Transparent display module and transparent LED display screen

Abstract

To solve the problems in the prior art, the application provides a transparent display module and a transparent LED display screen. The application discloses a transparent display module, which comprises a light-transmitting substrate with a light-transmitting hole and light-emitting units arranged in an array on the light-transmitting substrate; wherein the light-transmitting substrate is provided with a driving circuit, the driving circuit comprises light-emitting pads arranged in an array, and each light-emitting pad is provided with one light-emitting unit; the light-emitting pad comprises a signal pad, a power pad and a burning pad; the burning pad is used for being connected with an external burning device, is used for burning the address code of each light-emitting pad, and stores the address information of the corresponding light-emitting unit in the driving chip. The transparent display module provided by the application is subjected to batch address burning through a special burning tool, and operation and material management are easier, thereby bringing great convenience to production, installation and after-sales management.

Description

Technical Field

[0001] This utility model relates to the field of LED displays, and more particularly to the field of transparent displays with light-transmitting holes. Background Technology

[0002] In the field of transparent LED displays, such as Figure 1 As shown, a transparent LED display screen 1000' is constructed by arraying LED beads 12' on a carrier board 1' with light-transmitting holes 11' arranged in an array to achieve a transparent display effect. Each LED bead 12' contains a light-emitting chip and a built-in driver chip; this method allows for the fabrication of large transparent LED displays. A driver circuit (not shown) is arranged on the carrier board 1'. The driver circuit includes an array of LED bead soldering areas, on which the LED beads are soldered. Power and signals are provided by the LED bead soldering areas. Specifically, the LED bead soldering areas include signal pads and power pads. The signal pins on the LED beads are connected to the signal pads, and the power pins are connected to the power pads. Each LED bead 12' has an address code programmed into it. Rows or columns are considered units, and the LED beads 12' in a row or column are connected in parallel. Their signals are transmitted through parallel signal lines to the driver chip within each LED bead 12'. The driver chip receives the drive signal corresponding to its address code to drive the light-emitting chip within the corresponding LED bead 12' to emit light.

[0003] Before the aforementioned LED beads 12' are soldered onto the lamp bead soldering area on the carrier 1', the addresses of the LED beads 12' need to be pre-programmed, assigning a corresponding code to each LED bead 12'. Then, they are surface-mounted onto the carrier board 1'. The carrier board 1' is generally quite large, with common sizes such as 250mm x 1500mm. Taking a standard pixel pitch of P3.91mm as an example, it has 64 x 384 pixels (each pixel corresponds to one LED bead 12'), which means 64 x 384 addresses need to be programmed. Even if 384 LED beads 12' (one column of LED beads 12') are considered as a feature group, there are still 384 different addresses for the LED beads. Before surface-mounting the LED beads 12', 384 types of LED beads 12' need to be programmed first, requiring the management of 384 types of materials, which is quite troublesome and can easily lead to confusion during after-sales maintenance.

[0004] Therefore, the existing transparent LED display screen 1000', because it uses the above-mentioned method of pre-programming the addresses of the LED beads 12' before installation, has problems such as complex process, troublesome material management, and complicated after-sales maintenance. Utility Model Content

[0005] To address the problems of complex processes, cumbersome material management, and complicated after-sales maintenance associated with pre-programming addresses to LED chips before installation in existing transparent LED display manufacturing methods, this application provides a transparent display module and a transparent LED display screen.

[0006] This application discloses a transparent display module, including a light-transmitting substrate with light-transmitting holes and light-emitting units arrayed on the light-transmitting substrate; wherein, a driving circuit is provided on the light-transmitting substrate, and the driving circuit includes light-emitting solder areas arranged in an array, with each light-emitting solder area corresponding to a light-emitting unit.

[0007] The light-emitting unit includes a light-emitting chip and a driving chip, wherein the driving chip is used to drive the light-emitting chip to emit light.

[0008] The light-emitting solder area includes signal pads, power pads, and programming pads; wherein, the signal pads are used to provide signals to the light-emitting units, the power pads are used to provide power to the light-emitting units, and the programming pads are used to connect to an external programming device to program the address code of each light-emitting solder area and store the address information of the corresponding light-emitting unit in the driver chip.

