Slurry delivery system and chemical mechanical polishing apparatus
By adding an ultrasonic device and a particle size measuring device to the grinding slurry delivery system, the problems of blockage and scratching caused by SiO2 abrasive agglomeration and sedimentation were solved, and stable delivery and efficient production of grinding slurry were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU HFC SEMICONDUCTOR CO
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-21
AI Technical Summary
The SiO2 abrasive aggregates and settles in the grinding fluid, forming large particles that clog the delivery pipes and filters, and cause wafer scratches, affecting product yield.
An ultrasonic device and a particle size measuring device are added to the grinding fluid delivery system. The ultrasonic device crushes and decomposes large particles, and the particle size measuring device measures the particle size. Based on the measurement results, particles that meet the requirements are selectively delivered to the grinding machine or waste liquid tank.
This effectively prevents the polishing slurry from clogging the delivery pipeline and filter, protects the wafer from being scratched, and improves product yield and production efficiency.
Smart Images
Figure CN224526883U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a slurry delivery system and a chemical mechanical polishing (CMP) device. Background Technology
[0002] Chemical mechanical polishing (CMP) is a critical step in wafer manufacturing. It smooths the surface of integrated circuit devices through a combination of the physical abrasive action of nanoscale particles and the chemical etching effect of a polishing slurry. Without this treatment, surface irregularities on the wafer become more pronounced with increasing thin film layers. Uneven thickness of the same metal film layer can lead to varying resistance values, causing electron migration and resulting in short circuits. Furthermore, an uneven wafer surface makes accurate focusing during photolithography impossible, leading to linewidth control failure, severely limiting the number of wiring layers, and reducing the performance of integrated circuits.
[0003] Polishing slurries typically contain abrasive particles, oxidants, complexing agents, surfactants, abrasives, pH adjusters, corrosion inhibitors, and other components. In the CMP process, the chemical reagents in the polishing slurry are first used to oxidize the substrate material, generating a relatively soft oxide film. Then, the oxide film is removed through mechanical friction. Through repeated oxidation-film formation and mechanical removal processes, the purpose of effective polishing is achieved.
[0004] The particle size of SiO2 abrasive in the polishing slurry is one of the key factors affecting polishing quality. Due to the large surface energy of SiO2 microspheres, they are prone to agglomeration. Although they have good dispersibility in the initial stage of polishing slurry preparation, as time goes on, SiO2 abrasive will agglomerate and settle. These large aggregated particles can not only easily cause blockage of pipes and filters, but also easily cause scratches on wafers, affecting product yield.
[0005] Therefore, how to improve the situation where the SiO2 abrasive aggregates and settles to form large particles, which clog the conveying pipes and filters, and cause wafer scratches, thus affecting product yield, has become a technical problem that needs to be solved by those skilled in the art. Utility Model Content
[0006] The purpose of this invention is to provide a grinding fluid delivery system and a chemical mechanical polishing (CMP) device to solve the problem of SiO2 abrasive agglomeration and sedimentation forming large particles, clogging delivery pipelines and filters, and causing wafer scratches.
[0007] To achieve the above objectives, this utility model provides a grinding fluid delivery system, including: a delivery pipeline, an ultrasonic device, and a particle size measuring device;
[0008] The delivery pipeline has an inlet end and an outlet end. The inlet end is connected to the liquid supply device. The outlet end, after being connected to the ultrasonic device and the particle size measuring device in sequence, forms two branches, which are respectively connected to the grinding machine and the waste liquid pool.
[0009] The ultrasonic device is used to break up and decompose the particles in the grinding fluid, and the particle size measuring device is used to measure the particle size of the broken up and decomposed particles.
[0010] When the measured particle size is within a preset range, the conveying pipeline connects to the branch connecting to the grinding machine; when the measured particle size is outside the preset range, the pipeline connects to the branch connecting to the waste liquid tank.
[0011] Optionally, the ultrasonic device includes a first ultrasonic device and a second ultrasonic device, and the delivery pipeline is connected to the first ultrasonic device and the second ultrasonic device in sequence; wherein the ultrasonic frequency emitted by the first ultrasonic device is lower than the ultrasonic frequency emitted by the second ultrasonic device.
