Multi-zone temperature controlled substrate table for a vapor deposition apparatus

Abstract

The utility model relates to a gas deposition technical field discloses a kind of multi-zone temperature control substrate table of gas deposition equipment, including top plate and bottom plate, the upper side of top plate is evenly formed multiple partitions, further include temperature control component, temperature control component includes multiple heating units being arranged in top plate, multiple cooling units being arranged in bottom plate, multiple thermocouples and control unit;The downside of top plate is correspondingly each partition and is laid out with curved strip groove, thermocouple and heating unit are arranged in corresponding strip groove;Cooling unit is arranged in bottom plate corresponding each partition;Control unit is connected with thermocouple, heating unit and cooling unit. By forming partition on the base, and by heating unit to the partition is heated and by cooling unit to the partition is cooled, so as to preferably control the base temperature of the partition, so that it can make the temperature of the product placed on the partition uniform in actual use, preferably guarantee film formation quality.

Description

Technical Field

[0001] This utility model relates to the field of vapor deposition technology, and more specifically, to a multi-zone temperature-controlled substrate stage for vapor deposition equipment. Background Technology

[0002] Microwave plasma chemical vapor deposition (MPCVD) is a widely used technique in the semiconductor field and is also extensively used to manufacture precision diamond films. It involves transmitting microwaves generated by a microwave generator into the reaction chamber (vacuum chamber) of the device via a waveguide transmission system. A mixture of methane and hydrogen gases is then introduced into the reaction chamber. Under microwave excitation, a glow discharge is generated within the reaction chamber, ionizing the molecules of the reaction gas and producing plasma, which deposits a diamond film onto the substrate.

[0003] Currently, during product growth, the surface of the product needs to be maintained at a certain temperature; excessively high or low temperatures will affect product growth. However, in some MPCVD devices, the plasma is spherical, and its distance from the substrate stage is uneven, leading to uneven substrate stage temperature and high temperatures. This can easily result in uneven temperature distribution of the diamond film, significantly affecting the film quality and physicochemical properties. Utility Model Content

[0004] The purpose of this invention is to provide a multi-zone temperature-controlled substrate stage for a vapor deposition apparatus to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A multi-zone temperature-controlled substrate stage for vapor deposition equipment includes a top plate and a bottom plate fixed to the lower side of the top plate. The upper side of the top plate is uniformly formed with multiple zones. The stage also includes a temperature control component for temperature regulation of each zone. The temperature control component includes multiple heating units in the top plate, multiple cooling units in the bottom plate, multiple thermocouples, and a control unit.

[0007] The lower side of the top plate is provided with curved strip grooves corresponding to each zone, and the thermocouples and the heating units are located in the corresponding strip grooves; the cooling units are located in the bottom plate corresponding to each zone; the control unit is connected to the thermocouples, the heating units and the cooling units.

[0008] Preferably, the cooling unit includes a first cooling water branch and a second cooling water branch formed in the base plate, the first cooling water branch and the second cooling water branch are connected, and an inlet pipe connected to the first cooling water branch and an outlet pipe connected to the second cooling water branch are provided outside the base plate.

[0009] Preferably, it also includes a lifting assembly for driving the top and bottom plates to rise and fall.

[0010] Preferably, the lifting assembly includes a lifting column located on the lower side of the base plate, and the lifting column has a wiring cavity for installing the water inlet pipe and the water outlet pipe.

[0011] The lifting assembly also includes a mounting platform, through which the lifting column is installed, and on the mounting platform are drive components for driving the lifting column to rise and fall.

[0012] Preferably, a rotating cylinder is rotatably mounted on the mounting platform, and a lifting column is threaded through the rotating cylinder. A bracket is provided at the bottom end of the lifting column, and a positioning column is provided on the mounting platform that passes through the bracket.

[0013] Preferably, the driving component includes a first gear fixedly disposed at the upper end of the rotating cylinder, and a second gear meshing with the first gear is disposed on the mounting plate via a servo motor.

