An overhead vehicle handling mechanism

Abstract

The utility model relates to the technical field of semiconductor handling equipment, especially point to a kind of overhead vehicle handling mechanism, including the transverse component for being connected with walking component, the lifting mechanism being drivenly connected with transverse component and the grabbing component being drivenly connected with lifting mechanism, the grabbing component is used to grab or loosen wafer box;When needing to grab wafer box, walking component moves to specified wafer box grabbing station, transverse component drives lifting mechanism and grabbing component to move close to wafer box, until grabbing component is located directly above wafer box, lifting mechanism drives grabbing component to descend, grabbing component grabs wafer box, lifting mechanism drives wafer box to rise, transverse component drives wafer box to be located below walking component;The utility model realizes the stable grabbing of wafer box, successfully compensates the position deviation between grabbing mechanism and actual wafer box, improves the grabbing precision of wafer box.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor handling equipment technology, and in particular to an overhead vehicle handling mechanism. Background Technology

[0002] In semiconductor manufacturing, wafer cassettes are typically transported using overhead crane systems. This method of using wafer cassettes to transport wafers efficiently enables the transfer, processing, and handling of wafers. In existing overhead crane wafer cassette handling processes, the crane first travels along a track to a workstation, where its gripping mechanism picks up the wafer cassette. The gripping mechanism then lifts the wafer cassette from that workstation. Next, the crane moves the wafer cassette along the track to the next workstation, where the gripping mechanism lowers and releases the wafer cassette to the next workstation. This completes the wafer cassette transport operation.

[0003] In the actual handling of wafer cassettes, the existing track width is usually fixed. When the overhead crane moves along the track to the designated workstation, there is a deviation between the gripping mechanism and the actual position that the wafer cassette can be gripped. Due to the lack of a lateral adjustment mechanism, it is not easy to compensate for the positional offset of the gripping mechanism, which affects the gripping accuracy of the wafer cassette. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing an overhead conveyor transport mechanism that enables stable gripping of wafer cassettes, effectively compensates for positional deviations between the gripping mechanism and the actual wafer cassette being gripped, and improves the gripping accuracy of the wafer cassettes.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] This utility model provides an overhead vehicle transport mechanism, including a lateral component for connecting to a traveling component, a lifting mechanism driven to the lateral component, and a gripping component driven to the lifting mechanism. The gripping component is used to grip or release a wafer cassette.

[0007] When a wafer cassette needs to be gripped, the traveling component moves to the designated wafer cassette gripping station. The lateral component drives the lifting mechanism and gripping component to move closer to the wafer cassette until the gripping component is directly above the wafer cassette. The lifting mechanism then drives the gripping component to descend, and the gripping component grips the wafer cassette. The lifting mechanism then drives the wafer cassette to rise, and the lateral component moves the wafer cassette to a position below the traveling component.

[0008] The lifting mechanism includes a lifting frame that is horizontally rotatably connected to the output end of the transverse component and a lifting component installed on the lifting frame. The lifting component is driven to connect with the gripping component and is used to drive the gripping component to descend or rise to the desired position.

[0009] The lifting assembly includes at least three flexible components and a lifting drive unit installed on the lifting frame. One end of each flexible component is connected to the gripping component. The flexible component passes through the lifting frame. The lifting drive unit is driven to the flexible component. When the lifting drive unit releases or retracts the flexible component, it drives the gripping component to descend or rise synchronously to the desired position.

[0010] The lifting frame is equipped with at least two docking parts, the gripping assembly is equipped with at least two docking cylinders, the docking parts cooperate with the docking cylinders, the lifting frame is equipped with at least two longitudinally arranged photoelectric sensors, and the gripping assembly is equipped with blocking parts.

[0011] When the blocking member blocks one of the photoelectric sensors, one end of the docking member extends into the docking cylinder, and the lifting drive unit reduces the moving speed of the gripping component.

