Substrate processing apparatus
By rationally arranging wafer cassette transfer robots and substrate handling robots in the substrate processing device, and stacking multiple cavities in the vertical direction, the problems of large space occupation and insufficient production capacity in the existing technology are solved, achieving more efficient space utilization and production capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI XINYUAN MICRO ENTERPRISE DEV CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-21
AI Technical Summary
Existing high-capacity substrate processing equipment occupies a large space due to the separate fixed area designed for substrate handling robots, resulting in an overall non-compact layout and inefficient use of vertical space, which affects the equipment's capacity.
Design a substrate processing device, in which a wafer cassette transfer robot is mounted on the mounting frame of the substrate supply module, and a substrate handling robot is mounted on the mounting frame of the processing module. This device makes reasonable use of space and stacks multiple cavities in the vertical direction to reduce the floor space and improve space utilization and production capacity.
By making reasonable use of space, the length of the substrate processing device was shortened, the number of cavities was increased, and the device's capacity and processing efficiency were significantly improved.
Smart Images
Figure CN224538691U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment, specifically to a substrate processing device. Background Technology
[0002] With the rapid development of industries such as semiconductors and display panels, substrate processing equipment, as a key piece of equipment in the production process, is receiving increasing attention for its processing efficiency and space utilization. Substrate processing equipment typically includes components such as a substrate supply module, a wafer cassette transfer robot, a processing module, and a substrate handling robot, used to perform various processing steps on the substrates.
[0003] Existing high-capacity substrate processing equipment has designed fixed areas for wafer cassette transfer robots and substrate handling robots to enable robotic wafer transfer and retrieval. For example, through a separate fixed structure, the wafer cassette transfer robot is set between the substrate supply module and the processing module, and the substrate handling robot is set between the two processing modules. This arrangement occupies a large space in the entire equipment and is not conducive to the effective use of factory space. Utility Model Content
[0004] The purpose of this invention is to provide a substrate processing device that can make reasonable use of limited space.
[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: This utility model provides a substrate processing device, including a substrate supply module, a wafer cassette transfer robot, a processing module and a substrate handling robot. The substrate supply module includes a first mounting frame and a substrate loading module. The substrate loading module is used to load substrate placement boxes, and the wafer cassette transfer robot is mounted on the first mounting frame. The processing module includes a processing chamber, a wafer transfer module, and a second mounting frame. The substrate handling robot is mounted on the second mounting frame. The wafer cassette transfer robot is used to transfer substrates between the substrate loading module and the wafer transfer module, and the substrate handling robot is used to transfer substrates between the wafer transfer module and the processing chamber.
[0006] Preferably, the processing module includes a first processing module, a second processing module, and a third processing module arranged sequentially along the X direction. The first processing module includes a first processing chamber arranged symmetrically, the second processing module includes a second processing chamber arranged symmetrically, and the third processing module includes a third processing chamber arranged symmetrically. Each of the first, second, and third processing chambers includes n independent cavities, which are stacked vertically, and n≥4.
[0007] Furthermore, the wafer transfer module includes a first wafer transfer module and a second wafer transfer module, and the substrate handling robot includes a first substrate handling robot and a second substrate handling robot. The first substrate handling robot is used to transfer substrates between the first wafer transfer module and the second wafer transfer module, and between the first processing module and the first wafer transfer module. The second substrate handling robot is used to transfer substrates between the second processing module, the third processing module, and the second wafer transfer module.
[0008] Preferably, a medicine supply module is provided on the side of the third processing module away from the second processing module, and the medicine supply module supplies medicine to the first processing module, the second processing module and the third processing module; an intermediate medicine supply module is provided between the first processing module and the second processing module, and the intermediate medicine supply module supplies medicine to the first processing module and the second processing module.
[0009] Furthermore, there are multiple substrate loading modules, and the multiple substrate loading modules are arranged sequentially along the Y direction.
[0010] Preferably, the chip box transfer robot includes a first mounting module, which is mounted on the first mounting frame, and the first mounting module is a side mounting module.
[0011] Furthermore, the first installation module includes a first drive module for driving the chip cassette transfer robot to move in the Y direction, the chip cassette transfer robot includes a handling finger, the chip cassette transfer robot includes a second module for driving the handling finger to move in the Z direction and a third module for driving the handling finger to move in the X direction.
