Silicon rod position adjustment device, cutting chamber and slicer
By using a drive mechanism to drive the top block to adjust the position of the silicon rod, the problems of complex and time-consuming silicon rod position adjustment and silicon powder accumulation are solved, achieving precise adjustment and improved cleanliness, thereby improving cutting efficiency and silicon wafer quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO GAOCE TECH CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-10
AI Technical Summary
In existing technologies, adjusting the position of the silicon rod is complex, time-consuming, and inaccurate, and the protruding structure inside the cutting chamber causes silicon powder to accumulate, affecting cutting efficiency and silicon wafer quality.
The silicon rod position is adjusted by a top block driven by a drive mechanism. The top block's extension and limiting steps enable precise adjustment, avoiding hard contact. When not in operation, it is completely retracted to seal the inner wall of the cutting chamber, reducing silicon powder accumulation.
It enables automated and precise adjustment of the silicon rod position, improving cutting accuracy and production efficiency, reducing silicon powder accumulation, and enhancing silicon wafer quality and the cleanliness of the cutting chamber.
Smart Images

Figure CN224476397U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of slicing machine technology, and more specifically, to a silicon rod position adjustment device, a cutting chamber, and a slicing machine. Background Technology
[0002] In the manufacturing process of semiconductor materials and photovoltaic silicon wafers, multi-wire dicing machines are key equipment used to cut hard and brittle materials such as silicon rods into silicon wafers. These dicing machines typically include a dicing chamber containing dicing wires and mechanical devices for fixing and adjusting the position of the silicon rod. The dicing accuracy and efficiency of the dicing machine directly affect the yield and production cost of silicon wafers; therefore, optimizing the process and equipment structure within the dicing chamber is crucial.
[0003] Inside the cutting chamber, especially in the pre-cutting position, the adjustment of the thicker edges at both ends of the silicon ingot ("thicker edges" refers to the edges at both ends of the silicon ingot that are thicker than the finished silicon wafers during cutting) is usually done manually or with the assistance of a loading robotic arm. The operator needs to lower the silicon ingot to a position close to the cutting wire mesh, measure its position visually or by other means, and then use tools to adjust the position of the workpiece plate to ensure proper alignment of the silicon ingot edges with the cutting wire mesh. As the cutting wire diameter becomes increasingly fine, identification and adjustment become more complex and time-consuming, posing a greater challenge to the operator's technical skills and physical endurance.
[0004] In non-working states, the device used to adjust the position of the thick wafer often has part of its structure still located in the cutting chamber. Even if it does not directly act on the cutting process, its structure protruding from the wall of the cutting chamber becomes a potential location for silicon powder accumulation.
[0005] During silicon ingot cutting, the cleanliness of the cutting chamber directly affects cutting efficiency and wafer quality. Any protrusions or unnecessary structures inside the cutting chamber can become accumulation points for silicon powder. This accumulation not only affects the cleanliness of the cutting chamber but can also contaminate the wafers during the cutting process due to silicon powder shedding, and may even damage the cutting lines, severely impacting production efficiency and wafer quality. Utility Model Content
[0006] The main purpose of this invention is to provide a silicon rod position adjustment device, a cutting chamber, and a slicing machine, which can facilitate rapid adjustment of the silicon rod position and effectively prevent the accumulation of silicon powder.
[0007] To achieve the above objectives, according to one aspect of the present invention, a silicon rod position adjustment device is provided, comprising:
[0008] Drive mechanism, having a drive unit;
[0009] A top block is disposed on the drive unit. The top block includes a first shaft segment and a second shaft segment arranged sequentially along the direction close to the drive unit. The first shaft segment and the second shaft segment form a first limiting step.
[0010] The first baffle is sleeved on the first shaft segment and can move relative to the first shaft segment. The first limiting step limits the movement position of the first baffle.
[0011] An elastic device is connected to the first baffle and provides the first baffle with an elastic force toward the drive unit;
[0012] The drive mechanism is connected to the top block drive, driving the top block to extend or retract;
[0013] The first shaft segment has a first position extending outward from the outside of the first baffle and a second position retracting inward from the inside of the first baffle.
[0014] Furthermore, the silicon rod position adjustment device also includes a second baffle, which is disposed at the first end of the drive unit. A top block is disposed on the side of the second baffle away from the drive unit. The first baffle is slidably sleeved on the first shaft segment. An elastic device is disposed between the first baffle and the second baffle, and the elastic device applies an elastic force close to the second baffle to the first baffle.
