A bin fullness sensing device
By combining mechanical structure and optical sensors, the hopper full detection device uses the rotation of the hopper baffle and the sensing baffle to determine the hopper status, which solves the problem of insufficient reliability of traditional detection methods and achieves highly reliable full detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHUANDONG MAGNETIC ELECTRONICS CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-07-14
AI Technical Summary
In traditional silo full-load detection solutions, mechanical detection suffers from contact oxidation and spring fatigue, while optical detection is susceptible to environmental interference, resulting in a high false trigger rate and insufficient reliability.
Combining mechanical structure and optical sensors, the fullness of the hopper is determined by the rotation of the hopper baffle and sensing baffle, using infrared light blocking and receiving. The optical sensor is set on the outside of the hopper to avoid environmental interference.
It solves the problems of oxidation of mechanical structure and spring fatigue, reduces false triggering rate, and improves the reliability and durability of detection.
Smart Images
Figure CN224483679U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of detection technology, and in particular to a silo full material sensing device. Background Technology
[0002] In electrical appliances or equipment with hopper functions, such as coffee machines, ice makers, and soy milk makers, as well as industrial equipment such as food processing equipment, feed processing equipment, and pharmaceutical equipment, there are two main traditional full-material detection solutions: mechanical detection and optical direct material detection. These two solutions have different drawbacks: mechanical detection relies on physical contact, and long-term frequent mechanical movements can lead to contact oxidation or spring fatigue; although optical detection is non-contact, it is severely affected by environmental interference, such as condensation adhering to the lens causing light scattering or powder adhering to the lens causing sensor failure. Both have problems with high false trigger rates and insufficient reliability. Utility Model Content
[0003] The purpose of this invention is to provide a silo full-load sensing device to solve the above-mentioned problems.
[0004] To achieve this objective, the present invention adopts the following technical solution:
[0005] A hopper full-material sensing device includes a hopper, a hopper baffle, a rotating shaft, a sensing baffle, and an optical sensor. The hopper baffle is fixed to the rotating shaft, which is rotatably mounted on the upper part of the hopper. The end of the rotating shaft extends out of the side wall of the hopper. The sensing baffle is fixed to the end of the rotating shaft. The optical sensor has an infrared emitting end and an infrared receiving end. The infrared emitting end is used to emit infrared rays to the infrared receiving end. The emitting end and the infrared receiving end are located on opposite sides of the sensing baffle. The hopper baffle is used to drive the sensing baffle into or out of the optical sensor via the rotating shaft.
[0006] Preferably, the hopper includes a feeding channel and a storage channel; the storage channel is inclined, the feeding channel is located at the top of the storage channel, and the hopper baffle is located at the top of the storage channel.
[0007] Preferably, the lower part of the hopper baffle is bent toward the feed channel.
[0008] Preferably, the optical sensor has a U-shaped structure, and the optical sensor includes a housing and a circuit board. The housing has a hollow structure, and the circuit board is disposed inside the housing.
[0009] Preferably, the opening of the housing is filled with electronic potting compound.
[0010] Preferably, the circuit board includes an infrared emitting circuit, an infrared receiving circuit, and a signal generating circuit. The infrared emitting circuit, the infrared receiving circuit, and the signal generating circuit are connected in parallel. The infrared receiving circuit has a first signal output terminal, and the signal generating circuit has a signal receiving terminal and a second signal output terminal. The first signal output terminal is connected to the signal receiving terminal, and the second signal output terminal is used to output a detection signal.
[0011] Preferably, the infrared emitting circuit includes a first resistor and an infrared emitting diode, one end of the first resistor is connected to an external power supply, and the other end is connected to the positive terminal of the infrared emitting diode; the negative terminal of the infrared emitting diode is grounded.