[0012] Optionally, the chip box transfer robot includes a first installation module, which is mounted on the first installation frame and is a bottom-mounted module.
[0013] Furthermore, the wafer cassette transfer robot includes a multi-axis rotary arm, which is used to transfer substrates from multiple substrate loading modules arranged along the Y direction.
[0014] Furthermore, the first and second transfer modules are mounted on the second mounting frame. Both the first and second transfer modules include two sets of substrate support structures stacked vertically, and each set of substrate support structures includes more than four layers of substrate support blocks.
[0015] Preferably, both the first substrate handling robot and the second substrate handling robot include a second mounting module, which is mounted on the second mounting frame; the second mounting module is a side mounting module or a bottom mounting module.
[0016] Furthermore, the second mounting module of the first substrate handling robot is provided with a drive module for driving the first substrate handling robot to move in the Z direction, and the second mounting module of the second substrate handling robot is provided with a drive module for driving the second substrate handling robot to move in the Z direction.
[0017] The substrate processing apparatus of this utility model includes a substrate supply module, a wafer cassette transfer robot, a processing module, and a substrate handling robot. The substrate supply module includes a first mounting frame and a substrate loading module. The substrate loading module is used to load substrate placement cassettes. The wafer cassette transfer robot is mounted on the first mounting frame. The processing module includes a processing chamber, a wafer transfer module, and a second mounting frame. The substrate handling robot is mounted on the second mounting frame. The wafer cassette transfer robot is used to transfer substrates between the substrate loading module and the wafer transfer module, and the substrate handling robot is used to transfer substrates between the wafer transfer module and the processing chamber. The wafer cassette transfer robot of this substrate processing apparatus is mounted on the first mounting frame of the substrate supply module, and the substrate handling robot is mounted on the second mounting frame of the processing module. This shortens the overall length of the substrate processing apparatus, reduces the footprint of the entire substrate processing apparatus, and makes efficient use of space. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A top view of the internal layout of the substrate processing apparatus provided in an embodiment of this utility model; Figure 2 This is a side view of the internal layout of the substrate processing apparatus provided in an embodiment of the present invention. Figure 3 This is a magnified structural diagram of the transfer module provided in an embodiment of the present utility model; Figure 4 A magnified schematic diagram of the chip cassette transfer robot provided in an embodiment of this utility model; Figure 5 This is an enlarged structural schematic diagram of the substrate handling robot provided in an embodiment of the present invention.
[0020] The following are the labeling elements in the figure: 1-Substrate supply module; 2-First processing module; 3-Second processing module; 4-Third processing module; 5-Drug supply module; 6-Intermediate drug supply module; 11-First mounting frame; 12-Baseboard loading module; (21, 31, 41)-Second mounting frame; 70-Bottom mounting plate; (71~78)-Baseboard support block; 79-Moving module; 80-Second mounting module; 81-Z-axis rotation module; 82-Finger moving module; (83~86)-Finger assembly; 101 - Substrate placement box; 102 - First mounting module; 103 - First driving module; 104 - Second driving module; 105 - Third driving module; (106~109) - Finger assembly; 110 - Handling finger; (201, 202) - First processing chamber; (301, 302) - Second processing chamber; (401, 402) - Third processing chamber; 501 - First supply module; 502 - Second supply module; CR - wafer cassette transfer robot; PS1 - first wafer transfer module; PS2 - second wafer transfer module; TR1 - first substrate handling robot; TR2 - second substrate handling robot; (CH1-CH4) - independent cavities; W - substrate. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0022] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.
[0023] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. In the description of this utility model, unless otherwise stated, "multiple" means two or more.
[0025] With the rapid development of industries such as semiconductors and display panels, substrate processing equipment, as a key piece of equipment in the production process, is receiving increasing attention for its processing efficiency and space utilization. Substrate processing equipment typically includes components such as a substrate supply module, a processing module, and a substrate handling robot, used to perform various processing steps on the substrate.
[0026] However, existing substrate processing devices still have some problems: First, existing high-capacity substrate processing devices have designed a separate fixed area for the substrate handling robot, which occupies a large space in the device, resulting in an insufficiently compact overall layout; second, the vertical space is not used rationally, resulting in wasted space, and the insufficient number of cavities affects the overall capacity of the device, failing to meet the needs of high-capacity production. Based on the above reasons, this application provides a substrate processing device.
