Holding unit and bonding apparatus
By using a retaining assembly with elastic connections in the retaining fixture, the problem of damage to the retaining fixture and motion mechanism is solved, thereby improving bonding yield and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 天津中科晶禾电子科技有限责任公司
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-10
AI Technical Summary
Damage to tooling and motion mechanisms during pressurization due to direct or adapter connections can affect motion accuracy and bonding yield, thus reducing production efficiency.
A retaining assembly including a first retainer and a second retainer is adopted and connected by an elastic element. When an external force is applied to the first retainer, the elastic element is compressed to reduce the transmitted force, thereby reducing the pressure load on the second retainer and the drive assembly and improving the bonding yield.
This reduces the risk of deformation and damage to the retainer and drive components caused by the pressurized components, and improves bonding yield and production efficiency.
Smart Images
Figure CN224482033U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a holding unit and bonding equipment. Background Technology
[0002] In the field of semiconductor material manufacturing, the preparation of semiconductor materials requires applying pressure to the semiconductor materials through a pressurizing mechanism to achieve bonding between semiconductor materials. Typically, the semiconductor materials need to be placed on a holding fixture, which is then pressurized by the pressurizing mechanism. With the development of semiconductor material manufacturing technology, the holding fixture is no longer limited to being fixed to the pressurizing mechanism; it is also now equipped with motion mechanisms to enable the holding fixture to perform other functional actions before pressurization.
[0003] However, the holding fixture and motion mechanism are usually connected directly or through an adapter. The pressure applied by the pressurizing mechanism to the holding fixture will be transmitted to the adapter or motion mechanism, causing the adapter and motion mechanism to be subjected to a large load, resulting in damage to the adapter and motion mechanism, leading to a decrease in motion accuracy or even failure to perform functional actions, resulting in a decrease in bonding yield or even failure to bond normally, thus reducing production efficiency.
[0004] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content
[0005] The purpose of this invention is to provide a holding unit and bonding device that can reduce the possibility of the pressure mechanism affecting the motion mechanism and improve the bonding yield.
[0006] To achieve the above objectives, the following technical solution is provided:
[0007] A holding unit, the holding unit comprising:
[0008] A retaining assembly includes a first retaining member and a second retaining member stacked together. The first retaining member includes a first side and a second side disposed opposite to each other. The first side is disposed away from the second retaining member and configured to carry semiconductor material, and the second side is disposed toward the second retaining member and configured to receive external force.
[0009] The second retainer includes a through region that allows the external force to be applied to a second side of the first retainer, the second retainer being used to connect an external drive assembly;
[0010] A connecting assembly for connecting a first retainer and a second retainer, the connecting assembly including an elastic element configured to compress when an external force is applied to a second side of the first retainer to reduce the force transmitted by the connecting assembly to the second retainer.
[0011] As an optional embodiment of the retaining unit, the connecting assembly includes an elastic element and a guide rod, with the first end of the guide rod located on the side of the second retaining member opposite to the first retaining member, and the second end of the guide rod fixedly connected to the first retaining member.
[0012] As an alternative to the retaining unit, the elastic element is sleeved between the first end of the guide rod and the second retaining element.
[0013] As an alternative to the retaining unit, the second retaining member includes a through hole, through which the guide rod passes, and the guide rod is movably disposed relative to the second retaining member.
[0014] As an optional solution for the retaining unit, a linear guide is provided in the through hole, and the guide rod passes through the linear guide.
[0015] As an alternative to the retaining unit, the first retaining member includes a first main body and a frame, the first main body and the frame are detachably connected, the first main body includes a first side and a second side, and the first main body is connected to the second retaining member through the frame.
[0016] As an alternative to the retaining unit, the second retaining member includes a second main body and a through region, the through region extending through the second main body, and the second main body for connecting an external drive assembly. The second main body surrounds the through region, and the side of the second main body facing away from the through region is used for connecting the external drive assembly.
[0017] As an alternative to the holding unit, the projection of the first main body portion along the stacking direction of the first holding member and the second holding member is located within the projection of the through region along the stacking direction of the first holding member and the second holding member.
[0018] A bonding device is also provided, including a holding unit as described in any of the foregoing embodiments; and a driving component, drively connected to the second holding member, for driving the second holding member to move.
[0019] As an alternative to the bonding device, a pressure member is also included, at least one of which is capable of passing through the through-area of the second retainer and applying an external force to the second side of the first retainer.