[0014] Preferably, the top of the lifting column extends outward to form a mounting section, which is mounted to the lower side of the base plate by screws.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model forms a partition on the substrate, heats the partition by a heating unit, and cools the partition by a cooling unit, thereby better controlling the substrate temperature of the partition. This ensures that the temperature of the product placed on the partition remains uniform during actual use, thus better guaranteeing the film formation quality.

[0017] 2. This utility model can adjust the height of the base in the vacuum chamber through the lifting component, and can better adjust the distance between the base and the plasma above the vacuum chamber, so as to maintain the growth of the product placed on the base at a suitable temperature, thereby improving the film quality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a multi-zone temperature-controlled substrate stage for a vapor deposition apparatus according to the present invention.

[0019] Figure 2 This is a schematic diagram of the top plate in this utility model.

[0020] Figure 3 This is a schematic diagram of the structure of the base plate in this utility model.

[0021] Figure 4 This is one of the structural schematic diagrams of the lifting component in this utility model.

[0022] Figure 5 This is the second structural schematic diagram of the lifting component in this utility model.

[0023] The meanings of the labels in the diagram are as follows:

[0024] 100. Top plate; 110. Bottom plate; 120. Lifting column; 121. Bracket; 130. Mounting platform; 131. Positioning column; 140. Rotating cylinder; 141. First gear; 150. Servo motor; 151. Second gear; 160. Sealing flange;

[0025] 200. Zone; 201. Strip groove;

[0026] 301, First cooling water branch; 302, Second cooling water branch; 310, Inlet pipe; 320, Outlet pipe;

[0027] 401. Mounting part; 402. Through hole;

[0028] 501. Cable routing cavity; 510. Bearing mounting base. Detailed Implementation

[0029] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are merely illustrative of this utility model and are not intended to limit it.

[0030] The following is in conjunction with the appendix Figures 1-5 This embodiment will be described in further detail.

[0031] This embodiment of a vapor deposition apparatus includes a multi-zone temperature-controlled substrate stage, comprising a top plate 100 and a bottom plate 110 fixed to the lower side of the top plate 100. The upper side of the top plate 100 is uniformly formed with multiple zones 200. It also includes a temperature control component for temperature regulation of each zone 200. The temperature control component includes multiple heating units disposed in the top plate 100, multiple cooling units disposed in the bottom plate 110, multiple thermocouples, and a control unit.

[0032] The lower side of the top plate 100 is provided with curved strip grooves 201 corresponding to each partition 200, and the thermocouples and heating units are located in the corresponding strip grooves 201; the cooling units are located in the bottom plate 110 corresponding to each partition 200; the control unit is connected to the thermocouples, heating units and cooling units.

[0033] In this embodiment, a base is formed between the top plate 100 and the bottom plate 110. In actual use, the base is set in the vacuum chamber of an existing vapor deposition equipment.

[0034] In this embodiment, both the top plate 100 and the bottom plate 110 are circular, wherein, for example... Figure 2As shown, four fan-shaped partitions 200 are evenly formed on the upper side of the top plate 100. The strip grooves 201 are curved and arranged in the corresponding partitions 200. When the top plate 100 is installed on the bottom plate 110, the bottom plate 110 can block the opening of the strip grooves 201, so that the heating unit and the thermocouple can be better encapsulated in the strip grooves 201.

[0035] The heating unit is a conventional heating wire distributed along the strip groove 201 to heat the corresponding partition 200 on the top plate 100, thereby raising the temperature of the corresponding partition 200. The cooling unit is used to cool down the top plate 100. Since the cooling unit is set in the corresponding partition 200, it can cool down the corresponding partition 200. The thermocouple is a conventional structure, which is set in the strip groove 201 between the top plate 100 and the heating unit, and is used to measure the temperature of the corresponding partition 200 on the top plate 100.

