segment, 102-second segment, 110-inner hole, 111-first hole segment, 112-second hole segment, 200-base, 100'-first comparison ring, 100”-second comparison ring, 101”-third segment, 102”-fourth segment, 1-target object, 2-grinding pad. Detailed Implementation

[0039] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0040] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0041] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “link” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate relative importance or implicitly specify the number of indicated technical features. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] One objective of this invention is to provide a grinding apparatus capable of performing chemical mechanical grinding on a target object, thereby improving the grinding effect and increasing the overall planarization degree of the target object. The target object may be, for example, a wafer, sapphire, or other objects requiring grinding to achieve planarization.

[0043] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0044] Figure 1 The diagram illustrates the structure of a grinding apparatus provided in some embodiments of the present invention. For example... Figure 1As shown, the grinding equipment includes a base 10, a grinding table 20, a robotic arm 30, and a grinding head 40. Both the grinding table 20 and the robotic arm 30 are mounted on the base 10. The grinding head 40 is mounted on the robotic arm 30 and can move towards or away from the grinding table 20 under the influence of the robotic arm 30.

[0045] Please refer to Figure 2 The grinding head 40 includes a retaining ring 100 and a base 200. The base 200 is connected to the robotic arm 30. The retaining ring 100 is connected to the base 200. (Continue to refer to...) Figure 2 and combined Figure 3 and Figure 4 The retaining ring 100 includes a first segment 101 and a second segment 102 connected axially. The first segment 101 is closer to the base 200 than the second segment 102, and the second segment 102 is closer to the base 10 than the first segment 101. The retaining ring 100 has an inner hole 110 extending through it in its own axial direction. The portion of the inner hole 110 on the first segment 101 has a uniform diameter, and the portion of the inner hole 110 on the second segment 102 has a diameter that increases in the direction away from the first segment 101.

[0046] The grinding equipment is used to perform chemical mechanical grinding on the target object 1, and can effectively improve the grinding effect of the target object 1 and improve the overall flatness of the target object 1.

[0047] For ease of description, the portion of the inner hole 110 on the first segment 101 will be referred to as the first hole segment 111, and the portion of the inner hole 110 on the second segment 102 will be referred to as the second hole segment 112. Please refer to [reference needed]. Figure 2 and Figure 3 The wall of the second hole segment 112 can directly intersect with the outer surface of the buckle 100, or, as... Figure 4 As shown, the hole wall of the second hole segment 112 intersects with the end face of the second segment 102 away from the first segment 101.

[0048] Furthermore, those skilled in the art will understand that the grinding table 20 is configured to rotate relative to the base 10, and during the grinding process, the axis of rotation of the grinding table 20 is parallel to the axis of the retaining ring 100. Generally, the axis of the retaining ring 100 extends in the vertical direction.

[0049] The operation process of performing chemical mechanical grinding on the target object 1 using the grinding equipment is roughly as follows, including:

[0050] The target object 1 is placed on the grinding head 40, and the target object 1 is positioned within the first hole section 111, with the surface of the target object 1 to be ground facing the base 10. A grinding pad 2 (such as...) is placed on the grinding table 20. Figure 5 (As shown).

[0051] The robotic arm 30 moves the grinding head 40 and the target object 1 on it to the grinding table 20, causing the end of the second segment 102 away from the first segment 101 to press against the grinding pad 2 (e.g., ...). Figure 5 (As shown).

[0052] Abrasive fluid is supplied to the abrasive pad 2, and the abrasive table 20 is controlled to rotate.

[0053] The advantages of the grinding equipment provided in the embodiments of this utility model will be further explained below with reference to two comparative examples. The two comparative examples are the first comparative example and the second comparative example.

[0054] A first comparative example also provides a grinding apparatus, referred to as a first comparative grinding apparatus. The difference between the first comparative grinding apparatus and the grinding apparatus provided in this embodiment lies in the construction of the retaining ring used. For example... Figure 6 As shown, the retaining ring in the first grinding device is referred to as the first comparison retaining ring 100'. The first comparison retaining ring 100' has a uniform inner diameter and a uniform outer diameter. The first comparison retaining ring 100' is a type of retaining ring in the prior art.