[0015] Furthermore, the top block includes a mounting block and a top head. The mounting block is fixedly connected to the drive unit, and the top head is located at the end of the mounting block away from the drive unit. The top head is made of a soft material; or, the top block is made of a soft material.
[0016] Furthermore, when the first shaft segment is in the first position, the length of the first shaft segment extending outward from the outside of the first baffle is L, 3mm≤L≤10mm; and / or, when the first shaft segment retracts into the inside of the first baffle, the end face of the first shaft segment away from the drive part is flush with the plate surface of the first baffle away from the drive part.
[0017] Furthermore, the outer and / or inner peripheral walls of the first baffle are provided with an annular sealing groove, and a sealing ring is provided in the sealing groove.
[0018] Furthermore, a push rod is provided between the drive unit and the top block, and the push rod is detachably connected to the top block and / or the drive unit.
[0019] Furthermore, the silicon rod position adjustment device also includes a guide sleeve, a push rod and / or a drive unit sleeved inside the guide sleeve, and moving along the guide sleeve.
[0020] Furthermore, a flange is provided at the end of the guide sleeve away from the top block.
[0021] According to another aspect of the present invention, a cutting chamber is provided, including a cutting chamber frame and the aforementioned silicon rod position adjustment device, wherein the silicon rod position adjustment device is mounted on the cutting chamber frame.
[0022] Furthermore, an installation cavity is provided on the side wall of the cutting chamber frame, and the silicon rod position adjustment device is set in the installation cavity. The cavity wall of the installation cavity is provided with a second limiting step, which limits the movement of the first baffle toward the drive mechanism.
[0023] Furthermore, the drive mechanism includes a fixing part, which is disposed inside the cutting chamber frame or outside the cutting chamber frame.
[0024] According to another aspect of the present invention, a slicing machine is provided, including the silicon rod position adjustment device described above or the cutting chamber described above.
[0025] By applying the technical solution of this utility model, the silicon rod position adjustment device drives the top block to extend and retract through the extension and retraction of the drive part of the drive mechanism. The extension and retraction of the top block is used to adjust the position of the silicon rod, so that the silicon rod can be accurately adjusted to the target position, thereby realizing the automatic adjustment of the silicon rod position. The operation is simple and convenient, and the adjustment accuracy is high. During the extension and retraction of the top block, since the top block includes a first shaft segment and a second shaft segment, and a first limiting step is formed between the first shaft segment and the second shaft segment, the extension position of the first shaft segment of the top block relative to the first baffle is guaranteed. The extension length of the top block relative to the first baffle is limited, ensuring that the top block can effectively adjust the position of the silicon rod. This allows the top block to extend a sufficient length beyond the first baffle to contact the silicon rod or workpiece stage, thereby adjusting the position of the silicon rod. This avoids damage to the silicon rod or workpiece stage caused by direct contact between the first baffle and the silicon rod. In addition, when not in operation, the top block can be completely retracted to the inside of the first baffle. Under the action of the top block, the first baffle is also completely retracted to the inside of the inner wall surface of the cutting chamber, or flush with the inner wall surface of the cutting chamber. The top block and the first baffle cooperate to form a sealing structure on the inner wall of the cutting chamber, so that there is no obvious protrusion structure in the cutting chamber. This effectively reduces the accumulation and shedding of silicon powder, ensures cutting accuracy and the cleanliness of the cutting chamber, and improves production efficiency and silicon wafer quality. Attached Figure Description
[0026] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:
[0027] Figure 1 A schematic diagram of the structure of a silicon rod position adjustment device according to an embodiment of the present invention is shown;
[0028] Figure 2 A partially enlarged structural schematic diagram of a silicon rod position adjustment device according to an embodiment of the present invention is shown;
[0029] Figure 3A schematic diagram of the cutting chamber according to an embodiment of the present invention is shown;
[0030] Figure 4 A schematic diagram of the silicon rod position adjustment device according to an embodiment of the present invention is shown when the top block is retracted.
[0031] Figure 5 A schematic diagram of the silicon rod position adjustment device according to an embodiment of the present invention is shown when the top block is extended.
[0032] Figure 6 A schematic diagram of the mounting cavity structure of the cutting chamber according to an embodiment of the present invention is shown; and
[0033] Figure 7 A schematic diagram of the top block of a silicon rod position adjustment device according to an embodiment of the present invention is shown.