[0012] When the blocking member blocks at least two photoelectric sensors, the docking member is inserted into the docking cylinder, and the lifting drive unit stops.

[0013] The gripping assembly includes a gripping frame driven by a lifting mechanism, at least two clamping members symmetrically arranged on both sides of the gripping frame, and a gripping drive unit. The gripping drive unit is driven by the clamping members, the clamping members are slidably connected to the gripping frame in the same direction, and the gripping drive unit drives the clamping members on both sides to move in opposite directions simultaneously.

[0014] The wafer cassette has several limiting grooves circumferentially, and the clamping member has a limiting part. When the gripping drive unit drives the clamping member to move towards the desired position, the limiting part cooperates with the limiting groove.

[0015] The lifting frame is connected to a rotating shaft, which is horizontally rotatably connected to the output end of the horizontal component. A rotation drive unit is installed at the output end of the horizontal component, and the rotation drive unit is drivenly connected to the rotating shaft.

[0016] When the horizontal orientation of the wafer cassette needs to be adjusted, the rotary drive unit drives the rotating shaft to rotate so that the orientation of the wafer cassette corresponds to the required direction.

[0017] The clamping member is hinged to a calibration component, the clamping member is equipped with a calibration detection switch, and a reset component is connected between the calibration detection switch and the calibration component. When the reset component is in a normal state, at least part of the calibration component blocks the calibration detection switch.

[0018] When the clamping component moves a certain distance toward the wafer cassette, the wafer cassette squeezes the calibration component and simultaneously compresses the reset component, causing the calibration component to separate from the calibration detection switch. Then the clamping component continues to move toward the wafer cassette in the same direction so that the clamping component can stably clamp both ends of the wafer cassette.

[0019] The clamping member is provided with a clamping surface, and the calibration component is provided with a guiding surface. When the clamping member moves toward the wafer cassette, the wafer cassette presses the calibration component along the guiding surface.

[0020] When the clamping member moves to the desired position towards the wafer cassette, the clamping surface is flush with the guiding surface to achieve stable clamping of the wafer cassette.

[0021] The opening end of the docking cylinder is flared.

[0022] The beneficial effects of this utility model are:

[0023] To grip the wafer cassette, the traveling assembly moves along the overhead crane track to the designated wafer cassette gripping station. The lateral assembly then drives the lifting mechanism and gripping assembly to move closer to the wafer cassette until the gripping assembly is directly above it, successfully compensating for the positional deviation between the gripping mechanism and the actual wafer cassette being gripped, thus improving the gripping accuracy. The lifting mechanism then lowers the gripping assembly to grip the wafer cassette, and the lifting mechanism raises the wafer cassette. The lateral assembly then positions the wafer cassette below the traveling assembly, achieving stable gripping of the wafer cassette. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the overhead transport mechanism.

[0025] Figure 2 This is a front view of the lifting mechanism.

[0026] Figure 3 This is a cross-sectional view of the connecting cylinder.

[0027] Figure 4 This is a 3D diagram of the connection structure between the lifting frame and the photoelectric sensor.

[0028] Figure 5 This is a three-dimensional structural diagram of the blocking component, photoelectric sensor, docking component, and docking cylinder when one end of the docking component extends into the docking cylinder.

[0029] Figure 6 To capture the structural cross-sectional view of the component.

[0030] Figure 7 This is a three-dimensional view of a partial structure of a wafer cassette.

[0031] Figure 8 This is a structural cross-sectional view of a lifting frame, a rotating shaft, and a transverse assembly.

[0032] Figure 9 This is an exploded view of the installation structure of the clamping and calibration components.