[0036] It should be noted that the control unit in this embodiment can be implemented using a controller, programmable logic device, or other hardware in the prior art. The control unit is connected to the thermocouple and is used to receive the temperature signal measured by the thermocouple; the control unit is also connected to the heating unit and the cooling unit and is used to control the operation of the heating unit and the cooling unit according to the temperature signal measured by the thermocouple, thereby completing the temperature control of the partition 200. Thus, the base has multiple temperature partitions and can individually control the temperature of each temperature partition.

[0037] In this embodiment, the cooling unit includes a first cooling water branch 301 and a second cooling water branch 302 formed in the base plate 110. The first cooling water branch 301 and the second cooling water branch 302 are connected. The base plate 110 is provided with an inlet pipe 310 that connects to the first cooling water branch 301 and an outlet pipe 320 that connects to the second cooling water branch 302.

[0038] In this embodiment, as Figure 3 As shown, the first cooling water branch 301 is arranged in a curved manner to extend into the base plate 110, and the second cooling water branch 302 is arranged radially along the base plate 110 to extend to the outside of the side wall of the base plate 110. The ends of the first cooling water branch 301 and the second cooling water branch 302 located in the base plate 110 are connected to form a cooling water flow channel. Therefore, in actual use, cooling water enters the cooling water flow channel through the inlet pipe 310 and flows out through the outlet pipe 320, thereby cooling the partition 200 through heat exchange.

[0039] In this embodiment, a lifting assembly for driving the top plate 100 and the bottom plate 110 to rise and fall is also included.

[0040] In this embodiment, the lifting assembly is located outside the vacuum chamber of the existing vapor deposition equipment. The height of the stage inside the vacuum chamber can be adjusted by the lifting assembly, which can better adjust the distance between the stage and the plasma above the vacuum chamber, so that the growth of the product placed on the stage is maintained at a suitable temperature, thereby improving the film quality.

[0041] In this embodiment, the lifting assembly includes a lifting column 120 disposed on the lower side of the base plate 110, and the lifting column 120 is provided with a wiring cavity 501 for installing the water inlet pipe 310 and the water outlet pipe 320.

[0042] The lifting assembly also includes a mounting platform 130, with the lifting column 120 passing through the mounting platform 130. The mounting platform 130 is provided with a drive component for driving the lifting column 120 to rise and fall.

[0043] In this embodiment, as Figure 4 As shown, the top end of the lifting column 120 extends outward to form a mounting part 401. The mounting part 401 is mounted on the lower side of the base plate 110 by screws, thereby better realizing the installation of the base on the lifting column 120.

[0044] In practical use, the lifting column 120 passes through the sealing flange 160 at the bottom of the vacuum chamber and is mounted on the mounting platform 130 in a liftable manner. The lifting column 120 is driven to rise and fall by the driving component on the mounting platform 130, which in turn drives the base to rise and fall within the vacuum chamber.

[0045] It should be noted that, in order to ensure the airtightness of the vacuum chamber, a sealing gasket is installed at the point where the lifting column 120 passes through the sealing flange 160 to achieve a sealed sliding connection between the two.

[0046] Among them, combined Figure 5 As shown, the opening of the wiring cavity 501 extends to the lower end of the lifting column 120, and the upper end of the wiring cavity 501 is provided with a through hole 402 that connects to the vacuum chamber. Thus, the water inlet pipe 310, the water outlet pipe 320 and the wires located in the vacuum chamber enter the wiring cavity 501 through the corresponding through hole 402, and extend out through the wiring cavity 501 to connect with the external equipment.

[0047] Among them, a sealing ring is provided at the through hole 402 to cover the water inlet pipe 310, the water outlet pipe 320 and the wire to ensure the airtightness of the vacuum chamber.

[0048] In this embodiment, a rotating cylinder 140 is rotatably mounted on the mounting platform 130, a lifting column 120 is threaded through the rotating cylinder 140, a bracket 121 is provided at the bottom end of the lifting column 120, and a positioning column 131 is provided on the mounting platform 130 through the bracket 121.

