Acoustic assembly and earphone
By integrating the speaker and microphone into the same acoustic component, the problem of large headphone size affecting wearing comfort is solved, achieving headphone miniaturization and improving the user experience.
CN224473397UActive Publication Date: 2026-07-07SHENZHEN QIAN HAI WOER TECH LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN QIAN HAI WOER TECH LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-07
AI Technical Summary
Technical Problem
Existing headphones have separate components for the speaker and microphone, resulting in a large in-ear portion that affects user comfort.
Method used
The speaker and microphone are integrated into the same acoustic component. The magnetic field amplification magnet, magnetic field output magnet, washer, diaphragm, front cover, and FB MIC bracket are all housed within the main frame. The voice coil is housed within the magnetic field output magnet, washer, and diaphragm. The FPC board is housed in a notch on the main frame, reducing the product size.
Benefits of technology
This effectively reduces the size of the headphones and improves user comfort.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224473397U_ABST
Abstract
The utility model discloses an acoustic assembly and earphone, this acoustic assembly includes main body support, PCBA board, magnetic field amplification magnet, FPC board, magnetic field output magnet, huasi, diaphragm, front cover, FB MIC support, voice coil, FB MIC, the PCBA board sets up in the top of main body support, the magnetic field amplification magnet, the magnetic field output magnet, huasi, diaphragm, front cover, FB MIC support from top to bottom in proper order set up in main body support, the FB MIC sets up in the FB MIC support, the voice coil sets up in the magnetic field output magnet, huasi, diaphragm, and the voice coil is located in the diaphragm, the FPC board with the FB MIC electric connection, the main body support is equipped with the gap, and the FPC board sets up in the gap. The utility model can solve the problem that the prior art earphone enters the ear part volume, and influences user wearing comfort problem.
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