Anti-skid wear-resistant silica gel heat-conducting pad

Abstract

The utility model belongs to the technical field of heat conduction pad, concretely relates to a kind of anti-skid wear-resistant silica gel heat conduction pad, including heat conduction pad, one outer frame is attached around the heat conduction pad, the inner wall of the outer frame is attached with a contact plate;The contact plate adopts heat conduction silica gel material, the utility model, when using, the outer frame and contact plate are attached together, then heat conduction pad is attached between four contact plates in the inside of outer frame. Then heat conduction pad bottom is attached on the surface of corresponding chip, after attaching, the outer frame and contact plate will be around heat conduction pad and chip four around.In the use process, the silicon oil that flows out of heat conduction pad will first contact with contact plate, then along the through hole on contact plate flows to the inside of outer frame and contact plate, so that the activated carbon plate in the inside of outer frame and contact plate will absorb silicon oil, so as to prevent silicon oil from scattering on the electronic components around chip, pollute circuit board, cause the surface of element to form insulating layer, hinder heat transfer.

Description

Technical Field

[0001] This utility model belongs to the field of thermal pad technology, specifically relating to a non-slip and wear-resistant silicone thermal pad. Background Technology

[0002] In the field of electronic devices, chips are core components that generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it can lead to performance degradation or even damage. Therefore, efficient heat dissipation technology is crucial for ensuring the stable operation of electronic devices. Currently, using thermal pads for heat dissipation is a common and effective method. Thermal pads can adhere closely to the chip surface, rapidly conducting heat and significantly improving heat dissipation efficiency.

[0003] However, existing thermal pads have significant drawbacks in practical use. Since most thermal pads contain silicone oil, this oil can easily seep out under high temperatures or prolonged use. Once the silicone oil overflows, it spreads to electronic components around the chip, not only contaminating the circuit board but also forming an insulating layer on the component surface, hindering heat transfer. Utility Model Content

[0004] The purpose of this invention is to provide a non-slip and wear-resistant silicone thermal pad, aiming to solve the obvious defects of existing thermal pads in practical use. Since thermal pads often contain silicone oil, this oil easily seeps out under high-temperature environments or prolonged use. Once the silicone oil overflows, it spreads to electronic components around the chip, not only contaminating the circuit board but also forming an insulating layer on the component surface, hindering heat transfer.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a non-slip and wear-resistant silicone thermal pad, comprising a thermal pad, wherein an outer frame is adhesively fitted around the perimeter of the thermal pad, and a contact plate is adhesively fitted onto the inner wall of the outer frame;

[0006] The contact plate is made of thermally conductive silicone. The side of the contact plate has an inverted "U" shape. A set of through holes are equally spaced on the outer wall of the contact plate. The size of the contact plate is adapted to the size of the mounting part on one side of the outer frame.

[0007] In order to ensure that the bottom of the thermal pad is attached to the chip surface and the bottom of the outer frame can surround the chip, the thickness of the thermal pad is preferably two-thirds of the thickness of the outer frame, which is a non-slip and wear-resistant silicone thermal pad of this utility model.

[0008] In order to allow the silicone oil to flow along the through holes to the activated carbon plate during use, as a non-slip and wear-resistant silicone thermal pad of this utility model, preferably, the outer frame and the contact plate mounting part are equipped with an activated carbon plate, and one side of the activated carbon plate is tightly attached to the inner wall of the "U" shaped opening of the contact plate.

[0009] As a non-slip and wear-resistant silicone thermal pad of this utility model, preferably, the outer wall of the thermal pad is in close contact with the outer wall of one side of the contact plate.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] During use, the outer frame and contact plates are bonded together, and then the thermal pad is bonded between the four contact plates inside the outer frame. Next, the bottom of the thermal pad is bonded to the corresponding chip surface. After bonding, the outer frame and contact plates will surround the thermal pad and chip. During use, the silicone oil flowing from the thermal pad will first contact the contact plates, and then flow along the through-holes on the contact plates into the interior of the outer frame and contact plates. In this way, the activated carbon plates inside the outer frame and contact plates will absorb the silicone oil, thereby preventing silicone oil from spilling onto the electronic components around the chip, contaminating the circuit board and forming an insulating layer on the component surface, which would hinder heat transfer. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0013] Figure 1 This is a bottom view of the assembly structure provided in an embodiment of this application.

[0014] Figure 2 This is a schematic diagram of the outer frame structure provided in an embodiment of this application.

[0015] Figure 3 This is a schematic diagram of the activated carbon plate installation structure provided in an embodiment of this application.

[0016] Figure 4 This is a side view of the contact plate structure provided in an embodiment of this application.