[0009] The transparent display module provided in this application does not require pre-programming the addresses of each light-emitting unit on the transparent light-emitting module. The driver chip on each light-emitting unit on the transparent display module has empty address information before it is mounted. Instead, after each light-emitting unit is installed on the light-transmitting substrate, the addresses are programmed in batches using a special programming tool. This makes operation and material management easier and brings great convenience to production, installation and after-sales management.

[0010] Furthermore, the programming pads are electrically connected to the signal pads.

[0011] Furthermore, the driving chips within the light-emitting units on the transparent display module are connected in parallel.

[0012] Furthermore, the driver chips within the light-emitting units on the transparent display module are connected in series.

[0013] Furthermore, the light-emitting unit includes a light-emitting wafer and a driving chip that are separate and have no outer shell; the light-emitting wafer is disposed on the front side of the light-transmitting substrate, and the driving chip is disposed on the back side of the light-transmitting substrate.

[0014] Furthermore, the programming pads are disposed on the back and / or reverse side of the light-transmitting substrate.

[0015] Furthermore, the programming pad is disposed on the front side of the light-transmitting substrate, located on the side corresponding to the light-emitting unit.

[0016] Furthermore, the programming pad is an extension of the signal pad, and the programming pad and the signal pad are an integral pad.

[0017] The second aspect of this application discloses a transparent LED display screen, including a transparent motherboard and a plurality of transparent display modules mounted on the transparent motherboard.

[0018] The transparent display screen provided in this application does not require pre-programming the addresses of each light-emitting unit on the transparent light-emitting module. The driver chip on each light-emitting unit on the transparent display module has empty address information before it is mounted. Instead, after each light-emitting unit is installed on the light-transmitting substrate, the addresses are programmed in batches using a special programming tool. This makes operation and material management easier and brings great convenience to production, installation and after-sales management. Attached Figure Description

[0019] Figure 1 This is a top view diagram of a transparent display screen provided in the prior art;

[0020] Figure 2 This is a front perspective view of the first transparent display module provided in the specific embodiments of this application;

[0021] Figure 3 yes Figure 2 A three-dimensional front view of the LED beads;

[0022] Figure 4 This is a three-dimensional rear view of the first transparent display module provided in the specific embodiments of this application;

[0023] Figure 5 yes Figure 2 Enlarged view of point A in the middle;

[0024] Figure 6 yes Figure 4 Enlarged view of point B in the middle;

[0025] Figure 7 This is a top view of the first transparent display module provided in the specific embodiments of this application;

[0026] Figure 8 This is a top view of the second type of transparent display module provided in the specific embodiments of this application;

[0027] Figure 9 yes Figure 8 Enlarged view of point C in the middle;

[0028] Figure 10 This is a schematic diagram of the optimized dedicated programming tool provided in a specific embodiment of this application;

[0029] Figure 11 This is a circuit diagram showing the parallel connection of the LED beads provided in the specific embodiments of this application;

[0030] Figure 12 This is a schematic diagram of the transparent display screen provided in a specific embodiment of this application;

[0031] Figure 13 This is a schematic diagram showing the connection between the transparent display screen and the external controller and power supply provided in a specific embodiment of this application.

[0032] The reference numerals in the prior art are as follows:

[0033] 1000' Transparent LED display screen; 1' Carrier board; 11' Light-transmitting hole; 12' LED beads;

[0034] The reference numerals in the attached diagram are as follows: 100, transparent display module; 200, transparent LED display screen; 300, dedicated programming tool;

[0035] 1. Transparent substrate; 2. Transparent motherboard; 3. Controller; 4. Power supply;

[0036] 11. First light-transmitting hole; 12. LED lamp bead; 13. Programming pad;

[0037] 121. Driver chip (driver IC); 122. Pin; 123. Light-emitting chip; 123b. Blue light-emitting chip; 123g. Green light-emitting chip; 123r. Red light-emitting chip;

[0038] 14. Motherboard interface; 14V, Motherboard power supply interface; 14G, Motherboard grounding interface; 14D1, First motherboard data interface; 14D2, Second motherboard data interface;