[0034] The above figures include the following reference numerals:
[0035] 1. Drive mechanism; 2. Drive unit; 3. First baffle; 4. Top block; 5. First shaft section; 6. Second shaft section; 7. First limiting step; 8. Second baffle; 9. Elastic device; 10. Mounting block; 11. Top head; 12. Sealing groove; 13. Sealing ring; 14. Push rod; 15. Guide sleeve; 16. Flange; 17. Cutting chamber frame; 18. Workpiece table; 19. Mounting cavity; 20. Second limiting step; 21. First chamber; 22. Second chamber; 23. Third chamber; 24. Fourth chamber; 25. Fifth chamber; 26. Guide groove. Detailed Implementation
[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0037] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0038] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.
[0039] See also Figures 1 to 7As shown, according to an embodiment of the present invention, the silicon rod position adjustment device includes: a driving mechanism 1 having a driving part 2; a top block 4 disposed on the driving part 2, the top block 4 including a first shaft segment 5 and a second shaft segment 6 arranged sequentially along the direction close to the driving part 2, the first shaft segment 5 and the second shaft segment 6 forming a first limiting step 7; a first baffle 8 sleeved on the first shaft segment 5 and capable of moving relative to the first shaft segment 5, the first limiting step 7 limiting the movement position of the first baffle 8; an elastic device 9 connected to the first baffle 8 and providing the first baffle 8 with an elastic force toward the driving part 2; the driving mechanism 1 is drivenly connected to the top block 4, driving the top block 4 to extend or retract; the first shaft segment 5 has a first position extending outward of the first baffle 8 and a second position retracted inward of the first baffle 8.
[0040] The silicon rod position adjustment device drives the top block 4 to extend and retract via the drive unit 2 of the drive mechanism 1. This extension and retraction of the top block 4 adjusts the position of the silicon rod, allowing it to be precisely positioned to the target location. This achieves automated position adjustment of the silicon rod, offering simple and convenient operation with high precision. During the extension and retraction of the top block 4, the elastic device 9 provides an elastic force to the first baffle 8 towards the drive unit 2. After the top block 4 is fully extended, the first baffle 8 moves towards the drive unit 2 under the elastic force of the elastic device 9, causing the end of the top block 4 to extend beyond the first baffle 8. Since the top block 4 includes a first shaft segment 5 and a second shaft segment 6, and a first limiting step 7 is formed between the first shaft segment 5 and the second shaft segment 6, the extension position of the first shaft segment 5 relative to the first baffle 8 is guaranteed. This limits the extension length of the top block 4 relative to the first baffle 8, ensuring effective adjustment of the silicon rod position. The top block 4 extends sufficiently beyond the first baffle 8 to reach the silicon rod or workpiece stage. The 18-point contact mechanism allows for position adjustment of the silicon rod, preventing direct contact between the first baffle 8 and the silicon rod or workpiece stage 18, which could damage the silicon rod or workpiece stage 18. Furthermore, the top block 4 can fully retract into the inside of the first baffle 8 when not in operation. The first baffle 8, driven by the top block 4, also fully retracts into the inner wall surface of the cutting chamber, or is flush with the inner wall surface of the cutting chamber frame 17. The top block 4 and the first baffle 8 cooperate to form a sealing structure on the inner wall of the cutting chamber frame 17, eliminating any obvious protrusions within the cutting chamber. This effectively reduces the accumulation and shedding of silicon powder, ensuring cutting accuracy and the cleanliness of the cutting chamber, and improving production efficiency and silicon wafer quality.
[0041] In one embodiment, the drive mechanism 1 is, for example, a linear motor, an electric cylinder, a hydraulic cylinder, a pneumatic cylinder, a lead screw drive mechanism, etc.
[0042] When the drive mechanism 1 is a ball screw drive mechanism, it includes a drive motor and a ball screw. The drive part 2 is a ball screw, which is located at the end of the drive motor and rotates with the drive motor. The top block 4 is driven by the ball screw and moves telescopically under the drive of the ball screw. The top block 4 can be directly threaded onto the ball screw, and is restricted from rotating relative to the inner wall of the cutting chamber frame 17, thus converting the rotation of the ball screw into linear motion of the top block 4, achieving telescopic position adjustment. Alternatively, the top block 4 can be connected to the ball screw via a drive sleeve, which is threaded onto the ball screw and moves axially along the ball screw under its rotation. The top block 4 is connected to the end of the drive sleeve, thus achieving telescopic position adjustment with the movement of the drive sleeve. The outer contour cross-section of the drive sleeve is non-circular, such as elliptical or polygonal, to prevent the drive sleeve from rotating with the ball screw.