[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0021] The holding unit and bonding apparatus provided by this invention can hold semiconductor materials. When the second side of the first holding member is subjected to an external force, the first holding member moves away from the second holding member, thereby causing the elastic member to undergo elastic deformation with a compressive tendency. A portion of the pressure load transmitted from the pressure member to the second holding member through the first holding member is converted into elastic potential energy, while reducing the peak force transmitted to the driving component. This reduces the pressure load transmitted from the pressure member to the second holding member through the first holding member, thereby reducing the possibility of deformation or even damage to the second holding member and / or the driving component under the action of pressure load, and improving the bonding yield. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0023] Figure 1 This is a simplified schematic diagram of a bonding device according to an embodiment of the present utility model;
[0024] Figure 2 This is a simplified schematic diagram of another bonding device in an embodiment of the present utility model;
[0025] Figure 3 This is a schematic diagram of the structure of a retaining unit in an embodiment of the present utility model;
[0026] Figure 4 for Figure 3 A schematic diagram of an enlarged structure of P;
[0027] Figure 5 This is a bottom view of the structure of a holding unit in an embodiment of the present utility model;
[0028] Figure 6 for Figure 5 A schematic diagram of a cross-sectional structure of AA;
[0029] Figure 7 for Figure 5 Another cross-sectional structural diagram of AA.
[0030] Figure label:
[0031] 100. Bonding device; 110. Holding unit; 120. Drive assembly; 130. Pressure component; 140. Holding fixture;
[0032] 10. Holding component; 11. First holding member; 111. First main body; 112. Frame; 12. Second holding member; 121. Through area; 122. Second main body; S1. First side; S2. Second side; 20. Connecting component; 21. Elastic member; 22. Guide rod; 221. Rod body; 222. Connecting part; 23. Linear guide member; 24. Limiting member; X. First direction. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0034] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0035] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0037] Figure 1 This is a simplified schematic diagram of a bonding device according to an embodiment of the present invention. Figure 2 This is a simplified schematic diagram of another bonding device in an embodiment of this utility model. Figure 3 This is a schematic diagram of the structure of a retaining unit in an embodiment of the present invention. Figure 4 for Figure 3 A schematic diagram of an enlarged structure of P. Figure 5 This is a bottom view of the structure of a holding unit in an embodiment of the present invention. Figure 6 for Figure 5 A schematic diagram of a cross-sectional structure of AA; Figure 7 for Figure 5 Another cross-sectional structural diagram of AA. Figure 1 The pressure component is not shown in the image. Figure 2 The driving components are not shown. Figure 6 This is a cross-sectional schematic diagram showing the structure when the pressure-applying component does not apply pressure to the first retaining component. Figure 7 This is a cross-sectional structural diagram showing the pressure applied by the pressurizing component to the first retaining component. Figure 6 and Figure 7 Pressure components are not shown in any of them.
[0038] Please see Figures 1 to 7 This utility model provides a bonding device 100. The bonding device 100 includes a holding unit 110 and a driving assembly 120. The driving assembly 120 is tractively connected to a second holding member 12 and is used to drive the second holding member 12 to move.
[0039] Optionally, the drive assembly 120 can drive the second retainer 12 to translate in a single direction or drive the second retainer 12 to rotate about a specific axis.
[0040] The bonding device 100 also includes a pressure member 130, at least one of which is capable of passing through the through area of the second retainer 12 and applying an external force to the second side S1 of the first retainer 11.
[0041] It is understandable that semiconductor bonding involves bonding two semiconductor materials together to form a new stacked structure. Therefore, two retaining fixtures are required. When semiconductor bonding is needed, the two retaining fixtures are positioned opposite each other, with the two semiconductor materials located between the two retaining fixtures. Two pressure-applying components 130 are also required, each applying pressure to one of the two retaining fixtures.
[0042] Optionally, both retaining fixtures can be retaining units 110 as described in this embodiment. In this case, the two pressure-applying members 130 pass through the through-area of the two second retaining members 12 respectively, so as to apply external force to the second side S2 of the two first retaining members 11 respectively. Of course, one of the two retaining fixtures can be the retaining unit 110 as described in this embodiment, and the other retaining fixture is fixed in a preset position without moving. In this case, one pressure-applying member 130 passes through the through-area 121 of the second retaining member 12 and applies external force to the second side S2 of the first retaining member 11.
[0043] The bonding apparatus 100 can apply pressure to semiconductor materials to bond them together. Optionally, the semiconductor materials include wafers, chips, or other acceptor substrates.
[0044] The pressurizing component 130 includes a pressure head, a drive unit, and other mechanisms. Optionally, the drive unit applies pressure to the first retaining member 11.