[0049] In this embodiment, the driving component includes a first gear 141 fixedly disposed at the upper end of the rotating cylinder 140, and a second gear 151 meshing with the first gear 141 is provided on the mounting plate 130 via a servo motor 150.

[0050] In actual use, the mounting plate 130 is fixedly installed, and the rotating cylinder 140 is rotatably installed on the mounting plate 130 through the bearing mounting seat 510, so as to realize the rotatable installation of the rotating cylinder 140.

[0051] The bracket 121 is fixedly installed at the lower end of the lifting column 120, and the upper end of the positioning column 131 is fixedly installed on the lower side of the mounting platform 130. The lower end of the positioning column 131 passes through the bracket 121 to restrict the lifting column 120 and prevent it from rotating circumferentially.

[0052] Among them, due to the threaded connection between the rotating cylinder 140 and the lifting column 120, the rotation of the rotating cylinder 140 can realize the lifting column 120 to rise and fall, thereby realizing the lifting and adjustment of the base in the vacuum chamber;

[0053] The servo motor 150, the first gear 141, and the second gear 151 are configured such that the forward and reverse rotation of the servo motor 150 can drive the lifting column 120 to rise and fall.

[0054] In summary, the above description is only a preferred embodiment of the present utility model. All equivalent changes and modifications made within the scope of the patent application of the present utility model shall fall within the scope of the patent of the present utility model.

Claims

1. A multi-zone temperature-controlled substrate stage for a vapor deposition apparatus, comprising a top plate (100) and a bottom plate (110) fixed to the lower side of the top plate (100), characterized in that: The upper side of the top plate (100) is uniformly formed with multiple partitions (200), and also includes a temperature control component for temperature regulation of each partition (200). The temperature control component includes multiple heating units in the top plate (100), multiple cooling units in the bottom plate (110), multiple thermocouples, and a control unit. The lower side of the top plate (100) is provided with curved strip grooves (201) corresponding to each partition (200), and the thermocouple and the heating unit are located in the corresponding strip grooves (201); the cooling unit is located in the bottom plate (110) corresponding to each partition (200); the control unit is connected to the thermocouple, the heating unit and the cooling unit.

2. The multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 1, characterized in that: The cooling unit includes a first cooling water branch (301) and a second cooling water branch (302) formed in the base plate (110). The first cooling water branch (301) and the second cooling water branch (302) are connected. The base plate (110) is provided with an inlet pipe (310) that connects to the first cooling water branch (301) and an outlet pipe (320) that connects to the second cooling water branch (302).

3. The multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 1, characterized in that: It also includes a lifting assembly for driving the top plate (100) and the bottom plate (110) to rise and fall.

4. A multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 3, characterized in that: The lifting assembly includes a lifting column (120) located on the lower side of the base plate (110), and the lifting column (120) has a wiring cavity (501) for installing the water inlet pipe (310) and the water outlet pipe (320). The lifting assembly also includes a mounting platform (130), a lifting column (120) is installed through the mounting platform (130), and a drive component for driving the lifting column (120) to rise and fall is provided on the mounting platform (130).

5. A multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 4, characterized in that: A rotating cylinder (140) is rotatably mounted on the mounting platform (130). A lifting column (120) is threaded through the rotating cylinder (140). A bracket (121) is provided at the bottom end of the lifting column (120). A positioning column (131) is provided on the mounting platform (130) through the bracket (121).

6. A multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 5, characterized in that: The driving component includes a first gear (141) fixed at the upper end of the rotating cylinder (140), and a second gear (151) meshing with the first gear (141) is provided on the mounting plate (130) via a servo motor (150).

7. A multi-zone temperature-controlled substrate stage for vapor deposition equipment according to claim 4, characterized in that: The top of the lifting column (120) extends outward to form a mounting part (401), which is mounted on the lower side of the base plate (110) by screws.

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