A circuit board vertical mounting structure

Abstract

The utility model discloses a vertical installation structure of circuit board, it includes outer casing, circuit board, board box and baffle, outer casing has the cavity, and the baffle is installed vertically in the cavity, board box has the accessory cavity, and the circuit board is locked in the accessory cavity, and the circuit board is installed vertically with the board box in the baffle, makes the circuit board present vertical state, the back of circuit board is installed with finned radiator, and finned radiator locally stretches into the accessory cavity and is connected with the circuit board, to make the circuit board radiate through finned radiator, the baffle is equipped with the bayonet, and finned radiator is embedded in the bayonet to define board box position. It has simple structure, compact cooperation, and the advantages such as reasonable in design, therefore, it is a kind of product with superior performance in technicality and economy.

Description

Technical Field

[0001] This utility model mainly relates to a vertical mounting structure for circuit boards. Background Technology

[0002] In traditional air conditioner design, for ease of structural layout and assembly, air conditioner circuit boards are generally installed horizontally. Specifically, the circuit board is typically fixed parallel to the top cover or chassis of the indoor unit in the upper part of the casing (near the air inlet or duct). However, this horizontal installation method has gradually revealed the following significant technical drawbacks in practical applications:

[0003] Power devices on an air conditioner's circuit board (such as IPM modules, relays, and switching power supply chips) generate a significant amount of heat during operation. When horizontally installed, this heat is primarily dissipated upwards through natural convection. However, the interior of an air conditioner is typically enclosed and has complex airflow patterns, making it easy for a horizontally placed circuit board to form a "hot air stagnation zone" directly above it, hindering effective heat dissipation. This heat dissipation problem is particularly pronounced when the circuit board is installed near a heat source (such as the compressor drive circuitry) or is obstructed by other components above it, potentially leading to overheating of components, accelerated aging, or even triggering a protective shutdown.

[0004] When an air conditioner is running in cooling mode, the evaporator produces a large amount of condensate. Although it is designed with a drip tray and drain pipe, condensate dripping or internal condensation can still occur in high humidity environments, when the machine is tilted, or when drainage is poor. Horizontally mounted circuit boards have a large upper surface area. If they are located in areas where condensate is likely to drip or where moisture accumulates, water droplets or condensation can easily accumulate on their surface or between component leads, leading to serious malfunctions such as short circuits, component corrosion, and decreased insulation performance, posing safety hazards.

[0005] In view of this, we have improved the circuit board mounting structure of the air conditioner and proposed a new solution. Utility Model Content

[0006] To solve at least one of the above problems, this utility model proposes a new structural solution. The vertical mounting structure of this circuit board adopts the following technical solution:

[0007] A vertical mounting structure for a circuit board includes an outer casing, a circuit board, a board box, and a partition.

[0008] The outer casing has a cavity, and the partition is vertically installed in the cavity; the board box has an accessory cavity, and the circuit board is locked in the accessory cavity. The circuit board and the board box are vertically installed on the partition, so that the circuit board is in a vertical state.

[0009] A finned heat sink is mounted on the back of the circuit board. The finned heat sink partially extends into the accessory cavity and connects to the circuit board so that the circuit board can dissipate heat through the finned heat sink. The partition has a bayonet, and the finned heat sink is fitted into the bayonet to define the position of the board box.

[0010] Preferably, the box has an opening through which the finned heat sink extends into the accessory cavity and connects to the circuit board.

[0011] Preferably, a vertically arranged partition divides the cavity into a first cavity and a second cavity. A fan is installed in the first cavity, a finned heat sink is installed in the first cavity, and a plate box is installed in the second cavity.

[0012] Preferably, a pressure plate is installed on the top of the partition, and the pressure plate is connected to the panel box to prevent the panel box from disengaging from the bayonet.

[0013] The beneficial effects of this utility model compared with the prior art are:

[0014] In this design, the circuit board is vertically mounted instead of the traditional horizontal mounting. The vertically designed circuit board surface is parallel to the natural upward direction of hot air. The heat generated by the power devices rises rapidly along the board surface, creating a "chimney effect" that effectively avoids the problem of hot air stagnation at the top, as seen in horizontal mounting. Vertical mounting significantly reduces the upper surface area (horizontal projected area) of the circuit board, greatly decreasing the probability of condensation dripping directly onto the board surface. Even if a small amount of water splashes onto the board, it slides more easily down the vertical surface under gravity, preventing accumulation on components or solder joints. It boasts advantages such as simple structure, compact fit, and rational design; therefore, it is a product with superior technical and economic performance. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the vertical installation of the circuit board in a preferred embodiment of the present invention.

