Support and three-dimensional x-ray system

Abstract

The utility model provides a kind of support, for supporting panel level wafer to be used for three-dimensional X-ray detection, comprising: clamping part, for clamping the panel level wafer;Fixed part, bearing the clamping part;Slide rail part, connecting the clamping part and the fixed part, the clamping part moves in horizontal direction by the slide rail part, to change the detection position of the panel level wafer.The utility model aims at providing a kind of support and three-dimensional X-ray system, to at least realize to panel level wafer support and detection.

Description

Technical Field

[0001] This utility model relates to a support component and a three-dimensional X-ray system. Background Technology

[0002] Figure 1 The diagram illustrates a prior art carrier 1 and a panel 2 on the carrier 1. The carrier 1 clamps the panel 2 at the center of its bottom edge. The width of the portion of the carrier 1 used to clamp the panel 2 is, for example, 20 mm. Currently, the carrier 1 can only support panels 2 with dimensions of 100*100 mm or less. If an electrical failure is detected in the panel, non-destructive analysis using 3D X-rays will be performed. If the panel size is 300*300 mm, it must first be cut to a size of 100*100 mm or less before it can be fixed and supported by the carrier 1 for non-destructive analysis. However, this approach results in the cut sample being unusable for subsequent processes, thus rendering the entire panel unusable.

[0003] Therefore, 3D X-rays cannot currently analyze a complete 300*300mm panel, mainly because there is no suitable carrier. Utility Model Content

[0004] In view of the problems existing in the related technologies, the purpose of this utility model is to provide a support component and a three-dimensional X-ray system to at least achieve support and inspection of panel-level wafers.

[0005] To achieve the above objectives, this utility model provides a support member for supporting panel-level wafers for three-dimensional X-ray inspection, comprising: a clamping part for clamping the panel-level wafer; a fixing part for supporting the clamping part; and a slide rail part for connecting the clamping part and the fixing part. The clamping part moves horizontally via the slide rail part to change the inspection position of the panel-level wafer.

[0006] In some embodiments, the fixing part is disposed on the platform, and the slide rail part is disposed on the fixing part.

[0007] In some embodiments, the clamping portion is disposed on the slide rail portion and contacts the panel-level wafer.

[0008] In some embodiments, the slide rail includes: a first slide rail fixedly connected to the fixing part; and a second slide rail fixedly connected to the clamping part, wherein the second slide rail moves relative to the first slide rail to cause the clamping part to move in the horizontal direction.

[0009] In some embodiments, the clamping portion includes: a first clamping plate and a second clamping plate disposed opposite to each other and extending longitudinally, respectively used to clamp opposite first and second sides of the panel-level wafer; and a support plate, wherein the first clamping plate and the second clamping plate are fixed to the support plate, and the support plate is used to support a third side of the panel-level wafer.

[0010] In some embodiments, the first slide rail has a groove, and the second slide rail has a protrusion that is received within the groove.

[0011] In some embodiments, the second slide rail further includes a knob for limiting the movement of the protrusion.

[0012] In some embodiments, both the first clamping plate and the second clamping plate have oppositely disposed receiving grooves to accommodate the first side and the second side.

[0013] In some embodiments, both the first clamping plate and the second clamping plate are provided with limiting members that abut against the first side and the second side, respectively.

[0014] In some embodiments, the panel-level wafer has a dimension of 260 mm to 300 mm in the horizontal direction.

[0015] In some embodiments, the maximum moving distance of the clamping portion in the horizontal direction is greater than or equal to 1 / 2 of the dimension of the panel-level wafer in the horizontal direction.

[0016] In some embodiments, the lengths of the first clamp and the second clamp are less than the lengths of the first side and the second side.

[0017] In some embodiments, the fixing part is fastened to the platform by screws.

[0018] In some embodiments, the fixing part is secured to the platform by three screws.

[0019] In some embodiments, the fixing portion includes a first portion disposed directly below the slide rail portion and a second portion extending in a direction perpendicular to the first portion.

[0020] In some embodiments, the screw secures the second portion to the platform.

[0021] Embodiments of this application also provide a three-dimensional X-ray system for inspecting panel-level wafers, comprising: a light source for emitting X-rays; a detector for receiving the X-rays; a stage; and the aforementioned support member disposed on the stage, the support member being used to position the panel-level wafer in an upright position for inspection, the support member being disposed between the light source and the detector.

