A circuit board assembly, a chip anti-shake motor and a camera module

Abstract

The application discloses a circuit board assembly, a chip anti-shake motor and a camera module. The circuit board assembly comprises a first circuit board, a second circuit board and a pre-positioning structure. The first circuit board comprises a movable part and a fixed part. The movable part is arranged on the inner side of the fixed part and is flexibly connected with the fixed part. The movable part has a first surface. The first surface is provided with a first solder pad. The second circuit board is arranged opposite to the movable part. The second circuit board has a second surface opposite to the first surface. The second surface is provided with a second solder pad. The first solder pad and the second solder pad are welded. The pre-positioning structure is arranged on the movable part and the second circuit board. The pre-positioning structure is used for pre-fixing the movable part and the second circuit board. The transverse space occupation is reduced. The module is flattened. The welding offset is avoided. The welding precision is ensured. The anti-shake effect is enhanced.

Description

Technical Field

[0001] This application relates to the field of camera technology, and in particular to a circuit board assembly, a chip-based image stabilization motor, and a camera module. Background Technology

[0002] In the field of photography and videography, optical image stabilization (OIS) technology is crucial for improving image quality. Traditional lens-based image stabilization achieves stabilization by moving the lens, but this suffers from problems such as complex optical design due to light refraction from the lens, bulky lens structures, and slow movement response, limiting further improvements in stabilization performance. With technological advancements, chip-based image stabilization has emerged. It achieves stabilization through a chip within the moving module, avoiding the problems caused by light refraction from the lens. Compared to moving the lens, the chip is smaller and lighter, making it easier to achieve flexible and agile movement response, providing a new direction for improving image stabilization performance.

[0003] As the consumer electronics market continues to demand higher image quality, camera pixel counts are constantly breaking records, leading to a significant increase in the size of supporting chips. Simultaneously, consumers are increasingly demanding miniaturization and integration of electronic products, expecting more functions within a smaller footprint. In the field of chip-based image stabilization motor technology, existing solutions often use a method where the chip circuit board and the flexible circuit board below are connected via side leads. This design results in the flexible circuit board occupying excessive lateral space, making it difficult to compress the overall size of the chip-based image stabilization motor module. This problem not only contradicts the trend of miniaturization in electronic products but also limits the application of products in thin and light devices, while increasing the difficulty of internal space layout and hindering the realization of multi-functional integration. Utility Model Content

[0004] This application discloses a circuit board assembly, a chip-based image stabilization motor, and a camera module, which can reduce the lateral space occupied, achieve module flattening, avoid short circuits or open circuits caused by soldering misalignment, ensure soldering accuracy, improve production yield, and enhance image stabilization effect.

[0005] To achieve the above objectives, this application discloses a circuit board assembly, comprising:

[0006] A first circuit board, the first circuit board comprising:

[0007] Fixing part;

[0008] The movable part is disposed inside the fixed part and flexibly connected to the fixed part. The movable part has a first surface and a first pad is provided on the first surface.

[0009] A second circuit board is arranged opposite to the movable part. The second circuit board has a second surface opposite to the first surface. A second pad is provided on the second surface. The first pad and the second pad are soldered together.

[0010] A pre-positioning structure is disposed on the movable part and the second circuit board, and the pre-positioning structure is used to pre-fix the movable part and the second circuit board.

[0011] In one possible implementation, the prepositioning structure includes a positioning adhesive bonded between the first surface and the second surface.

[0012] In one possible implementation, the pre-positioning structure includes a first positioning hole disposed on the movable part and a second positioning hole disposed on the second circuit board, the first positioning hole and the second positioning hole being arranged opposite to each other for providing positioning posts for pre-positioning the movable part and the second circuit board.

[0013] In one possible implementation, the first circuit board further includes a suspension connection portion comprising a plurality of sequentially connected connecting segments, with two adjacent connecting segments extending toward the first direction and the second direction, respectively. One end of the suspension connection portion is connected to the fixed portion, and the other end of the suspension connection portion is connected to the movable portion. The first direction and the second direction are perpendicular and both extend along the plane of the first circuit board.

