Heat dissipation structure and refrigerator

By combining a substrate and heat pipe with a C-shaped fin heat dissipation structure, the problem of uneven heat dissipation at the hot end of the semiconductor cooling chip is solved, improving heat dissipation efficiency and reducing costs, making it suitable for silent refrigerators.

CN224481930UActive Publication Date: 2026-07-10HEFEI HUALING CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEFEI HUALING CO LTD
Filing Date
2025-05-07
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing heat dissipation structures for the hot end of semiconductor cooling chips suffer from uneven fin temperatures, high costs, and low heat dissipation efficiency, which affect cooling efficiency and may cause the chip to burn out.

Method used

The system employs a combination structure of a substrate, heat transfer components, and a radiator. Heat transfer components, such as heat pipes, are placed on the substrate to conduct heat evenly. Combined with a C-shaped finned radiator, air channels are formed to improve heat transfer efficiency and reduce the temperature at the hot end.

Benefits of technology

It achieves uniform substrate temperature, improves heat dissipation and cooling effects, reduces costs, and maintains the product's quiet performance, making it suitable for products such as silent refrigerators.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to the field of refrigeration technology, providing a heat dissipation structure and a refrigerator. The heat dissipation structure includes: a substrate, a heat transfer element, and a heat sink. The heat transfer element is disposed on the substrate, and the substrate is connected to the heat sink. A first region on the substrate is used to receive heat, and the heat transfer element is configured to transfer heat from the first region to other regions of the substrate. This heat dissipation structure enhances the heat transfer efficiency of the substrate, effectively reduces the temperature of the hot end of the refrigeration chip, and improves the heat dissipation and refrigeration effect of the structure.
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