[0055] A second comparative example also provides a grinding apparatus, referred to as the second comparative grinding apparatus. The difference between the second comparative grinding apparatus and the grinding apparatus provided in this embodiment lies in the construction of the retaining ring used. For example... Figure 7 As shown, the retaining ring in the second comparative grinding device is referred to as the "second comparative retaining ring 100". The second comparative retaining ring 100" includes a third segment 101" and a fourth segment 102" connected axially. The outer diameter of the third segment 101" is uniform, and the outer diameter of the fourth segment 102" decreases in the direction away from the third segment 101". The inner diameter of the second comparative retaining ring 100" is uniform. During the grinding operation, the end of the fourth segment 102" away from the third segment 101" is pressed against the grinding pad 2.

[0056] like Figure 8As shown in a), in the grinding apparatus provided by this embodiment of the present invention, the contact portion between the grinding pad 2 and the second segment 102, as well as the portion of the grinding pad 2 adjacent to the retaining ring 100, are deformed, and the amount of deformation decreases along the direction away from the retaining ring 100. Specifically, the deformation of the portion of the grinding pad 2 located inside the retaining ring 100 (e.g., Figure 8 The red line in a) indicates that the grinding effect on the target object 1 is affected.

[0057] like Figure 8 As shown in (b), in the first comparative grinding apparatus, the contact portion of the grinding pad 2 with the first comparative retaining ring 100' and the portion of the grinding pad 2 adjacent to the first comparative retaining ring 100' undergo deformation, and the deformation decreases in the direction away from the first comparative retaining ring 100'. Specifically, the deformation of the portion of the grinding pad 2 located inside the first comparative retaining ring 100' (e.g., ...) Figure 8 (b) As shown by the red line, it affects the grinding effect of the target object 1.

[0058] like Figure 8 As shown in (c), in the second comparative grinding apparatus, the contact portion of the grinding pad 2 with the second comparative retaining ring 100” and the portion of the grinding pad 2 adjacent to the second comparative retaining ring 100” undergo deformation, and the deformation decreases in the direction away from the second comparative retaining ring 100”. Specifically, the deformation of the portion of the grinding pad 2 located inside the second comparative retaining ring 100” (e.g., Figure 8 (c) As shown by the red line, it affects the grinding effect of the target object 1.

[0059] When the outer diameters of the retaining ring 100, the first comparing retaining ring 100', and the second comparing retaining ring 100" are equal, and the pressure applied by the grinding head to the grinding pad 2 is equal, such as Figure 8 As shown, the inner side of the polishing pad 2 deforms less due to pressure, while the portion of the polishing pad 2 located inside the first comparison buckle 100' deforms more due to pressure, and the portion of the polishing pad 2 located inside the second comparison buckle 100" also deforms more due to pressure. Moreover, the deformation of the portion of the polishing pad 2 located inside the first comparison buckle 100' caused by pressure is similar to the deformation of the portion of the polishing pad 2 located inside the second comparison buckle 100" caused by pressure.

[0060] Those skilled in the art will know that the greater the deformation caused by the pressure on the part of the grinding pad 2 located inside the buckle (including the buckle 100, the first comparison buckle 100' and the second comparison buckle 100"), the more unstable the grinding effect of the grinding equipment (including the grinding equipment provided in this utility model embodiment, the first comparison grinding equipment and the second comparison grinding equipment) on the edge of the target object 1 near the buckle. Figure 9 This diagram illustrates the variation curves of the amount of material removed from various parts of the target object 1 from its center to its edge when the target object 1 is subjected to chemical mechanical polishing using the polishing equipment, the first comparative polishing equipment, and the second comparative polishing equipment provided in this embodiment of the invention. The horizontal axis represents the position of each point along a diameter of the target object 1, with the point having an horizontal axis of 0 being the center point of the target object 1. A larger horizontal axis value indicates a greater distance from the center point of the target object 1. The vertical axis represents the amount of material removed. Figure 10 yes Figure 9 A magnified diagram of point D in the image. Figure 9 and Figure 10 As can be seen, the grinding equipment, the first comparative grinding equipment, and the second comparative grinding equipment provided in this embodiment of the present invention have comparable amounts of abrasion removed from the central region of the target object 1. The abrasion removed from the edge region of the target object 1 by the first and second comparative grinding equipment drops sharply to a much smaller amount than that removed from the central region. While the abrasion removed from the edge region of the target object 1 by the grinding equipment provided in this embodiment of the present invention fluctuates, the fluctuation range is small. Therefore, it can be determined that the grinding equipment provided in this embodiment of the present invention has a better grinding effect on the target object 1 than the first and second comparative grinding equipment.