[0027] The substrate processing apparatus provided by this utility model will be described in detail below with reference to specific embodiments.
[0028] Figure 1 This is a top view of the internal layout of the substrate processing apparatus provided in an embodiment of the present invention. Figure 2 This is a side view of the internal layout of the substrate processing apparatus provided in an embodiment of the present invention. Figure 3 This is an enlarged structural diagram of the chip transfer module provided in an embodiment of the present invention. Figure 4 This is an enlarged structural schematic diagram of the chip cassette transport robot provided in an embodiment of the present invention. Figure 5Please refer to the enlarged structural schematic diagram of the substrate handling robot provided in the embodiment of this utility model. Figure 1 This embodiment provides a substrate processing apparatus, which is provided with a substrate supply module 1, a first processing module 2, a second processing module 3, and a third processing module 4 arranged sequentially along the X direction. In this embodiment, a wafer cassette transfer robot CR is provided between the substrate supply module 1 and the first processing module 2. The substrate supply module 1 includes a first mounting frame 11 and a substrate loading module 12. The substrate loading module 12 is used to load the substrate placement box 101. The wafer cassette transfer robot CR is mounted on the first mounting frame 11. In this embodiment, the first processing module 2 is provided with a first wafer transfer module PS1, a first processing chamber (201, 202) and a first substrate handling robot TR1. The first substrate handling robot TR1 is mounted on the second mounting frame 21 of the first processing module 2. In this embodiment, the second processing module 3 is provided with a second wafer transfer module PS2 and a second processing chamber (301, 302). The second wafer transfer module PS2 is mounted on the second mounting frame 31 of the second processing module. In this embodiment, the third processing module 4 is provided with a third processing chamber (401, 402) and a second substrate handling robot TR2. The second substrate handling robot TR2 is mounted on the second mounting frame 41 of the third processing module 4.
[0029] In this embodiment, the substrate supply module 1 is located at the front end of the device. The substrate supply module 1 has four substrate loading modules 12. Each substrate loading module 12 can hold a substrate placement box 101. The substrate placement box 101 can have a number of substrates W evenly distributed in the vertical direction.
[0030] Optionally, the cassette transfer robot CR in this embodiment includes a first mounting module 102, which is mounted on a first mounting frame 11. In this embodiment, the first mounting module 102 is a side-mounted module, which is bolted to the first mounting frame 11. Of course, in other embodiments, the connection between the first mounting module 102 and the first mounting frame 11 can also be achieved using methods other than bolt fixing. Further, the first mounting module 102 includes a first drive module 103 for driving the cassette transfer robot CR to move in the Y direction. The cassette transfer robot CR includes a handling finger, and the cassette transfer robot CR includes a second drive module 104 for driving the handling finger to move in the Z direction and a third drive module for driving the handling finger to move in the X direction.
[0031] Specifically, in this embodiment, the wafer cassette transfer robot CR is connected to the substrate supply module 1 via the first mounting module 102. Please refer to [link to relevant documentation]. Figure 1 and Figure 4The first mounting module 102 of the CR robot is connected to the substrate supply module 1 by bolt fixing. In this embodiment, the first mounting module 102 has a built-in first drive module 103 for Y-axis movement. The first drive module 103 realizes the Y-axis movement of the cassette transfer robot CR through its internal motor, guide rail and slider. The cassette transfer robot CR includes a handling finger 110, which contains four layers of finger assemblies (106~109). The cassette transfer robot CR includes a second drive module 104 for driving the handling finger 110 to move along the Z-axis. The second drive module 104 is connected to the first drive module 103. In this embodiment, the second drive module 104 also includes a motor for realizing the rotation of the cassette transfer robot CR along the Z-axis. The cassette transfer robot CR includes a third drive module 105 for driving the handling finger to move along the X-axis. The third drive module 105 enables the handling finger 110 to pick up and place substrate W. Through the coordinated operation of the various motion modules of the wafer cassette transfer robot CR, the finger components (106-109) can pick up and place the substrate W in the substrate placement box 101, and can also transfer the substrate W to the first wafer transfer module PS1. In this embodiment, the wafer cassette transfer robot CR is installed through a side mounting module, which can further reduce the space occupied.