[0033] 100. Walking components;

[0034] 01. Wafer box; 02. Positioning groove;

[0035] 1. Lateral component; 101. Rotation drive unit;

[0036] 2. Lifting mechanism;

[0037] 21. Lifting frame; 211. Rotating shaft; 22. Lifting assembly;

[0038] 221. Flexible component; 222. Lifting drive unit;

[0039] 3. Crawling component;

[0040] 31. Gripping frame; 32. Clamping component; 321. Limiting part; 322. Clamping surface;

[0041] 33. Grasping drive unit;

[0042] 301. Blocking component;

[0043] 41. Connecting component; 42. Connecting cylinder; 43. Photoelectric sensor;

[0044] 51. Calibration component; 511. Guide surface; 52. Calibration detection switch; 53. Reset component. Detailed Implementation

[0045] To facilitate understanding by those skilled in the art, the present invention will be further described below in conjunction with embodiments and accompanying drawings. Specific embodiments of the present invention will be described below. It should be noted that, in order to provide a concise description of these embodiments, this specification cannot provide a detailed description of all features of the actual embodiments.

[0046] refer to Figures 1 to 9As shown, this utility model provides an overhead crane transport mechanism, including a transverse component 1 for connection with a traveling component 100, a lifting mechanism 2 drivenly connected to the transverse component 1, and a gripping component 3 drivenly connected to the lifting mechanism 2. The gripping component 3 is used to grip or release wafer cassettes 01. In practical applications, the transverse component 1 is a linear module, hydraulic cylinder, electric cylinder, or lead screw motor module. When it is necessary to grip the wafer cassette 01, the traveling component 100 is moved along the crane track, and the traveling component 100 moves to the designated wafer cassette 01. At the gripping station, the horizontal component 1 drives the lifting mechanism 2 and the gripping component 3 to move closer to the wafer cassette 01 until the gripping component 3 is directly above the wafer cassette 01, thus successfully compensating for the positional deviation between the gripping mechanism and the actual gripping of the wafer cassette 01 and improving the gripping accuracy of the wafer cassette 01. The lifting mechanism 2 drives the gripping component 3 to descend, the gripping component 3 grips the wafer cassette 01, the lifting mechanism 2 drives the wafer cassette 01 to rise, and the horizontal component 1 drives the wafer cassette 01 to be located below the traveling component 100, thus achieving stable gripping of the wafer cassette 01.

[0047] refer to Figure 1 , 2 As shown, in this embodiment, the lifting mechanism 2 includes a lifting frame 21 that is horizontally rotatably connected to the output end of the horizontal component 1 and a lifting component 22 installed on the lifting frame 21. The lifting component 22 is driven to connect with the gripping component 3. The lifting component 22 is used to drive the gripping component 3 to descend or rise to the required position. In actual application, force is applied to drive the lifting frame 21 to rotate horizontally along the output end of the horizontal component 1, so as to smoothly adjust the direction of the wafer cassette 01 and realize the directional gripping of the wafer cassette 01.

[0048] refer to Figure 2 As shown, in this embodiment, the lifting assembly 22 includes at least three flexible components 221 and a lifting drive unit 222 installed on the lifting frame 21. One end of the flexible component 221 is connected to the gripping assembly 3. The flexible component 221 passes through the lifting frame 21. The lifting drive unit 222 is drivenly connected to the flexible component 221. When the lifting drive unit 222 releases or retracts the flexible component 221, it drives the gripping assembly 3 to descend or rise synchronously to the desired position, thereby realizing the lifting control of the gripping assembly 3. Specifically, a reflector can be installed on the gripping assembly 3, and a detection sensor can be installed on the lifting frame 21. When the gripping assembly 3 is horizontal, the light beam emitted by the detection sensor can be smoothly reflected back to the detection sensor after passing through the reflector, accurately determining that the gripping assembly 3 is in a horizontal state. When the gripping assembly 3 is tilted, the detection sensor is decoupled from the optical path of the reflector, and the detection sensor does not receive a feedback signal, accurately detecting that the gripping assembly 3 is tilted, which facilitates timely adjustment of the placement state of the gripping assembly 3.