[0014] In one possible implementation, the movable portion includes a first extension extending in a first direction and a second extension extending in a second direction, the suspension wire connection portion is connected to the first extension portion, and the width of the movable portion is greater than the width of the suspension wire connection portion.

[0015] In one possible implementation, the movable part and / or the suspension wire connection part are arranged in a centrally symmetrical manner.

[0016] In one possible implementation, the suspension wire connection includes two parts, which are spaced apart and arranged in parallel.

[0017] In one possible implementation, the second pads include a plurality of pads arranged circumferentially at intervals along the center of the second circuit board, the first pads include a plurality of pads, the plurality of first pads and the plurality of second pads are arranged in a one-to-one correspondence, the first pads and the second pads are arranged opposite to each other, and the size of the first pads and the size of the second pads are the same.

[0018] This application also discloses a chip-based image stabilization motor, including a circuit board assembly as described in any of the above claims, a motor cover, a chip, a magnet, a coil, and a base. The circuit board assembly is disposed on the base, the fixed part is fixedly connected to the base, a ball bearing assembly is provided between the movable part and the base, the chip is electrically connected to a second circuit board, the magnet is fixedly disposed on the surface of the base facing the circuit board assembly, the coil is disposed on the movable part, and the coil and the magnet are correspondingly disposed.

[0019] This application also discloses a camera module, including a lens assembly and a chip-based image stabilization motor as described in any of the above claims.

[0020] Compared with the prior art, the beneficial effects of this application are as follows:

[0021] In the circuit board assembly, chip-based image stabilization motor, and camera module provided in this application, the first circuit board includes a fixed portion and a movable portion. A first pad is provided on the first surface of the first circuit board for electrical connection with a second circuit board. The movable portion of the first circuit board is located inside the fixed portion and flexibly connected to it, maintaining circuit continuity and providing stable support when the movable portion moves. A second pad is provided on the second surface of the second circuit board, and the second pad of the second circuit board is soldered to the first pad of the movable portion. A pre-positioning structure is provided on the movable portion and the second circuit board to pre-fix the two components before soldering, ensuring pad alignment accuracy and improving assembly efficiency.

[0022] In this way, the second circuit board is stacked vertically with the first circuit board, and the first and second pads are soldered together to form an electrical and mechanical connection. The moving parts are directly connected to the second circuit board, reducing intermediate transmission structures and improving response speed. Compared with traditional side leads, this reduces lateral space occupation, achieves module flattening, shortens signal transmission paths, reduces signal loss, and improves electrical performance. At the same time, the pre-positioning structure ensures pad alignment through mechanical positioning before soldering, avoiding short circuits or open circuits caused by soldering misalignment, ensuring soldering accuracy, reducing the risk of cold solder joints, improving production yield, reducing assembly difficulty, and enhancing anti-shake effect. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 One of the structural schematic diagrams of a chip-based anti-shake motor provided in this embodiment of the present utility model;

[0025] Figure 2 A schematic diagram of the structure of a chip-based anti-shake motor display chip assembly provided in an embodiment of this utility model;

[0026] Figure 3 One of the schematic diagrams of the structure of a first circuit board for a chip-based anti-shake motor provided in this embodiment of the present invention;

[0027] Figure 4 A second schematic diagram of the structure of a first circuit board for a chip-based anti-shake motor provided in an embodiment of this utility model;

[0028] Figure 5 This is a schematic diagram of the structure of a second circuit board for a chip-based anti-shake motor provided in an embodiment of the present invention;

[0029] Figure 6 A second schematic diagram of a chip-based anti-shake motor provided as an embodiment of this utility model;

[0030] Figure 7 for Figure 6 A cross-sectional view from the AA perspective;

[0031] Figure 8 A schematic diagram of the structure of a display positioning adhesive for a chip anti-shake motor provided in this embodiment of the present utility model;

[0032] Figure 9 A schematic diagram of the display positioning hole of a chip anti-shake motor provided for an embodiment of this utility model;