[0045] Please see Figures 1 to 7 This utility model embodiment provides a holding unit 110, which includes a holding component 10 and a connecting component 20. The holding component 10 includes a first holding member 11 and a second holding member 12 stacked together. The first holding member 11 includes a first side S1 and a second side S2 disposed opposite to each other. The first side S1 is disposed away from the second holding member 12 and configured to support semiconductor material, while the second side S2 is disposed towards the second holding member 12 and configured to receive external force. The second holding member 12 includes a through region 121, which allows external force to be applied to the second side S2 of the first holding member 11. The second holding member 12 is used to connect to an external driving component 120. The connecting component 20 connects the first holding member 11 and the second holding member 12. The connecting component 20 includes an elastic member 21 configured to compress when an external force is applied to the second side S2 of the first holding member 11, thereby reducing the force transmitted from the connecting component 20 to the second holding member 12.
[0046] The retaining assembly 10 includes a first retaining member 11 and a second retaining member 12 stacked together. The first retaining member 11 and the second retaining member 12 are stacked sequentially along a first direction X. The first retaining member 11 includes a first side S1 and a second side S2 disposed opposite to each other along the first direction X. The first side S1 faces the semiconductor material and can directly or indirectly support the semiconductor material. Here, "supporting" means being able to fix the semiconductor material to the first side S1. The second side S2 faces the second retaining member 12. Optionally, a portion of the surface of the second side S2 can abut against the second retaining member 12; or, a connecting assembly 20 is provided between the second side S2 and the second retaining member 12. The pressure head of the pressure member 130 can directly abut against the second side S2. Of course, the pressure head of the pressure member 130 can also abut against the second side S2 through an intermediate mechanism. Optionally, the intermediate mechanism includes an elastic material.
[0047] The drive assembly 120 connects to the second retainer 12 to drive the entire retainer assembly 10 to move along a preset motion trajectory, thereby moving the semiconductor material to a preset position. When the semiconductor material moves to the preset position, the pressure member 130 abuts against the second side S2 to apply pressure to the first retainer 11, thereby realizing the bonding process of the semiconductor material. When the first retainer 11 is subjected to pressure, the elastic member 21 undergoes elastic deformation with a compression tendency to offset the pressure load, thereby reducing the pressure load transmitted to the second retainer 12 and the drive assembly 120, and thus reducing the risk of deformation or even damage to the second retainer 12 and the drive assembly 120 under the action of pressure load.
[0048] Optionally, the preset motion trajectory includes rotational motion and lifting motion. For example, the drive assembly 120 includes a rotation mechanism that drives the holding assembly 10 to rotate to a preset position; the drive assembly 120 also includes a lifting mechanism that drives the holding assembly 10 to lift to a preset position. Optionally, the preset position can be a position where two semiconductor materials to be bonded are opposite each other and the distance between them is within a preset range.
[0049] Optionally, the number of connecting components 20 may include one or more.
[0050] In these alternative embodiments, the holding component 10 is capable of holding the semiconductor material. When the second side S2 of the first holding member 11 is subjected to an external force, the first holding member 11 moves away from the second holding member 12, thereby causing the elastic member 21 to undergo elastic deformation in a compressive tendency. A portion of the pressure load transmitted from the pressure member 130 to the second holding member 12 through the first holding member 11 is converted into elastic potential energy, while reducing the peak force transmitted to the driving component 120. This reduces the pressure load transmitted from the pressure member 130 to the second holding member 12 through the first holding member 11, thereby reducing the possibility of deformation or even damage to the second holding member 12 and / or the driving component 120 under the action of pressure load, and improving the bonding yield.
[0051] In some alternative embodiments, the connecting assembly 20 further includes a guide rod 22, the first end of which is located on the side of the second retainer 12 opposite to the first retainer 11, and the second end of which is fixedly connected to the first retainer 11.
[0052] When the first retainer 11 and the second retainer 12 move relative to each other (separate or move closer to each other), the guide rod 22 can play a guiding role, thereby reducing the possibility of misalignment after the first retainer 11 and the second retainer 12 move relative to each other and improving the motion accuracy of the first retainer 11 and the second retainer 12.
[0053] In some alternative embodiments, the elastic element 21 is sleeved between the first end of the guide rod 22 and the second retainer 12.
[0054] Optionally, the elastic element 21 includes a spring.
[0055] Optionally, the guide rod 22 may include a rod body 221 and a connecting portion 222. The connecting portion 222 is located at the first end of the guide rod 22, and the radial dimension of the guide rod 22 is smaller than the radial dimension of the connecting portion 222. The connecting portion 222 and part of the rod body 221 are located on the side of the second retainer 12 facing away from the first retainer 11. The elastic member 21 is sleeved between the connecting portion 222 and the side of the second retainer 12 facing the connecting portion 222. The rod body 221 is fixedly connected to the first retainer 11.