[0061] Those skilled in the art will know that the wall of the second hole segment 112 gradually wears down during operation, causing the acute angle α formed between the wall of the second hole segment 112 and the axis of the retaining ring 100 (e.g., ...) to... Figure 11 and Figure 12 (The angle change is indicated by the annotation).

[0062] That is, the acute angle α formed by the wall of the second hole segment 112 and the axis of the buckle 100 has a reference angle. It is easily understood that the reference angle is greater than 0° and less than 90°, and more preferably greater than 45° and less than 90°. For a brand new, unused buckle 100, the angle α of the acute angle formed by the wall of the second hole segment 112 and the axis of the buckle 100 is the reference angle. When the buckle 100 is used and the wall of the second hole segment 112 is worn, the angle α of the acute angle formed by the wall of the second hole segment 112 and the axis of the buckle 100 deviates from the reference angle.

[0063] Define a preset wear amount. When the wear amount of the hole wall of the second hole segment 112 is less than the preset wear amount, the angle of the acute angle α formed between the hole wall of the second hole segment 112 and the axis of the buckle 100 deviates slightly from the reference angle, and its impact on the grinding effect of the target object 1 is negligible. In this case, the buckle 100 can still be used. When the wear amount of the hole wall of the second hole segment 112 reaches the preset wear amount, the angle of the acute angle α formed between the hole wall of the second hole segment 112 and the axis of the buckle 100 deviates significantly from the reference angle, and its impact on the grinding effect of the target object 1 is not negligible. In this case, the buckle 100 cannot be used. Therefore, the buckle 100 needs to be replaced, or the hole wall of the second hole segment 112 needs to be ground so that the angle of the acute angle α formed between the hole wall of the second hole segment 112 and the axis of the buckle 100 returns to the reference angle.

[0064] The preset wear amount is determined according to actual needs. For ease of description, the state of the buckle 100 when the acute angle α formed by the hole wall of the second hole section 112 and the axis of the buckle 100 is the reference angle is referred to as the reference state.

[0065] Therefore, it is necessary to detect the wear amount of the hole wall of the second hole segment 112. Thus, the grinding device of this embodiment further includes a first detection element, configured to detect whether the wear amount of the hole wall of the second hole segment 112 reaches the preset wear amount, thereby determining whether the retaining ring 100 can continue to be used.

[0066] With the grinding parameters unchanged, the wear amount of the hole wall of the second hole segment 112 is related to the operating time of the retaining ring 100. Therefore, the wear amount of the hole wall of the second hole segment 112 can be detected by detecting the operating time of the retaining ring 100. In other words, the first detection element may include a timer configured to detect the operating time of the retaining ring 100.

[0067] In this embodiment, given the retaining ring 100 and given grinding parameters, the operator performs a wear test in advance to determine the target working time when the retaining ring 100 reaches the preset wear amount when the wear amount on the hole wall of the second hole segment 112 reaches the preset wear amount from the reference state. Therefore, by judging whether the working time of the retaining ring 100 detected by the timer has reached the preset working time, it is determined whether the wear amount on the hole wall of the second hole segment 112 has reached the preset wear amount.

[0068] In this document, the timer can be set in any suitable way, as long as it can detect the working time of the buckle 100. The setting method of the timer is known to those skilled in the art and will not be described in detail here.

[0069] It should be noted that the buckle 100 is operational when it presses against the polishing pad 2 and the polishing table 20 rotates. That is, the working time of the buckle 100 refers to the duration during which the buckle 100 is pressed against the polishing pad 2 and the polishing table 20 rotates.

[0070] In addition, the grinding parameters include the type of the grinding pad 2, the rotation speed of the grinding table 20, the pressure applied to the grinding pad 2 by the grinding head 40, and the type of the grinding fluid.

[0071] With the grinding parameters remaining constant, the working time of the retaining ring 100 determines the rotation angle of the grinding table 20. Therefore, in an alternative embodiment, the first detection element includes an angle sensor configured to detect the rotation angle of the grinding table 20 to indirectly detect the amount of wear on the hole wall of the second hole segment 112.