[0033] Figure 10 An exploded view of a chip-based anti-shake motor provided for an embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10-Base; 20-First circuit board; 21-Moving part; 211-First surface; 2111-First pad; 212-First extension; 213-Second extension; 22-Fixing part; 221-Square frame; 23-Suspension wire connection; 231-Connecting section; 30-Soft soldering material; 31-Chip; 32-Second circuit board; 321-Second surface; 3211-Second pad; 322-Side; 40-Motor top cover; 50-Filter assembly; 60-Magnet; 70-Coil; 80-Pre-positioning structure; 81-Positioning adhesive; 82-First positioning hole; 83-Second positioning hole; 84-Positioning post; 90-Ball assembly. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0039] In the field of photography and videography, optical image stabilization (OIS) technology is crucial for improving image quality. Traditional lens-based image stabilization achieves stabilization by moving the lens, but this suffers from problems such as complex optical design due to light refraction from the lens, bulky lens structures, and slow movement response, limiting further improvements in stabilization performance. With technological advancements, chip-based image stabilization has emerged. It achieves stabilization through a chip within the moving module, avoiding the problems caused by light refraction from the lens. Compared to moving the lens, the chip is smaller and lighter, making it easier to achieve flexible and agile movement response, providing a new direction for improving image stabilization performance.

[0040] As the consumer electronics market continues to demand higher image quality, camera pixel counts are constantly breaking records, leading to a significant increase in the size of supporting chips. Simultaneously, consumers are increasingly demanding miniaturization and integration of electronic products, expecting more functions within a smaller footprint. In the field of chip-based image stabilization motor technology, existing solutions often use a method where the chip circuit board and the flexible circuit board below are connected via side leads. This design results in the flexible circuit board occupying excessive lateral space, making it difficult to compress the overall size of the chip-based image stabilization motor module. This problem not only contradicts the trend of miniaturization in electronic products but also limits the application of products in thin and light devices, while increasing the difficulty of internal space layout and hindering the realization of multi-functional integration.

[0041] In view of this, some embodiments of this application provide a circuit board assembly, a chip-based image stabilization motor, and a camera module, which are connected by a first pad and a second pad using a soft soldering material. A pre-positioning structure is disposed on at least one of the movable part and the second circuit board. The pre-positioning structure is used to pre-fix the movable part and the second circuit board, which can reduce the lateral space occupied, realize the module flattening, avoid short circuits or open circuits caused by soldering misalignment, ensure soldering accuracy, improve production yield, and enhance the image stabilization effect.

[0042] The present application will be described in detail below through specific embodiments:

[0043] The circuit board assembly in the embodiments of this application, such as Figures 1 to 10 As shown, a circuit board assembly includes a first circuit board 20, a second circuit board 32, and a prepositioning structure.

[0044] The first circuit board 20 includes a movable part 21 and a fixed part 22. The movable part 21 is disposed inside the fixed part 22 and is flexibly connected to the fixed part 22. The movable part 21 has a first surface 211 and a first pad 2111 is provided on the first surface 211.

[0045] The second circuit board 32 is arranged opposite to the movable part 21. The second circuit board 32 has a second surface 321 opposite to the first surface 211. The second surface 321 is provided with a second pad 3211, a first pad 2111 and a second pad 3211.

[0046] The pre-positioning structure 80 is disposed on at least one of the movable part 21 and the second circuit board 32, and the pre-positioning structure 80 is used to pre-fix the movable part 21 and the second circuit board 32.

[0047] In the circuit board assembly provided in this application embodiment, the first circuit board 20 includes a fixed portion 22 and a movable portion 21. A first pad 211 is provided on the first surface 211 of the first circuit board 20 for electrical connection with the second circuit board 32. The movable portion 21 of the first circuit board 20 is disposed inside the fixed portion 22 and flexibly connected to it, maintaining circuit continuity and providing stable support when the movable portion 21 moves. A second pad 321 is provided on the second surface 321 of the second circuit board 32. The second pad 3211 of the second circuit board 32 is soldered to the first pad 2111 of the movable portion 21. A pre-positioning structure 80 is disposed on the movable portion 21 and the second circuit board 32 to pre-fix the two components before soldering, ensuring pad alignment accuracy and improving assembly efficiency.

