Multispectral chip assembly and electronic device

Abstract

The application provides a multispectral chip assembly and an electronic device. The multispectral chip assembly comprises an image sensor and a filter layer. The image sensor is configured to acquire light of different wavebands to obtain spectral information of each channel. Different channels correspond to spectral information of different wavebands. The filter layer is arranged on a light sensing path of the image sensor. The filter layer is configured to filter light entering the image sensor and allow light of at least four different wavebands to pass through. The waveband range of light that can pass through the filter layer is within the waveband range of light that can be acquired by the image sensor. The multispectral chip assembly provided by the application can allow light entering the image sensor to include at least four different wavebands by arranging the filter layer on the light sensing path of the image sensor. At least four spectral channels can be implemented, thereby increasing the number of channels and achieving multispectral imaging.

Description

Technical Field

[0001] This application relates to the field of multispectral chip component technology, specifically to multispectral chip components and electronic devices. Background Technology

[0002] Image sensing technology is a crucial element in modern information acquisition and is widely used in many fields such as consumer electronics, industrial inspection, security monitoring, autonomous driving, and biomedical imaging. Among them, RGB (red, green, and blue) color image sensors have become the mainstream solution in the current market due to their mature technology, controllable cost, and high integration.

[0003] Image sensors such as RGB in related technologies have the technical problem of a limited number of spectral channels. Utility Model Content

[0004] Embodiments of this application provide a multispectral chip assembly and electronic device.

[0005] In a first aspect, embodiments of this application provide a multispectral chip assembly, comprising:

[0006] An image sensor is used to acquire light in different wavelength bands to obtain spectral information for each channel, wherein different channels correspond to spectral information in different wavelength bands;

[0007] A filter layer is disposed on the photosensitive path of the image sensor. The filter layer is used to filter the light entering the image sensor and allow light of at least four different wavelengths to pass through.

[0008] The wavelength range of light that can pass through the filter layer is within the wavelength range of light that the image sensor can acquire.

[0009] In one embodiment, the bandwidth of light that can pass through at least a portion of the wavelengths of the filter layer is smaller than the bandwidth of light that can be acquired by the image sensor in at least one of the wavelengths.

[0010] In one embodiment, the image sensor includes a filter, the filter including at least one filter unit module, each filter unit module including an R filter unit, a G filter unit, a B filter unit and at least one extended filter unit, the R filter unit being used to allow light in the red band to pass through, the G filter unit being used to allow light in the green band to pass through, the B filter unit being used to allow light in the blue band to pass through, and the extended filter unit being used to allow light in a specific band to pass through, wherein any one of the red band, the green band and the blue band is different from the specific band.

[0011] In one embodiment, the extended filtering unit includes an X-filter unit for allowing light of a specific wavelength band to pass through.

[0012] In one embodiment, the number of X-filter units is at least two, and different X-filter units are used to allow light of different wavelengths to pass through.

[0013] In one embodiment, the image sensor includes R pixels, G pixels, B pixels, and at least one extended pixel, wherein the light wavelength acquired by any one of the R pixels, the G pixels, and the B pixels is different from the light wavelength acquired by the extended pixel.

[0014] In one embodiment, the extended pixel includes at least one X pixel, which is used to acquire at least one of long-wave ultraviolet light, mid-wave ultraviolet light, near-infrared light, mid-infrared light, and far-infrared light.

[0015] In one embodiment, the filter layer includes at least four filter regions, each filter region being used to allow light of at least three different wavelengths to pass through, and different filter regions being used to allow light of different wavelengths to pass through; or,

[0016] The filter layer includes a filter region for allowing light of at least four different wavelengths to pass through.

[0017] In one embodiment, the wavelength range of at least one band of light is within the red band range, the wavelength range of at least one band of light is within the green band range, the wavelength range of at least one band of light is within the blue band range, and the wavelength range of at least one band of light is within the specific band range.

[0018] In one embodiment, when the center wavelength of the light transmitted through the filter layer is between 400 nm and 420 nm, the quantum efficiency of the multispectral chip assembly is between 38% and 40%; and / or,

[0019] When the center wavelength of light passing through the filter layer is between 450nm and 470nm, the quantum efficiency of the multispectral chip assembly is between 50% and 51%; and / or,

[0020] When the center wavelength of light passing through the filter layer is between 500nm and 520nm, the quantum efficiency of the multispectral chip assembly is between 53% and 55%; and / or,

[0021] When the center wavelength of light passing through the filter layer is between 540nm and 560nm, the quantum efficiency of the multispectral chip assembly is between 51.5% and 52.5%; and / or,

[0022] When the center wavelength of light passing through the filter layer is between 640nm and 660nm, the quantum efficiency of the multispectral chip assembly is between 40.3% and 42%; and / or,

[0023] When the center wavelength of the light passing through the filter layer is between 800nm ​​and 820nm, the quantum efficiency of the multispectral chip assembly is between 16% and 19%.

[0024] In one embodiment, the maximum transmittance of the filter layer is greater than or equal to 90%; and / or,

[0025] The cutoff rate of the filter layer is greater than or equal to 2.5; and / or,

[0026] The error tolerance of the filter layer is less than or equal to 1%.

[0027] In one embodiment, the filter layer allows light with a center wavelength between 400nm and 420nm to pass through, and the bandwidth of the light with a center wavelength between 400nm and 420nm is between 40nm and 43nm; and / or,

[0028] The filter layer allows light with a center wavelength between 450nm and 470nm to pass through, and the bandwidth of the light with a center wavelength between 450nm and 470nm is between 31nm and 32nm; and / or,

[0029] The filter layer allows light with a center wavelength between 500nm and 520nm to pass through, and the bandwidth of the light with a center wavelength between 500nm and 520nm is between 29nm and 31nm; and / or,

[0030] The filter layer allows light with a center wavelength between 540nm and 560nm to pass through, and the bandwidth of the light with a center wavelength between 540nm and 560nm is between 31.5nm and 33nm; and / or,

[0031] The filter layer allows light with a center wavelength between 640nm and 660nm to pass through, and the bandwidth of the light with a center wavelength between 640nm and 660nm is between 40.5nm and 44nm; and / or,

[0032] The filter layer allows light with a center wavelength between 800nm ​​and 820nm to pass through, and the bandwidth of the light with a center wavelength between 800nm ​​and 820nm is between 98nm and 102nm.