[0049] refer to Figure 2 , 3As shown, in this embodiment, the lifting frame 21 is equipped with at least two docking parts 41, the gripping assembly 3 is equipped with at least two docking cylinders 42, the docking parts 41 cooperate with the docking cylinders 42, the lifting frame 21 is equipped with at least two longitudinally arranged photoelectric sensors 43, and the gripping assembly 3 is equipped with a blocking part 301; Reference Figure 4 , 5 As shown, in practical applications, when the blocking member 301 blocks one of the photoelectric sensors 43, one end of the docking member 41 extends into the docking cylinder 42, and the lifting drive unit 222 reduces the moving speed of the gripping component 3. A progressive positioning strategy is adopted to effectively protect the gripping component 3 and achieve a shock-free transition from coarse positioning to fine positioning. When the blocking member 301 blocks at least two photoelectric sensors 43, the docking member 41 cooperates to insert into the docking cylinder 42, and the lifting drive unit 222 stops, achieving accurate positioning of the gripping component 3.

[0050] refer to Figure 6 As shown, in this embodiment, the gripping assembly 3 includes a gripping frame 31 driven by the lifting mechanism 2, at least two clamping members 32 symmetrically arranged on both sides of the gripping frame 31, and a gripping drive unit 33. The gripping drive unit 33 is driven by the clamping members 32. The clamping members 32 are slidably connected to the gripping frame 31 in the same direction. The gripping drive unit 33 drives the clamping members 32 on both sides to move in opposite directions simultaneously. In actual application, the gripping drive unit 33 adopts a gripper cylinder, which drives the clamping members 32 on both sides to move in opposite directions simultaneously through its two output ends, thereby achieving the clamping of the wafer cassette 01. The wafer cassette 01 is circumferentially provided with a number of positioning cavities. At least part of the clamping members 32 is adapted to the positioning cavities. When the clamping members 32 on both sides move towards the desired position, the clamping members 32 are adapted to the positioning cavities, thereby achieving stable clamping of the wafer cassette 01.

[0051] refer to Figure 7 , 9 As shown, in this embodiment, the wafer cassette 01 is provided with a plurality of limiting grooves 02 in the circumferential direction, and the clamping member 32 is provided with a limiting part 321. When the gripping drive unit 33 drives the clamping member 32 to move towards the desired position, the limiting part 321 cooperates with the limiting groove 02. Specifically, the limiting groove 02 is triangular. When the limiting part 321 cooperates with the limiting groove 02, the width of the space is gradually compressed and narrowed, so that the tip of the limiting groove 02 and the limiting part 321 gradually approach each other until they merge, which facilitates the quick adaptation of the limiting part 321 and the limiting groove 02, thereby restricting the horizontal relative rotation of the wafer cassette 01 and the clamping member 32.

[0052] refer to Figure 1 , 8As shown, in this embodiment, the lifting frame 21 is connected to a rotating shaft 211, which is horizontally rotatably connected to the output end of the horizontal component 1. A rotation drive unit 101 is installed at the output end of the horizontal component 1, and the rotation drive unit 101 is drivenly connected to the rotating shaft 211. In practical applications, when it is necessary to adjust the horizontal orientation of the wafer cassette 01, the rotation drive unit 101 drives the rotating shaft 211 to rotate so that the orientation of the wafer cassette 01 corresponds to the required direction, thereby meeting the orientation gripping requirements of the wafer cassette 01.

[0053] refer to Figure 6 , 9 As shown, in this embodiment, the clamping member 32 is hinged to a calibration member 51, the clamping member 32 is equipped with a calibration detection switch 52, and a reset member 53 is connected between the calibration detection switch 52 and the calibration member 51. When the reset member 53 is in the normal state, at least part of the calibration member 51 blocks the calibration detection switch 52.