[0043] When the drive mechanism 1 is an electric cylinder, the drive unit 2 is an electric cylinder push rod.
[0044] In one embodiment, the silicon rod position adjustment device further includes a second baffle 3, which is disposed at the first end of the drive unit 2. The top block 4 is disposed on the side of the second baffle 3 away from the drive unit 2. The first baffle 8 is slidably sleeved on the first shaft segment 5. An elastic device 9 is disposed between the first baffle 8 and the second baffle 3. The elastic device 9 applies an elastic force close to the second baffle 3 to the first baffle 8.
[0045] In the silicon rod position adjustment device, the second baffle 3 is connected to the drive unit 2, the top block 4 is installed on the side of the second baffle 3 away from the drive unit 2, and the first baffle 8 can slide along the first shaft segment 5 and be applied an elastic force towards the second baffle 3 by the elastic device 9. This ensures that in the non-working state, when the top block 4 retracts, the first baffle 8 can remain in the preset position under the stop action of the side wall of the cutting chamber frame 17, so that it is flush with or slightly lower than the inner wall surface of the cutting chamber frame 17. The top block 4 can be completely retracted to a position that does not affect the cleaning of the cutting chamber. In the working state, when the top block 4 extends, under the action of the elastic device 9, the first baffle 8 is stretched towards the second baffle 3 and gradually approaches the first limiting step 7. When it contacts the first limiting step 7, it stops on the first limiting step 7 and then extends under the driving action of the drive unit 2. As the first baffle 8 gradually approaches the first limiting step 7, it can slide relative to the first shaft segment 5 toward the second baffle 3, allowing the first shaft segment 5 to extend a certain distance beyond the first baffle 8. This ensures that the top block 4, rather than the harder first baffle 8, is pushing the workpiece stage 18. This allows for precise adjustment of the position of the top block 4 while preventing the hard material of the first baffle 8 from causing a hard impact on the silicon rod, protecting the integrity of the silicon rod surface, and effectively preventing damage to the silicon rod.
[0046] In one embodiment, the top block 4 includes a mounting block 10 and a top head 11. The mounting block 10 is fixedly connected to the drive unit 2, and the top head 11 is disposed at the end of the mounting block 10 away from the drive unit 2. The top head 11 is made of a soft material; or, the top block 4 is made of a soft material.
[0047] In one embodiment, the top block 4 includes a rigid mounting block 10 and a flexible mandrel 11. The mounting block 10 is moved by the driving unit 2, and the flexible mandrel 11 gently pushes the silicon rod to adjust its position when in contact with it, effectively avoiding surface damage to the silicon rod that may be caused by rigid contact, thus ensuring high quality of silicon wafer cutting. The combination of the rigid mounting block 10 and the flexible mandrel 11 forms a more reasonable top block 4, which can ensure the rigidity of the top block 4, improve the ejection effect of the top block 4, and prevent the top block 4 from deforming excessively when subjected to large resistance, thereby reducing the ejection effect of the top block 4. At the same time, the flexible mandrel 11 can contact the workpiece stage 18 or the silicon rod, avoiding damage to the workpiece stage 18 or the silicon rod due to excessive hardness of the material.
[0048] In the preparatory stage before silicon rod cutting, especially during the relative position adjustment of the silicon rod and the cutting wire mesh, the soft mandrel 11 pushes the silicon rod to achieve precise position adjustment, avoiding potential damage to the silicon rod caused by hard materials. Under the control of the drive mechanism 1, the drive unit 2 drives the top block 4 to extend, and the soft mandrel 11 contacts and pushes the workpiece stage 18 or the silicon rod until it reaches the ideal position, and then retracts, completing the position adjustment.
[0049] In one embodiment, the top block 4 is made entirely of a soft material.
[0050] The top block 4 is made entirely of a soft material. Driven by the drive mechanism, it can gently contact and push the silicon rod to a precise position, effectively preventing surface damage to the silicon rod that may be caused by hard contact and improving cutting accuracy. In addition, the fact that the top block 4 is made entirely of a soft material also reduces the processing difficulty and cost of the top block 4.
[0051] Soft materials, such as rubber.