[0033] In one embodiment, the image sensor is an RGB image sensor.

[0034] In one embodiment, the filter layer allows light of multiple different wavelengths to pass through, including a first band set, a second band set, and a third band set. The wavelength range of the first band set is within the wavelength range of the green channel of the RGB image sensor, the wavelength range of the second band set is within the wavelength range of the green channel of the RGB image sensor, and the wavelength range of the third band set is within the wavelength range of the blue channel of the RGB image sensor. Each of the first band set, the second band set, and the third band set includes at least one wavelength.

[0035] In one embodiment, the filter layer allows light from n different bands to pass through, wherein the first band set, the second band set, and the third band set each include n / 3 bands.

[0036] In one embodiment, the multispectral chip assembly further includes a housing, in which the image sensor and the filter layer are both encapsulated.

[0037] In one embodiment, the image sensor has a photosensitive lens, and the filter layer is connected to the photosensitive lens.

[0038] In one embodiment, the image sensor is a CSP-packaged image sensor; or, the image sensor is a COB-packaged image sensor.

[0039] Secondly, embodiments of this application provide an electronic device including the multispectral chip assembly described above.

[0040] The beneficial effects of the embodiments of this application are as follows:

[0041] In the embodiments of this application, a filter layer is provided on the photosensitive path of the image sensor, so that light passes through the filter layer before entering the image sensor. The filter layer can filter the light entering the image sensor, allowing light of at least four different wavelengths to enter the image sensor. The wavelength range of light that can pass through the filter layer is all within the wavelength range of light that the image sensor can acquire, ensuring that the image sensor can form images normally. In other words, by providing a filter layer on the photosensitive path of the image sensor, this application enables the light from the image sensor to include at least four different wavelengths, realizing at least four spectral channels, thereby increasing the number of channels and achieving multispectral imaging. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of a multispectral chip assembly provided in an embodiment of this application. The arrows in the diagram indicate the direction of light transmission.

[0044] Figure 2 This is a simplified structural diagram of a multispectral chip assembly provided in an embodiment of this application. The arrows in the diagram indicate the direction of light transmission.

[0045] Figure 3 This is a schematic diagram of the structure of the filter provided in an embodiment of this application;

[0046] Figure 4 This is one of the exploded structural diagrams of the multispectral chip assembly provided in the embodiments of this application. The arrows in the diagram indicate the direction of light transmission.

[0047] Figure 5 This is the second exploded view of the structure of the multispectral chip assembly provided in the embodiments of this application. The arrows in the figure indicate the direction of light transmission.

[0048] Figure 6 This is a schematic diagram of the structure of the filter layer provided in an embodiment of this application;

[0049] Figure 7 This is a schematic diagram of the structure of a multispectral chip assembly provided in an embodiment of this application, wherein the image sensor in the figure is an RGBX image sensor;

[0050] Figure 8 This is a schematic diagram of wavelength-quantum efficiency provided in an embodiment of this application;

[0051] Figure 9 This is a parameter table provided in the embodiments of this application;

[0052] Figure 10 The embodiments provided in this application are related to Figure 9 The parameter table corresponds to the spectral curves.

[0053] Figure 11 This is a wavelength-quantum efficiency curve provided in an embodiment of this application;

[0054] Figure 12 This is a schematic diagram of the structure of a multispectral chip assembly provided in an embodiment of this application, wherein the filter layer has four filter regions, and each filter region can transmit light in seven different wavelength bands;

[0055] Figure 13 This is a flowchart of a method for fabricating a multispectral chip assembly provided in an embodiment of this application. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0057] The following is combined Figures 1 to 13 This application describes a multispectral chip assembly and electronic device. Figure 2 In the image sensor, filter layer 2 is a 6-channel filter layer, and image sensor 1 is an RGB image sensor. Figure 7 In the image sensor, filter layer 2 is an 8-channel filter layer, and image sensor 1 is an RGBX image sensor. Figure 8 In the diagram, R, G, B, and X represent the four photosensitive bands of the image sensor, while CH1, CH2, CH3, CH4, CH5, CH6, CH7, and CH8 represent the eight different bands of the light-transmitting filter layer 2.

[0058] According to the embodiments of the first aspect of this application, such as Figure 1 and Figure 2 The multispectral chip assembly includes an image sensor 1 and a filter layer 2. The image sensor 1 is used to acquire light of different wavelengths to obtain spectral information of each channel, wherein different channels correspond to spectral information of different wavelengths. The filter layer 2 is disposed on the photosensitive path of the image sensor 1 and is used to filter the light entering the image sensor 1, allowing light of at least four different wavelengths to pass through.

[0059] The wavelength range of light that can pass through the filter layer 2 is within the wavelength range of light that can be acquired by the image sensor 1.

[0060] According to the multispectral chip assembly of this application embodiment, by setting a filter layer 2 on the photosensitive path of the image sensor 1, light passes through the filter layer 2 before entering the image sensor 1. The filter layer 2 can filter the light entering the image sensor 1, allowing light of at least four different wavelengths to enter the image sensor 1. The wavelength range of light that can pass through the filter layer 2 is all within the wavelength range of light that the image sensor 1 can acquire, ensuring that the image sensor 1 can form an image normally. In other words, by setting a filter layer 2 on the photosensitive path of the image sensor 1, this application enables the light from the image sensor 1 to include at least four different wavelengths, thereby realizing at least four spectral channels, increasing the number of channels, and achieving multispectral imaging.