[0012] Optionally, the particle size of the polishing fluid flowing from the first ultrasonic device is larger than the particle size of the polishing fluid flowing from the second ultrasonic device.
[0013] Optionally, the delivery conduit passes through the interior of the ultrasonic device, and the length of the delivery conduit located inside the first ultrasonic device is shorter than the length of the delivery conduit located inside the second ultrasonic device.
[0014] Optionally, the delivery pipeline located inside the ultrasonic device has a straight section and an arc-shaped section, which are connected sequentially to form a serpentine distribution. The distance between two adjacent straight sections in the first ultrasonic device is greater than the distance between two adjacent straight sections in the second ultrasonic device.
[0015] Optionally, the diameter of the delivery conduit located inside the first ultrasonic device is larger than the diameter of the delivery conduit located inside the second ultrasonic device.
[0016] Optionally, the particle size measuring device measures the particle size of the grinding fluid flowing out of the ultrasonic device within a preset time interval.
[0017] Optionally, the preset range of the particle size r satisfies 100nm≤r≤200nm.
[0018] Optionally, the conveying pipeline is equipped with a switching valve at the branch fork. When the measured particle size is within the preset range, the switching valve shuts off the branch connected to the waste liquid tank; when the measured particle size is outside the preset range, the switching valve shuts off the branch connected to the grinding machine.
[0019] To achieve the above objectives, this utility model also provides a chemical mechanical grinding apparatus, comprising: a grinding machine base and a grinding fluid delivery system as described above;
[0020] The delivery pipeline connects the liquid supply device and the grinding machine, and is used to deliver the grinding liquid contained in the liquid supply device to the grinding machine.
[0021] The grinding fluid contained in the liquid supply device contains particle deposits, and the particle size of the particle deposits exceeds the safe range for production by the grinding machine.
[0022] Compared with existing grinding slurry delivery pipelines, the grinding slurry delivery system and grinding equipment provided in this application have the following advantages:
[0023] The polishing slurry delivery system provided in this application incorporates an ultrasonic device and a particle size measuring device, which are sequentially connected via a delivery pipeline. This allows the polishing slurry containing particle deposits flowing through the pipeline to first pass through the ultrasonic device, which breaks down and decomposes the resulting particle deposits. Then, the particle size measuring device measures the particle size of the broken-down particles and compares it to a preset range, selecting one for delivery to the polishing machine or waste liquid tank. The ultrasonic device effectively breaks down large-diameter particle deposits, preventing them from clogging the delivery pipeline and filter. Simultaneously, the particle size measuring device ensures that the particle size of the broken-down particles meets the production requirements of the polishing machine, avoiding wafer scratches during production and further improving product yield.
[0024] The chemical mechanical polishing (CMP) equipment provided in this application, by using the aforementioned polishing slurry delivery system, first crushes and decomposes large-diameter particles exceeding the safety range using an ultrasonic device, and then measures the particle size of the decomposed particles using a particle size measuring device. This polishing equipment, without affecting the normal transport of polishing slurry during wafer processing, avoids clogging of delivery pipelines and filters and scratching of wafers, thereby improving the production efficiency and product yield of the polishing equipment. Attached Figure Description
[0025] Figure 1 A schematic diagram illustrating the principle of particle deposition in grinding fluid;
[0026] Figure 2 This is a schematic diagram of the structure of the grinding fluid delivery system provided in an embodiment of the present invention;
[0027] The explanations of the reference numerals in the accompanying drawings are as follows:
[0028] 1-Liquid supply device; 10-Grinding fluid; 11-Large diameter particles;
[0029] 2-Ultrasonic device; 20-First ultrasonic device; 21-Second ultrasonic device;
[0030] 3-Particle size measuring device;
[0031] 4-Transportation pipeline; 40-Branch; 41-Straight section; 42-Arc-shaped section;
[0032] 5-Grinding machine; 6-Waste liquid tank. Detailed Implementation
[0033] To make the objectives, advantages, and features of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the objectives of the embodiments of this utility model. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may emphasize different aspects and sometimes use different scales.