[0054] refer to Figure 6 As shown, in practical applications, when the clamping member 32 moves a certain distance towards the wafer cassette 01, the wafer cassette 01 squeezes the calibration member 51 and simultaneously compresses the reset member 53, causing the calibration member 51 to separate from the calibration detection switch 52. This accurately detects that one end of the wafer cassette 01 is in contact with the calibration member 51. It can be understood that the clamping member 32 on one side supports the wafer cassette 01. In order to solve the problem that the wafer cassette 01 is suspended when one side is clamped, it is determined whether the separation state of the calibration detection switch 52 is triggered simultaneously. When the separation of the calibration detection switch 52 is achieved simultaneously, the clamping member 32 stably clamps both ends of the wafer cassette 01, preventing uneven force when clamping the wafer cassette 01, preventing the wafer cassette 01 from tilting or causing positioning deviation, and ensuring the wafer processing accuracy. Then the clamping member 32 continues to move towards the wafer cassette 01 in the same direction, so that the clamping member 32 stably clamps both ends of the wafer cassette 01, completing the stable clamping of the wafer cassette 01.

[0055] refer to Figure 9As shown, in this embodiment, the clamping member 32 is provided with a clamping surface 322, and the calibration member 51 is provided with a guiding surface 511. When the clamping member 32 moves toward the wafer cassette 01, the wafer cassette 01 presses against the calibration member 51 along the guiding surface 511. When the clamping member 32 moves toward the wafer cassette 01 to the desired position, the clamping surface 322 and the guiding surface 511 are flush to achieve stable clamping of the wafer cassette 01. By making the clamping surface 322 and the guiding surface 511 flush, the clamping member 32 and the wafer cassette 01 are aligned. The contact triggering conditions of the wafer cassette 01 are kept strictly consistent. This geometric consistency ensures that the calibration detection switches 52 of multiple clamping components 32 are triggered synchronously, avoiding misjudgments caused by differences in contact time. Furthermore, the two flush planes allow the clamping components 32 to automatically correct their trajectory through the guide surface 511 even with slight positional deviations, thus successfully correcting the positioning error of the clamping components 32. This reduces the positioning accuracy requirements of the wafer cassette 01 and helps to reduce the probability of clamping failure caused by vibration or inertia.

[0056] refer to Figure 2 , 3 As shown, in this embodiment, the opening end of the docking cylinder 42 is flared, and the space width gradually shortens when the docking piece 41 is inserted into the docking cylinder 42, which facilitates the smooth docking of the docking cylinder 42 and the docking piece 41 and facilitates the rapid positioning of the docking piece 41 and the docking cylinder 42.

[0057] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A high-altitude vehicle transport mechanism, characterized in that, It includes a lateral component (1) for connection to a walking component (100), a lifting mechanism (2) driven to the lateral component (1), and a gripping component (3) driven to the lifting mechanism (2), the gripping component (3) being used to grip or release a wafer cassette (01); When it is necessary to grab a wafer cassette (01), the walking assembly (100) moves to the designated wafer cassette (01) grabbing station. The horizontal assembly (1) drives the lifting mechanism (2) and the grabbing assembly (3) to move closer to the wafer cassette (01) until the grabbing assembly (3) is directly above the wafer cassette (01). The lifting mechanism (2) drives the grabbing assembly (3) to descend, the grabbing assembly (3) grabs the wafer cassette (01), the lifting mechanism (2) drives the wafer cassette (01) to rise, and the horizontal assembly (1) drives the wafer cassette (01) to be below the walking assembly (100).

2. The elevated vehicle transport mechanism according to claim 1, characterized in that, The lifting mechanism (2) includes a lifting frame (21) that is horizontally rotatably connected to the output end of the transverse component (1) and a lifting component (22) installed on the lifting frame (21). The lifting component (22) is driven to connect with the gripping component (3). The lifting component (22) is used to drive the gripping component (3) to descend or rise to the desired position.

