Electronic device
By stacking audio interface modules and camera modules in electronic devices, the user inconvenience and device lightweighting issues caused by removing the 3.5mm headphone jack module are resolved. This achieves audio interface compatibility with the thinner and lighter design of electronic devices and improves the user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-10
Smart Images
Figure CN224481725U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of terminal technology, and more particularly to an electronic device. Background Technology
[0002] Some related technologies incorporate a 3.5mm headphone jack module for connecting headphones. However, this module occupies space along the thickness of the electronic device, hindering its slim and lightweight design. Therefore, to align with this trend, some electronic devices have eliminated the 3.5mm headphone jack module, retaining only the Type-C interface. This necessitates users purchasing headphone adapters when using 3.5mm headphones, increasing costs and adding inconvenience. Utility Model Content
[0003] This disclosure provides an electronic device to address the shortcomings of the related art.
[0004] According to embodiments of this disclosure, an electronic device is provided, comprising:
[0005] A battery cover, the battery cover including a clearance opening;
[0006] A middle frame, which is assembled with the battery cover, includes an insertion interface;
[0007] Decorative element, which corresponds to the clearance opening and is connected to the battery cover and is at least partially protruding from the outside of the battery cover;
[0008] A camera module, located inside the decorative element, and receiving light through the decorative element;
[0009] An audio interface module is disposed on the inside of the battery cover, corresponding to the plug interface, and the audio interface module is located below the camera module in the thickness direction of the electronic device.
[0010] Optionally, the circumferential surface of the connector facing the outside of the electronic device is inclined inward along the axial direction of the connector towards the center of the connector.
[0011] Optional, the tilt angle is less than or equal to 45°.
[0012] Optionally, the mid-frame further includes an inwardly extending extension, and the electronic device further includes a metal bracket located inside the battery cover, with the audio interface module portion sandwiched between the metal bracket and the extension.
[0013] Optionally, the metal bracket is at least partially located between the camera module and the audio interface module.
[0014] Optionally, it also includes a flash assembly, which is located on the same side of the metal bracket as the camera module, and the audio interface module is located on the side of the metal bracket away from the camera module;
[0015] And / or, it also includes a sensor assembly located on the same side of the metal bracket as the camera module, and the audio interface module located on the side of the metal bracket opposite to the camera module.
[0016] Optionally, the system also includes a circuit board, to which the camera module is electrically connected, on the side facing the battery cover. The circuit board also includes a recessed groove extending inward from its edge, into which the audio interface module partially passes.
[0017] Optionally, the circuit board may also include audio traces and camera traces, which are independent of each other, and multiple grounding points are provided around the audio traces.
[0018] Optionally, the audio interface module includes a stainless steel inner ring, which surrounds and forms a plug-in cavity, which is connected to the plug-in interface.
[0019] Optionally, a shock-absorbing layer is provided on the surface of the stainless steel inner ring.
[0020] Optionally, the audio interface module may further include a buffer connected to the outside; or, a metal layer may be provided between the camera module and the audio interface module.
[0021] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:
[0022] As can be seen from the above embodiments, the audio interface module and camera module of this disclosure are stacked in the thickness direction of the electronic device. The space of the decorative part can be used to accommodate the camera module and audio interface module, so that only the thickness dimension needs to be locally increased at the position of the decorative part. This achieves the setting of the audio interface module, while being compatible with the trend of thinner and lighter electronic devices, which is conducive to improving the user experience.
[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.
[0025] Figure 1 This is a partial schematic diagram of an electronic device according to an exemplary embodiment.
[0026] Figure 2 This is a partial cross-sectional schematic diagram of a middle frame according to an exemplary embodiment.
[0027] Figure 3 This is a partial schematic diagram of another electronic device according to an exemplary embodiment.
[0028] Figure 4 This is a schematic diagram of a circuit board structure according to an exemplary embodiment.
[0029] Figure 5 This is a cross-sectional schematic diagram of an audio interface module according to an exemplary embodiment. Detailed Implementation
[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0031] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.