[0048] In this way, the second circuit board 32 is stacked vertically with the first circuit board 20, and the first pad 2111 and the second pad 3211 are directly soldered together to form an electrical and mechanical connection. The moving part 21 is directly connected to the second circuit board 32, reducing intermediate transmission structures and improving response speed. Compared with traditional side leads, this reduces the lateral space occupied, achieves module flattening, shortens the signal transmission path, reduces signal loss, and improves electrical performance. At the same time, the pre-positioning structure ensures pad alignment through mechanical positioning before soldering, avoiding short circuits or open circuits caused by soldering misalignment, ensuring soldering accuracy, reducing the risk of poor soldering, improving production yield, reducing assembly difficulty, and enhancing anti-shake effect.

[0049] In the diagram, the X direction is the first direction, and the Y direction is the second direction.

[0050] The first circuit board 20 is typically a flexible circuit board, and the second circuit board 32 is typically a printed circuit board. The second circuit board 32 is used to house the chip 31. The outer perimeter of the movable part 21 matches the outer perimeter of the second circuit board 32, which is more conducive to the miniaturization of the motor.

[0051] In some embodiments, such as Figure 3 and Figure 4 As shown, there are multiple second pads 3211, which are arranged circumferentially at intervals along the center of the second circuit board 32. There are multiple first pads 2111, which are arranged in a one-to-one correspondence with the multiple second pads 3211.

[0052] By arranging multiple second solder pads 3211 circumferentially around the center of the second circuit board 32, the second circuit board 32 is subjected to uniform force during movement, reducing local stress concentration and lowering the risk of solder joint fatigue fracture. Compared to single-point or single-sided connections, circumferentially distributed solder joints can better resist multi-angle impacts (such as drops and vibrations), improving the durability of the anti-shake motor.

[0053] Furthermore, the circumferentially distributed solder joints increase the contact area between the second circuit board 32 and the first circuit board 20. Heat is conducted through the solder joints, assisting in heat dissipation of the chip 31 and preventing localized overheating from affecting performance. The circumferential spacing design of the solder pads generates a self-aligning force (surface tension of the molten solder) during the soldering process, reducing positional deviations during assembly. This results in a tighter connection between the second circuit board 32 and the moving part 21, better synchronization during movement, reduced lag during jitter compensation, improved anti-shake accuracy, and increased production yield.

[0054] In some embodiments, such as Figure 2 , Figure 4 and Figure 5 As shown, the first pad 2111 and the second pad 3211 are arranged opposite to each other, and the size of the first pad 2111 and the size of the second pad 3211 are the same.

[0055] Thus, the first pad 2111 (located in the movable part 21) and the second pad 3211 (located in the second circuit board 32) are perfectly aligned in the vertical direction, forming a face-to-face stacked structure. This ensures that the solder material 30, in its molten state, can uniformly fill the gap between the two pads, forming a reliable connection. Pads of the same size ensure uniform shrinkage during the solder joint's solidification process, reducing cracks or cold solder joints caused by stress concentration. The surface tension of the molten solder generates a stronger self-aligning force between the size-matched pads, reducing the risk of solder misalignment.

[0056] Furthermore, size-matched pads provide a larger contact area, reducing contact resistance and signal transmission loss. The corresponding pad structure also improves impedance consistency across signal paths, reducing reflections and crosstalk. When pad sizes are the same, a wider range of assembly tolerances is allowed, improving production yield. Standardized pad designs facilitate mass production and reduce setup costs.

[0057] The first pad 2111 and the second pad 3211 can be circular, square, or other structures, as long as their diameters or side lengths are the same.

[0058] In one possible implementation, such as Figure 8 As shown, the prepositioning structure 80 includes a positioning adhesive 81, which is bonded between the first surface 211 and the second surface 321.

[0059] Positioning adhesive 81, serving as a pre-positioning structure 80, fills the space between the movable portion 21 (first surface 211) of the first circuit board 20 and the second circuit board 32 (second surface 321). Before soldering, the positioning adhesive 81 temporarily fixes the two components together through bonding, ensuring precise alignment of the solder pads. After soldering, the positioning adhesive 81 remains in the assembly as an auxiliary support structure, enhancing the solder joint's resistance to vibration and impact.

[0060] Specifically, the positioning adhesive 81 can be UV adhesive, which is applied to the first circuit board 20 or the second circuit board 32. Then the two circuit boards are snapped together, and the UV adhesive is cured by the side lamp 322 to achieve pre-fixation. Then the first circuit board 20 and the second circuit board 32 are put into the reflow oven for soldering.