3. The elevated vehicle transport mechanism according to claim 2, characterized in that, The lifting assembly (22) includes at least three flexible components (221) and a lifting drive unit (222) installed on the lifting frame (21). One end of the flexible component (221) is connected to the gripping assembly (3). The flexible component (221) passes through the lifting frame (21). The lifting drive unit (222) is driven to connect with the flexible component (221). When the lifting drive unit (222) releases or retracts the flexible component (221), it drives the gripping assembly (3) to descend or rise synchronously to the desired position.

4. The elevated vehicle transport mechanism according to claim 3, characterized in that, The lifting frame (21) is equipped with at least two docking parts (41), the gripping assembly (3) is equipped with at least two docking cylinders (42), the docking parts (41) cooperate with the docking cylinders (42), the lifting frame (21) is equipped with at least two longitudinally arranged photoelectric sensors (43), and the gripping assembly (3) is equipped with a blocking part (301). When the blocking member (301) blocks one of the photoelectric sensors (43), one end of the docking member (41) extends into the docking cylinder (42), and the lifting drive unit (222) reduces the moving speed of the gripping component (3); When the blocking member (301) blocks at least two photoelectric sensors (43), the docking member (41) is inserted into the docking cylinder (42), and the lifting drive unit (222) stops.

5. The elevated vehicle transport mechanism according to claim 1, characterized in that, The gripping assembly (3) includes a gripping frame (31) driven by the lifting mechanism (2), at least two clamping members (32) symmetrically arranged on both sides of the gripping frame (31), and a gripping drive unit (33). The gripping drive unit (33) is driven by the clamping members (32). The clamping members (32) are slidably connected to the gripping frame (31) in the same direction. The gripping drive unit (33) drives the clamping members (32) on both sides to move in opposite directions at the same time.

6. The elevated vehicle transport mechanism according to claim 5, characterized in that, The wafer cassette (01) is provided with several limiting grooves (02) in the circumferential direction. The clamping member (32) is provided with a limiting part (321). When the gripping drive unit (33) drives the clamping member (32) to move towards the desired position, the limiting part (321) cooperates with the limiting groove (02).

7. The elevated vehicle transport mechanism according to claim 2, characterized in that, The lifting frame (21) is connected to a rotating shaft (211), which is horizontally rotatably connected to the output end of the horizontal component (1). A rotation drive unit (101) is installed at the output end of the horizontal component (1), and the rotation drive unit (101) is drivenly connected to the rotating shaft (211). When it is necessary to adjust the horizontal orientation of the wafer cassette (01), the rotation drive unit (101) drives the rotating shaft (211) to rotate so that the orientation of the wafer cassette (01) corresponds to the required direction.

8. The elevated vehicle transport mechanism according to claim 5, characterized in that, The clamping member (32) is hinged to a calibration member (51), and the clamping member (32) is equipped with a calibration detection switch (52). A reset member (53) is connected between the calibration detection switch (52) and the calibration member (51). When the reset member (53) is in the normal state, at least part of the calibration member (51) blocks the calibration detection switch (52). When the clamping member (32) moves a certain distance toward the wafer cassette (01), the wafer cassette (01) squeezes the calibration member (51) and simultaneously compresses the reset member (53), causing the calibration member (51) to separate from the calibration detection switch (52). Then the clamping member (32) continues to move toward the wafer cassette (01) in the same direction so that the clamping member (32) stably clamps both ends of the wafer cassette (01).

9. The elevated vehicle transport mechanism according to claim 8, characterized in that, The clamping member (32) is provided with a clamping surface (322), and the calibration member (51) is provided with a guiding surface (511). When the clamping member (32) moves toward the wafer cassette (01), the wafer cassette (01) presses the calibration member (51) along the guiding surface (511). When the clamping member (32) moves to the desired position on the wafer cassette (01), the clamping surface (322) is flush with the guiding surface (511) to achieve stable clamping of the wafer cassette (01).

10. The elevated vehicle transport mechanism according to claim 4, characterized in that, The opening end of the docking cylinder (42) is flared.

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