[0022] In some embodiments, the X-rays emitted by the light source pass through the panel-level wafer and are received by the detector.

[0023] In some embodiments, the three-dimensional X-ray system further includes a rotary stage disposed below the stage, for driving the stage, the support member, and the panel-level wafer to rotate.

[0024] In some embodiments, the rotation angle is 360°.

[0025] The beneficial technical effects of this utility model are as follows:

[0026] The embodiments of this application provide a support member that can support panel-level wafers. The support member can move the panel-level wafers horizontally via a slide rail to adjust the detection position of the panel-level wafers, which is convenient for three-dimensional X-ray machines to perform detection. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It is worth noting that, according to industry standard practice, the various components are not drawn to scale and are only used for illustrative purposes. In fact, for the sake of clarity of discussion, the dimensions of the various components can be arbitrarily increased or decreased.

[0028] Figure 1 The image shows a vehicle and a panel on the vehicle, both based on existing technology.

[0029] Figure 2 A front view of a support member and the panel-level wafer supported thereon, according to an embodiment of this application, is shown.

[0030] Figure 3 A side view of a support member and the panel-level wafer supported thereon, according to an embodiment of this application, is shown.

[0031] Figure 4 A top view of the fixing part according to an embodiment of this application is shown.

[0032] Figure 5 A three-dimensional X-ray system provided by an embodiment of this application is shown.

[0033] Figure 6 The image shown is a 4x magnified image obtained by scanning a redistribution layer in a chip on a fan-out substrate using a 3D X-ray system according to an embodiment of this application.

[0034] Figure 7The image shown is magnified 10 times by scanning a redistribution layer in a chip on a fan-out substrate using a three-dimensional X-ray system according to an embodiment of this application. Detailed Implementation

[0035] To better understand the spirit of the embodiments of this application, the following description is based on some preferred embodiments of this application.

[0036] Embodiments of this application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are indicated by similar reference numerals. The embodiments described herein with reference to the accompanying drawings are illustrative and diagrammatic in nature and are intended to provide a basic understanding of this application. The embodiments of this application should not be construed as limiting this application.

[0037] As used herein, the terms “approximately,” “generally,” “substantially,” and “about” are used to describe and indicate minor variations. When used in conjunction with an event or situation, these terms may refer to examples in which the event or situation occurred precisely or in examples in which the event or situation occurred very approximately.

[0038] In this specification, unless otherwise specified or limited, relative terms such as “central,” “longitudinal,” “lateral,” “front,” “rear,” “right,” “left,” “inner,” “outer,” “lower,” “higher,” “horizontal,” “vertical,” “above,” “below,” “above,” “below,” “top,” “bottom,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the directions described in the discussion or depicted in the accompanying drawings. These relative terms are used for descriptive convenience only and do not require that this application be constructed or operated in a particular orientation.

[0039] For ease of description, "first," "second," "third," etc., can be used in this article to distinguish different components of a figure or a series of figures. "First," "second," "third," etc., are not intended to describe the corresponding components.

[0040] Currently, the sample carrier 1 for 3D X-rays is only suitable for samples smaller than 100*100mm. The area of ​​the carrier 1 used to fix the panel 2 is too small. If the sample size is larger than 100*100mm, the sample is prone to slipping and tipping over.

[0041] Therefore, the existing technology has the following problems: poor yield improvement efficiency. Panels are the current main product. If final analysis (FA) cannot be performed, the process improvement progress will be delayed. Low resource utilization. If samples are cut for final analysis, the cut samples cannot be recycled for subsequent processes, resulting in panel scrap.

[0042] Figure 2 A front view of a support member 100 and the panel-level wafer 200 supported thereon, according to an embodiment of this application, is shown. Figure 3 A side view of a support member 100 and the panel-level wafer 200 supported thereon, according to an embodiment of this application, is shown.

[0043] This application provides a support member 100 for supporting a panel-level wafer 200 for three-dimensional X-ray inspection. The support member includes: a clamping part 10 for clamping the panel-level wafer 200; a fixing part 20 for supporting the clamping part 10; and a slide rail part 30 connecting the clamping part 10 and the fixing part 20. The clamping part 10 moves horizontally via the slide rail part 30 to change the inspection position of the panel-level wafer 200. This application provides a support member 100 capable of supporting a panel-level wafer 200. The support member 100 allows the panel-level wafer 200 to move horizontally via the slide rail part 30, thereby adjusting the inspection position of the panel-level wafer 200 and facilitating inspection by a three-dimensional X-ray machine.