[0052] In one embodiment, when the first shaft segment 5 is in the first position, the length of the first shaft segment 5 extending outward from the first baffle 8 is L, where 3mm≤L≤10mm.
[0053] When the first shaft segment 5 is in the first position, its precise length L extending beyond the first baffle 8 is controlled between 3mm and 10mm, ensuring that the top block 4 can provide a stable and appropriate force when pushing the silicon rod. Because the workpiece stage 18 and the silicon rod have large masses, the soft top block 4 requires a large force to push it, which may cause slight deformation. By limiting the length L of the first shaft segment 5 extending beyond the first baffle 8, a deformation allowance can be reserved for the first shaft segment 5, ensuring that the top block 4 still extends beyond the first baffle 8 after deformation, thus preventing collision between the first baffle 8 and the workpiece stage 18.
[0054] In one embodiment, when the first shaft segment 5 retracts into the inner side of the first baffle 8, the end face of the first shaft segment 5 away from the drive part 2 is flush with the plate surface of the first baffle 8 away from the drive part 2.
[0055] When the first shaft section 5 retracts to the inside of the first baffle 8, it ensures that the end face of the first shaft section 5 is flush with the surface of the first baffle 8. This effectively eliminates any potential protrusions in the cutting chamber when the silicon rod position adjustment device is not in operation, preventing the accumulation and fall of silicon powder on the boss, simplifying the cleaning work of the cutting chamber, and significantly improving the overall efficiency of the production line and the cleanliness of the working environment.
[0056] In one embodiment, the outer peripheral wall and / or inner peripheral wall of the first baffle 8 are provided with an annular sealing groove 12, and a sealing ring 13 is provided in the sealing groove 12.
[0057] An annular sealing groove 12 is provided on the outer and / or inner peripheral walls of the first baffle 8, and a sealing ring 13 is provided in the sealing groove 12. During the movement of the first baffle 8, it can ensure that the first baffle 8 is tightly attached to the inner hole wall of the cutting chamber frame 17 and the outer peripheral wall of the top block 4. The sealing ring 13 is used to seal the installation space of the silicon rod position adjustment device on the side wall of the cutting chamber frame 17, effectively isolating the external environment, preventing the leakage of water vapor and silicon powder during the cutting operation, ensuring that precision components such as electric cylinders are not contaminated, reducing the cleaning cost of the production area, maintaining a good workshop environment and equipment operating conditions, further improving the safety and production efficiency of the production line, and extending the service life of the equipment.
[0058] In one embodiment, a push rod 14 is provided between the drive unit 2 and the top block 4, and the push rod 14 is detachably connected to the top block 4 and / or the drive unit 2.
[0059] By installing a push rod 14 between the top block 4 and the drive unit 2, the working length of the drive unit 2 can be extended by the push rod 14, so that the drive unit 2 extends into the cutting chamber in the working state. This prevents the drive mechanism 1 from being directly exposed in the cutting chamber, reduces the possibility of silicon powder falling on the drive mechanism 1, protects the drive mechanism 1, and extends the service life of the drive mechanism 1.
[0060] The drive unit 2 is connected to the top block 4 by a detachable push rod 14, which allows the top block 4 and the push rod 14 to be easily replaced when worn or damaged without affecting other parts of the device, thus ensuring the long-term stable operation of the equipment.
[0061] In one embodiment, the first end of the push rod 14 is provided with a threaded hole, and the top block 4 has a recessed groove inside. A connecting hole is provided at the bottom of the recessed groove. A bolt is placed in the recessed groove, passes through the connecting hole, and is threadedly connected to the threaded hole at the first end of the push rod 14, thereby achieving a fixed connection between the push rod 14 and the top block 4. The second end of the push rod 14 is provided with a threaded connector. The driving mechanism is, for example, an electric cylinder, and the driving part 2 is an electric cylinder push rod. The end of the electric cylinder push rod is provided with a threaded connector. The push rod 14 is threadedly connected to the threaded connector at the end of the flashlight push rod through the threaded connector, thereby achieving a fixed connection between the push rod 14 and the electric cylinder push rod.