[0012] The infrared receiving circuit includes a second resistor and an infrared receiving tube. One end of the second resistor is connected to one end of the first resistor, and the other end of the second resistor is connected to the emitter of the infrared receiving tube. The collector of the infrared emitting tube is connected to the negative terminal of the infrared emitting tube, and the emitter of the infrared receiving tube is the first signal output terminal.
[0013] The signal generating circuit includes a third resistor and an NMOS transistor. One end of the third resistor is connected to one end of the second resistor, and the other end of the third resistor is connected to the drain of the NMOS transistor. The source of the NMOS transistor is connected to the collector of the infrared receiver. The gate of the NMOS transistor is the signal receiving terminal and is connected to the emitter of the infrared receiver. The drain of the NMOS transistor is the second signal output terminal.
[0014] One embodiment of this utility model has the following beneficial effects:
[0015] 1. By setting a baffle in the hopper, when the hopper is low on material, the baffle naturally hangs down under the action of gravity. The rotating shaft drives the induction baffle to move and enter the optical sensor. When the hopper is full, the baffle drives the induction baffle to leave the optical sensor. Thus, the mechanical and optical structures can be used to determine whether the hopper is full or low on material. This solves the oxidation and spring fatigue problems of traditional pure mechanical structures during long-term use, as well as the false detection problems caused by pure optical structures.
[0016] 2. The optical sensor is located on the outside of the hopper, which can avoid the influence of condensation and dust generated by the material on the optical sensor. Attached Figure Description
[0017] The accompanying drawings further illustrate the present invention, but the content of the drawings does not constitute any limitation on the present invention.
[0018] Figure 1This is a three-dimensional structural diagram of one embodiment of the present utility model;
[0019] Figure 2 This is a schematic diagram of the right side structure of one embodiment of the present invention;
[0020] Figure 3 This is a structural diagram of the hopper in a full state according to one embodiment of the present invention;
[0021] Figure 4 This is a structural schematic diagram of the hopper in a material shortage state according to one embodiment of this utility model;
[0022] Figure 5 This is an exploded view of the optical sensor according to one embodiment of the present invention;
[0023] Figure 6 This is a schematic diagram of the circuit block structure of a circuit board according to one embodiment of the present invention;
[0024] Figure 7 This is a circuit diagram of a circuit board according to one embodiment of the present invention;
[0025] In the attached diagram: 1-hopper, 11-feeding channel, 12-storage channel, 2-hopper baffle, 3-rotating shaft, 4-sensing baffle, 5-optical sensor, 51-infrared transmitter, 52-infrared receiver, 53-shell, 54-circuit board, 55-electronic potting compound, 56-infrared transmitting circuit, 57-infrared receiving circuit, 58-signal generating circuit, 6-material. Detailed Implementation
[0026] The embodiments of this utility model are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0029] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0030] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0031] This embodiment of a hopper full sensing device can be applied to electrical appliances or equipment with hopper functions, such as ice makers. The material to be detected is ice. When the hopper is low on ice, the ice maker needs to start making ice to replenish the ice in the hopper; when the hopper is full of ice, it stops making ice to prevent ice from overflowing the hopper.
[0032] like Figure 1-4 As shown, a hopper full-material sensing device of this utility model includes a hopper 1, a hopper baffle 2, a rotating shaft 3, a sensing baffle 4, and an optical sensor 5. The hopper baffle 2 is fixed to the rotating shaft 3, which is rotatably mounted on the upper part of the hopper 1, with the end of the rotating shaft 3 extending out of the side wall of the hopper 1. The sensing baffle 4 is fixed to the end of the rotating shaft 3. The optical sensor 5 has an infrared emitting end 51 and an infrared receiving end 52. The infrared emitting end 51 is used to emit infrared rays to the infrared receiving end 52, and the emitting end and the infrared receiving end 52 are located on both sides of the sensing baffle 4.
[0033] The hopper baffle is used to drive the sensing baffle into or out of the optical sensor via a rotating shaft:
[0034] In the first implementation, such as Figure 4 As shown, when the hopper 1 is in a material shortage state, the sensing baffle 4 enters the optical sensor 5 and blocks the infrared emitting end 51 and the infrared receiving end 52.