[0032] Optionally, the first mounting module 102 is a bottom mounting module, which is bolted to the first mounting frame 11. Of course, the connection between the first mounting module 102 and the first mounting frame 11 can also be achieved using other fixing methods besides bolting. The wafer cassette transfer robot CR includes a multi-axis rotary arm, which is used by the wafer cassette transfer robot to transfer substrates from multiple substrate loading modules arranged along the Y direction. In this embodiment, the wafer cassette transfer robot CR cannot reciprocate along the Y direction. In this embodiment, there are four substrate loading modules, and the multi-axis rotary arm is used by the wafer cassette transfer robot to transfer substrates from these four modules arranged along the Y direction. In this embodiment, the wafer cassette transfer robot CR is installed using a bottom mounting module, making the installation method faster and more convenient.
[0033] Please see Figure 1 and Figure 2In this embodiment, the first processing module 2, the second processing module 3, and the third processing module 4 are used for substrate processing, such as photolithography, etching, and deposition. The first processing module 2 includes symmetrically arranged first processing chambers (201, 202), the second processing module 3 includes symmetrically arranged second processing chambers (301, 302), and the third processing module 4 includes symmetrically arranged third chambers (401, 402). Each of the first, second, and third processing chambers (201, 202), second, and third processing chambers (401, 402) includes n independent cavities, which are stacked vertically, where n ≥ 4. Most existing high-capacity substrate processing devices are equipped with 18 independent cavities, typically evenly distributed across three processing modules, with each module equipped with 6 independent cavities arranged symmetrically from left to right. Therefore, there are only three layers of cavities vertically, resulting in inefficient use of vertical space. The insufficient number of cavities also affects the device's capacity. In this embodiment, the first processing chamber (201, 202), the second processing chamber (301, 302), and the third chamber (401, 402) each include n independent cavities. These independent cavities are stacked vertically, and n≥4. This design greatly improves the space utilization and processing efficiency of the substrate processing device. In this embodiment, the first processing chamber (201, 202) of the first processing module 2, the second processing chamber (301, 302) of the second processing module 3, and the third chamber (401, 402) of the third processing module 4 each include four layers of independent cavities (CH1~CH4). In this example, when n=4, the number of independent cavities is 24. Of course, in other embodiments, the number of first processing chambers (201, 202) can be set to four, in which case the number of independent cavities is not limited to 24 cavities, and 32 independent cavities can be achieved, and so on, to achieve a greater number of independent cavities.
[0034] Furthermore, a medicine supply module 5 is provided on the side of the third processing module 4 away from the second processing module 3. The medicine supply module 5 supplies medicine to the first processing module 2, the second processing module 3 and the third processing module 4. An intermediate medicine supply module 6 is provided between the first processing module 2 and the second processing module 3. The intermediate medicine supply module 6 supplies medicine to the first processing module 2 and the second processing module 3.
[0035] The chemical supply module 5 in this embodiment can provide each processing module with the chemical solutions and water required for substrate processing, as well as other substances needed during substrate processing. Of course, the chemical supply module 5 in this embodiment is not limited to the attached... Figure 1The first supply module 501 and the second supply module 502 shown along the Y direction can be equipped with a corresponding number of supply modules as needed. Of course, the chemical supply module 5 can be connected to the substrate processing device or can be independent of the device, as long as it can supply the device with the chemical liquids and water and other substances required for substrate processing. In this embodiment, an intermediate chemical supply module 6 is provided between the first processing module 2 and the second processing module 3. The intermediate chemical supply module 6 supplies chemical liquids to the first processing module 2 and the second processing module 3. The intermediate chemical supply module 6 can also provide the processing modules with the chemical liquids and water and other substances required for substrate processing when processing the substrate W. At the same time, it can also serve as a maintenance area in the middle of the entire device.