[0062] In one embodiment, when the top block 4 includes a mounting block 10 and a top head 11, the recess and connecting hole are both located within the mounting block 10. The top head 11 is a block structure. After the bolt is installed in the connecting hole within the mounting block 10, the top head 11 can be installed at the end of the mounting block 10 and fixedly connected to it. This not only seals the recess, preventing moisture or silicon powder from entering, thus protecting the bolt, but also allows the protruding end of the mounting block 10 to form a soft structure, preventing damage to the workpiece stage 18 or the silicon rod during silicon rod position adjustment. The top head 11 can be fixedly connected to the mounting block 10 by adhesive bonding or interference fit. In one embodiment, a slot can also be provided at the opening of the recess, allowing the top head 11 to have a protrusion extending into the recess. A hook is provided on the protrusion, which hooks onto the slot, achieving a fixed connection between the top head 11 and the mounting block 10.
[0063] In one embodiment, the silicon rod position adjustment device further includes a guide sleeve 15, a push rod 14 and / or a drive part 2 sleeved inside the guide sleeve 15 and moving along the guide sleeve 15.
[0064] During the adjustment of the silicon rod position, the push rod 14 may tilt to a certain extent due to the weight of the silicon rod, which will affect the service life of the electric cylinder.
[0065] The guide sleeve design in the silicon rod position adjustment device allows the push rod 14 and / or drive unit 2 to slide smoothly within the trajectory defined by the guide sleeve 15, which greatly enhances the linearity and stability of the push rod movement, effectively avoids possible skewing or vibration during the pushing of the silicon rod, and ensures the high accuracy of silicon rod position adjustment. At the same time, the use of the guide sleeve also reduces friction and wear between the push rod and the cutting chamber frame, extending the service life of the equipment.
[0066] The guide sleeve 15 is fixed inside the cutting chamber frame 17 and supported by the cutting chamber frame 17. The push rod 14 and the electric cylinder push rod move within the guide sleeve 15. The guide sleeve 15 is made of polypropylene or other inorganic materials, which have a low coefficient of friction with metals and a strong guiding ability for the movement of the push rod 14 and the electric cylinder push rod, ensuring that the electric cylinder push rod remains horizontal in the extended state. By adding the guide sleeve 15 to guide the push rod 14 and the electric cylinder push rod, radial torque can be effectively avoided from the electric cylinder push rod, extending the service life of the electric cylinder.
[0067] In one embodiment, a flange 16 is provided at the end of the guide sleeve 15 away from the top block 4.
[0068] A flange 16 is fitted to the end of the guide sleeve 15 furthest from the top block 4. This flange not only provides a stable connection between the guide sleeve 15 and the cutting chamber frame 17, ensuring the robustness and positioning accuracy of the guide sleeve 15 when bearing the power transmission of the push rod 14, but also facilitates the installation and disassembly of the guide sleeve 15, simplifying the maintenance process. Furthermore, the combination of the flange 16 and the guide sleeve 15 forms a closed guide channel, effectively preventing external impurities such as silicon powder from entering the guide sleeve, protecting the smooth movement of the push rod 14, reducing maintenance frequency, and thus improving the overall efficiency and reliability of the device.
[0069] In one embodiment, the silicon rod position adjustment device may further include a mounting sleeve, in which all the aforementioned structures are installed. The outer periphery of the mounting sleeve is cylindrical. After all other structures of the silicon rod position adjustment device are installed within the mounting sleeve, the mounting sleeve is then installed onto the cutting chamber frame 17, completing the overall installation of the silicon rod position adjustment device. In this case, the structure of the mounting sleeve can be processed separately, reducing the processing difficulty and cost of the cutting chamber frame 17, and also facilitating the replacement and maintenance of the silicon rod position adjustment device.
[0070] See also Figures 1 to 7 As shown, according to an embodiment of the present invention, the cutting chamber includes a cutting chamber frame 17 and the aforementioned silicon rod position adjustment device, which is mounted on the cutting chamber frame 17.
[0071] In this embodiment, the installation position of the silicon rod position adjustment device corresponds to the workpiece stage 18, ensuring that when the device is working, the top block 4 can accurately contact and push the workpiece plate or silicon rod, realizing fine adjustment of the silicon rod thickness position. This not only improves the accuracy and efficiency of the adjustment process and reduces the intervention of operators and the uncertainty of manual adjustment, but also, due to the good integration of the device with the cutting chamber frame, makes the entire internal structure of the cutting chamber compact and the operating space optimized, further improving the automation level of the cutting operation and the smoothness of the production process, providing strong technical support for high-quality silicon wafer cutting.