[0035] like Figure 3 As shown, when the hopper 1 is full, the sensing baffle 4 moves away from the optical sensor 5.
[0036] Conversely, in the second embodiment (not shown in the figure), when the hopper 1 is full, the sensing baffle 4 enters the optical sensor 5 and blocks the infrared emitting end 51 and the infrared receiving end 52.
[0037] When the hopper 1 is in a state of material shortage, the sensing baffle 4 moves away from the optical sensor 5.
[0038] This invention innovatively combines mechanical and optical structures, thereby solving the oxidation and spring fatigue problems of traditional purely mechanical structures during long-term use, as well as the false detection problems caused by purely optical structures. The optical sensor 5 is located on the outside of the hopper 1, preventing the influence of condensate and dust generated by the material 6 on the optical sensor 5. By installing a hopper baffle 2 in the hopper 1, when the hopper 1 is low on material, the baffle 2 naturally droops under gravity, driving the sensing baffle 4 to move and enter the optical sensor 5 via the rotating shaft 3, separating the infrared emitter 51 from the infrared receiver 52. The sensing baffle 4 blocks the infrared emitter 51 and the infrared receiver 52, ensuring that the infrared receiver 52 receives the infrared signal. When the infrared radiation is significantly reduced, the optical sensor 5 outputs the first signal. When material 6 is added to the hopper 1, during the filling process, the material 6 will gradually lift the hopper baffle 2, thereby driving the sensing baffle 4 to rotate upwards until the hopper 1 is full. At this time, the sensing baffle 4 leaves the optical sensor 5, and the infrared receiver 52 can directly receive the infrared radiation emitted by the infrared emitter 51. The optical sensor 5 outputs the second signal. When the material 6 in the hopper 1 is gradually consumed, the hopper baffle 2, under the action of gravity, drives the sensing baffle 4 to rotate downwards until the sensing baffle 4 enters the optical sensor 5 and blocks the infrared emitter 51 and the infrared receiver 52. At this time, the optical sensor 5 outputs the first signal. During the entire operation, the lifting of the hopper baffle 2 by the material 6 and the natural descent of the hopper baffle 2 under the action of gravity drive the rotation of the sensing baffle 4. When the sensing baffle 4 rotates to different positions, it triggers the optical sensor 5 to emit different signals, thereby determining whether the hopper 1 is full. Figure 2 As shown, the sensing baffle 4 and the optical sensor 5 do not need to contact each other, which can effectively avoid wear and tear and cleverly solve the problems existing in traditional detection methods.
[0039] Furthermore, the hopper 1 includes a feeding channel 11 and a storage channel 12; the storage channel 12 is inclined, the feeding channel 11 is located at the top of the storage channel 12, and the hopper baffle 2 is located at the top of the storage channel 12.
[0040] During feeding, material 6 slides from feeding channel 11 to storage channel 12. When material 6 enters storage channel 12, it will push the baffle to rotate, so that material 6 can gradually lift the baffle 2 of the hopper during the accumulation process.
[0041] Furthermore, such as Figure 1 , Figure 3 and Figure 4 As shown, the lower part of the hopper baffle 2 is bent toward the feed channel 11.
[0042] With this design, when the hopper 1 is low on material, the hopper baffle 2 will naturally droop under gravity. The line connecting the lower end of the hopper baffle 2 and the center of the rotating shaft 3 will have a negative angle. This allows the hopper baffle 2 to rotate a larger angle compared to a straight plate structure when the same material 6 is at a certain height. Therefore, the width of the sensing baffle 4 also needs to be increased accordingly so that the sensing baffle 4 can just leave the optical sensor 5 when the hopper 1 is full. When the material 6 slides into the storage channel 12, the material 6 will break through the hopper baffle 2 and slide down along the storage channel 12. During this process, the hopper baffle 2 will drive the sensing baffle 4 to rotate a certain angle through the rotating shaft 3. Because the hopper baffle 2 adopts a bent shape at the lower end and the sensing baffle 4 is wider, it is less likely to cause false detection due to the material 6 impacting the hopper baffle 2.