[0061] It is understood that this application directly adds a filter layer 2 to the photosensitive path of the image sensor 1 without changing the pixels of the image sensor 1, thereby enabling more spectral channels without sacrificing spatial resolution. Furthermore, the image sensor 1 can be an existing RGB image sensor 1 or other image sensors 1, thus allowing for the rapid and low-cost acquisition of a multispectral chip component.

[0062] In some examples, filter layer 2 allows light of a different wavelength bands to pass through, while the filter structure of image sensor 1 itself allows light of b different wavelength bands to pass through, where a is greater than b.

[0063] Specifically, when b is no greater than 3, a can be greater than b. In this case, the number of spectral channels can be increased through filter layer 2.

[0064] Specifically, when b is greater than 3, a can be greater than or equal to b. When a = b, the image sensor 1 can already achieve at least four spectral channels. Since the wavelength range of light that can pass through the filter layer 2 is within the wavelength range of light that the image sensor 1 can acquire, although the filter layer 2 cannot increase the number of spectral channels, it can limit the photosensitive wavelength range of the image sensor 1 to improve the photosensitive effect.

[0065] Understandably, the existing RGB image sensor 1 only has three spectral channels: R, G, and B, which is a relatively small number. However, this application adds a filter layer 2 to the photosensitive channel of the image sensor 1. Since the filter layer 2 allows light of at least four different wavelengths to pass through, the light entering the image sensor 1 includes at least four different wavelengths. Therefore, the multispectral chip component of this application has at least four spectral channels, effectively increasing the number of channels and enabling multispectral imaging.

[0066] The multispectral implementation schemes in related technologies have the following problems: 1. Generally, each pixel is made into an independent spectral unit for each channel, which is complex, has a long production cycle, low yield, and high cost; 2. When multiple channels are arranged in space, spatial resolution is sacrificed, and the spatial distance between the same channels is too long, making it difficult to realize more channels.

[0067] This application allows for the direct placement of a filter layer 2 on the existing image sensor 1. The filter layer 2 filters the light entering the image sensor 1, ensuring that the light includes at least four wavelengths. This enables the image sensor 1 to achieve at least four spectral channels, thus realizing multispectral imaging. In other words, this application obtains a multispectral chip component simply by placing a filter layer 2 on the photosensitive path of the image sensor 1. This process is simple, has a short production cycle, high yield, and low cost. Furthermore, at least some pixels can achieve multi-channel imaging, ensuring spatial resolution.

[0068] In one embodiment of this application, the wavelength width of light that can pass through at least a portion of the light bands of the filter layer 2 is smaller than the wavelength width of light in at least one of the light bands that the image sensor 1 can acquire, thereby reducing the photosensitive wavelength width of the image sensor 1 and improving imaging accuracy.

[0069] In one embodiment of this application, the image sensor 1 is, for example, an RGB image sensor 1. It should be noted that the image sensor 1 is only used as an example for illustration and is not intended to be particularly limited. The image sensor 1 can also be any other suitable sensor, such as an infrared sensor.

[0070] Specifically, the filter layer 2 allows light of multiple different wavelengths to pass through. These multiple different wavelengths include a first wavelength set, a second wavelength set, and a third wavelength set. The wavelength range of the first wavelength set is within the wavelength range of the green channel of the RGB image sensor 1, the wavelength range of the second wavelength set is within the wavelength range of the green channel of the RGB image sensor 1, and the wavelength range of the third wavelength set is within the wavelength range of the blue channel of the RGB image sensor 1. Each of the first wavelength set, the second wavelength set, and the third wavelength set includes at least one wavelength.

[0071] In other words, the wavelength range of at least one band of light is within the wavelength range of the red channel of the RGB image sensor 1, the wavelength range of at least one band of light is within the wavelength range of the green channel of the RGB image sensor 1, and the wavelength range of at least one band of light is within the wavelength range of the blue channel of the RGB image sensor 1. This ensures that the R pixel 13, G pixel 14 and B pixel 15 of the RGB image sensor 1 can all be photosensitive, avoiding the situation where some pixels are idle.

[0072] Specifically, filter layer 2 allows light from n different wavelengths to pass through, wherein the first band set, the second band set, and the third band set each include n / 3 bands.

[0073] In other words, the wavelength range of n / 3 light bands is within the wavelength range of the red channel of the RGB image sensor 1, the wavelength range of n / 3 light bands is within the wavelength range of the green channel of the RGB image sensor 1, and the wavelength range of n / 3 light bands is within the wavelength range of the blue channel of the RGB image sensor 1, so that each pixel unit can realize n / 3 spectral channels.

[0074] The filter layer 2 allows light from at least four different wavelengths to pass through, so n is greater than or equal to 6. In other words, each pixel unit can achieve at least two spectral channels. The R pixel unit, G pixel unit and B pixel unit together can achieve at least 6 spectral channels, thus realizing multispectral.

[0075] In one embodiment of this application, such as Figure 1 The spectral chip also includes a housing 3, in which the image sensor 1 and the filter layer 2 are encapsulated.

[0076] Understandably, packaging the image sensor 1 and the filter layer 2 together to obtain a multispectral chip assembly improves the integration of the multispectral chip assembly.

[0077] In one embodiment of this application, the image sensor 1 has a photosensitive lens, and the filter layer 2 is connected to the photosensitive lens.

[0078] It is understandable that by directly placing the filter layer 2 on the photosensitive lens of the image sensor 1, the filter layer 2 can filter the light entering the image sensor 1, which is a simple operation.

[0079] In some examples, image sensor 1 is, for example, a CSP packaged image sensor 1, that is, image sensor 1 can be an image sensor 1 obtained based on CSP packaging technology.

[0080] In some examples, image sensor 1 is, for example, a COB packaged image sensor 1, that is, image sensor 1 can be an image sensor 1 obtained based on COB packaging technology.

[0081] In one embodiment of this application, image sensor 1 is taken as an RGBX image sensor. Figure 3 and Figure 7The image sensor 1 includes a filter 11, which includes at least one filter unit module 12. Each filter unit module 12 includes an R filter unit 121, a G filter unit 122, a B filter unit 123, and at least one extended filter unit 124. The R filter unit 121 is used to allow light in the red band to pass through, the G filter unit 122 is used to allow light in the green band to pass through, the B filter unit 123 is used to allow light in the blue band to pass through, and the extended filter unit 124 is used to allow light in a specific band to pass through. Each of the red band, green band, and blue band is different from the specific band.