[0072] The entire silicon rod position adjustment device is installed at the rear of the cutting chamber and is secured to the cutting chamber frame 17 by an electric cylinder mounting plate. The entire silicon rod position adjustment device is installed directly above the lower cutting spindle box, and its horizontal height is the same as that of the workpiece plate 18 in the cutting preparation position.
[0073] In this embodiment, since the silicon rod position adjustment device is directly set to correspond to the workpiece stage 18, after the silicon rod reaches the vicinity of the confirmed position, the position of the silicon rod on the workpiece stage 18 can be directly adjusted by the silicon rod position adjustment device. There is no need to adjust the position of the silicon rod up and down and adjust the position of the thick wafer of the silicon rod by a robotic arm. The thick wafer position adjustment process can be completed in one go without multiple lifting and lowering operations, which effectively reduces the operation time and does not occupy the loading time of the robotic arm, thus effectively improving the production changeover efficiency.
[0074] In one embodiment, a mounting cavity 19 is provided on the side wall of the cutting chamber frame 17, and a silicon rod position adjustment device is provided in the mounting cavity 19. The cavity wall of the mounting cavity 19 is provided with a second limiting step 20, which limits the movement of the first baffle 8 toward the drive mechanism 1.
[0075] A silicon rod position adjustment device is installed in the mounting cavity 19 on the side wall of the cutting chamber frame 17. The second limiting step 20 on the cavity wall precisely limits the retraction movement of the first baffle 8, ensuring that the first baffle 8 can accurately stop at the preset position when the silicon rod position adjustment device is not in operation. This avoids excessive retraction that could cause a large step difference inside the cutting chamber, which could easily lead to silicon powder accumulation. At the same time, it maintains the airtightness of the device and the cutting chamber environment, effectively protecting the internal precision components from contamination and extending the service life of the device. It also optimizes the spatial layout inside the cutting chamber, ensuring the safety and smoothness of equipment operation, and improving the overall efficiency and environmental cleanliness of the production line.
[0076] In this embodiment, the mounting cavity 19 includes a first chamber 21, a second chamber 22, a third chamber 23, a fourth chamber 24, and a fifth chamber 25. A first baffle 8 is installed within the first chamber 21, and the length of the first baffle 8 along the telescopic direction is equal to or slightly less than the depth of the first chamber 21. "Slightly less" means that the height difference between the two is within 1 mm. This value can be adjusted as needed. A second limiting step 20 is formed between the first chamber 21 and the second chamber 22, which can stop the movement of the first baffle 8. A portion of the top block 4 is located in the first chamber 21, and another portion is located in the second chamber 22. The second baffle 3 is located in the second chamber 22. A stepped structure is formed between the second chamber 22 and the third chamber 23, allowing the second baffle 3 to be stopped outside the third chamber 23 by this stepped structure. The guide sleeve 15 is fixed inside the third chamber 23. The push rod 14 is sleeved inside the guide sleeve 15 and can slide along the guide of the guide sleeve 15. The flange 16 is located in the fourth chamber 24 and is bolted to the wall of the fourth chamber to achieve the installation and fixation of the guide sleeve 15. The drive mechanism 1 is located in the fifth chamber 25. The end of the drive mechanism 1 is provided with a mounting flange, and the drive mechanism 1 is fixedly mounted on the end wall of the fifth chamber 25 through the mounting flange.
[0077] A guide groove 26 is provided on the inner side wall of the first chamber 21 near the cutting chamber frame 17. The guide groove 26 gradually expands along the direction near the inner side wall of the cutting chamber frame 17, which can form a guiding structure for the sealing ring 13 on the outer peripheral wall of the first baffle 8, reducing the difficulty of the first baffle 8 retracting after the silicon rod position adjustment device has completed its work, and also preventing the sharp corners of the first chamber 21 at the opening from damaging the sealing ring 13, thus effectively protecting the sealing ring 13.
[0078] In one embodiment, the drive mechanism 1 includes a fixing part, which is disposed inside the cutting chamber frame 17 or outside the cutting chamber frame 17.
[0079] The electric cylinder can be installed deep inside the cutting chamber frame 17. Its installation position can be adjusted forward and backward, or it can be installed completely outside the cutting chamber. It works with the extended guide sleeve and extended push rod to push the workpiece stage and silicon rod.