[0032] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0033] Figure 1 This is a partial cross-sectional schematic diagram of an electronic device according to an exemplary embodiment, such as... Figure 1As shown, the electronic device includes a battery cover 1, a middle frame 2, and a decorative component 3. The battery cover 1 forms the back panel of the electronic device and includes a clearance opening 11. The middle frame 2 includes an insertion interface 21, and the middle frame 2 and battery cover 1 are assembled to form an installation space, facilitating the layout of electronic modules such as the battery and motherboard. The decorative component 3 is positioned corresponding to the clearance opening 11. The decorative component 3 is connected to the battery cover 1, and at least partially protrudes from the outer side of the battery cover 1, for example... Figure 1 As shown, the decorative element 3 protrudes completely from the outer side of the battery cover 1. Alternatively, in other embodiments, the decorative element 3 may partially extend into the battery cover 1 through the clearance opening 11, thus partially protruding from the battery cover 1. The decorative element 3 and the battery cover 1 can be directly bonded and fixed, or they can be connected and fixed using other intermediate connecting parts; this disclosure does not impose any limitations on this. The decorative element 3 may include an aluminum alloy decorative element, the surface of which can be anodized and subsequently colored to enhance its aesthetics.
[0034] Furthermore, the electronic device also includes a camera module 4 and an audio interface module 5. The camera module 4 is located inside the decorative element 3 and can collect light through the decorative element 3. The camera module 4 being located inside the decorative element 3 can be understood as the side of the electronic device facing inwards in the thickness direction, or as the inner wall of the ring structure formed by the decorative element 3 itself; the specific design can be customized as needed. The audio interface module 5 is located inside the battery cover 1 corresponding to the connector 21, and in the thickness direction of the electronic device, the audio interface module 5 is located below the camera module 4.
[0035] Based on this, the audio interface module 5 and the camera module 4 are stacked in the thickness direction of the electronic device. The space of the decorative piece 3 allows for compatibility between the camera module 4 and the audio interface module 5, thus requiring only a local increase in thickness at the location of the decorative piece 3. This achieves the inclusion of the audio interface module 5 while maintaining compatibility with the trend towards thinner and lighter electronic devices, improving user experience. Specifically, when the audio interface module 5 is configured as a 3.5mm headphone jack, it balances thinness and lightness with compatibility with users' conventional headphone devices or audio settings, eliminating the need for adapters and significantly enhancing the user experience. For example, in some embodiments, the thickness of the electronic device can be 7.8mm in the area where the decorative piece 3 is located, but only 7.25mm in most other areas, achieving both thinness and the requirement of a conventional headphone jack.
[0036] In some embodiments, such as Figure 2As shown, the circumferential surface of the connector 21 facing outwards from the electronic device is inclined inwards along the axial direction of the connector 21 towards its center. In other words, the end of the connector 21 facing outwards from the electronic device is a conical surface, facilitating blind insertion of audio devices and improving efficiency. The inclination angle of this circumferential surface can be less than or equal to 45°. Within this angle range, blind insertion is effectively achieved while avoiding obstruction of the connection due to excessive inclination. For example, the inclination angle of the circumferential surface can be 25°, 30°, 35°, or 40°.
[0037] In some embodiments, such as Figure 3 As shown, the middle frame 2 also includes an inwardly extending extension 22, which can be located outside the connector 21, and the shape of the extension 22 can be adapted to the shape of the audio interface module 5. The electronic device also includes a metal bracket 6, located inside the battery cover 1, and the audio interface module 5 is partially clamped between the metal bracket 6 and the extension 22. This design allows the audio interface module 5 to be clamped securely by the metal bracket 6 and the extension 22, improving its robustness.
[0038] The metal bracket 6 can also be located below the extension 22. Or it can still be... Figure 3 As shown, the metal bracket 6 is located above the extension 22, and at least partially between the camera module 4 and the audio interface module 5. This design isolates electromagnetic interference between the camera module 4 and the audio interface module 5, improving their respective functionalities. Alternatively, in some embodiments, a metal layer, such as a copper foil layer, can be provided between the audio interface module 5 and the camera module 4. The thickness of this copper foil layer can be less than or equal to 0.4 mm, for example, 0.2 mm, 0.3 mm, etc. This metal layer isolates electromagnetic interference between the camera module 4 and the audio interface module 5. Optionally, in the same embodiment, the electronic device can simultaneously isolate electromagnetic interference using both the metal bracket 6 and the metal layer; this disclosure does not impose any limitations on this.
