An internet of things temperature and humidity collector circuit board

Abstract

The utility model discloses a kind of temperature and humidity collector circuit boards of Internet of Things, specifically related to circuit board technical field, including circuit board main body, the end surface of the circuit board main body is equipped with multiple limit slots, the circuit board main body includes substrate, first reinforcing plate and second reinforcing plate, multiple tapered slots are set in the both ends of the substrate, the end surface of the lamination of the substrate and first reinforcing plate is equipped with first connecting glue layer;The upper end of the substrate is equipped with second reinforcing plate.The utility model is actually used, under the corresponding setting state of substrate, first reinforcing plate, second reinforcing plate, tapered block and tapered slot, the mechanical strength of circuit board main body can be increased by substrate, first reinforcing plate and second reinforcing plate, to effectively increase the service life and stability of use of circuit board main body, simultaneously, the lamination area of substrate, first reinforcing plate and second reinforcing plate is increased by tapered block and tapered slot, to further increase the stability of use of circuit board main body.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a circuit board for an Internet of Things (IoT) temperature and humidity collector. Background Technology

[0002] Temperature and humidity sensors are devices that convert temperature and humidity into easily measurable and processable electrical signals. They are widely used and require placement in environments with significant temperature and humidity fluctuations, placing high demands on the circuit board. The printed circuit board (PCB) manufacturing industry has developed rapidly, but this development has also revealed many problems that need to be solved. For example, patent CN205611057U discloses a circuit board comprising an electrical layer, a non-electrical layer, and a thermally conductive layer. The thermally conductive layer is a thermally conductive adhesive, specifically a composition containing boron nitride particles and acrylic polymers. Multiple parallel copper tubes are laid within the thermally conductive layer, parallel to the layer and located in the center. The diameter of the copper tubes is smaller than the thickness of the thermally conductive layer. Since the environment where the circuit board is located typically has circulating air, the copper tubes in the circuit board align with the airflow, effectively providing air cooling and significantly accelerating heat dissipation. The wall thickness of the copper tubes is 0.5 mm. While ensuring the strength of the thermally conductive layer, the wall thickness of the copper tubes is minimized, and the diameter of the copper tubes is maximized.

[0003] When the above-mentioned device is in use, the heat-conducting layer is combined with the copper pipe. The structure is simple and practical, and the heat conduction is rapid. It can solve the problem of poor heat conduction of existing circuit boards. However, when the circuit board is working in a high temperature and humid environment, the circuit board is prone to moisture, which will affect the service life of the circuit board and may also cause short circuits in the internal circuit of the circuit board. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides an Internet of Things temperature and humidity collector circuit board. The technical problem to be solved by the present invention is: how to increase the mechanical strength of the temperature and humidity collector circuit board so as to make the heating and humidity collector circuit board more stable in use.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an Internet of Things temperature and humidity collector circuit board, comprising a circuit board body, wherein multiple limiting grooves are provided on the end face of the circuit board body, the circuit board body includes a substrate, a first reinforcing plate and a second reinforcing plate, multiple tapered grooves are provided on both ends of the substrate, and a first connecting adhesive layer is provided on the end face of the substrate and the first reinforcing plate where they are attached.

[0006] The upper end of the substrate is provided with a second reinforcing plate. The inner end faces of the first and second reinforcing plates are provided with multiple conical blocks. The joint between the substrate and the second reinforcing plate is provided with a second connecting adhesive layer.

[0007] In a preferred embodiment, the lower end of the first reinforcing plate is provided with a first conductive copper plate layer.

[0008] In a preferred embodiment, a first insulating layer is provided at the lower end of the first conductive copper plate layer.

[0009] In a preferred embodiment, the upper end of the second reinforcing plate is provided with a second conductive copper plate layer.

[0010] In a preferred embodiment, a second insulating layer is provided at the upper end of the second conductive copper plate layer.

[0011] In a preferred embodiment, the inner end faces of the plurality of conical grooves are in contact with the outer end faces of the plurality of conical blocks, and the first connecting adhesive layer and the second connecting adhesive layer are both modified epoxy resin adhesive components.

[0012] In a preferred embodiment, the substrate is a modified epoxy glass cloth laminate, and both the first reinforcing plate and the second reinforcing plate are modified epoxy glass fiber cloth laminates. The substrate, the first adhesive layer, the first reinforcing plate, the second adhesive layer, and the second reinforcing plate are connected by hot pressing.

[0013] In a preferred embodiment, the first insulating layer and the second insulating layer are protective coatings made of silicone resin as the core material.

[0014] The technical effects and advantages of this utility model are as follows:

[0015] In practical use, by correspondingly setting the substrate, the first reinforcing plate, the second reinforcing plate, the conical block, and the conical groove, the mechanical strength of the circuit board body can be increased by the substrate, the first reinforcing plate, and the second reinforcing plate, thereby effectively increasing the service life and stability of the circuit board body. At the same time, by increasing the bonding area of ​​the substrate, the first reinforcing plate, and the second reinforcing plate by the conical block and the conical groove, the stability of the circuit board body in use is further increased, thereby improving the stability of the circuit board body in high temperature and high humidity environments.

[0016] Meanwhile, with the first connecting adhesive layer and the second connecting adhesive layer in corresponding configuration, the stability of the connection between the substrate, the first reinforcing plate and the second reinforcing plate can be effectively increased. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0018] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the overall connection structure of this utility model.