[0034] As used herein, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. “One end” and “the other end,” as well as “proximal end” and “distal end,” generally refer to two corresponding parts, including not only endpoints. The terms “installed,” “connected,” and “joined” should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Furthermore, as used in this specification, the phrase "one element is disposed on another element" generally only indicates that there is a connection, coupling, cooperation, or transmission relationship between the two elements, and the connection, coupling, cooperation, or transmission between the two elements can be direct or indirect through an intermediate element. It should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located arbitrarily inside, outside, above, below, or to the side of another element, unless otherwise explicitly stated. The terms "above," "below," "top," and "bottom" generally refer to relative positional relationships arranged according to the direction of gravity; the terms "vertical" or "vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground; "horizontal" or "horizontal plane direction" generally refers to a direction parallel to the ground. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.
[0035] The purpose of this invention is to provide a grinding fluid delivery system and a chemical mechanical polishing (CMP) device to solve the problem of SiO2 abrasive agglomeration and sedimentation forming large particles, clogging delivery pipelines and filters, and causing wafer scratches.
[0036] For those skilled in the art, please refer to [the relevant documentation]. Figure 1 Taking Chemical Mechanical Polishing (CMP) as an example, the prepared polishing slurry contains not only chemical reagents but also small-diameter abrasive particles, such as SiO2 abrasive. While SiO2 abrasive has good dispersibility in the freshly prepared slurry, due to surface energy, after the slurry has been left for a period of time (e.g., 48 hours), the SiO2 abrasive will aggregate and deposit into large-diameter particles (e.g., ...). Figure 1As shown, this can significantly affect the performance of the polishing slurry, causing blockages in the delivery pipeline 4 and the filter, and potentially scratching the wafer surface during polishing, reducing product yield. Therefore, this embodiment provides a polishing slurry delivery system and polishing equipment. By adding an ultrasonic device 2 and a particle size measuring device 3, the ultrasonic device 2 breaks down the aggregated large-diameter particles 11 into small-diameter particles suitable for production, and the particle size measuring device 3 measures the particle size of the small-diameter particles, forming a monitoring mechanism to prevent particles from clogging the delivery pipeline 4 and the filter, and scratching the wafer surface.
[0037] Please refer to Figure 2 This utility model provides a grinding fluid delivery system, including: a delivery pipeline 4, an ultrasonic device 2, and a particle size measuring device 3; the delivery pipeline 4 has an inlet end and an outlet end, the inlet end is connected to a liquid supply device 1, and the outlet end, after being connected to the ultrasonic device 2 and the particle size measuring device 3 in sequence, forms two branches 40, which are respectively connected to a grinding machine 5 and a waste liquid tank 6; wherein, the ultrasonic device 2 is used to crush and decompose the particles in the grinding fluid 10, and the particle size measuring device 3 is used to measure the particle size of the crushed and decomposed particles; when the measured particle size is within a preset range, the delivery pipeline 4 connects to the branch 40 connected to the grinding machine 5; when the measured particle size is outside the preset range, the branch 40 connected to the waste liquid tank 6 is closed, and the operation of the grinding machine 5 is stopped. It should be noted that the liquid supply device 1 can be a chamber equipped with a pump body, which contains a pre-prepared polishing slurry 10. In this embodiment, it is a polishing slurry. At the start of the CMP process, the polishing slurry in the chamber is drawn by the pump body to provide the power for transporting the polishing slurry, and it is transported through the transport pipeline 4. In other embodiments, it can also be other materials required for production that are prone to deposits. The ultrasonic equipment typically includes an ultrasonic generator and an ultrasonic transducer. The ultrasonic generator is used to convert the mains power into a high-frequency AC signal that matches the ultrasonic transducer to drive the ultrasonic transducer to work. The ultrasonic transducer is used to convert the input electrical power into mechanical power (i.e., ultrasonic waves) and then transmit it. In this application, the ultrasonic waves generated by the ultrasonic equipment act on the large-diameter particles 11 in the polishing slurry, causing them to break up and decompose into small-diameter particles suitable for the CMP process. The particle size measuring device 3 can be a particle size analyzer that utilizes dynamic light scattering (DLS) technology. As those skilled in the art will understand, in a DLS experiment, a liquid sample is irradiated by a laser, and the particles in the solution cause the laser to scatter. These scattering particles are captured by a detector at a specific angle. Due to the Brownian motion of the particles in the solution, the intensity of the scattered light will fluctuate over time. By measuring these fluctuations, the particle size can be calculated.