[0082] It is understandable that the filter 11 of the image sensor 1 allows light in the red, green, and blue bands, as well as specific bands, to pass through. The image sensor 1 includes at least four pixel units, meaning that the image sensor 1 can realize at least four spectral channels. Assuming that the filter layer 2 allows light in a different band to pass through, by expanding the arrangement of the filter units 124, the light-sensing range of the image sensor 1 is increased, which in turn helps to increase the upper limit of a, i.e., it helps to increase the number of spectral channels that the multispectral chip assembly can realize.

[0083] When the filter layer 2 allows light of at least five different wavelengths to pass through, the filter layer 2 can make the light entering the image sensor 1 include at least five different wavelengths, thereby increasing the number of spectral channels that the image sensor 1 can achieve.

[0084] When the filter layer 2 allows light of four different wavelengths to pass through, although the filter layer 2 cannot increase the number of spectral channels, it can limit the photosensitive wavelength width of the image sensor 1 to improve the photosensitive effect.

[0085] Specifically, such as Figure 3 The extended filter unit 124 includes an X-filter unit 1241, which allows light of a specific wavelength band to pass through. By setting the X-filter unit 1241, the light-sensing range of the image sensor 1 is increased, which is beneficial for increasing the number of spectral channels that the multispectral chip assembly can achieve.

[0086] In some examples, the number of X-filter units 1241 is at least two, and different X-filter units 1241 are used to allow light of different wavelengths to pass through. That is, the image sensor 1 can realize at least five spectral channels. Assuming that the filter layer 2 can allow light of a different wavelengths to pass through, the setting of at least two X-filter units 1241 increases the light-sensing range of the image sensor 1, which in turn helps to increase the upper limit of a, that is, helps to increase the number of spectral channels that the multispectral chip assembly can realize.

[0087] In one embodiment of this application, image sensor 1 is taken as an RGBX image sensor. Figure 4 and Figure 7 The image sensor 1 includes R pixel 13, G pixel 14, B pixel 15 and extended pixel 16. The light band acquired by any one of R pixel 13, G pixel 14 and B pixel 15 is different from the light band acquired by extended pixel 16.

[0088] In other words, image sensor 1 can realize at least four spectral channels. Assuming that filter layer 2 can allow light of a different wavelength bands to pass through, by expanding the setting of pixel points 16, the light-sensing range of image sensor 1 is increased, which in turn helps to increase the upper limit of a, that is, helps to increase the number of spectral channels that the multispectral chip component can realize.

[0089] In some examples, after filtering by the light-filtering layer, R pixel 13, G pixel 14, B pixel 15, and extended pixel 16 can sense the same number of light wavelengths.

[0090] In some examples, such as Figure 4 The extended pixel 16 includes at least one X pixel, which is used to acquire at least one of long-wave ultraviolet light UA, mid-wave ultraviolet light UB, near-infrared light NR, mid-infrared light MR, and far-infrared light LR. In other words, the image sensor 1 can sense not only visible light but also invisible light, thus increasing the light-sensing range of the image sensor 1.

[0091] In one embodiment of this application, such as Figure 5 The filter layer 2 includes at least four filter areas 20, each filter area 20 is used to allow light of at least three different wavelengths to pass through, and different filter areas 20 are used to allow light of different wavelengths to pass through.

[0092] In other words, the filter layer 2 allows light from at least 12 different wavelengths to pass through, thereby enabling the image sensor 1 to achieve at least 12 spectral channels.

[0093] Alternatively, filter layer 2 can consist of only one filter region, which allows light of at least four different wavelengths to pass through. In this case, filter layer 2 is a single unit, and the entire filter layer 2 can transmit light of at least four different wavelengths.

[0094] In some examples, each filter area 20 is used to allow light of 8 different wavelengths to pass through, so that the filter layer 2 can allow light of 32 different wavelengths to pass through, thus enabling the image sensor 1 to achieve 32 channels.

[0095] In some examples, such as Figure 12The four filter regions 20 include a first filter region, a second filter region, a third filter region, and a fourth filter region. The first filter region allows light from a first set of filtered wavelengths to pass through; the second filter region allows light from a second set of filtered wavelengths to pass through; the third filter region allows light from a third set of filtered wavelengths to pass through; and the fourth filter region allows light from a fourth set of filtered wavelengths to pass through. The first set of filtered wavelengths includes 410nm, 450nm, 480nm, 550nm, 610nm, 650nm, and 810nm wavelengths. The second filter region... The first set includes the 415nm, 455nm, 485nm, 560nm, 615nm, 670nm, and 815nm wavelengths; the second set includes the 420nm, 460nm, 490nm, 565nm, 620nm, 680nm, and 820nm wavelengths; and the third set includes the 425nm, 465nm, 495nm, 570nm, 625nm, 6805nm, and 825nm wavelengths.

[0096] Specifically, at least one band of light falls within the red band range, at least one band of light falls within the green band range, at least one band of light falls within the blue band range, and at least one band of light falls within a specific band range. This ensures that at least one band of light can pass through the R filter unit, at least one band of light can pass through the G filter unit, and at least one band of light can pass through the B filter unit, guaranteeing that all photosensitive units of the image sensor can perform photosensitive functions.

[0097] In one embodiment of this application, when the center wavelength of the light passing through the filter layer 2 is between 400nm and 420nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 38% and 40%; and / or,

[0098] When the center wavelength of light passing through the filter layer 2 is between 450nm and 470nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 50% and 51%; and / or,

[0099] When the center wavelength of light passing through the filter layer 2 is between 500nm and 520nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 53% and 55%; and / or,

[0100] When the center wavelength of light passing through the filter layer 2 is between 540nm and 560nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 51.5% and 52.5%; and / or,

[0101] When the center wavelength of light passing through the filter layer 2 is between 640nm and 660nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 40.3% and 42%; and / or,

[0102] When the center wavelength of light passing through the filter layer 2 is between 800nm ​​and 820nm, the quantum efficiency (QE value) of the multispectral chip assembly is between 16% and 19%.