[0036] Please see Figure 1 and Figure 3 In this embodiment, the first wafer transfer module PS1 is fixed to the second mounting frame 21 of the first processing module 2 via a bottom mounting plate 70. The first wafer transfer module PS1 includes two sets of stacked substrate support structures. In this embodiment, the substrate support structures consist of two sets of eight substrate support blocks (71-78). The first wafer transfer module PS1 transfers wafers independently through these two sets of substrate support blocks, greatly improving the efficiency of wafer transfer. The first wafer transfer module PS1 can move along the X-axis via a moving module 79. When the substrate W moves to a position adjacent to the first transfer robot TR1, the first transfer robot TR1 docks with the first wafer transfer module PS1, removes the substrate W from PS1, and transports it to the second wafer transfer module PS2. In this embodiment, the structure of the second wafer transfer module PS2 is similar to that of the first wafer transfer module PS1.
[0037] Please see Figure 2 and Figure 5Furthermore, both the first substrate handling robot TR1 and the second substrate handling robot TR2 include a second mounting module. Exemplarily, in this embodiment, the second mounting module 80 is a side mounting module. The first substrate handling robot TR1 is connected to the side of the second mounting frame 21 of the first processing module 2 via the side mounting module. The side mounting module in this embodiment has a built-in drive module that enables the first substrate handling robot TR1 to achieve high-precision reciprocating motion in the Z-axis. The first substrate handling robot TR1 in this embodiment includes a Z-axis rotation module 81, which enables the first substrate handling robot TR1 to rotate around the Z-axis. The first substrate handling robot TR1 in this embodiment includes four layers of finger assemblies (83-86) and a finger movement module 82, which enables the fingers to pick up and place substrates W. The structures of the first substrate handling robot TR1 and the second substrate handling robot TR2 in this embodiment are similar. Exemplarily, the second substrate handling robot TR2 in this embodiment is connected to the side of the mounting frame 41 of the third processing module 4 via the side mounting module. The second mounting module 80 in this embodiment has a built-in drive module that enables the second substrate handling robot TR2 to achieve high-precision reciprocating motion in the Z-axis. The second substrate handling robot TR2 in this embodiment includes a Z-axis rotation module 81, which enables the second substrate handling robot TR2 to rotate around the Z-axis. The second substrate handling robot TR2 in this embodiment also includes four-layer finger assemblies (83-86) and a finger movement module 82, which enables the fingers to pick up and place substrates W. The first substrate handling robot TR1 is connected to the side of the second mounting frame 21 of the first processing module 2 via a side mounting module, and the second substrate handling robot TR2 is connected to the side of the second mounting frame 41 of the third processing module 4 via a side mounting module. In other embodiments, the first substrate handling robot TR1 can also be connected to the second mounting frame 21 of the first processing module 2 via a bottom mounting module, and the second substrate handling robot TR2 can also be connected to the second mounting frame 41 of the third processing module 4 via a bottom mounting module. Exemplarily, the second mounting module 80 of the first substrate handling robot TR1 in this embodiment is bolted to the second mounting frame 21 of the first processing module 2. However, the connection between the second mounting module 80 and the second mounting frame 21 of the first processing module 2 can also be achieved using other fixing methods besides bolt fixing. In this embodiment, the second mounting module 80 of the second substrate handling robot TR2 is mounted on the second mounting frame 41 of the third processing module 4 by bolts. Of course, the connection between the second mounting module 80 and the second mounting frame 41 of the third processing module 4 can also be achieved by other fixing methods besides bolt fixing.
[0038] In this embodiment, when the second transfer module PS2 has a sufficient number of substrates W, the first substrate handling robot TR1 can directly transfer the substrates W to be processed to the first processing chamber 201 on the left or the first processing chamber 202 on the right, further improving the substrate processing efficiency. In this embodiment, the first processing chambers (201, 202) of the first processing module 2, the second processing chambers (301, 302) of the second processing module 3, and the third chambers (401, 402) of the third processing module 4 all contain four independent cavities CH1~CH4. When the second transfer module PS2 transfers the substrate W to the adjacent second substrate handling robot TR2, the second substrate handling robot TR2 can transfer the substrates W to be processed to the second processing chambers (301, 302) of the second processing module 3 and the third chambers (401, 402) of the third processing module 4 for processing.