[0039] 301. Programming motherboard; 302. Programming control box; 303. Programming ejector pins;

[0040] 21. Second light-transmitting hole; 22. Module interface; 23. External interface. Detailed Implementation

[0041] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0042] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0043] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0044] Example 1

[0045] This example will provide a detailed explanation of the transparent display module disclosed in this application. As follows: Figures 2-6 As shown, a transparent display module 100 includes a light-transmitting substrate 1 with a light-transmitting hole and an array of light-emitting units mounted on the light-transmitting substrate 1; the light-emitting unit includes a light-emitting chip 123 and a driving chip 121, the driving chip 121 being used to drive the light-emitting chip 123 to emit light; for distinction, the light-transmitting hole on the light-transmitting substrate 1 is named the first light-transmitting hole 11; regarding the light-emitting unit, as... Figure 3As shown, in this example, the light-emitting unit is an integrated LED bead 12. The LED bead 12 includes a housing and a light-emitting chip 123 and a driver chip 121 encapsulated within the housing. The LED bead 12 array is arranged on the front side of the light-transmitting substrate 1. The aforementioned light-emitting chip 123 generally includes three types: blue light-emitting chip 123b, green light-emitting chip 123g, and red light-emitting chip 123r. Pins 122 are led out from the housing for connecting to the pads on the light-emitting solder area. Pins 122 generally include power pins, signal pins, etc., which are known to those skilled in the art. However, as an alternative, the light-emitting unit can also include a separate light-emitting chip 123 and driver chip 121 without a housing. In this case, both the light-emitting chip 123 and driver chip 121 can be arranged on the front side of the light-transmitting substrate 1, or the light-emitting chip 123 can be arranged on the front side of the light-transmitting substrate 1, and the driver chip 121 can be arranged on the back side of the light-transmitting substrate 1.

[0046] The light-transmitting substrate 1 is provided with a driving circuit (not shown in the figure). The driving circuit includes an array of light-emitting solder areas, each corresponding to a light-emitting unit. The driving circuit, as is publicly known, provides power and driving signals to the driving chip 121 and the chips in the light-emitting units. The driving circuit arranged on the light-transmitting substrate 1 typically connects the light-emitting units in parallel, sequentially providing driving signals to the driving chip 121 in each light-emitting unit. Simultaneously, the driving circuit includes power supply lines and ground lines to provide power to the light-emitting units. Alternatively, the driving circuit can be configured to connect the driving chips 121 in series, so that the driving signals are sequentially connected in series to each driving chip 121; this method is relatively less common.

[0047] The light-emitting solder area includes a signal pad, a power pad, and a programming pad 13; wherein the signal pad is used to provide signals to the light-emitting unit, the power pad is used to provide power to the light-emitting unit, and the programming pad 13 is used to connect to an external programming device to program the address code of each light-emitting solder area and store the address information of the corresponding light-emitting unit in the driver chip 121.

[0048] Regarding the programming pad 13, it can be disposed on the light-emitting solder area formed on the front side of the light-transmitting substrate 1, or it can be disposed on the light-emitting solder area formed on the back side of the light-transmitting substrate 1. Alternatively, as shown in this example, programming pads 13 can be disposed on both the front and back sides of the light-transmitting substrate 1. Figures 2-5 As shown, the programming pads 13 are configured as metal vias, forming a programming hole structure that penetrates from the front side of the light-transmitting substrate 1 to the back side of the light-transmitting substrate 1. This allows address programming operations to be performed from both the front and back sides.

[0049] The aforementioned programming pad 13 is generally circular or other regular or irregular shapes. To facilitate programming after installation, it needs to avoid the light-emitting unit (LED bead 12). Therefore, when the programming pad 13 is placed on the front side of the light-transmitting substrate 1, it is positioned on the side corresponding to the light-emitting unit. This leaves space for the connection of the programming pin 303 of the subsequent programming tool.

[0050] The programming pad 13 is essentially a type of input signal. Therefore, it and the signal pad can be integrated or directly or indirectly connected. However, the programming pad 13 only functions when programming the address, while the signal pad functions when the light-emitting unit is driven by the driving signal.