[0072] It is understood that, when the first detection element includes the angle sensor, the operator pre-determines the relationship between the rotation angle of the grinding table 20 and the wear amount of the hole wall of the second hole segment 112, so as to determine the target rotation angle of the grinding table 20 when the wear amount of the hole wall of the second hole segment 112 reaches the preset wear amount. Therefore, whether the wear amount of the hole wall of the second hole segment 112 reaches the preset wear amount can be detected by detecting whether the rotation angle of the grinding table reaches the target rotation angle.

[0073] When the wear of the hole wall of the second hole segment 112 reaches the preset wear amount, the acute angle α formed by the hole wall of the second hole segment 112 and the axis of the buckle 100 reaches an angle threshold. Preferably, as follows... Figure 11As shown, the grinding equipment further includes a second detection element 50, which is disposed on the base 10 and configured to measure the acute angle α formed by the wall of the second hole segment 112 and the axis of the retaining ring 100. The robotic arm 30 is also configured to move the grinding head 40 closer to or further away from the second detection element 50. After the first detection element detects that the wear of the wall of the second hole segment 112 has reached the preset wear amount, the robotic arm 30 can move the grinding head 40 to the second detection element 50 to measure whether the acute angle α formed by the wall of the second hole segment 112 and the axis of the retaining ring 100 has reached the angle threshold, thereby further determining whether the wear of the wall of the second hole segment 112 has reached the preset wear amount. That is, the second detection element 50 and the first detection element provide redundant detection.

[0074] In an optional embodiment, the second detection element 50 includes a laser transceiver comprising an integrated laser emitting module and a laser receiving module. The laser emitting module emits laser beams S1 and S2, and the laser receiving module receives reflected laser beams S1 and S2. Laser beams S1 and S2 are spaced apart along the extension direction of the axis of the retaining ring 100, and are also perpendicular to the axis of the retaining ring 100. When the second detection element 50 measures the acute angle α formed by the wall of the second aperture segment 112 and the axis of the retaining ring 100, the laser transceiver is located within the second aperture segment 112.

[0075] The principle of the second detection element measuring the acute angle α between the second hole segment 112 and the axis of the buckle 100 is as follows: the laser transceiver simultaneously emits the laser beam S1 and the laser beam S2 towards the hole wall of the second hole segment 112. The laser beam S1 is incident on point M on the hole wall of the second hole segment 112 and is reflected back to the laser transceiver by the hole wall of the second hole segment 112. The laser beam S2 is incident on point N on the hole wall of the second hole segment 112 and is reflected back to the laser transceiver by the hole wall of the second hole segment 112. The acute angle formed by the line connecting points M and N and the axis of the buckle 100 is the acute angle α formed by the hole wall of the second hole segment 112 and the axis of the buckle 100. The transmission times of laser beams S1 and S2 are different. Based on the time difference between laser beams S1 and S2, the transmission speed of laser beam S1, and the distance between laser beams S1 and S2, the acute angle between the second hole segment 112 and the axis of the buckle 100 can be calculated. The specific calculation process is well known in the art and will not be elaborated here. Furthermore, in this embodiment of the invention, a phase method is preferably used to obtain the time difference between laser beams S1 and S2 to improve measurement accuracy.

[0076] Furthermore, such as Figure 12 As shown, the grinding equipment also includes a grinding device 60, which is disposed on the base 10 and used to grind the hole wall of the second hole segment 112 so that the retaining ring 100 returns to the reference state. The robotic arm 30 is also configured to move the grinding head 40 to approach or move away from the die grinding device.

[0077] The grinding device 60 includes a grinding section 61. Preferably, the grinding section 61 is inclined relative to the axis of the retaining ring 100, and the acute angle β formed by the grinding section and the axis of the retaining ring 100 is (e.g., ...). Figure 12 The angle (as indicated) is equal to the reference angle.

[0078] When grinding the hole wall of the second hole section 112 using the grinding device 60, the grinding head 40 is first moved until the grinding device 60 is located in the inner hole, and the hole wall of the second hole section 112 is brought into contact with the grinding part 61. Then, the grinding head 60 is controlled to rotate around the axis of the retaining ring 100.