[0017] In the diagram: 1. Thermal pad; 2. Outer frame; 21. Activated carbon plate; 3. Contact plate; 31. Through hole. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-4The present invention provides the following technical solution: a non-slip and wear-resistant silicone thermal pad, including a thermal pad 1, an outer frame 2 is glued around the thermal pad 1, and a contact plate 3 is glued to the inner wall of the outer frame 2.

[0020] The contact plate 3 is made of thermally conductive silicone. The side of the contact plate 3 has an inverted "U" shape. A set of through holes 31 are equally spaced on the outer wall of the contact plate 3. The size of the contact plate 3 is adapted to the size of the mounting part on one side of the outer wall of the outer frame 2.

[0021] Preferably, the thickness of the thermal pad 1 is two-thirds of the thickness of the outer frame 2.

[0022] In practical use, the thermal pad 1 is adhered to the surface of the chip, and the bottom of the outer frame 2 will surround the chip, thus enclosing the thermal pad 1 within the outer frame 2.

[0023] Preferably, an activated carbon plate 21 is installed at the mounting position of the outer frame 2 and the contact plate 3, and one side of the activated carbon plate 21 is tightly attached to the inner wall of the "U"-shaped opening of the contact plate 3.

[0024] Preferably, the outer wall of the thermal pad 1 is in close contact with one side of the outer wall of the contact plate 3.

[0025] In actual use, the silicone oil generated by the thermal pad 1 will come into contact with the outer wall of the contact plate 3 immediately. In this way, the silicone oil will flow into the interior of the through hole 31 on the outer wall of the contact plate 3 and will eventually be absorbed by the activated carbon plate 21.

[0026] During the installation of thermal pad 1, the outer frame 2 is bonded and fixed to the contact plate 3. To ensure stable bonding, it is recommended to use a high-strength, low-volatile adhesive suitable for electronic component assembly. Apply the adhesive evenly to the contact surface, ensuring the adhesive layer thickness is controlled between 0.1-0.2 mm to avoid affecting overall assembly accuracy due to excessive adhesive thickness. After application, quickly and precisely align and attach the outer frame 2 and contact plate 3, allowing the adhesive to initially cure.

[0027] Subsequently, the thermal pad 1 is embedded and bonded inside the outer frame 2, specifically in the gap area between the four contact plates 3. The installation of the thermal pad 1 must ensure a tight fit with the contact plates 3, while taking care to avoid wrinkles or air bubbles that could affect thermal conductivity.

[0028] Next, the bottom of the thermal pad 1 is bonded to the corresponding chip surface. The outer frame 2 and the contact plate 3 will completely surround the thermal pad 1 and the chip to form a closed protective structure.

[0029] During equipment operation, the thermal pad 1 may experience silicone oil seepage due to heat. When the silicone oil flows out, it will first come into contact with the contact plate 3. Subsequently, the silicone oil will flow along the evenly distributed through holes 31 on the contact plate 3, through capillary action and gravity, to the internal cavity formed by the outer frame 2 and the contact plate 3.

[0030] Inside the outer frame 2 and the contact plate 3, there is an activated carbon plate 21. The activated carbon plate 21 has a honeycomb porous structure and has a strong adsorption capacity. When silicone oil flows into the internal cavity, the activated carbon plate 21 can quickly absorb it, thereby effectively preventing silicone oil from overflowing and avoiding silicone oil from spreading around the chip and affecting the chip's heat dissipation.

[0031] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A non-slip and wear-resistant silicone thermal pad, comprising a thermal pad (1), characterized in that, An outer frame (2) is glued around the thermal pad (1), and a contact plate (3) is glued to the inner wall of the outer frame (2). The contact plate (3) is made of thermally conductive silicone. The side of the contact plate (3) is an inverted "U" shape. A set of through holes (31) are opened at equal intervals on the outer wall of the contact plate (3). The size of the contact plate (3) is adapted to the size of the installation part on one side of the outer wall of the outer frame (2).

2. The anti-slip and wear-resistant silicone thermal pad according to claim 1, characterized in that: The thickness of the thermal pad (1) is two-thirds of the thickness of the outer frame (2).

3. The anti-slip and wear-resistant silicone thermal pad according to claim 1, characterized in that: An activated carbon plate (21) is installed at the mounting position of the outer frame (2) and the contact plate (3), and one side of the activated carbon plate (21) is tightly attached to the inner wall of the "U"-shaped opening of the contact plate (3).

4. The anti-slip and wear-resistant silicone thermal pad according to claim 1, characterized in that: The outer wall of the heat-conducting pad (1) is in close contact with the outer wall of one side of the contact plate (3).

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