[0051] like Figure 7 As shown, a transparent display module 100 requires external input of drive signals and power supply. In this example, a motherboard interface 14 is separately provided on the light-transmitting substrate 1. Specifically, a motherboard power supply interface 14V, a motherboard grounding interface 14G, and a data interface are respectively provided at the four corners of the light-transmitting substrate 1. The number of data interfaces can be one or more. In this example, two data interfaces are provided, defined as the first motherboard data interface 14d1 and the second motherboard data interface 14d2 (these motherboard interfaces 14 can also be centrally located, such as the transparent motherboard 2 shown in Embodiment 2). The motherboard interface 14 is used to connect to the outside. When the transparent motherboard 2 shown in Embodiment 2 is used to integrate and assemble into a large transparent LED display screen 200, the above-mentioned template interface is used to interface with the module interface 22 on the transparent motherboard 2 in Embodiment 2.

[0052] As a preferred method, such as Figure 8 , Figure 9 As shown, the programming pad 13 is an extension pad of the signal pad, and the programming pad 13 and the signal pad are an integral pad. It extends from the signal pad into a long strip-shaped space to form an extension pad. This extension pad, as the programming pad 13, extends beyond the frontal projection area of ​​the LED bead 12, and is large enough to connect to the programming pin 303 of the dedicated programming tool 300.

[0053] This dedicated burning tool is 300. Figure 10As shown, the system includes a programming control box 302, a programming motherboard 301, and programming pins 303. An array of programming pins 303 is arranged on the programming motherboard 301, which is connected to the programming control box 302 via wiring. Each programming pin 303 corresponds to a programming pad 13 on the transparent display module 100, allowing for rapid address programming of the transparent display module 100 in a single operation. Alternatively, the dedicated programming tool 300 can also use other tools, such as a single programming pin 303 or programming pins arranged in rows or columns, with a motion device driving the programming pins 303 one by one, row by row, or column by column for address programming.

[0054] like Figure 11 As shown, in this example, the transparent light-emitting module preferably adopts a parallel arrangement. Each driver IC 121 within each light-emitting unit is connected to a signal line (marked with DATA in the figure). The driver chip 121 drives its respective controlled light-emitting chip 123 for display. All are powered by parallel power supply lines. There can be multiple signal lines. For example, two signal lines, which are connected to... Figure 7 , Figure 8 The first motherboard data interface 14d1 and the second motherboard data interface 14d2 are in the middle.

[0055] In this example, the programming method is as follows: programming is not performed during the fabrication of the LED beads 12. Instead, unprogrammed LED beads 12 are first arrayed on the transparent display module 100. Then, the entire transparent display module 100 is pressed onto programming pins 303 arranged in an NxM matrix. Each programming pin 303 contacts a programming pad 13 on the transparent display module 100. Each programming pin 303 is simultaneously connected to a programming control box 302. Through the programming control box 302, each of the NxM light-emitting units is electrically connected. Based on the position of the light-emitting unit, a signal is sent to the corresponding driver IC 121 to form storable address information, resulting in NxM driver ICs 121 with different address information. When these NxM LED pixel driver ICs 121 operate in parallel, each driver IC 121 reads its corresponding data segment to display the corresponding pixel information. When several such transparent display modules 100 are assembled into a large-size transparent LED display screen 200, it is only necessary to identify the position of these transparent display modules 100 and send the corresponding image information to form the overall picture.

[0056] Using the transparent display module 100 provided in this example, it is not necessary to pre-program the addresses of each light-emitting unit on the transparent light-emitting module. The driver chip 121 on each light-emitting unit on the transparent display module 100 has empty address information before it is mounted. Instead, after each light-emitting unit is installed on the light-transmitting substrate 1, the addresses are programmed in batches using a dedicated programming tool 300. This makes operation and material management easier and brings great convenience to production, installation and after-sales management.

[0057] Example 2

[0058] This example provides a transparent LED display screen 200, such as Figure 12 As shown, it includes a transparent motherboard 2 and a plurality of transparent display modules 100 mounted on the transparent motherboard 2. The transparent display module 100 is the transparent display module 100 provided in Embodiment 1.