[0056] The elastic element 21 applies pressure to the second retainer 12 under the constraint of the guide rod 22, so that the elastic element 21 and the first retainer 11 clamp the second retainer 12, causing the first retainer 11 to move with the second retainer 12, thereby realizing the overall movement of the retaining assembly 10. When the pressure member 130 can apply pressure to the first retainer 11, the first retainer 11 will separate from the second retainer 12 when it is under pressure. The first retainer 11 drives the guide rod 22 to move. When the guide rod 22 moves, the connecting part 222 of the guide rod 22 applies pressure to the elastic element 21, so that the elastic element 21 undergoes elastic compression. The elastic element 21 can buffer the pressure load, avoid the rigid connection between the pressure member 130 and the drive assembly 120, and reduce the possibility of breakage at the connection between the drive assembly 120 and the second retainer 12.
[0057] In some alternative embodiments, the second retainer 12 includes a through hole through which the guide rod 22 passes, and the guide rod 22 is movably disposed relative to the second retainer 12.
[0058] Optionally, a portion of the rod body 221 of the guide rod 22 (the second end and the portion near the second end) passes through the through hole and is fixedly connected to the first retainer 11.
[0059] The embodiments of this application, through the above-described settings, facilitate the reduction of the overall size of the first retaining member 11, thereby reducing the overall size of the retaining assembly 10 and improving the integration of the retaining unit 110.
[0060] In some other examples, the projection of the second retainer 12 along the first direction X falls within the projection of the first retainer 11 along the first direction X. Alternatively, a through hole may not be provided on the second retainer 12, and the guide rod 22 may be connected only in the area of the first retainer 11 that extends beyond the second retainer 12.
[0061] In some alternative embodiments, a linear guide 23 is provided within the through hole, and the guide rod 22 passes through the linear guide 23. The linear guide 23 can improve the movement accuracy of the guide rod 22, reduce the possibility of the guide rod 22 wobbling, and improve the movement accuracy of the first gripper under the action of the pressure member 130.
[0062] Optionally, the linear guide 23 includes a linear bearing.
[0063] Optionally, the connecting assembly 20 further includes a limiting member 24, which is disposed on the side of the second retainer 12 facing away from the first retainer 11. The limiting member 24 is disposed above the through hole and restricts the axial movement of the linear guide 23. At the same time, the setting of the limiting member 24 can also make part of the linear guide 23 located outside the second retainer 12, thereby reducing the thickness of the second retainer 12 and reducing the overall weight.
[0064] In some alternative embodiments, the first retainer 11 includes a first body portion 111 and a frame 112, the first body portion 111 and the frame 112 are detachably connected, the first body portion 111 includes a first side S1 and a second side S2, and the first body portion 111 is connected to the second retainer 12 through the frame 112.
[0065] Optionally, when it is necessary to place the semiconductor material on the first side S1 of the first main body 111, the first main body 111 can be separated from the frame 112 firstly. After the semiconductor material is placed on the first side S1 of the first main body 111, the first main body 111 can be connected to the frame 112, thereby reducing the difficulty of placing the semiconductor material. At the same time, the first main body 111 is connected to the second retainer 12 through the frame 112 and the connecting component 20. The pressure on the first main body 111 is transmitted to the second retainer 12 through the frame 112 and the connecting component 20. When the pressure on the first main body 111 is too high, the frame 112 and the connecting component 20 preferably undergo plastic deformation with respect to the second retainer 12, thereby reducing the possibility of damage to the drive component 120. Moreover, maintenance can be achieved by simply replacing the retainer 10, reducing the difficulty of maintenance.
[0066] In some alternative embodiments, the second retainer 12 includes a second main body portion 122 and a through region 121, the through region 121 being disposed through the second main body portion 122, and the second main body portion 122 being used to connect the drive assembly 120. The second main body portion 122 is disposed around the through region 121, and the side of the second main body portion 122 facing away from the through region 121 is used to connect the drive assembly 120.
[0067] Optionally, the second main body 122 can be a frame structure.
[0068] Optionally, the second main body 122 and the first retainer 11 are connected by a connecting assembly 20. Optionally, the second main body 122 and the frame 112 are connected by a connecting assembly 20.
[0069] Optionally, the penetrating region 121 is provided to penetrate the second main body 122 along the first direction X.
