A heat dissipation assembly and a water-cooled heat dissipation device
By designing a flexible and deformable epoxy board and heat dissipation pipe bonding structure, the problems of miniaturization and low cost of water-cooled heat dissipation devices in medical equipment are solved, and efficient heat dissipation is achieved in a limited space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ELECTRONICS GRP CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-07-10
Smart Images
Figure CN224481929U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of medical equipment accessories technology, and in particular to a heat dissipation component and a water-cooling heat dissipation device. Background Technology
[0002] Water cooling devices are required in some existing medical devices. As the core of water cooling devices, the layout of heat dissipation pipes has become the most critical issue. With the miniaturization and cost reduction of medical devices, the design of existing water cooling devices can no longer meet the needs. Utility Model Content
[0003] The technical problem to be solved by this utility model embodiment is to provide a miniaturized and low-cost heat dissipation component and water-cooled heat dissipation device, so as to solve the problem that it is difficult to meet the miniaturization and low cost in the prior art.
[0004] This utility model discloses a heat dissipation component, which includes: a heat dissipation pipe and a plurality of flexible and deformable epoxy boards. The plurality of epoxy boards are arranged in parallel on the same plane according to a preset spacing. The epoxy boards are provided with a plurality of through holes. The heat dissipation pipe is bound to the plurality of epoxy boards by passing through the through holes via a strip.
[0005] Optionally, the distance between two adjacent epoxy boards is the same.
[0006] Optionally, the heat dissipation pipes are arranged according to a preset rule on a plane in which multiple epoxy boards are arranged in parallel.
[0007] Optionally, the heat dissipation pipe is wound clockwise or counterclockwise on a plane in which the plurality of epoxy boards are arranged in parallel.
[0008] Optionally, the heat dissipation pipe is a nylon water pipe.
[0009] Optionally, it may also include at least one solid tube, which is arranged side by side with the heat dissipation tube.
[0010] Optionally, the hardness of the solid tube is greater than that of the heat dissipation tube.
[0011] Optionally, the solid tube is a PVC flexible tube.
[0012] Optionally, the strap body is a rope, nylon cable tie, silicone strap, or fiber strap.
[0013] To address the problems existing in the prior art, this utility model also provides a water-cooled heat dissipation device, which includes any of the heat dissipation components described above, as well as a water pump and a water tank. The heat dissipation pipe includes an outlet and an inlet connected to the water tank. The water pump is connected to the water tank to drive the water in the water tank to flow in the heat dissipation pipe.
[0014] Compared with the prior art, the beneficial effects of the heat dissipation component provided by this utility model embodiment are as follows: By designing a heat dissipation component, including heat dissipation pipes and multiple flexible and deformable epoxy boards, the multiple epoxy boards are arranged in parallel on the same plane according to a preset spacing, and multiple through holes are opened on the epoxy boards. The heat dissipation pipes are bound to the multiple epoxy boards by passing through the through holes through the pipes via a strip. This solution, by designing multiple flexible and deformable epoxy boards arranged in parallel on the same plane and separated from each other by a preset spacing for binding the heat dissipation pipes, not only achieves deformability to be suitable for miniaturized medical devices, but also effectively saves epoxy board material, reduces production costs, and the contact area between the epoxy boards and the heat dissipation pipes is smaller, making heat dissipation easier. Attached Figure Description
[0015] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:
[0016] Figure 1 This is a schematic diagram of the structure of the heat dissipation component provided in an embodiment of the present invention;
[0017] Figure 2 This is a partially enlarged view of the heat dissipation assembly provided in an embodiment of this utility model;
[0018] Figure 3 This is a schematic diagram of the structure of the water-cooled heat dissipation device provided in this embodiment of the utility model.
[0019] The labels for the attached figures are as follows:
[0020] 100, heat dissipation pipe; 200, epoxy board; 300, solid pipe; 210, through hole. Detailed Implementation
[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0022] like Figure 1 and Figure 2 As shown, this utility model provides a specific embodiment of a heat dissipation component.
[0023] A heat dissipation component, reference Figure 1 and Figure 2 It includes: heat dissipation pipe 100 and multiple flexible and deformable epoxy boards 200. The multiple epoxy boards 200 are arranged in parallel on the same plane according to a preset spacing. Multiple through holes 210 are opened on the epoxy boards 200. The heat dissipation pipe 100 is bound to the multiple epoxy boards 200 by passing through the through holes 210 with a strip.
[0024] Specifically, refer to Figure 1 and Figure 2 The heat dissipation component uses multiple flexible and deformable epoxy boards 200 to stitch around the water pipes. The multiple flexible and deformable epoxy boards 200 are laid on the same plane and arranged in parallel, with a certain distance between adjacent epoxy boards 200. Several through holes 210 are opened on the multiple epoxy boards 200 for stitching. The heat dissipation pipes 100 of the heat dissipation component are used for water circulation to achieve heat dissipation. The heat dissipation pipes 100 are arranged in a regular manner according to actual needs, and then placed on the plane formed by the multiple epoxy boards 200. They are fixed to the multiple epoxy boards 200 by a strip that can pass through the through holes 210 to fix the arranged water pipes to the multiple epoxy boards 200 respectively to form an integrated heat dissipation component.
[0025] Water cooling devices are required in some existing medical devices. As the core of the water cooling device, the most critical issue is how to lay out the heat dissipation pipe 100 in the medical device. With the miniaturization of medical devices, the installation space reserved for water cooling devices is limited. Conventional heat dissipation pipe installation methods are difficult to meet current needs. In order to enable the heat dissipation pipe to be used in conjunction with the medical device within the limited installation space, some designs currently arrange the heat dissipation pipe according to the actual needs and bind it to a large flexible and deformable epoxy board. Although this method meets the miniaturization requirements, its cost is relatively high.