[0038] This configuration, by adding an ultrasonic device 2 and a particle size measuring device 3, and connecting them sequentially via a delivery pipeline 4, allows the grinding slurry 10 containing particle deposits flowing through the delivery pipeline 4 to first pass through the ultrasonic device 2, breaking up and decomposing the resulting particle deposits. Then, the particle size measuring device 3 measures the particle size of the broken and decomposed particles, compares it with a preset range, and selects one to be delivered to the grinding machine 5 or the waste liquid tank 6. The ultrasonic device 2 can impact and break up the large-diameter particle deposits 11, preventing them from clogging the delivery pipeline 4 and the filter. Simultaneously, the particle size measuring device 3 ensures that the particle size of the broken particles meets the production requirements of the grinding machine 5, avoiding scratching the wafers during production and further improving product yield.
[0039] As an optional embodiment, please continue to refer to Figure 2 The ultrasonic device 2 includes a first ultrasonic device 20 and a second ultrasonic device 21, with a delivery pipe 4 sequentially connecting the first ultrasonic device 20 and the second ultrasonic device 21; wherein the ultrasonic frequency emitted by the first ultrasonic device 20 is lower than the ultrasonic frequency emitted by the second ultrasonic device 21. Furthermore, the particle size of the polishing slurry 10 flowing from the first ultrasonic device 20 is larger than the particle size of the polishing slurry 10 flowing from the second ultrasonic device 21. It should be noted that in... Figure 2 In the illustrated example, the first ultrasonic device 20 generates low-frequency ultrasound of 20kHz to 40kHz, which can break large-diameter particles 11 in the polishing slurry into smaller particles. The second ultrasonic device 21 generates high-frequency ultrasound of 100kHz to 200kHz, which can break small-diameter particles into nanoscale particles, thus meeting the particle size requirements of the abrasive (SiO2) in the CMP process. In other embodiments, the ultrasonic device 2 may be configured as one or more, but the interaction time of the ultrasonic device 2 with the particles must be ensured to guarantee that the ultrasonic waves achieve the desired breaking and decomposition effect on the particles. Those skilled in the art can control the ultrasonic frequencies generated by multiple ultrasonic devices 2 to break large-diameter particles 11 into nanoscale particles suitable for CMP processes in stages. Multi-step vibration decomposition can further improve the uniformity of particle size, reduce the probability of large-diameter particles 11 that easily scratch the wafer surface in the polishing slurry, and further improve product yield.
[0040] In an alternative embodiment, the delivery conduit 4 passes through the interior of the ultrasonic device 2, and the length of the delivery conduit 4 located inside the first ultrasonic device 20 is shorter than the length of the delivery conduit 4 located inside the second ultrasonic device 21. Figure 2In the illustrated example, the ultrasonic device 2 is disposed outside the delivery pipe 4, which passes through the interior of the ultrasonic device 2. The ultrasonic device 2 generates ultrasonic waves to vibrate the grinding fluid flowing through the delivery pipe 4, thereby breaking down large-diameter particles 11 in the grinding fluid. In other embodiments, the ultrasonic device 2 may also be disposed inside the delivery pipe 4, for example, by placing an ultrasonic transducer inside the delivery pipe 4, to enhance the vibrational effect of the ultrasonic waves on the grinding fluid. It should be noted that, with the flow rate of the grinding fluid remaining constant, the longer the length of the delivery pipe 4 located inside the ultrasonic device 2, the longer the ultrasonic device 2 acts on the grinding fluid, and the better the corresponding breaking down effect. The first ultrasonic device 20 generates low-frequency ultrasound, which can break large-diameter particles 11 into small-diameter particles. The second ultrasonic device 21 generates high-frequency ultrasound, which needs to further break the small-diameter particles into nano-sized particles. Therefore, in order to ensure the breaking and decomposition effect of the ultrasound, the action time of the second ultrasonic device 21 should be longer than that of the first ultrasonic device 20. This is reflected in the delivery pipeline 4, which means that the length of the delivery pipeline 4 located inside the second ultrasonic device 21 needs to be longer.