[0080] The working process of the silicon rod position adjustment device is as follows:
[0081] The automated loading device pushes the workpiece plate 18 into position using a robotic arm. The robotic arm then retracts. The operator controls the silicon rod to move downwards, positioning it close to the cutting wire mesh and within the recognition range of the identification equipment. The identification equipment positions the wire mesh and the edge of the silicon rod. Subsequently, the silicon rod position adjustment device extends its top block 4, pushing the workpiece plate 18 to the target position. The top block 4 retracts. The silicon rod rises back to the standby position. The silicon rod position adjustment device has now completed its operation. Subsequent cutting processes can proceed normally.
[0082] According to an embodiment of the present invention, the slicing machine includes the silicon rod position adjustment device described above or the cutting chamber described above.
[0083] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0084] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0085] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0086] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A silicon rod position adjustment device, characterized in that, include: The drive mechanism (1) has a drive unit (2); A top block (4) is disposed on the drive unit (2). The top block (4) includes a first shaft segment (5) and a second shaft segment (6) arranged sequentially along the direction close to the drive unit (2). The first shaft segment (5) and the second shaft segment (6) form a first limiting step (7). The first baffle (8) is sleeved on the first shaft segment (5) and can move relative to the first shaft segment (5). The first limiting step (7) limits the movement position of the first baffle (8). An elastic device (9) is connected to the first baffle (8) and provides the first baffle (8) with an elastic force toward the drive unit (2); The drive mechanism (1) is driven to extend or retract the top block (4); The first shaft segment (5) has a first position extending outward from the first baffle (8) and a second position retracted inward from the first baffle (8).
2. The silicon rod position adjustment device according to claim 1, characterized in that, The silicon rod position adjustment device further includes a second baffle (3), which is disposed at the first end of the drive unit (2). The top block (4) is disposed on the side of the second baffle (3) away from the drive unit (2). The first baffle (8) is slidably sleeved on the first shaft segment (5). The elastic device (9) is disposed between the first baffle (8) and the second baffle (3). The elastic device (9) applies an elastic force close to the second baffle (3) to the first baffle (8).
3. The silicon rod position adjustment device according to claim 1, characterized in that, The top block (4) includes a mounting block (10) and a top head (11). The mounting block (10) is fixedly connected to the driving part (2). The top head (11) is located at one end of the mounting block (10) away from the driving part (2). The top head (11) is made of a soft material; or, the top block (4) is made of a soft material.
4. The silicon rod position adjustment device according to claim 1, characterized in that, When the first shaft segment (5) is in the first position, the length of the first shaft segment (5) extending out of the outside of the first baffle (8) is L, 3mm≤L≤10mm; and / or, when the first shaft segment (5) retracts into the inside of the first baffle (8), the end face of the first shaft segment (5) away from the driving part (2) is flush with the plate surface of the first baffle (8) away from the driving part (2).
5. The silicon rod position adjustment device according to claim 1, characterized in that, The outer and / or inner peripheral walls of the first baffle (8) are provided with an annular sealing groove (12), and a sealing ring (13) is provided in the sealing groove (12).
6. The silicon rod position adjustment device according to claim 1, characterized in that, A push rod (14) is provided between the drive unit (2) and the top block (4), and the push rod (14) is detachably connected to the top block (4) and / or the drive unit (2).
7. The silicon rod position adjustment device according to claim 6, characterized in that, The silicon rod position adjustment device further includes a guide sleeve (15), and the push rod (14) and / or the drive part (2) are sleeved in the guide sleeve (15) and move along the guide sleeve (15).
8. The silicon rod position adjustment device according to claim 7, characterized in that, A flange (16) is provided at the end of the guide sleeve (15) away from the top block (4).
9. A cutting chamber, comprising a cutting chamber frame (17), characterized in that, It also includes a silicon rod position adjustment device according to any one of claims 1 to 7, the silicon rod position adjustment device being mounted on the cutting chamber frame (17).
10. The cutting chamber according to claim 9, characterized in that, The cutting chamber frame (17) has an installation cavity (19) on its side wall. The silicon rod position adjustment device is located in the installation cavity (19). The cavity wall of the installation cavity (19) is provided with a second limiting step (20). The second limiting step (20) limits the movement of the first baffle (8) toward the driving mechanism (1).
11. The cutting chamber according to claim 9, characterized in that, The drive mechanism (1) includes a fixing part, which is disposed inside the cutting chamber frame (17) or outside the cutting chamber frame (17).
12. A slicer, characterized in that, It includes the silicon rod position adjustment device according to any one of claims 1 to 8 or the cutting chamber according to any one of claims 9 to 11.