[0061] Alternatively, the positioning adhesive 81 can be a thermosetting adhesive. The thermosetting adhesive is applied to the first circuit board 20 or the second circuit board 32, and then the two circuit boards are snapped together and sent into an oven to bake and cure.

[0062] In another possible implementation, such as Figure 9As shown, the pre-positioning structure 80 includes a first positioning hole 82 disposed on the movable part 21 and a second positioning hole 83 disposed on the second circuit board 32. The first positioning hole 82 and the second positioning hole 83 are arranged opposite to each other to provide positioning posts 84 for pre-positioning the movable part 21 and the second circuit board 32.

[0063] The first positioning hole 82 is located in the movable part 21 (first circuit board 20) and is typically a through hole or a blind hole. The second positioning hole 83 is located in the second circuit board 32 and is perfectly aligned with the first positioning hole 82 in the vertical direction. By setting the positioning pins 84 on the fixture in the two positioning holes, the two boards are mechanically constrained. After entering the reflow oven together, the fixture is removed, ensuring that the two components are accurately positioned before welding.

[0064] Thus, by using positioning posts 84 in the positioning holes, they can withstand the high temperatures during the soldering process without deformation or adhesion. After soldering, the positioning posts 84 can be easily removed for reuse, reducing consumable costs. During the reflow soldering heating process, the positioning posts constrain the relative positions of the two circuit boards, preventing misalignment caused by differences in thermal expansion. The positioning posts 84 provide stable support, ensuring uniform stress on the solder during solidification and reducing voids and cold solder joints.

[0065] In some embodiments, such as Figure 5 As shown, the second circuit board 32 has multiple sides 322, and the second pad 3211 is located on the second circuit board 32 near the edge of the side 322.

[0066] The pads are located near the edge of side 322, distributing the connection points between the second circuit board 32 and the movable part 21 around the periphery of the structure, forming a frame-like support and improving overall bending resistance. This also avoids the pads being concentrated near the center of the chip 31, reducing the risk of cracking in the center area of ​​the chip 31 due to thermal expansion or external forces. This eliminates the need for pads in the center of the second circuit board 32, allowing for the integration of other components (such as capacitors and resistors) or a reduction in circuit board size, resulting in a smaller module area. The pads' proximity to side 322 allows for rapid heat conduction to the external heat dissipation structure via the metal layer (such as copper foil) at the edge of the circuit board, and also keeps them away from the heat source area in the center of the chip 31, preventing solder softening or aging due to high temperatures.

[0067] For example, if the second circuit board 32 is rectangular, the pads may be distributed in a rectangular array along the edge. If the second circuit board 32 is circular, the pads may be arranged in concentric circles. In this embodiment, the second circuit board 32 includes four longer sides 322, and the second pads 3211 are distributed near the edges of these four sides.

[0068] In some embodiments, such as Figure 3 and Figure 4As shown, the first circuit board 20 also includes a suspension wire connection part 23, which includes a plurality of connecting segments 231 connected in sequence. Two adjacent connecting segments 231 extend in a first direction and a second direction, respectively. One end of the suspension wire connection part 23 is connected to the fixed part 22, and the other end of the suspension wire connection part 23 is connected to the movable part 21. The first direction and the second direction are perpendicular and both extend along the plane where the first circuit board 20 is located.

[0069] In some embodiments, such as Figure 3 and Figure 4 As shown, the movable part 21 includes a first extension 212 extending in a first direction and a second extension 213 extending in a second direction, and the width of the movable part 21 is greater than the width of the suspension wire connection part 23.

[0070] In some embodiments, such as Figure 3 and Figure 4 As shown, the suspension wire connection part 23 includes two parts, which are spaced apart and arranged in parallel to ensure the structural strength of the suspension wire connection part 23.

[0071] The first extension 212 and the second extension 213 can be formed as follows: Figure 4 The “L-shape” shown can also form a “T-shape” structure, but this embodiment does not limit it.