[0016] Figure 2 An exploded view of the vertical mounting structure of the circuit board in the preferred embodiment of this utility model;

[0017] Figure 3 This is a partially exploded view of the vertical mounting structure of the circuit board in the preferred embodiment of this utility model. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0019] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] The following description, in conjunction with the accompanying drawings, further illustrates specific embodiments of the present invention, making the technical solution and beneficial effects of the present invention clearer and more explicit. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0021] The preferred embodiment provided by this utility model is as follows: Figures 1-3 As shown, a vertical mounting structure for a circuit board includes an outer casing 1, a circuit board 2, a board box 3, and a partition 4. The outer casing 1 has a cavity 1, and the partition 4 is vertically mounted in the cavity 1. The board box 3 has an accessory cavity, and the circuit board 2 is locked in the accessory cavity. The circuit board 2 and the board box 3 are vertically mounted on the partition 4, so that the circuit board 2 is in a vertical state.

[0022] A finned heat sink 21 is mounted on the back of circuit board 2. The finned heat sink 21 partially extends into the component cavity and connects to circuit board 2, allowing the circuit board 2 to dissipate heat through the finned heat sink 21. A latch 41 is provided on partition 4, and the finned heat sink 21 is fitted into the latch 41 to define the position of board box 3. A pressure plate 42 is mounted on the top of partition 4, and the pressure plate 42 connects to board box 3 to prevent board box 3 from disengaging from the latch 41. Board box 3 has an opening 31 through which the finned heat sink 21 extends into the component cavity and connects to circuit board 2.

[0023] A vertically arranged partition 4 divides cavity 1 into a first cavity 11 and a second cavity 12. A fan 13 and a finned heat sink 21 are located in the first cavity 11, while a plate box 3 is located in the second cavity 12. Due to the fan 13, the air flow rate in the first cavity 11 is high, thus the placement of the finned heat sink 21 in the first cavity 11 aids in heat dissipation. The second cavity 12 is separated from the first cavity 11 by the partition 4, providing independent space for other components.

[0024] In this design, the circuit board is mounted vertically instead of horizontally. The vertically designed circuit board surface is parallel to the natural upward direction of hot air. The heat generated by the power devices rises rapidly along the board surface, creating a "chimney effect" that effectively avoids the problem of hot air stagnation at the top, as seen in horizontal mounting. Vertical mounting significantly reduces the upper surface area (horizontal projected area) of the circuit board, greatly decreasing the probability of condensation dripping directly onto the board surface. Even if a small amount of water splashes onto the board, it slides more easily down the vertical surface under gravity, preventing accumulation on components or solder joints.

[0025] In the description of this specification, references to terms such as "an embodiment," "preferred," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. Illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] Based on the above description of the structure and principle, those skilled in the art should understand that this utility model is not limited to the specific embodiments described above. Improvements and substitutions based on this utility model using techniques known in the art all fall within the protection scope of this utility model and should be defined by the claims.

Claims

1. A vertical mounting structure for a circuit board, characterized in that: It includes the outer casing, circuit boards, board housing, and partitions; The outer casing has a cavity, and the partition is installed vertically inside the cavity; The board box has an accessory cavity, and the circuit board is locked in the accessory cavity. The circuit board and the board box are vertically mounted on the partition, so that the circuit board is in a vertical position. A finned heat sink is mounted on the back of the circuit board. The finned heat sink partially extends into the accessory cavity and connects to the circuit board so that the circuit board can dissipate heat through the finned heat sink. The partition has a bayonet, and the finned heat sink is fitted into the bayonet to define the position of the board box.

2. The circuit board vertical mounting structure according to claim 1, characterized in that: The box has an opening through which the finned heat sink extends into the accessory cavity and connects to the circuit board.

3. The vertical mounting structure for a circuit board according to claim 1, characterized in that: A vertically arranged partition divides the cavity into a first cavity and a second cavity. A fan is installed in the first cavity, a finned radiator is installed in the first cavity, and a plate box is installed in the second cavity.

4. The vertical mounting structure for a circuit board according to claim 1, characterized in that: A pressure plate is installed on the top of the partition, which connects with the panel box to prevent the panel box from disengaging from the bayonet.

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