[0044] Figure 4 A top view of the fixing part 20 according to an embodiment of this application is shown. Figure 2 and Figure 3 In the illustrated embodiment, the fixing part 20 is a cuboid. Figure 4 In the embodiment shown, the fixing part 20 has a cross shape and includes a first part 21 disposed directly below the slide rail part 30 and a second part 22 extending in a direction perpendicular to the first part 21.

[0045] Figure 5 The embodiment of this application shows a three-dimensional X-ray system 1000 for the inspection of a panel-level wafer 200. The three-dimensional X-ray system 1000 includes: a light source 400 for emitting X-rays 402; a detector 500 for receiving X-rays 402; and a stage 300. Figure 2 and Figure 3 The support member 100 shown Figure 5 (Not shown) is placed on the stage 300. The support 100 is used to make the panel-level wafer 200 stand upright for detection. The support 100 is disposed between the light source 400 and the detector 500.

[0046] In some embodiments, X-ray 402 is emitted by light source 400, passes through panel-level wafer 200, and is received by detector 500.

[0047] Reference Figures 2 to 4 In some embodiments, the support member 100 is mounted on the platform 300 via the fixing part 20, and the slide rail part 30 is mounted on the fixing part 20.

[0048] In some embodiments, the fixing part 20 is attached to the platform 300 by screws.

[0049] In some embodiments, the fixing part 20 has three screw holes 24 and is secured to the platform 300 by three screws. The three screw holes 24 are located at the three vertices of a triangle to make the locking between the fixing part 20 and the platform 300 more secure.

[0050] In some embodiments, screws secure the second portion 22 to the stage 300.

[0051] In some embodiments, the clamping part 10 is disposed on the slide rail part 30 and contacts the panel-level wafer 200.

[0052] In some embodiments, the slide rail 30 includes: a first slide rail 31, which is fixedly connected to the fixing part 20; and a second slide rail 32, which is fixedly connected to the clamping part 10. The second slide rail 32 moves relative to the first slide rail 31 to allow the clamping part 10 to move horizontally.

[0053] In some embodiments, the first slide rail 31 has a groove 34, and the second slide rail 32 has a protrusion 36 that is accommodated in the groove 34.

[0054] In some embodiments, the second slide rail 32 further includes a knob 38 for limiting the movement of the protrusion 36.

[0055] In some embodiments, the clamping portion 10 includes: a first clamping plate 11 and a second clamping plate 12 disposed opposite to each other, extending longitudinally, for clamping opposite first sides 201 and second sides 202 of the panel-level wafer 200, respectively; and a support plate 13, to which the first clamping plate 11 and the second clamping plate 12 are fixed, the support plate 13 for supporting a third side 203 of the panel-level wafer 200. The first clamping plate 11 and the second clamping plate 12 are fixed to the support plate 13 by screws 16, and the relative positions of the first clamping plate 11 and the second clamping plate 12 with respect to the support plate 13 are adjustable.

[0056] In some embodiments, the first clamping plate 11 and the second clamping plate 12 each have oppositely disposed receiving grooves to receive the first side 201 and the second side 202. The horizontal dimension of the portion of the panel-level wafer 200 received by the first clamping plate 11 and the second clamping plate 12 is, for example, 1 mm.

[0057] In some embodiments, the lengths of the first clamping plate 11 and the second clamping plate 12 are less than the lengths of the first side 201 and the second side 202.

[0058] In some embodiments, both the first clamping plate 11 and the second clamping plate 12 are provided with limiting members 14 that abut against the first side 201 and the second side 202, respectively. The limiting members 14 are, for example, rubber plugs, to prevent damage to the panel-level wafer 200.

[0059] In some embodiments, the panel-level wafer 200 has a horizontal dimension of 260 mm to 300 mm.

[0060] In some embodiments, the three-dimensional X-ray system 1000 further includes a rotary stage 600 disposed below the stage 300 for driving the stage 300, the support member 100, and the panel-level wafer 200 to rotate.