[0072] The width of the active part 21 refers to the width of the first extension 212 and the width of the second extension 213. The width of the first extension 212 is the distance along the extension direction perpendicular to the first extension 212. Similarly, the width of the first extension 212 is sufficient to withstand the soldering strength of the pads.

[0073] The width of the suspension connector 23 refers to the distance along the extension direction perpendicular to the suspension connector 23, making the suspension connector 23 relatively slender, so as to ensure that the movable part 21 can move smoothly along the first direction and the second direction.

[0074] Specifically, such as Figure 3 and Figure 4 As shown, the fixed part 22 includes a square frame 221, and the movable part 21 is disposed within the square frame 221. There are two movable parts 21, which are symmetrically arranged with respect to the center of the square frame 221.

[0075] The movable part 21 and the suspension wire connection part 23 are both centrally symmetrically arranged. The square frame 221 serves as the fixed part 22, providing a supporting boundary for the movable part 21. With the geometric center of the square frame 221 as the axis of symmetry, the two movable parts 21 and the suspension wire connection part 23 are centrally symmetrically distributed to ensure balanced force during movement. Each movable part 21 includes a first extension 212 (along a first direction) and a second extension 213 (along a second direction), which are perpendicular to each other and located on the same plane (the plane of the first circuit board 20).

[0076] The two movable parts 21 are connected to the fixed part 22 through the suspension wire connection part 23, and can be translated in the first direction and the second direction to drive the chip 31 to achieve two-dimensional anti-shake. The suspension wire connection part 23 is composed of multiple connecting segments 231 connected in sequence. Adjacent connecting segments 231 extend alternately along the first direction and the second direction to form a fold-like structure. One end is fixed to the edge of the square frame 221, and the other end is connected to the extension of the movable part 21, providing a degree of freedom of movement through elastic deformation.

[0077] Thus, the symmetrical movable part 21, in conjunction with the folded suspension connector 23, can control the displacement of the chip 31 in the first and second directions, achieving multi-axis optical image stabilization, compensating for handheld device shake in the horizontal and vertical directions, and improving image clarity. The symmetrical layout and folded suspension connector 23 design integrate components such as the movable part 21 and suspension connector 23 within the square frame 221, reducing the module area compared to the traditional single-sided suspension connector 23 structure, making it suitable for ultra-thin devices. The centrally symmetrical mechanical balance design reduces torsional stress on the frame, improving vibration resistance. The multi-segment folded structure of the suspension connector 23 absorbs impact energy through elastic deformation, reducing the risk of solder joint breakage during drops.

[0078] In some embodiments, such as Figure 5 As shown, each side 322 is provided with a plurality of second pads 3211, which are spaced apart along the extension direction of the corresponding side 322.

[0079] like Figure 4 As shown, the first extension 212 has a plurality of first pads 2111 distributed thereon, and the second extension 213 has a plurality of first pads 2111 distributed thereon. The plurality of first pads 2111 are distributed at intervals along the extension direction of the corresponding extension.

[0080] Multiple pads are distributed along each side 322 and each extension, forming a support network at the connection point between the second circuit board 32 and the movable part 21, thus improving bending strength. Each pad bears a similar mechanical load, preventing solder joint breakage due to single-point overload, which is particularly suitable for the anti-jitter requirements of large-size chips 31. Pads arranged in the same direction allow for uniform width and spacing, facilitating the design of equal-length impedance control lines and reducing signal reflection and distortion. The linear arrangement of the pads on the side 322 facilitates soldering by the pick-and-place machine through linear motion, improving placement efficiency.

[0081] In some embodiments, such as Figure 8 and Figure 9 As shown, the first pad 2111 and the second pad 3211 are connected by a soldering material 30. The soldering material 30 has a variety of possible implementations. For example, in this embodiment, the soldering material 30 includes solder paste.

[0082] Solder paste is the most commonly used material in soft soldering (low-temperature soldering), mainly composed of solder alloy powder, flux, and additives mixed uniformly. Solder paste is precisely applied to the second pad 3211 of the second circuit board 32 and the first pad 2111 of the movable part 21 through stencil printing. After the movable part 21 and the second circuit board 32 are pre-positioned using positioning posts (ensuring pad alignment), the circuit board enters the reflow oven. The solder paste melts upon heating and forms solder joints after cooling.