[0103] Understandably, spectral chips have high quantum efficiency (>50%) in the 450nm-470nm (blue light), 500nm-520nm (cyan-green light), and 540nm-560nm (yellow-green light) regions, enabling them to capture photons of these specific wavelengths more efficiently and convert them into electrical signals, thus significantly improving the detection capability and signal-to-noise ratio of optical signals in these bands.

[0104] Understandably, the spectral chip maintains high quantum efficiency in the 640nm-660nm (red light) range, and the chip's spectral response is highly matched with the characteristic wavelengths of these key biological / chemical indicators, significantly improving the accuracy and sensitivity of related biosensors or health monitoring devices.

[0105] It is understandable that ambient light (especially sunlight) is rich in near-infrared light. Reducing the quantum efficiency in the 800nm-820nm and 400nm-420nm wavelength bands can significantly reduce the interference of the NIR component in ambient light on the target visible light signal (especially blue and green light).

[0106] In some examples, such as Figure 9 and Figure 10 When the center wavelength of the light passing through filter layer 2 is 410 nm, the quantum efficiency of the spectral chip is 39.4%; and / or,

[0107] When the center wavelength of light passing through filter layer 2 is 460 nm, the quantum efficiency of the spectral chip is 50.6%; and / or,

[0108] When the center wavelength of light passing through filter layer 2 is 510 nm, the quantum efficiency of the spectral chip is 54.5%; and / or,

[0109] When the center wavelength of light passing through filter layer 2 is 550 nm, the quantum efficiency of the spectral chip is 52.0%; and / or,

[0110] When the center wavelength of light passing through filter layer 2 is 650 nm, the quantum efficiency of the spectral chip is 40.3%; and / or,

[0111] When the center wavelength of light passing through the filter layer 2 is 810 nm, the quantum efficiency of the spectral chip is 17.3%. In one embodiment of this application, the maximum transmittance of the filter layer 2 is greater than or equal to 90%, which is beneficial for maximizing signal strength, significantly improving the signal-to-noise ratio, and enhancing the accuracy of multispectral data.

[0112] In one embodiment of this application, the filter layer 2 allows light with a center wavelength between 400nm and 420nm to pass through, and the bandwidth of the light with a center wavelength between 400nm and 420nm is between 40nm and 43nm; and / or,

[0113] Filter layer 2 allows light with a center wavelength between 450nm and 470nm to pass through, and the bandwidth of light with a center wavelength between 450nm and 470nm is between 31nm and 32nm; and / or,

[0114] Filter layer 2 allows light with a center wavelength between 500nm and 520nm to pass through, and the bandwidth of light with a center wavelength between 500nm and 520nm is between 29nm and 31nm; and / or,

[0115] Filter layer 2 allows light with a center wavelength between 540nm and 560nm to pass through, and the bandwidth of light with a center wavelength between 540nm and 560nm is between 31.5nm and 33nm; and / or,

[0116] Filter layer 2 allows light with a center wavelength between 640nm and 660nm to pass through, and the bandwidth of light with a center wavelength between 640nm and 660nm is between 40.5nm and 44nm; and / or,

[0117] The filter layer 2 allows light with a center wavelength between 800nm ​​and 820nm to pass through, and the bandwidth of light with a center wavelength between 800nm ​​and 820nm is between 98nm and 102nm.

[0118] Understandably, the 400nm-420nm wavelength range is designed to balance the intensity of ultraviolet signals with the complexity of the manufacturing process.

[0119] The 500nm-520nm and 540nm-560nm bands have narrower bandwidths, which can avoid interference from adjacent bands.

[0120] The 450nm-470nm wavelength range has a relatively narrow bandwidth, which is beneficial for optimizing the detection of blue light absorbing substances while suppressing ambient light noise.

[0121] The 800nm-820nm band has a relatively wide bandwidth, which is beneficial to improving the near-infrared signal throughput, compensating for the disadvantage of low quantum efficiency (QE value) in this band, and ensuring the signal-to-noise ratio of active sensing.

[0122] The 640nm-660nm wavelength range has a relatively wide bandwidth, which can cover the red light region and balance sensitivity and anti-interference capability.

[0123] In some examples, such as Figure 9 and Figure 10 Filter layer 2 allows light with a center wavelength of 410 nm to pass through, and the bandwidth of light with a center wavelength of 410 nm is 42 nm; and / or,

[0124] Filter layer 2 allows light with a center wavelength of 460 nm to pass through, and the bandwidth of light with a center wavelength of 460 nm is 32.5 nm; and / or,

[0125] Filter layer 2 allows light with a center wavelength of 510 nm to pass through, and the bandwidth of light with a center wavelength of 510 nm is 30 nm; and / or,

[0126] Filter layer 2 allows light with a center wavelength of 550nm to pass through, and the bandwidth of light with a center wavelength of 550nm is 32nm; and / or,

[0127] Filter layer 2 allows light with a center wavelength of 650nm to pass through, and the bandwidth of light with a center wavelength of 410nm is 41nm; and / or,

[0128] The filter layer 2 allows light with a center wavelength of 810nm to pass through, and the bandwidth of light with a center wavelength of 810nm is 100nm.

[0129] In one embodiment of this application, the cutoff ratio (OD) of the filter layer 2 is greater than or equal to 2.5, which helps to reduce the influence of interference light, improve the signal-to-noise ratio, enhance the independence of spectral data of each channel, and reduce the complexity of algorithm correction.

[0130] In some examples, such as Figure 9 and Figure 10 The cutoff rate of filter layer 2 is, for example, greater than or equal to 3.