[0026] In this embodiment, a heat dissipation component is designed, including a heat dissipation pipe 100 and multiple flexible and deformable epoxy boards 200. The multiple epoxy boards 200 are arranged in parallel on the same plane according to a preset spacing. Multiple through holes 210 are opened on the epoxy boards 200. The heat dissipation pipe 100 is bound to the multiple epoxy boards 200 by passing through the through holes 210 with a strip. By arranging multiple flexible and deformable epoxy boards 200 in parallel on the same plane and separating each pair of epoxy boards 200 with a preset spacing to bind the heat dissipation pipe 100, it is possible to deform to suit miniaturized medical devices, effectively save epoxy board 200 material, reduce production costs, and the contact area between the epoxy board 200 and the heat dissipation pipe 100 is smaller, which is more convenient for heat dissipation.
[0027] In one embodiment, reference Figure 1 The distance between two adjacent epoxy boards 200 is the same, and epoxy boards 200 are provided at both ends of the heat dissipation pipe 100 to improve the stability of the heat dissipation component.
[0028] In one embodiment, reference Figure 1 and Figure 2The heat dissipation pipes 100 are arranged in a plane on which multiple epoxy boards 200 are arranged in parallel according to a preset rule. The specific arrangement rules can be preset according to actual needs, and then the arrangement is carried out according to the arrangement rules. In actual production, the heat dissipation pipes 100 are first placed in the mold according to the preset rules, and then multiple epoxy boards 200 are placed on the arranged heat dissipation pipes 100. The epoxy boards 200 and heat dissipation pipes 100 are bound together by passing the belt through the through hole 210. Finally, the bound whole is demolded.
[0029] In one embodiment, reference Figure 1 and Figure 2 The heat dissipation pipe 100 is wound clockwise or counterclockwise on a plane where multiple epoxy boards 200 are arranged in parallel. That is, the heat dissipation pipe 100 is first wound clockwise or counterclockwise to form a wound body and placed in a mold. Then, multiple epoxy boards 200 are placed on the wound body. The epoxy boards 200 are bound to the heat dissipation pipe 100 by passing a strip through the through hole 210. Finally, the bound whole is demolded.
[0030] In one embodiment, the heat dissipation pipe 100 is a nylon water pipe, which is a pipe made of nylon material and used for water transportation. It not only has the characteristics of high pressure resistance, corrosion resistance, wide temperature adaptability and high wear resistance, but is also lightweight, flexible, easy to install and bendable, and can be rolled into the required shape.
[0031] In one embodiment, reference Figure 1 It also includes at least one solid tube 300, which is arranged side by side with the heat dissipation tube 100. The solid tube 300 has a higher hardness than the heat dissipation tube 100 in order to limit the position of the heat dissipation tube 100 and further control the bypass route of the heat dissipation tube 100 to improve the overall aesthetics and stability. The solid tube 300 is also bound to the epoxy board 200 by passing through the through hole 210 with a strip.
[0032] In one embodiment, the solid tube 300 is a PVC flexible tube, which is a flexible pipe made of polyvinyl chloride and has the characteristics of being lightweight, corrosion-resistant, and low-cost.
[0033] In one embodiment, the strap is a rope, nylon cable tie, silicone strap, or fiber strap.
[0034] like Figure 3 As shown, this utility model also provides a specific embodiment of a water-cooled heat dissipation device.
[0035] A water-cooled heat dissipation device, reference Figure 3The water-cooled heat dissipation device includes the heat dissipation component 10 as described above, and also includes a water pump 20 and a water tank 30. The heat dissipation pipe 100 includes an outlet and an inlet connected to the water tank 30. The water pump 20 is connected to the water tank 30 to drive the water in the water tank 30 to flow in the heat dissipation pipe 100.
[0036] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.
Claims
1. A heat dissipation component, characterized in that, include: The device includes a heat dissipation pipe and multiple flexible and deformable epoxy boards. The epoxy boards are arranged in parallel on the same plane according to a preset spacing. Multiple through holes are provided on the epoxy boards. The heat dissipation pipe is bound to the multiple epoxy boards by passing through the through holes with a strip.
2. The heat dissipation assembly according to claim 1, characterized in that, The distance between any two adjacent epoxy boards is the same.
3. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation pipes are arranged in a plane on which multiple epoxy boards are arranged in parallel, according to a preset rule.
4. The heat dissipation assembly according to claim 3, characterized in that, The heat dissipation pipes are wound clockwise or counterclockwise around a plane on which multiple epoxy boards are arranged in parallel.
5. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation pipe is a nylon water pipe.
6. The heat dissipation assembly according to claim 1, characterized in that, It also includes at least one solid tube, which is arranged side by side with the heat dissipation tube.
7. The heat dissipation assembly according to claim 6, characterized in that, The hardness of the solid tube is greater than that of the heat dissipation tube.
8. The heat dissipation assembly according to claim 6, characterized in that, The solid tube is a PVC flexible tube.
9. The heat dissipation assembly according to claim 6, characterized in that, The strap can be a rope, nylon cable tie, silicone strap, or fiber strap.
10. A water-cooled heat dissipation device, characterized in that, The device includes the heat dissipation assembly as described in any one of claims 1-9, and further includes a water pump and a water tank. The heat dissipation pipe includes an outlet and an inlet communicating with the water tank. The water pump is connected to the water tank to drive the water in the water tank to flow in the heat dissipation pipe.