[0021] Figure 3 This utility model Figure 1 Enlarged view of section A.

[0022] Figure 4 This utility model Figure 2 Enlarged view of section B in the middle.

[0023] The attached figures are labeled as follows: 1 Circuit board body, 2 Limiting groove, 3 Substrate, 4 First connecting adhesive layer, 5 First reinforcing plate, 6 First conductive copper plate layer, 7 First insulating layer, 8 Second connecting adhesive layer, 9 Second reinforcing plate, 10 Second conductive copper plate layer, 11 Second insulating layer, 12 Conical block, 13 Conical groove. Detailed Implementation

[0024] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that the description of this disclosure will be more complete and fully convey the concept of the exemplary embodiments to those skilled in the art. The drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0025] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more exemplary embodiments. Numerous specific details are provided in the following description to give a full understanding of exemplary embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced with one or more of the specific details omitted, or other methods, components, steps, etc., can be employed. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0026] This utility model provides a circuit board for an Internet of Things (IoT) temperature and humidity data acquisition device, such as... Figures 1 to 4 As shown, the circuit board body 1 includes a circuit board body 1, and a plurality of limiting grooves 2 are provided on the end face of the circuit board body 1. The circuit board body 1 includes a substrate 3, a first reinforcing plate 5, and a second reinforcing plate 9.

[0027] Multiple tapered grooves 13 are provided at both ends of the substrate 3. A first connecting adhesive layer 4 is provided at the end face where the substrate 3 and the first reinforcing plate 5 are attached. A second reinforcing plate 9 is provided at the upper end of the substrate 3. Multiple tapered blocks 12 are provided on the inner end faces of the first reinforcing plate 5 and the second reinforcing plate 9.

[0028] A second connecting adhesive layer 8 is provided at the bonding area of ​​the substrate 3 and the second reinforcing plate 9, and a first conductive copper plate layer 6 is provided at the lower end of the first reinforcing plate 5, and a first insulating layer 7 is provided at the lower end of the first conductive copper plate layer 6.

[0029] The upper end of the second reinforcing plate 9 is provided with a second conductive copper plate layer 10, and the upper end of the second conductive copper plate layer 10 is provided with a second insulating layer 11. The inner end faces of the plurality of conical grooves 13 are in contact with the outer end faces of the plurality of conical blocks 12. The contact area between the substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9 can be effectively increased through the contact state of the conical grooves 13 and the conical blocks 12. At the same time, the substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9 can be stably connected together through the first connecting adhesive layer 4 and the second connecting adhesive layer 8, thereby effectively increasing the strength of the circuit board body 1 and increasing the service life of the circuit board body 1.

[0030] The first connecting adhesive layer 4 and the second connecting adhesive layer 8 are both modified epoxy resin adhesive components. The first connecting adhesive layer 4 and the second connecting adhesive layer 8 can improve the heat resistance, flame retardancy, and extend the service life and storage period of the circuit board body 1, making the connection between the substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9 more stable. The substrate 3 is a modified epoxy glass cloth laminate, and the first reinforcing plate 5 and the second reinforcing plate 9 are both modified epoxy glass fiber laminates. The substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9 are pressed products made by hot pressing with chemically treated alkali-free electrical glass fiber cloth as the base material and epoxy resin as the adhesive. They have high mechanical strength at high temperature and good electrical performance stability under high humidity. At the same time, dividing the substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9 into three layers can effectively increase the mechanical strength of the board material composed of the substrate 3, the first reinforcing plate 5 and the second reinforcing plate 9, and effectively increase the service life and stability of the circuit board body 1.

[0031] The substrate 3, the first connecting adhesive layer 4, the first reinforcing plate 5, the second connecting adhesive layer 8, and the second reinforcing plate 9 are connected by hot pressing. The first insulating layer 7 and the second insulating layer 11 are protective coatings made of silicone resin as the core material, which can effectively increase the insulation effect of the insulating layer.

[0032] Finally, it should be noted that: the accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board for an Internet of Things (IoT) temperature and humidity sensor, comprising a circuit board body (1), characterized in that: The circuit board body (1) has multiple limiting grooves (2) on its end face. The circuit board body (1) includes a substrate (3), a first reinforcing plate (5) and a second reinforcing plate (9). Both ends of the substrate (3) have multiple tapered grooves (13). The end face of the substrate (3) and the first reinforcing plate (5) at the joint is provided with a first connecting adhesive layer (4). The upper end of the substrate (3) is provided with a second reinforcing plate (9), and the inner end faces of the first reinforcing plate (5) and the second reinforcing plate (9) are provided with multiple conical blocks (12). The bonding area of ​​the substrate (3) and the second reinforcing plate (9) is provided with a second connecting adhesive layer (8).

2. The circuit board for an IoT temperature and humidity sensor according to claim 1, characterized in that: The lower end of the first reinforcing plate (5) is provided with a first conductive copper plate layer (6).

3. The circuit board for an IoT temperature and humidity sensor according to claim 2, characterized in that: The lower end of the first conductive copper plate layer (6) is provided with a first insulating layer (7).

4. The circuit board for an IoT temperature and humidity sensor according to claim 1, characterized in that: The upper end of the second reinforcing plate (9) is provided with a second conductive copper plate layer (10).

5. The circuit board for an IoT temperature and humidity sensor according to claim 4, characterized in that: The upper end of the second conductive copper plate layer (10) is provided with a second insulating layer (11).

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