[0041] Furthermore, the delivery conduit 4 located inside the ultrasonic device 2 has a straight section 41 and an arc-shaped section 42, which are connected sequentially to form a serpentine distribution. The distance between two adjacent straight sections 41 in the first ultrasonic device 20 is greater than the distance between two adjacent straight sections 41 in the second ultrasonic device 21. It should be noted that in... Figure 2 In the illustrated example, the delivery pipes 4 are arranged in a serpentine pattern. To ensure a longer delivery pipe length in the second ultrasonic device 21, the delivery pipes 4 in the second ultrasonic device 21 are densified, meaning the distance between two adjacent straight sections 41 is shorter. This configuration allows the grinding fluid to undergo more thorough vibration in the second ultrasonic device 21. Simultaneously, the ultrasonic frequency emitted by the second ultrasonic device 21 is higher, which is more conducive to further reducing the particle size, making it into nanoscale particles that meet the requirements. In other embodiments, the delivery pipes 4 may not have the curved sections 42, and may use straight pipes to form a zigzag arrangement. The delivery pipes 4 may also be arranged irregularly, as long as the length of the delivery pipe 4 in the first ultrasonic device 20 is less than the length of the delivery pipe 4 in the second ultrasonic device 21.
[0042] In a preferred embodiment, the diameter of the delivery pipe 4 inside the first ultrasonic device 20 is larger than the diameter of the delivery pipe 4 inside the second ultrasonic device 21. It should be noted that the ultrasonic frequency of the first ultrasonic device 20 is lower than that of the second ultrasonic device 21, meaning the ultrasonic energy provided by the first ultrasonic device 20 is lower than that provided by the second ultrasonic device 21. Therefore, the particle size in the grinding fluid flowing out of the first ultrasonic device 20 is larger than the particle size in the grinding fluid flowing out of the second ultrasonic device 21. This configuration, with the diameter of the delivery pipe 4 inside the first ultrasonic device 20 being larger than that inside the second ultrasonic device 21, can block some large-diameter particles 11 that are not broken up by the first ultrasonic device 20 at the diameter change point, further reducing the particle size entering the second ultrasonic device 21, thereby improving the uniformity of particle size. The diameter change section can be stepped, gradually varied, or irregularly varied; those skilled in the art can reasonably configure the diameter of the delivery pipe 4 according to the actual situation.
[0043] Optionally, the diameter of the delivery line 4 located inside the first ultrasonic device 20 can be 0.4 inch to 0.6 inch, for example, 0.4 inch, 0.45 inch, 0.5 inch, 0.55 inch, etc.; the diameter of the delivery line 4 located inside the second ultrasonic device 21 can be 0.25 inch to 0.4 inch, for example, 0.25 inch, 0.3 inch, 0.35 inch, 0.375 inch.
[0044] As an example, the material of the delivery pipeline 4 can be polytetrafluoroethylene (PTFE), perfluoroalkoxy resin (PFA), fluorinated ethylene propylene (FEP), etc. Considering the flexible design in this embodiment, the part of the delivery pipeline 4 located in the ultrasonic device 2 can be set as a corrugated pipe of PTFE / PFA material, or it can be lined with PFA hose and fitted with a stainless steel spring on the outside to achieve the bending of the delivery pipeline 4. At the same time, on the inner wall of the bent part of the delivery pipeline 4, a modification technology is used to improve the surface hydrophilicity in order to reduce the residue of substances in the grinding fluid.
[0045] In an optional embodiment, the particle size measuring device 3 measures the particle size of the polishing slurry 10 flowing from the ultrasonic device 2 within a preset time interval. Further, the preset range of the particle size r satisfies 100nm ≤ r ≤ 200nm. It should be noted that in this embodiment, the preset time interval can be an interval between predetermined batches of products, an interval between predetermined numbers of wafers, or an interval of predetermined time (e.g., 30 minutes, 1 hour, etc.). Those skilled in the art can reasonably configure the measurement gap of the particle size measuring device 3 according to actual conditions. Also, please refer to... Figure 1Only when the particle size r is between 100nm and 200nm can the requirements of the CMP process for the particle size of the abrasive in the polishing slurry be met. This ensures that the wafer surface can be polished while protecting it from scratches. Therefore, when the particle size measured by the particle size measuring device 3 meets the above range, the polishing slurry is introduced into the polishing machine 5 for subsequent processes. When the particle size measured by the particle size measuring device 3 does not meet the above range, the operation of the polishing machine 5 and the slurry supply device 1 should be stopped immediately. The polishing slurry in the slurry supply device 1, the ultrasonic device 2, and the particle size measuring device 3 should be tested until the cause of the non-compliance with the particle size is found and repaired. This further improves the product yield and reduces the additional costs caused by wafer scrap.