[0039] In some embodiments, still using Figure 3 and Figure 4 As shown, the electronic device also includes a circuit board 7, to which the camera module 4 is electrically connected. The circuit board 7 faces the battery cover 1. The circuit board 7 also includes a recess 71 that extends inward from the edge. The audio interface module 5 partially passes through the recess 71, thereby avoiding obstruction of the audio interface module 5 by the circuit board 7, thus ensuring the circuit board 7 functions as the main support for the camera module 4. The depth and width of the recess 71 can be adapted to the audio interface module 5.
[0040] Furthermore, the electronic device also includes audio and camera traces disposed on the circuit board 7. The audio traces are electrically connected to the audio interface module 5, and the camera traces are electrically connected to the camera module 4. The audio and camera traces are independent of each other and avoid parallel routing. Multiple grounding points are provided around the audio traces to achieve grounding and reduce electromagnetic interference between the audio and camera traces. These grounding points can be used to cover the entire surface or can be a single, independently provided grounding point.
[0041] In the above embodiments, such as Figure 5 As shown, the audio interface module 5 includes a stainless steel inner ring that can surround and form a plug-in cavity 51. The plug-in cavity 51 connects to and communicates with the plug-in interface 21. Multiple elastic contacts are provided on the inner wall of the plug-in cavity 51, allowing electrical connection to be established after the other end enters the plug-in cavity 51 from the plug-in interface 21, thus enabling electrical signal transmission. The design of this stainless steel inner ring can reduce rust and contamination of the audio interface module 5, which helps maintain the stability and reliability of the electrical connection.
[0042] Furthermore, a shock-absorbing layer 52 can be provided on the surface of the stainless steel inner ring. The design of this shock-absorbing layer 52 can improve the wear resistance of the audio interface module 5, reduce wear caused by plugging and unplugging, and extend its service life. Alternatively, the audio interface module may also include a buffer 53. The buffer 53 is provided on the outside of the audio interface module 5, which can buffer the impact when the electronic device is subjected to shock, reducing the probability of damage to the audio interface module 5.
[0043] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.
[0044] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.
Claims
1. An electronic device, characterized in that, include: A battery cover, the battery cover including a clearance opening; A middle frame, which is assembled with the battery cover, includes an insertion interface; Decorative element, which corresponds to the clearance opening and is connected to the battery cover and is at least partially protruding from the outside of the battery cover; A camera module, located inside the decorative element, and receiving light through the decorative element; An audio interface module is disposed on the inside of the battery cover, corresponding to the plug interface, and the audio interface module is located below the camera module in the thickness direction of the electronic device.
2. The electronic device according to claim 1, characterized in that, The circumferential surface of the connector facing the outside of the electronic device is inclined inward along the axial direction of the connector towards the center of the connector.
3. The electronic device according to claim 2, characterized in that, The tilt angle is less than or equal to 45°.
4. The electronic device according to claim 1, characterized in that, The mid-frame also includes an inwardly extending extension, and the electronic device also includes a metal bracket located inside the battery cover, with the audio interface module portion sandwiched between the metal bracket and the extension.
5. The electronic device according to claim 4, characterized in that, The metal bracket is located at least partially between the camera module and the audio interface module.
6. The electronic device according to claim 4, characterized in that, It also includes a flash assembly, which is located on the same side of the metal bracket as the camera module, and the audio interface module is located on the side of the metal bracket away from the camera module; And / or, it also includes a sensor assembly located on the same side of the metal bracket as the camera module, and the audio interface module located on the side of the metal bracket opposite to the camera module.
7. The electronic device according to claim 1, characterized in that, It also includes a circuit board, to which the camera module is electrically connected, on the side facing the battery cover. The circuit board also includes a recessed groove from the edge inwards, into which the audio interface module partially passes.
8. The electronic device according to claim 7, characterized in that, It also includes audio traces and camera traces disposed on the circuit board. The audio traces and camera traces are independent of each other, and multiple grounding points are disposed around the audio traces.
9. The electronic device according to claim 1, characterized in that, The audio interface module includes a stainless steel inner ring, which surrounds and forms a plug-in cavity, which is connected to the plug-in interface.
10. The electronic device according to claim 9, characterized in that, A shock-absorbing layer is provided on the surface of the stainless steel inner ring.
11. The electronic device according to claim 1, characterized in that, The audio interface module also includes a buffer on the outside; or, a metal layer is provided between the camera module and the audio interface module.