[0061] In some embodiments, the rotation angle is 360°.

[0062] In some embodiments, the maximum horizontal movement distance of the clamping part 10 is greater than or equal to half the horizontal dimension of the panel-level wafer 200. For example, the panel-level wafer 200 has a dimension of 300*300mm, and the maximum horizontal movement distance of the clamping part 10 is 150mm, meaning the second slide rail 32 can slide 150mm on the first slide rail 31. This allows the three-dimensional X-ray system 1000 to detect at least half of the panel-level wafer 200. Then, after the rotary table 600 rotates the stage 300, support member 100, and panel-level wafer 200 by 180°, the three-dimensional X-ray system 1000 can detect the other half of the panel-level wafer 200.

[0063] In some embodiments, the three-dimensional X-ray system 1000 can also be used in conjunction with a vacuum system, and additional rotating parts can be designed so that the panel-level wafer 200 can also rotate about its lateral central axis (perpendicular to the rotation axis 602 of the rotary table 600) to achieve more detection angles.

[0064] This application provides a novel three-dimensional X-ray carrier for the inspection of square panel-level packaging, which can fix the panel-level wafer 200 to the support member 100 and keep it stable without shaking. The support member 100 is installed inside the three-dimensional X-ray machine.

[0065] Figure 6 The image shown is a 4x magnified image obtained by scanning a redistribution layer in a FanOut Chip on Substrate (FOCoS) 2000 using a 3D X-ray system 1000 according to an embodiment of this application. Figure 7The image shown is a 10x magnified image obtained by scanning a redistribution layer of a chip 2000 on a fan-out substrate using the 3D X-ray system 1000 of this application embodiment. The 3D image of the chip 2000 on the fan-out substrate is clearly constructed. The 3D X-ray system 1000 of this application embodiment is also applicable to packages such as System-in-a-Package (SIP).

[0066] The support member 100 and the three-dimensional X-ray system 1000 of this application embodiment can stably support the large-size panel-level wafer 200 for three-dimensional X-ray inspection, assist in improving the yield of the process, and avoid the loss of panel resources (approximately 200,000 NTD per wafer).

[0067] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A support member for supporting a panel-level wafer for three-dimensional X-ray inspection, characterized in that, include: Clamping part, used to clamp the panel-level wafer; The fixing part supports the clamping part; The slide rail connects the clamping part and the fixing part. The clamping part moves horizontally via the slide rail to change the detection position of the panel-level wafer.

2. The support member according to claim 1, characterized in that, The slide rail includes: The first slide rail is fixedly connected to the fixing part; The second slide rail is fixedly connected to the clamping part, and the second slide rail moves relative to the first slide rail to allow the clamping part to move in the horizontal direction.

3. The support member according to claim 1, characterized in that, The clamping part includes: The first and second clamping plates, which are arranged opposite to each other, extend longitudinally and are used to clamp the opposite first and second sides of the panel-level wafer, respectively. A support plate, wherein the first clamping plate and the second clamping plate are fixed to the support plate, the support plate being used to support the third side of the panel-level wafer.

4. The support member according to claim 2, characterized in that, The first slide rail has a groove, and the second slide rail has a protrusion that is accommodated within the groove.

5. The support member according to claim 4, characterized in that, The second slide rail also includes a knob that restricts the movement of the protrusion.

6. The support member according to claim 3, characterized in that, Both the first clamping plate and the second clamping plate have oppositely arranged receiving grooves to accommodate the first side and the second side.

7. The support member according to claim 1, characterized in that, The panel-grade wafer has a dimension of 260 mm to 300 mm in the horizontal direction.

8. The support member according to claim 1 or 7, characterized in that, The maximum moving distance of the clamping part in the horizontal direction is greater than or equal to 1 / 2 of the dimension of the panel-level wafer in the horizontal direction.

9. A three-dimensional X-ray system for inspecting panel-level wafers, characterized in that, include: Light source, used to emit X-rays; Detector for receiving the X-rays; Platform; The support member as described in any one of claims 1-8 is disposed on the stage, the support member being used to make the panel-level wafer stand upright for detection, the support member being disposed between the light source and the detector.

10. The three-dimensional X-ray system according to claim 9, characterized in that, Also includes: A rotary table is disposed below the stage and is used to drive the stage, the support member, and the panel-level wafer to rotate.

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