[0046] As an optional embodiment, the conveying pipeline 4 is provided with a switching valve (not shown in the figure) at the bifurcation of the branch 40. When the measured particle size is within a preset range, the switching valve shuts off the branch 40 connected to the waste liquid tank 6; when the measured particle size is outside the preset range, the switching valve shuts off the branch 40 connected to the grinding machine 5. It should be noted that in this embodiment, the switching valve can be a movable plate-shaped component with a driving device. The driving device can drive the moving plate to rotate and / or move. The driving device can be a motor, which is communicatively connected to the control terminal of the grinding machine 5 (or the control terminal of the particle size measuring device 3). When the particle size measured by the particle size measuring device 3 is within a preset range, the driving device drives the moving plate to move or rotate towards the branch 40 connected to the waste liquid tank 6 until the moving plate completely shuts off the branch 40 connected to the waste liquid tank 6, so that the grinding liquid flows into the branch 40 connected to the grinding machine 5. When the particle size measured by the particle size measuring device 3 is outside the preset range, the driving device drives the moving plate to move or rotate towards the branch 40 connected to the grinding machine 5 until the moving plate completely shuts off the branch 40 connected to the grinding machine 5, so that the grinding liquid flows into the branch 40 connected to the waste liquid tank 6. In other embodiments, the branch points of the conveying pipeline 4 can also be provided with switchable valves or baffles, which can directly shut off the branch 40 when needed.
[0047] In another embodiment, the present invention also provides a chemical mechanical polishing apparatus, including: a polishing machine 5 and a polishing slurry delivery system as described above; a delivery pipeline 4 connects a slurry supply device 1 and the polishing machine 5, for delivering the polishing slurry 10 contained in the slurry supply device 1 to the polishing machine 5; wherein the polishing slurry 10 contained in the slurry supply device 1 contains particle deposits, the particle size of which exceeds the safe range for production by the polishing machine 5. It should be noted that in this embodiment, the polishing slurry delivery system mainly provides ultrasonic energy through an ultrasonic device 2 to break up and decompose large-diameter particle deposits. Therefore, in this embodiment, the polishing slurry 10 contains large-diameter particle deposits 11, and the range of particle deposits is greater than the safe range for safe production by the polishing machine 5. The aforementioned safe range in this embodiment can be 100nm to 200nm. With this configuration, by using the above-mentioned polishing slurry delivery system, the large-diameter particle deposits 11 containing the safe range are first broken up and decomposed by the ultrasonic device 2, and then the particle size of the decomposed particles is measured by the particle size measuring device 3. This ensures that the polishing slurry 10 will not clog the delivery pipeline 4 and the filter, nor will it scratch the wafer during the wafer processing, thus improving the production efficiency and product yield of the polishing equipment.
[0048] In summary, in the grinding slurry delivery system and chemical mechanical grinding equipment provided in this embodiment of the present invention, the grinding slurry delivery system includes: a delivery pipeline, an ultrasonic device, and a particle size measuring device; the delivery pipeline has an inlet end and an outlet end, the inlet end is connected to a liquid supply device, and the outlet end, after being connected to the ultrasonic device and the particle size measuring device in sequence, forms two branches, which are respectively connected to the grinding machine and the waste liquid pool; wherein, the ultrasonic device is used to crush and decompose the particles in the grinding slurry, and the particle size measuring device is used to measure the particle size of the crushed and decomposed particles; when the measured particle size is within a preset range, the delivery pipeline is connected to the branch connected to the grinding machine; when the measured particle size is outside the preset range, the delivery pipeline is connected to the branch connected to the waste liquid pool.