[0079] During the grinding process of the grinding device 60 on the wall of the second hole segment 112, grinding should be paused at regular intervals, and the grinding head 40 should be moved to the second detection element 50 to detect whether the acute angle α formed by the wall of the second hole segment 112 and the axis of the retaining ring 100 has recovered to the reference angle. It can be understood that when the acute angle α formed by the wall of the second hole segment 112 and the axis of the retaining ring 100 recovers to the reference angle, grinding of the wall of the second hole segment 112 is stopped; when the acute angle α formed by the wall of the second hole segment 112 and the axis of the retaining ring 100 has not recovered to the reference angle, the grinding head 40 is moved back to the grinding device 60, and grinding of the wall of the second hole segment 112 continues.

[0080] The reference angle may differ depending on the grinding parameters. Therefore, it is preferable that the grinding device 60 is rotatably mounted on the base 10, and that the axis of rotation of the grinding device 60 is perpendicular to the axis of the retaining ring 100. This allows the orientation of the grinding device 60 to be adjusted for different reference angles.

[0081] In addition, the grinding device 60 is a consumable and needs to be replaced periodically. Therefore, the grinding device 60 is detachably mounted on the base 10.

[0082] The second objective of this utility model is to provide a buckle, wherein the buckle is the aforementioned buckle 100.

[0083] The third objective of this utility model is to provide a grinding head, wherein the grinding head is the aforementioned grinding head 40.

[0084] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A buckle, characterized in that, The buckle has a first segment and a second segment connected axially; the buckle has an inner hole extending through it along its own axial direction; the portion of the inner hole on the first segment has a uniform diameter, and the portion of the inner hole on the second segment has a diameter that increases in the direction away from the first segment.

2. A grinding head, characterized in that, It includes a base and a buckle as described in claim 1, the buckle being disposed on the base, and the first segment being located at the end of the second segment near the base.

3. A grinding apparatus, characterized in that, The device includes a base, a grinding table, a robotic arm, and a grinding head as described in claim 2; both the grinding table and the robotic arm are mounted on the base; the grinding head is connected to the robotic arm, and the retaining ring is closer to the grinding table than the base; the grinding head can move towards or away from the grinding table under the drive of the robotic arm.

4. The grinding equipment according to claim 3, characterized in that, The grinding apparatus further includes a first detection element configured to detect the amount of wear on the bore wall of the portion of the inner bore on the second segment.

5. The grinding equipment according to claim 4, characterized in that, The grinding table is rotatably mounted on the base, and the axis of rotation of the grinding table is parallel to the axis of the buckle. The first detection element is an angle sensor, configured to detect the rotation angle of the grinding table to detect the amount of wear on the bore wall of the inner hole on the second segment; or, The first detection element is a timer, which is used to detect the working time of the buckle in order to detect the amount of wear on the hole wall of the inner hole on the second segment.

6. The grinding equipment according to claim 3, characterized in that, The grinding equipment further includes a second detection element disposed on the base and configured to measure the acute angle formed by the hole wall of the portion of the inner hole on the second segment and the axis of the retaining ring; The robotic arm is configured to move the grinding head closer to or further away from the second detection element.

7. The grinding equipment according to claim 6, characterized in that, The second detection element includes a laser transceiver, which is capable of emitting and receiving two laser beams. The transmission directions of the two laser beams are both perpendicular to the axis of the buckle, and the two laser beams are arranged along the extension direction of the axis of the buckle. When measuring the acute angle formed by the wall of the inner hole in the second segment and the axis of the buckle, the laser transceiver is located within the portion of the inner hole in the second segment.

8. The grinding equipment according to claim 3, characterized in that, The grinding equipment also includes a grinding device, which is disposed on the base and is used to grind the hole wall of the portion of the inner hole on the second segment; The robotic arm is configured to move the grinding head closer to or away from the grinding device.

9. The grinding equipment according to claim 8, characterized in that, The acute angle formed by the portion of the inner hole on the second segment and the axis of the buckle has a reference angle; The grinding device has a grinding section that is inclined relative to the axis of the retaining ring, and the acute angle formed by the grinding section and the axis of the retaining ring is the reference angle.

10. The grinding equipment according to claim 9, characterized in that, The grinding device is rotatably mounted on the base, and the axis of rotation of the grinding device is perpendicular to the axis of the retaining ring; and / or, The grinding device is detachably mounted on the base; and / or, The reference angle is greater than 0° and less than 90°.

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