[0083] Solder paste, as the core material for soft soldering, is an ideal choice for pad interconnection due to its high-precision connection, stable mechanical and electrical properties, and process compatibility. By optimizing alloy composition, flux formulation, and soldering process, defects such as voids and bridging can be effectively solved, meeting diverse needs from consumer electronics to industrial applications. It is a key technological foundation for achieving miniaturized, high-reliability electronic packaging.

[0084] In other embodiments, the soldering material 30 may also be other materials such as solder preforms, conductive adhesives, or sintered silver.

[0085] This application also discloses a chip-based image stabilization motor. In this embodiment, as shown... Figure 6 , Figure 7 and Figure 10 As shown, the chip-based image stabilization motor includes a circuit board assembly, which is the same circuit board assembly described above. Therefore, the chip-based image stabilization motor in this embodiment has roughly the same technical effect as the circuit board assembly described above. Since the technical effect of the circuit board assembly has been fully explained, it will not be repeated here.

[0086] Specifically, the chip-based image stabilization motor also includes a base 10, a motor cover 40, a chip 31, a magnet 60, a coil 70, and a filter assembly 50. The circuit board assembly is disposed on the base 10, the fixed part 22 is fixedly connected to the base 10, the movable part 21 is provided with a ball bearing assembly 90 between it and the base 10, the chip 31 is electrically connected to the second circuit board 32, the magnet 60 is fixedly disposed on the surface of the base 10 facing the circuit board assembly, the coil 70 is disposed on the movable part 21, and the coil 70 is correspondingly disposed with the magnet 60.

[0087] The motor cover 40 and the base 10 are fastened together to form a cavity, with part of the fixing part 22 positioned between them to ensure overall structural stability. The filter assembly 50 is positioned above the chip 31 and can filter specific wavelengths of light to improve image quality. Simultaneously, the motor cover 40 has clearance notches to precisely accommodate the installation and operation requirements of the filter assembly 50, protecting internal components while avoiding interference with light transmission and filtering functions, thus achieving a balance between structural compactness and optical performance.

[0088] A chip-based image stabilization motor is a component that integrates electromagnetic drive and precision mechanical structure. It mainly achieves image stabilization by driving moving parts with electromagnetic force and is widely used in scenarios that require dynamic stability, such as cameras and precision instruments.

[0089] The base 10 serves as the mounting base for the entire motor, supporting and fixing components such as the circuit board assembly and magnet 60, while also providing a guiding reference for the movement of the movable part 21. The fixed part 22 is fixedly connected to the base 10 for positioning and support. The movable part 21 carries the coil and drives the load (such as a lens) to move, offsetting external vibrations through displacement. Specifically, it is movably connected to the base 10 via the ball assembly 90, achieving linear or small-angle oscillation. The ball assembly 90 includes balls, a cage, and a guide groove (integrated into the base or movable part), converting the sliding friction between the movable part 21 and the base 10 into rolling friction, reducing motion resistance, ensuring the linearity and stability of the movement of the movable part 21, and preventing deviation from affecting the anti-shake accuracy.

[0090] Magnet 60 is fixed to the surface of base 10 facing the circuit board assembly, forming a stable magnetic field. It is typically a permanent magnet (such as a neodymium iron boron magnet) and provides a strong magnetic field to drive the coil. Coil 70 is fixed to movable part 21 and is positioned corresponding to magnet 60 (e.g., parallel or perpendicular layout). When energized, it generates an Ampere force in the magnetic field of magnet 60, driving the movable part to move. Chip 31 is responsible for photoelectric conversion. Second circuit board 32 houses chip 31 and is electrically connected to it. Based on jitter data input from a sensor (such as a gyroscope), it adjusts the magnitude and direction of the coil current in real time. The circuit board assembly provides electrical connection between the chip and the coil, enabling current transmission and signal processing.