[0131] In one embodiment of this application, such as Figure 9 and Figure 10 The error tolerance of filter layer 2 is less than or equal to 1%, which helps to ensure the absolute accuracy of the multispectral channels and improve stability.

[0132] It is understandable that the error tolerance refers to the ratio of the maximum deviation of key parameters such as center wavelength offset, bandwidth change, and transmittance fluctuation not exceeding the design value. For example, when the error tolerance is less than or equal to 1%, it means that the maximum deviation of key parameters such as center wavelength offset, bandwidth change, and transmittance fluctuation does not exceed 1% of the design value.

[0133] In some embodiments, along the optical path direction of the filter layer of the housing 3, the orthographic projection of the image sensor 1 on the bottom of the housing 3 coincides with the orthographic projection of the filter layer 2 on the bottom of the housing 3, thereby ensuring that the filter layer 2 can effectively filter the light entering the image sensor 1.

[0134] Along the light path direction of the filter layer of the housing 3, the orthographic projection of the image sensor 1 on the bottom of the housing 3 is within the orthographic projection of the filter layer 2 on the bottom of the housing 3, thereby ensuring that the filter layer 2 can effectively filter the light entering the image sensor 1.

[0135] It should be noted that the optical path direction of the filter layer refers to the direction in which light rays are transmitted when they enter the filter layer.

[0136] In some embodiments, such as Figure 6 The filter layer includes at least one first filter film 211 and at least one second filter film 212. The refractive index of the first filter film 211 is greater than the refractive index of the second filter film 212. The first filter film 211 and the second filter film 212 are alternately arranged.

[0137] It is understandable that by alternately stacking the first filter film 211 and the second filter film 212 with different refractive indices to form a filter layer, the filter layer can transmit light of at least two different wavelengths, thus achieving the goal of obtaining light of multiple different wavelengths using the same filter layer. In other words, the spectral structure of multiple wavelengths is the same. Therefore, the filter layer of this application does not require repeated etching, cleaning and other steps during preparation, making the process simple and the cost low.

[0138] In some examples, this application employs multilayer film technology, using alternating stacks of high-refractive-index filter films (such as titanium oxide, specifically titanium oxide or titanium dioxide) and low-refractive-index filter films (such as SiO2). By combining different thicknesses of these two films, at least one narrow-band transmission peak can pass through the filter layer, allowing a single filter layer to transmit multiple independent narrow-band transmission peaks, such as two, four, or seven. For example, a single filter layer can achieve four independent narrow-band transmission peaks with center wavelengths of 450 nm, 550 nm, 650 nm, and 750 nm.

[0139] It should be noted that, based on functional requirements and performance parameters, the wavelength range of the transmitted narrowband transmission peak can be adjusted to be the center wavelength ± (1nm-100nm), and the full width at half maximum (FWHM) ≤ (1nm-100nm) by adjusting the materials used in the first filter film 211 and the second filter film 212, as well as the alternating stacking of high and low refractive index materials. For example, if the center wavelength of the transmitted light is 550nm, then the actual transmitted narrowband transmission peak wavelength range is 550nm ± (1nm-100nm); if the center wavelength is 450nm, then the narrowband transmission peak wavelength range is 450nm ± (1nm-100nm). Crosstalk suppression between multiple narrowband transmission peaks transmitted through the same filter layer is sufficiently low, such as an isolation of ≥30dB between adjacent bands, ensuring sufficient independence of the corresponding quantum-responsible optical channel data.

[0140] In some examples, the first filter film 211 and the second filter film 212 can be made of any one of the following materials: aluminum (Al), chromium (Cr), gold (Au), silver (Ag), silicon (Si), germanium (Ge), aluminum oxide (Al₂O₃), cerium oxide (CeO₂), hafnium dioxide (HfO₂), indium tin oxide (ITO), magnesium oxide (MgO), niobium pentoxide (Nb₂O₅), silicon monoxide (SiO₂), silicon dioxide (SiO₂), titanium dioxide (TiO₂), titanium trioxide (Ti₃O₅), tantalum pentoxide (Ta₂O₅), yttrium oxide (Y₂O₃), zinc oxide (ZnO), zirconium oxide (ZrO₂), aluminum fluoride (AlF₃), magnesium fluoride (MgF₂), calcium fluoride (CaF₂), ytterbium fluoride (YbF₃), yttrium fluoride (YF₃), zinc sulfide (ZnS), and zinc selenide (ZnSe).

[0141] Specifically, the thickness of the different first filter films 211 varies.

[0142] It is understandable that when there are at least two first filter films 211, by adjusting the thickness of different first filter films 211, the thickness of different first filter films 211 can be different, thereby changing the number of light bands that can be transmitted by the filter layer composed of the first filter films 211, or changing the range of light bands that can be transmitted by the filter layer.

[0143] Specifically, the thickness of different second filter films 212 varies.

[0144] It is understandable that when there are at least two second filter films 212, by adjusting the thickness of different second filter films 212, the thickness of different second filter films 212 can be different, thereby changing the number of light bands that can be transmitted by the filter layer composed of the second filter films 212, or changing the range of light bands that can be transmitted by the filter layer.

[0145] Specifically, the first filter film 211 and the second filter film 212 have different thicknesses.

[0146] It is understandable that by adjusting the thickness of the first filter film 211 and the second filter film 212, making the thicknesses of the first filter film 211 and the second filter film 212 different, the number of light bands that the filter layer composed of the first filter film 211 and the second filter film 212 can transmit, or the range of light bands that the filter layer can transmit, can be changed.

[0147] In some examples, the thickness of the first filter film 211 and the second filter film 212 may also be the same.

[0148] In some embodiments, the filter layer includes at least two filter regions 20, and different filter regions 20 can allow light of different wavelengths to pass through.

[0149] It is understandable that different filter areas 20 can transmit light of different wavelengths, thus enabling the filter layer to transmit light of at least two different wavelengths at the same time.

[0150] Specifically, the thickness of different filter zones 20 varies.

[0151] It is understandable that by making the thickness of the filter medium different in different filter areas 20, different filter areas 20 can transmit light of different wavelengths.