[0049] This configuration, by adding an ultrasonic device and a particle size measuring device, and connecting them sequentially through a delivery pipeline, allows the grinding slurry containing particle deposits flowing through the pipeline to first pass through the ultrasonic device, breaking up and decomposing the resulting particle deposits. Then, the particle size measuring device measures the particle size of the broken-up particles and compares it with a preset range, selectively delivering either the slurry to the grinding machine or the waste liquid tank. The ultrasonic device effectively breaks up large-diameter particle deposits, preventing them from clogging the delivery pipeline and filters. Simultaneously, the particle size measuring device ensures that the particle size of the broken-up particles meets the production requirements of the grinding machine, avoiding wafer scratches during production and further improving product yield.
[0050] Furthermore, by using the aforementioned polishing slurry delivery system, large-diameter particles exceeding the safety range are first broken down by an ultrasonic device, and then the particle size of the decomposed particles is measured using a particle size measuring device. This polishing equipment, without affecting the normal transport of polishing slurry during wafer processing, avoids clogging of delivery pipelines and filters and scratching of wafers, thereby improving the production efficiency and product yield of the polishing equipment.
[0051] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A grinding fluid delivery system, characterized in that, include: Delivery pipelines, ultrasonic devices, and particle size measuring devices; The delivery pipeline has an inlet end and an outlet end. The inlet end is connected to the liquid supply device. The outlet end, after being connected to the ultrasonic device and the particle size measuring device in sequence, forms two branches, which are respectively connected to the grinding machine and the waste liquid pool. The ultrasonic device is used to break up and decompose the particles in the grinding fluid, and the particle size measuring device is used to measure the particle size of the broken up and decomposed particles. When the measured particle size is within a preset range, the conveying pipeline connects to the branch connecting to the grinding machine; when the measured particle size is outside the preset range, the pipeline connects to the branch connecting to the waste liquid tank.
2. The grinding fluid delivery system as described in claim 1, characterized in that, The ultrasonic device includes a first ultrasonic device and a second ultrasonic device, and the delivery pipeline is connected to the first ultrasonic device and the second ultrasonic device in sequence; wherein the ultrasonic frequency emitted by the first ultrasonic device is lower than the ultrasonic frequency emitted by the second ultrasonic device.
3. The grinding fluid delivery system as described in claim 2, characterized in that, The particle size of the grinding fluid flowing from the first ultrasonic device is larger than the particle size of the grinding fluid flowing from the second ultrasonic device.
4. The grinding fluid delivery system as described in claim 2, characterized in that, The delivery conduit passes through the interior of the ultrasonic device, and the length of the delivery conduit located inside the first ultrasonic device is shorter than the length of the delivery conduit located inside the second ultrasonic device.
5. The grinding fluid delivery system as described in claim 4, characterized in that, The delivery pipeline located inside the ultrasound device has a straight section and an arc-shaped section, which are connected in sequence to form a serpentine distribution. The distance between two adjacent straight sections in the first ultrasound device is greater than the distance between two adjacent straight sections in the second ultrasound device.
6. The grinding fluid delivery system as described in claim 4, characterized in that, The diameter of the delivery pipe located inside the first ultrasonic device is larger than the diameter of the delivery pipe located inside the second ultrasonic device.
7. The grinding fluid delivery system as described in claim 1, characterized in that, The particle size measuring device measures the particle size of the grinding fluid flowing out of the ultrasonic device within a preset time interval.
8. The grinding fluid delivery system as described in claim 7, characterized in that, The preset range of the particle size r satisfies 100nm≤r≤200nm.
9. The grinding fluid delivery system as described in claim 1, characterized in that, The conveying pipeline is equipped with a switching valve at the branch fork. When the measured particle size is within the preset range, the switching valve shuts off the branch connected to the waste liquid tank; when the measured particle size is outside the preset range, the switching valve shuts off the branch connected to the grinding machine.
10. A chemical mechanical grinding apparatus, characterized in that, include: The grinding machine and the grinding fluid delivery system as described in any one of claims 1 to 9; The delivery pipeline connects the liquid supply device and the grinding machine, and is used to deliver the grinding liquid contained in the liquid supply device to the grinding machine. The grinding fluid contained in the liquid supply device contains particle deposits, and the particle size of the particle deposits exceeds the safe range for production by the grinding machine.