[0043] Furthermore, such as Figure 5 As shown, the optical sensor 5 has a U-shaped structure and includes a housing 53 and a circuit board 54. The housing 53 has a hollow structure and the circuit board 54 is disposed inside the housing 53.
[0044] By enclosing the circuit board 54 with an outer layer, the circuit board 54 can be protected, making it less susceptible to damage, and also providing waterproof and dustproof protection.
[0045] Furthermore, the opening of the outer casing 53 is filled with electronic potting compound 55.
[0046] It can prevent the circuit board 54 from oxidizing due to contact with air, and also prevent moisture from penetrating into the optical sensor and corroding the circuit board 54.
[0047] Furthermore, such as Figure 6 As shown, the circuit board 54 includes an infrared emitting circuit 56, an infrared receiving circuit 57, and a signal generating circuit 58. The infrared emitting circuit 56, the infrared receiving circuit 57, and the signal generating circuit 58 are connected in parallel. The infrared receiving circuit 57 has a first signal output terminal, and the signal generating circuit 58 has a signal receiving terminal and a second signal output terminal. The first signal output terminal is connected to the signal receiving terminal, and the second signal output terminal is used to output a detection signal.
[0048] When the infrared emitting circuit 56 is powered on, it will continuously emit infrared rays. When the infrared rays emitted by the infrared emitting circuit 56 are received by the infrared receiving circuit 57, the infrared receiving circuit 57 outputs a first signal to the signal generating circuit 58. The signal generating circuit 58 outputs a full material detection signal based on the first signal. When the infrared rays emitted by the infrared emitting circuit 56 are blocked, resulting in insufficient infrared light flux received by the infrared receiving circuit 57, the infrared receiving circuit 57 outputs a second signal to the signal generating circuit 58. The signal generating circuit 58 outputs a material shortage detection signal based on the second signal.
[0049] Specifically, such as Figure 7 As shown, the infrared emitting circuit 56 includes a first resistor R1 and an infrared emitting diode D1. One end of the first resistor R1 is connected to the external power supply VCC, and the other end is connected to the positive terminal of the infrared emitting diode D1; the negative terminal of the infrared emitting diode D1 is grounded.
[0050] The infrared receiving circuit 57 includes a second resistor R2 and an infrared receiving tube D2. One end of the second resistor R2 is connected to one end of the first resistor R1, and the other end of the second resistor R2 is connected to the emitter of the infrared receiving tube D2. The collector of the infrared emitting tube D1 is connected to the negative terminal of the infrared emitting tube D1, and the emitter of the infrared receiving tube D2 is the first signal output terminal.
[0051] The signal generating circuit 58 includes a third resistor R3 and an NMOS transistor Q1. One end of the third resistor R3 is connected to one end of the second resistor R2, and the other end of the third resistor R3 is connected to the drain of the NMOS transistor Q1. The source of the NMOS transistor Q1 is connected to the collector of the infrared receiver D2. The gate of the NMOS transistor Q1 is the signal receiving terminal and is connected to the emitter of the infrared receiver D2. The drain of the NMOS transistor Q1 is the second signal output terminal.
[0052] Infrared emitting diode D1 continuously emits infrared rays after being powered on. Infrared emitting diode D1 can be an infrared light-emitting diode. Infrared receiving diode D2 can be an infrared phototransistor.
[0053] When infrared receiver D2 receives infrared light emitted by infrared emitter D1, the emitter and collector of infrared receiver D2 are connected. Since the collector is grounded, the emitter of infrared receiver D2 is pulled low to a low level, which is the first signal. Correspondingly, the gate voltage of NMOS transistor Q1 is pulled low, the drain and source are disconnected, and the drain outputs a high level, which is the detection signal of full charge status.