[0059] In one specific implementation, a plurality of second light-transmitting holes 21 are arranged in an array on the transparent motherboard 2, and these second light-transmitting holes 21 are mapped to the first light-transmitting holes 11 on the transparent substrate. This ensures that when the transparent display module 100 is mounted on the transparent motherboard 2, the entire module still maintains a transparent effect. Of course, there are many ways to achieve a transparent effect, and this is not limited to the implementation described in this example. This is not the core point of this application.

[0060] In this example, the transparent motherboard 2 is provided with module interfaces 22, which are used to connect to the motherboard interfaces 14 on each transparent display module 100.

[0061] The transparent motherboard 2 is generally also equipped with transmission circuits and external interfaces 23, such as Figure 13 As shown, the external interface 23 is used to connect the external controller 3 and the power supply. After the control signals and power are introduced through the external interface 23, they are transmitted to the motherboard interface 14 on the transparent display module 100 through the transmission circuit and module interface 22. The motherboard interface 14 then drives the light-emitting units on each transparent display module 100 through the driving circuit. Finally, the function of providing power and signal control to the light-emitting units on the transparent display module 100 is realized.

[0062] The transparent LED display screen 200 provided in this example has driver chips 121 on each light-emitting unit of its transparent display module 100 with empty address information before surface mounting. Only one type of light-emitting unit material needs to be managed, and even after fabrication into a transparent display module 100, only one type of light-emitting unit material remains. Taking a pixel pitch of 3.91mm as an example, when fabricating an LED display module with a resolution of 21 x 32 and an external size of 83.33mm x 125mm, and splicing them into a large panel of 250mm x 1500mm, only 3 x 12 transparent display modules 100 are needed. This means that only 36 sets of modular display information need to be set in the control system to form a complete large-size display screen. Operation and material management are much easier, bringing great convenience to production, installation, and after-sales management. The transparent display screen in the example above can be made larger, depending on production conditions and screen requirements.

[0063] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transparent display module, comprising a light-transmitting substrate having light-transmitting holes and light-emitting units arrayed and mounted on the light-transmitting substrate; wherein, The light-transmitting substrate is provided with a driving circuit, which includes an array of light-emitting solder areas, and each light-emitting solder area corresponds to a light-emitting unit. The light-emitting unit is characterized in that it includes a light-emitting wafer and a driving chip, wherein the driving chip is used to drive the light-emitting wafer to emit light; The light-emitting solder area includes signal pads, power pads, and programming pads; wherein, the signal pads are used to provide signals to the light-emitting units, the power pads are used to provide power to the light-emitting units, and the programming pads are used to connect to an external programming device to program the address code of each light-emitting solder area and store the address information of the corresponding light-emitting unit in the driver chip.

2. The transparent display module according to claim 1, characterized in that, The programming pads are electrically connected to the signal pads.

3. The transparent display module according to claim 1, characterized in that, The driving chips in the light-emitting units on the transparent display module are connected in parallel.

4. The transparent display module according to claim 1, characterized in that, The driver chips in the light-emitting units on the transparent display module are connected in series.

5. The transparent display module according to claim 1, characterized in that, The light-emitting unit is an integrated LED bead, which includes a housing and a light-emitting chip and a driving chip encapsulated in the housing; the LED bead array is arranged on the front side of the light-transmitting substrate.

6. The transparent display module according to claim 1, characterized in that, The light-emitting unit includes a light-emitting wafer and a driving chip that are separate and have no outer shell; the light-emitting wafer is disposed on the front side of the light-transmitting substrate, and the driving chip is disposed on the back side of the light-transmitting substrate.

7. The transparent display module according to claim 1, characterized in that, The programming pads are located on the back and / or reverse side of the light-transmitting substrate.

8. The transparent display module according to claim 7, characterized in that, The programming pads are disposed on the front side of the light-transmitting substrate, located on the side corresponding to the light-emitting unit.

9. The transparent display module according to claim 7, characterized in that, The programming pad is an extension of the signal pad, and the programming pad and the signal pad are an integral pad.

10. A transparent LED display screen, comprising a transparent motherboard and a plurality of transparent display modules mounted on the transparent motherboard; characterized in that, The transparent display module is the transparent display module according to any one of claims 1-9.

Images