[0152] Specifically, the materials of different filter zones 20 are different.

[0153] It is understandable that by making the filter medium in different filter areas 20 different materials, different filter areas 20 can transmit light of different wavelengths.

[0154] The following explanation uses an RGB image sensor 1 and a 6-channel filter layer 2 as examples:

[0155] like Figure 8 and Figure 11 The filter layer 2 is transparent to six multispectral bands, two of which are within the photosensitive band of pixel B, two within the photosensitive band of pixel G, and two within the photosensitive band of pixel R. For example, channels CH1 and CH2 are within the 400-500nm photosensitive band of pixel B, channels CH3 and CH4 are within the 500-600nm photosensitive band of pixel G, and channels CH5 and CH6 are within the 600-700nm photosensitive band of pixel R.

[0156] Existing equipment can be used to detect the quantum efficiency of six bands: CH1, CH2, CH3, CH4, CH5, and CH6. The quantum efficiency varies in different bands.

[0157] By combining the photosensitive data of pixel B with the quantum efficiencies of CH1 and CH2, the mixed photosensitive data of pixel B can be demixed to obtain the photosensitive data corresponding to the CH1 and CH2 bands, enabling pixel B to achieve dual channels. Similarly, pixel R and pixel G can be demixed, ultimately yielding six channels of photosensitive data. In other words, by adding a filter layer 2 to the image sensor 1, the number of spectral channels can be increased.

[0158] It should be noted that mixed light can also be demixed using any other suitable method. Examples include prism dispersion, diffraction grating, interferometry, fiber optic spectroscopy, and filtering. Prism dispersion utilizes the different refractive indices of a prism for different wavelengths of light, causing the mixed light to disperse and separate the spectra of different wavelengths after passing through the prism. Diffraction gratings use the diffraction properties of a grating to decompose the mixed light into spectra of different wavelengths. Interferometry uses an interferometer to split the mixed light into two beams, separating the different wavelengths through interference fringes. Fiber optic spectroscopy uses a combination of optical fiber and a spectrometer to transmit the mixed light to the spectrometer for separation and analysis. Filtering uses optical filters to selectively transmit light of specific wavelengths while filtering out other wavelengths, offering high flexibility and allowing selection of specific wavelengths as needed, making it the preferred method for spectral channel separation in multispectral imaging. Mixed spectra can also be separated computationally; common methods include deep learning-based mixed spectrum decomposition methods and mixed light decomposition systems based on sparse representations.

[0159] When the image sensor 1 has four or other photosensitive bands, and the filter layer 2 can transmit other bands, the demixing principle is the same as the principle described above, and will not be repeated here.

[0160] According to an embodiment of the second aspect of this application, such as Figure 13 Methods for fabricating multispectral chip components include...

[0161] Step 101: Acquire image sensor 1. Image sensor 1 is used to acquire light in different wavelength bands to obtain spectral information for each channel, where different channels correspond to spectral information in different wavelength bands.

[0162] Step 102: Form a filter layer 2 on the photosensitive path of the image sensor 1. The filter layer 2 is used to filter the light entering the image sensor 1 and allow light of at least four different wavelengths to pass through.

[0163] It is understood that by forming a filter layer 2 on the photosensitive path of the image sensor 1, light passes through the filter layer 2 before entering the image sensor 1. The filter layer 2 filters the light entering the image sensor 1, allowing light of at least four different wavelengths to enter the image sensor 1. The wavelength range of light that can pass through the filter layer 2 is all within the wavelength range of light that the image sensor 1 can acquire, ensuring that the image sensor 1 can form images normally. In other words, by forming a filter layer 2 on the photosensitive path of the image sensor 1, this application enables the light from the image sensor 1 to include at least four different wavelengths, thereby realizing at least four spectral channels, increasing the number of channels, and achieving multispectral imaging.

[0164] In some embodiments, after the step of forming the filter layer 2 on the photosensitive path of the image sensor 1, the method further includes:

[0165] The image sensor 1 and the filter layer 2 are encapsulated in the housing 3.

[0166] It is understandable that after the filter layer 2 is formed on the photosensitive path of the image sensor 1, the image sensor 1 and the filter layer 2 are packaged together to form a multispectral chip assembly, thereby improving the integration of the multispectral chip.

[0167] In one embodiment of this application, the step of forming the filter layer 2 on the photosensitive path of the image sensor 1 includes:

[0168] A filter layer 2 is stacked on the photosensitive lens of the image sensor 1.

[0169] It is understandable that the image sensor 1 senses light through a photosensitive lens. A filter layer 2 is stacked on the photosensitive lens of the image sensor 1, so that the filter layer 2 is located on the light-sensing path of the image sensor 1. Thus, the filter layer 2 can filter the light entering the image sensor 1, thereby increasing the number of channels that the image sensor 1 can achieve.

[0170] In some examples, the steps to acquire image sensor 1 include:

[0171] Obtain an image sensor 1 based on CSP packaging technology.

[0172] In some examples, the steps to acquire image sensor 1 include:

[0173] Obtain an image sensor 1 based on COB packaging technology.

[0174] According to an embodiment of the third aspect of this application, the electronic device includes the multispectral chip assembly described above.

[0175] According to the electronic device of this application embodiment, by providing a filter layer 2 on the photosensitive path of the image sensor 1, light passes through the filter layer 2 before entering the image sensor 1. The filter layer 2 can filter the light entering the image sensor 1, allowing light of at least four different wavelengths to enter the image sensor 1. The wavelength range of light that can pass through the filter layer 2 is all within the wavelength range of light that the image sensor 1 can acquire, ensuring that the image sensor 1 can form an image normally. In other words, by providing a filter layer 2 on the photosensitive path of the image sensor 1, this application enables the light from the image sensor 1 to include at least four different wavelengths, thereby realizing at least four spectral channels, increasing the number of channels, and achieving multispectral imaging.