[0091] When external vibrations cause the movable part 21 (such as a lens) to shift, the chip 31 receives a sensor signal and calculates a compensation displacement. The chip 31 controls the circuit board to output a corresponding current to the coil 70. The coil 70 experiences a force in the magnetic field of the magnet 60, pushing the movable part 21 to move in the opposite direction to counteract the vibration. The corresponding arrangement of the magnet 60 and the coil 70 (e.g., parallel vertically) forms a magnetic field perpendicular to the plane of the coil 70. After energization, the direction of the force on the coil 70 is consistent with the direction of movement of the movable part 21. The ball bearing assembly 90 ensures that the movable part moves only in a preset direction, avoiding deviation caused by the magnetic field force.

[0092] It should be explained that there are various ways in which the movable part 21 of the first circuit board 20 can be movably connected to the base 10. For example, it can be connected via the ball bearing assembly 90 in this embodiment, or via a spring or suspension wire, so that the movable part 21 can move relative to the base 10 in the X and Y directions, thereby achieving the anti-shake function of the chip 31. The chip 31 is usually an image sensor, responsible for photoelectric conversion. The chip 31 and the second circuit board 32 are electrically connected by flip-chip soldering of the chip 31.

[0093] This application also discloses a camera module, including a lens assembly and a chip-based image stabilization motor. The chip-based image stabilization motor in this camera module is the aforementioned chip-based image stabilization motor. Therefore, the camera module in this embodiment has roughly the same technical effect as the aforementioned chip-based image stabilization motor. Since the technical effect of the chip-based image stabilization motor has been fully explained, it will not be repeated here.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A circuit board assembly, characterized in that, include: A first circuit board, the first circuit board comprising: Fixing part; The movable part is disposed inside the fixed part and flexibly connected to the fixed part. The movable part has a first surface and a first pad is provided on the first surface. A second circuit board is arranged opposite to the movable part. The second circuit board has a second surface opposite to the first surface. A second pad is provided on the second surface. The first pad and the second pad are soldered together. A pre-positioning structure is disposed on the movable part and the second circuit board, and the pre-positioning structure is used to pre-fix the movable part and the second circuit board.

2. The circuit board assembly according to claim 1, characterized in that, The prepositioning structure includes a positioning adhesive, which is bonded between the first surface and the second surface.

3. The circuit board assembly according to claim 1, characterized in that, The pre-positioning structure includes a first positioning hole disposed on the movable part and a second positioning hole disposed on the second circuit board. The first positioning hole and the second positioning hole are arranged opposite to each other to provide positioning posts for pre-positioning the movable part and the second circuit board.

4. The circuit board assembly according to claim 1, characterized in that, The first circuit board further includes a suspension wire connection portion, which includes a plurality of connecting segments connected in sequence. Two adjacent connecting segments extend in a first direction and a second direction, respectively. One end of the suspension wire connection portion is connected to the fixed portion, and the other end of the suspension wire connection portion is connected to the movable portion. The first direction and the second direction are perpendicular to each other and both extend along the plane of the first circuit board.

5. The circuit board assembly according to claim 4, characterized in that, The movable part includes a first extension extending along the first direction and a second extension extending along the second direction. The suspension wire connection part is connected to the first extension part, and the width of the movable part is greater than the width of the suspension wire connection part.

6. The circuit board assembly according to claim 5, characterized in that, The movable part and / or the suspension wire connection part are arranged in a centrally symmetrical manner.

7. The circuit board assembly according to claim 4, characterized in that, The suspension wire connection includes two parts, which are spaced apart and arranged in parallel.

8. The circuit board assembly according to any one of claims 1-7, characterized in that, The second pads include multiple pads, which are arranged circumferentially at intervals along the center of the second circuit board. The first pads include multiple pads, which are arranged one-to-one with the multiple second pads. The first pads and the second pads are arranged opposite to each other, and the size of the first pads and the size of the second pads are the same.

9. A chip-based image stabilization motor, characterized in that, The device includes a circuit board assembly as described in any one of claims 1-8, a motor cover, a chip, a magnet, a coil, and a base. The circuit board assembly is disposed on the base, the fixed part is fixedly connected to the base, a ball bearing assembly is provided between the movable part and the base, the chip is electrically connected to the second circuit board, the magnet is fixedly disposed on the surface of the base facing the circuit board assembly, the coil is disposed on the movable part, and the coil and the magnet are correspondingly disposed.

10. A camera module, characterized in that, It includes a lens assembly and a chip-based image stabilization motor as described in claim 9.

Images