[0070] When the pressure member 130 needs to abut against and pressurize the first retainer 11, the pressure member 130 can pass through the through area 121, thereby reducing the possibility of interference between the second retainer 12 and the pressure member 130.
[0071] For example, the projection of the second main body 122 along the first direction X is a continuous closed shape. The second main body 122 encloses a through region 121, which is a through hole structure, such that the middle of the second retainer 12 is used for the pressure member 130 to pass through to apply pressure to the first retainer 11. At the same time, the edge of the second retainer 12 is connected to the drive assembly 120 to reduce the possibility of interference between the drive assembly 120 and the pressure member 130. Furthermore, the connecting assembly 20 can connect the second main body 122 and the frame 112 to improve the uniformity of the pressure load borne by the second retainer 12.
[0072] In some alternative embodiments, the projection of the first main body portion 111 along the stacking direction of the first retainer 11 and the second retainer 12 is located within the projection of the through region 121 along the stacking direction of the first retainer 11 and the second retainer 12.
[0073] For example, the projection of the first main body 111 along the first direction X is located within the projection of the through region 121 along the first direction X. In other words, the projected area of the through region 121 is greater than or equal to the projected area of the first main body 111, so that the pressure member 130 can pass through the through region 121 and abut against any area of the first main body 111, thereby increasing the usability of the holding unit 110.
[0074] This embodiment provides a bonding apparatus 100, including a holding unit 110 and a driving assembly 120 as described in any of the above embodiments. The driving assembly 120 is tractively connected to a second retainer for driving the second retainer to move. Since the bonding apparatus 100 provided in this application includes the holding unit 110 of any of the above embodiments, the bonding apparatus 100 provided in this application has the beneficial effects of the holding unit 110 of any of the above embodiments, which will not be described again here.
[0075] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims
1. A holding unit, characterized in that, include: The retaining component (10) includes a first retaining member (11) and a second retaining member (12) stacked together. The first retaining member (11) includes a first side (S1) and a second side (S2) disposed opposite to each other. The first side (S1) is disposed away from the second retaining member (12) and is configured to carry semiconductor material. The second side (S2) is disposed towards the second retaining member (12) and is configured to receive external force. The second retainer (12) includes a through region (121) that satisfies the requirement that the external force can be applied to the second side (S2) of the first retainer (11), and the second retainer (12) is used to connect an external drive assembly (120); A connecting assembly (20) for connecting the first retainer (11) and the second retainer (12), the connecting assembly (20) including an elastic element (21) configured such that when the external force is applied to the second side (S2) of the first retainer (11), the elastic element (21) tends to compress to reduce the force transmitted from the connecting assembly (20) to the second retainer (12).
2. The holding unit according to claim 1, characterized in that, The connecting assembly (20) further includes a guide rod (22), the first end of which is located on the side of the second retainer (12) facing away from the first retainer (11), and the second end of which is fixedly connected to the first retainer (11).
3. The holding unit according to claim 2, characterized in that, The elastic element (21) is sleeved between the first end of the guide rod (22) and the second retainer (12).
4. The holding unit according to claim 2, characterized in that, The second retainer (12) includes a through hole, through which the guide rod (22) passes, and the guide rod (22) is movably disposed relative to the second retainer (12).
5. The holding unit according to claim 4, characterized in that, A linear guide (23) is provided inside the through hole, and the guide rod (22) passes through the linear guide (23).
6. The holding unit according to claim 1, characterized in that, The first retainer (11) includes a first main body (111) and a frame (112). The first main body (111) and the frame (112) are detachably connected. The first main body (111) includes a first side (S1) and a second side (S2). The first main body (111) is connected to the second retainer (12) through the frame (112).
7. The holding unit according to claim 6, characterized in that, The second retainer (12) includes a second main body (122) and the through region (121). The second main body (122) is used to connect the drive assembly (120). The second main body (122) is disposed around the through region (121), and the side of the second main body (122) facing away from the through region (121) is used to connect the drive assembly (120).
8. The holding unit according to claim 7, characterized in that, The projection of the first main body (111) along the stacking direction of the first retainer (11) and the second retainer (12) is located within the projection of the through region (121) along the stacking direction of the first retainer (11) and the second retainer (12).
9. A bonding apparatus, characterized in that, include: The holding unit (110) as described in any one of claims 1 to 8; as well as A drive assembly (120) is drively connected to the second retainer (12) for driving the second retainer (12) to move.
10. The bonding apparatus according to claim 9, characterized in that, It also includes a pressure member (130), at least one of which is capable of passing through the through area of the second retainer (12) to apply an external force to the second side (S2) of the first retainer (11).