[0176] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A multispectral chip assembly, characterized in that, include: An image sensor is used to acquire light in different wavelength bands to obtain spectral information for each channel, wherein different channels correspond to spectral information in different wavelength bands; A filter layer is disposed on the photosensitive path of the image sensor. The filter layer is used to filter the light entering the image sensor and allow light of at least four different wavelengths to pass through. The wavelength range of light that can pass through the filter layer is within the wavelength range of light that the image sensor can acquire.

2. The multispectral chip assembly according to claim 1, characterized in that, The bandwidth of light that can pass through at least a portion of the wavelengths of the filter layer is smaller than the bandwidth of light in at least one of the wavelengths that the image sensor can acquire.

3. The multispectral chip assembly according to claim 1, characterized in that, The image sensor includes a filter, which includes at least one filter unit module. Each filter unit module includes an R filter unit, a G filter unit, a B filter unit, and at least one extended filter unit. The R filter unit allows light in the red band to pass through, the G filter unit allows light in the green band to pass through, the B filter unit allows light in the blue band to pass through, and the extended filter unit allows light in a specific band to pass through. Each of the red band, the green band, and the blue band is different from the specific band.

4. The multispectral chip assembly according to claim 3, characterized in that, The extended filtering unit includes an X-filter unit, and the number of the X-filter units is at least two. Different X-filter units are used to allow light of different wavelengths to pass through.

5. The multispectral chip assembly according to claim 1, characterized in that, The image sensor includes R pixels, G pixels, B pixels, and at least one extended pixel, wherein the light wavelength acquired by any one of the R pixels, G pixels, and B pixels is different from the light wavelength acquired by the extended pixel.

6. The multispectral chip assembly according to claim 5, characterized in that, The extended pixel point includes at least one X pixel point, which is used to acquire at least one of long-wave ultraviolet light, mid-wave ultraviolet light, near-infrared light, mid-infrared light, and far-infrared light.

7. The multispectral chip assembly according to claim 3, characterized in that, The filter layer includes at least four filter regions, each filter region being used to allow light of at least three different wavelengths to pass through, and different filter regions being used to allow light of different wavelengths to pass through; or... The filter layer includes a filter region for allowing light of at least four different wavelengths to pass through.

8. The multispectral chip assembly according to claim 7, characterized in that, The wavelength range of at least one band of light is within the red band range, the wavelength range of at least one band of light is within the green band range, the wavelength range of at least one band of light is within the blue band range, and the wavelength range of at least one band of light is within the specific band range.

9. The multispectral chip assembly according to claim 1, characterized in that, When the center wavelength of light passing through the filter layer is between 400nm and 420nm, the quantum efficiency of the multispectral chip assembly is between 38% and 40%; and / or, When the center wavelength of light passing through the filter layer is between 450nm and 470nm, the quantum efficiency of the multispectral chip assembly is between 50% and 51%; and / or, When the center wavelength of light passing through the filter layer is between 500nm and 520nm, the quantum efficiency of the multispectral chip assembly is between 53% and 55%; and / or, When the center wavelength of light passing through the filter layer is between 540nm and 560nm, the quantum efficiency of the multispectral chip assembly is between 51.5% and 52.5%; and / or, When the center wavelength of light passing through the filter layer is between 640nm and 660nm, the quantum efficiency of the multispectral chip assembly is between 40.3% and 42%; and / or, When the center wavelength of the light passing through the filter layer is between 800nm ​​and 820nm, the quantum efficiency of the multispectral chip assembly is between 16% and 19%.

10. The multispectral chip assembly according to any one of claims 1 to 9, characterized in that, The maximum transmittance of the filter layer is greater than or equal to 90%; and / or, The cutoff rate of the filter layer is greater than or equal to 2.5; and / or, The error tolerance of the filter layer is less than or equal to 1%.

11. The multispectral chip assembly according to any one of claims 1 to 9, characterized in that, The filter layer allows light with a center wavelength between 400nm and 420nm to pass through, and the bandwidth of the light with a center wavelength between 400nm and 420nm is between 40nm and 43nm; and / or, The filter layer allows light with a center wavelength between 450nm and 470nm to pass through, and the bandwidth of the light with a center wavelength between 450nm and 470nm is between 31nm and 32nm; and / or, The filter layer allows light with a center wavelength between 500nm and 520nm to pass through, and the bandwidth of the light with a center wavelength between 500nm and 520nm is between 29nm and 31nm; and / or, The filter layer allows light with a center wavelength between 540nm and 560nm to pass through, and the bandwidth of the light with a center wavelength between 540nm and 560nm is between 31.5nm and 33nm; and / or, The filter layer allows light with a center wavelength between 640nm and 660nm to pass through, and the bandwidth of the light with a center wavelength between 640nm and 660nm is between 40.5nm and 44nm; and / or, The filter layer allows light with a center wavelength between 800nm ​​and 820nm to pass through, and the bandwidth of the light with a center wavelength between 800nm ​​and 820nm is between 98nm and 102nm.

12. The multispectral chip assembly according to any one of claims 1 to 2, characterized in that, The image sensor is an RGB image sensor.

13. The multispectral chip assembly according to claim 12, characterized in that, The filter layer allows light of multiple different wavelengths to pass through. These multiple different wavelengths include a first set of wavelengths, a second set of wavelengths, and a third set of wavelengths. The wavelength range of the first set of wavelengths is within the wavelength range of the green channel of the RGB image sensor. The wavelength range of the second set of wavelengths is within the wavelength range of the green channel of the RGB image sensor. The wavelength range of the third set of wavelengths is within the wavelength range of the blue channel of the RGB image sensor. Each of the first set of wavelengths, the second set of wavelengths, and the third set of wavelengths includes at least one wavelength.

14. The multispectral chip assembly according to claim 13, characterized in that, The filter layer allows light from n different wavelengths to pass through, wherein the first set of wavelengths, the second set of wavelengths, and the third set of wavelengths each include n / 3 wavelengths.

15. An electronic device, characterized in that, Includes the multispectral chip assembly as described in any one of claims 1 to 14.

Images