[0054] When the infrared light emitted by infrared emitting diode D1 is blocked, the luminous flux of infrared light received by infrared receiving diode D2 drops below the threshold, and the current of infrared receiving diode D2 decreases significantly. That is, the emitter and collector of infrared receiving diode D2 are disconnected, and the emitter voltage resistor R2 of infrared receiving diode D2 is pulled up to a high level, which is the second signal. Correspondingly, the gate input of NMOS transistor Q1 is high, and the drain and source of NMOS transistor Q1 are connected. Since the source is grounded, the voltage of the drain is pulled down to ground, and the drain output is low, which is the detection signal of the material shortage state.
[0055] By detecting the voltage level of the drain of NMOS transistor Q1, it is possible to accurately determine whether the current state of the discharge bin 1 is full or short.
[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0057] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without inventive effort, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A hopper full-load sensing device, characterized in that, The device includes a hopper, a hopper baffle, a rotating shaft, a sensing baffle, and an optical sensor. The hopper baffle is fixed to the rotating shaft, which is rotatably mounted on the upper part of the hopper. The end of the rotating shaft extends out of the side wall of the hopper. The sensing baffle is fixed to the end of the rotating shaft. The optical sensor has an infrared emitting end and an infrared receiving end. The infrared emitting end is used to emit infrared rays to the infrared receiving end. The emitting end and the infrared receiving end are located on opposite sides of the sensing baffle. The hopper baffle is used to drive the sensing baffle into or out of the optical sensor via the rotating shaft.
2. The hopper full-load sensing device according to claim 1, characterized in that, The hopper includes a feeding channel and a storage channel; the storage channel is inclined, the feeding channel is located at the top of the storage channel, and the hopper baffle is located at the top of the storage channel.
3. The silo full-load sensing device according to claim 2, characterized in that, The lower part of the hopper baffle is bent toward the feed channel.
4. The silo full-load sensing device according to claim 1, characterized in that, The optical sensor has a U-shaped structure and includes a housing and a circuit board. The housing has a hollow structure and the circuit board is disposed inside the housing.
5. A silo full-load sensing device according to claim 4, characterized in that, The opening of the casing is filled with electronic potting compound.
6. A silo full-load sensing device according to claim 4, characterized in that, The circuit board includes an infrared emitting circuit, an infrared receiving circuit, and a signal generating circuit. The infrared emitting circuit, the infrared receiving circuit, and the signal generating circuit are connected in parallel. The infrared receiving circuit has a first signal output terminal, and the signal generating circuit has a signal receiving terminal and a second signal output terminal. The first signal output terminal is connected to the signal receiving terminal, and the second signal output terminal is used to output a detection signal.
7. A silo full-load sensing device according to claim 6, characterized in that, The infrared emitting circuit includes a first resistor and an infrared emitting diode. One end of the first resistor is connected to an external power supply, and the other end is connected to the positive terminal of the infrared emitting diode. The negative terminal of the infrared emitting diode is grounded. The infrared receiving circuit includes a second resistor and an infrared receiving tube. One end of the second resistor is connected to one end of the first resistor, and the other end of the second resistor is connected to the emitter of the infrared receiving tube. The collector of the infrared emitting tube is connected to the negative terminal of the infrared emitting tube, and the emitter of the infrared receiving tube is the first signal output terminal. The signal generating circuit includes a third resistor and an NMOS transistor. One end of the third resistor is connected to one end of the second resistor, and the other end of the third resistor is connected to the drain of the NMOS transistor. The source of the NMOS transistor is connected to the collector of the infrared receiver. The gate of the NMOS transistor is the signal receiving terminal and is connected to the emitter of the infrared receiver. The drain of the NMOS transistor is the second signal output terminal.