[0039] The substrate processing device provided in this embodiment is equipped with a wafer cassette transfer robot mounted on the first mounting frame of the substrate supply module and a substrate handling robot mounted on the second mounting frame of the processing module. This shortens the overall length of the substrate processing device, reduces the footprint of the entire device, and makes better use of space. By arranging four or more cavities in the vertical direction, the vertical height space is made better use of space, allowing the total number of cavities to reach 24 or 32, which greatly improves the production capacity of the device. Compared with the prior art, this invention does not require the design of separate fixed areas for the wafer cassette transfer robot and the substrate handling robot, avoiding the overall length of the device being stretched and reducing the occupied area. At the same time, the multi-layer cavity design in the vertical direction significantly improves the production capacity of the device.
[0040] In the above description, the terms "an embodiment," "some embodiments," "example," "specific example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0041] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A substrate processing apparatus, characterized in that: This includes a substrate supply module, a wafer cassette transfer robot, a processing module, and a substrate handling robot; The substrate supply module includes a first mounting frame and a substrate loading module. The substrate loading module is used to load substrate placement boxes, and the wafer cassette transfer robot is mounted on the first mounting frame. The processing module includes a processing chamber, a wafer transfer module, and a second mounting frame. The substrate handling robot is mounted on the second mounting frame. The wafer cassette transfer robot is used to transfer substrates between the substrate loading module and the wafer transfer module, and the substrate handling robot is used to transfer substrates between the wafer transfer module and the processing chamber.
2. The substrate processing apparatus according to claim 1, characterized in that: The processing module includes a first processing module, a second processing module, and a third processing module arranged sequentially along the X direction. The first processing module includes a first processing chamber arranged symmetrically, the second processing module includes a second processing chamber arranged symmetrically, and the third processing module includes a third processing chamber arranged symmetrically. Each of the first, second, and third processing chambers includes n independent cavities, which are stacked vertically, and n≥4.
3. The substrate processing apparatus according to claim 2, characterized in that: The wafer transfer module includes a first wafer transfer module and a second wafer transfer module. The substrate handling robot includes a first substrate handling robot and a second substrate handling robot. The first substrate handling robot is used to transfer substrates between the first wafer transfer module and the second wafer transfer module, and between the first processing module and the first wafer transfer module. The second substrate handling robot is used to transfer substrates between the second processing module, the third processing module, and the second wafer transfer module.
4. The substrate processing apparatus according to claim 2, characterized in that: The third processing module is provided with a medicine supply module on the side away from the second processing module. The medicine supply module supplies medicine to the first processing module, the second processing module and the third processing module. An intermediate medicine supply module is provided between the first processing module and the second processing module. The intermediate medicine supply module supplies medicine to the first processing module and the second processing module.
5. The substrate processing apparatus according to claim 1, characterized in that: The number of substrate loading modules is multiple, and the multiple substrate loading modules are arranged sequentially along the Y direction.
6. The substrate processing apparatus according to claim 5, characterized in that: The chip box transfer robot includes a first mounting module, which is mounted on the first mounting frame and is a side-mounted module.
7. The substrate processing apparatus according to claim 6, characterized in that: The first installation module includes a first drive module for driving the chip cassette transfer robot to move in the Y direction. The chip cassette transfer robot includes a handling finger. The chip cassette transfer robot includes a second drive module for driving the handling finger to move in the Z direction and a third drive module for driving the handling finger to move in the X direction.
8. The substrate processing apparatus according to claim 5, characterized in that: The chip box transfer robot includes a first installation module, which is mounted on the first installation frame and is a bottom-mounted module.
9. The substrate processing apparatus according to claim 8, characterized in that: The wafer cassette transfer robot includes a multi-axis rotary arm, which is used to transfer substrates from multiple substrate loading modules arranged along the Y direction.
10. The substrate processing apparatus according to claim 3, characterized in that: The first and second transfer modules are mounted on the second mounting frame. Both the first and second transfer modules include two sets of substrate support structures stacked vertically, and each set of substrate support structures includes more than four layers of substrate support blocks.
11. The substrate processing apparatus according to claim 3, characterized in that: Both the first substrate handling robot and the second substrate handling robot include a second mounting module, which is mounted on the second mounting frame; the second mounting module is a side mounting module or a bottom mounting module.
12. The substrate processing apparatus according to claim 11, characterized in that: The second mounting module of the first substrate handling robot is provided with a drive module for driving the first substrate handling robot to move in the Z direction, and the second mounting module of the second substrate handling robot is provided with a drive module for driving the second substrate handling robot to move in the Z direction.