A disc type multi-parallel multi-electronic-controlled power module
By designing a disc-type multi-parallel multi-electric control power module, and utilizing the arc connection of the annular heat dissipation substrate and the three-phase components, efficient heat dissipation and flexible current expansion are achieved, solving the problems of large system size, high cost and poor adaptability in the existing technology.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG CUIZHAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-17
AI Technical Summary
When driving multiple parallel loads, existing power modules increase system size and cost, raise circuit complexity, and are difficult to adapt flexibly to the needs of different industrial scenarios.
The power module adopts a disc-type multi-parallel multi-electric control design, including a ring heat sink and three-phase components. It is cooled by a ring water channel, and the three-phase terminals are connected to the TPAK module in an arc shape, realizing the parallel connection of multiple TPAK modules, simplifying the circuit connection and increasing the current carrying capacity.
It improves heat dissipation efficiency under high power density, simplifies system structure, reduces cost and size, and enables flexible current expansion capability.
Smart Images

Figure CN224520920U_ABST
Abstract
Claims
1. A disc-type multi-parallel multi-electronic-controlled power module, characterized by: The disc-type multi-parallel multi-electric control power module includes a base, an annular heat sink plate disposed on the base, at least three three-phase components disposed on the base, and a circuit board disposed on the base. The base includes a capacitor disposed at the center of the base. The three-phase components are arranged circumferentially and spaced apart. Each three-phase component includes at least one positive connection terminal disposed on the base, at least one negative connection terminal disposed on the base, a three-phase terminal disposed on the base, and at least two TPAK modules disposed on the annular heat sink plate. One end of the positive connection terminal is connected to the positive terminal of the capacitor, and one end of the negative connection terminal is connected to the negative terminal of the capacitor. The three-phase terminal includes an arc segment. The circuit board is mounted on the base, and an output section is provided on the arc-shaped segment for connecting to the TPAK module. The output section is provided for connecting to an external load. The bottom of the TPAK module is mounted on the annular heat sink substrate. The number of TPAK modules in the three-phase assembly is distributed in half and connected to the positive terminal and the negative terminal and the arc-shaped segment, respectively. One end of half of the TPAK modules is connected to the arc-shaped segment and the other end is connected to the positive terminal. The other half of the TPAK modules are connected to the arc-shaped segment and the other end is connected to the negative terminal. The circuit board is mounted on the base, and the signal pins of the multiple TPAK modules are inserted into the circuit board from the bottom.
2. The disc multi-parallel multi-automated power module according to claim 1, characterized in that: The base also includes a cover plate disposed on the base, an annular water channel disposed on the base, and two inlets and outlets disposed at the bottom of the base and communicating with the annular water channel.
3. The disc multi-parallel multi-automated power module according to claim 2, wherein: The base has a disc-shaped structure with a hollow center that is connected to one end face of the base. The cover plate covers the hollow center area of the base and is connected to the base. The cover plate has two interfaces for connecting to the positive and negative terminals of an external power source. The two interfaces are respectively connected to the positive and negative terminals of the capacitor.
4. The disc multi-parallel multi-automated power module of claim 2, wherein: The annular water channel is disposed on the end face of the base facing the annular heat dissipation substrate. The inlet and outlet serve as the inlet and outlet of the coolant, respectively. The annular heat dissipation substrate is disposed on the annular water channel. The end face of the annular heat dissipation substrate facing the annular water channel is used to contact the coolant for heat exchange. The end face of the annular heat dissipation substrate away from the annular water channel is used to house the TPAK module.
5. The disk-type multi-parallel multi-electric control power module as described in claim 1, characterized in that: The three-phase assembly also includes a current sensor disposed on the three-phase terminals, and a detection hole is provided on the output section, wherein the current sensor is disposed on the output section and inserted into the detection hole.
6. The disc multi-parallel multi-automated power module of claim 1, wherein: The three-phase terminals, the annular heat sink, the positive terminal, and the negative terminal are integrally formed with the base.