Light emitting device and 3D printing apparatus

Abstract

The utility model discloses a kind of light emitting device and 3D printing equipment, light emitting device includes light emitting unit, including frame body, light source and drive board, frame body has first installation surface, drive board is connected with first installation surface;Radiating unit, including first radiating part, second radiating part and heat preservation part, first radiating part is set on first installation surface, light source is sleeved in first radiating part, second radiating part is connected with first installation surface, heat preservation part covers first radiating part.The light emitting device of the utility model sets up light source on first radiating part, so that the heat generated by light source can be directly transmitted to first radiating part, heat absorbed by first radiating part is taken away by second radiating part, realize the rapid heat dissipation to light source, heat dissipation efficiency is high, heat preservation part covers first radiating part, can improve the heat dissipation effect of second radiating part to first radiating part, and then improve the output stability of optical power.

Description

Technical Field

[0001] This utility model relates to the field of 3D printing equipment technology, and in particular to a light emitting device and a 3D printing device. Background Technology

[0002] Light emitting units are widely used in electronic imaging equipment, such as 3D printing equipment. Their main function is to emit light from an LD lamp (light emitting lamp) onto the object being scanned, i.e., liquid resin, causing the resin to solidify and form a shape. A light emitting unit mainly includes: a beam emitting device; a deflection device to deflect the beam emitted from the beam emitting device into the scanning optical system; and a scanning optical system, located between the deflection device and the photosensitive component, which uses the deflected beam to scan the object. The LD lamp, as the most important light source in the light emitting unit, generates light power that is a crucial indicator affecting printing quality. However, LD lamps generate a significant amount of heat during operation; higher temperatures have a greater impact on the stability of light power output and also affect the size of the light spot, thus affecting the printing results. Utility Model Content

[0003] The purpose of this invention is to provide a light emitting device and a 3D printing equipment to solve the problem of poor heat dissipation during the operation of the light emitting device, thereby improving the output stability of light power and ensuring printing effect.

[0004] In a first aspect, this utility model provides a light emitting device, comprising: A light emitting unit, comprising a frame, a light source, and a driver board, wherein the frame has a first mounting surface; The heat dissipation unit includes a first heat dissipation component, a second heat dissipation component, and a heat insulation component. The first heat dissipation component is disposed on the first mounting surface, the light source is sleeved on the first heat dissipation component, and the heat insulation component covers the first heat dissipation component.

[0005] In the light emitting device described above, preferably, the second heat sink includes a first heat sink portion and a transmission portion, one side of the transmission portion abuts against the side of the first heat sink portion away from the mounting surface, and the other side of the transmission portion abuts against the first heat sink portion.

[0006] In the light emitting device described above, preferably, one side of the heat insulation member is connected to the first mounting surface, and the other side of the heat insulation member is connected to the first heat dissipation part. The first mounting surface, the heat insulation member, and the first heat dissipation part enclose a heat insulation space, and the first heat dissipation member and the transmission part are located within the heat insulation space.

[0007] In the light emitting device described above, preferably, the second heat sink further includes a second heat dissipation portion, which is disposed on the side of the first heat dissipation portion away from the first heat sink, and / or disposed on the side intersecting with the first mounting surface and close to the first heat sink.

[0008] In the light emitting device described above, preferably, the first heat sink, the second heat sink, and the driving plate are all mounted on the first mounting surface.

[0009] In the light emitting device described above, preferably, the light emitting unit further includes a second mounting surface and a driving member, wherein the second mounting surface intersects with the first mounting surface, and the driving member is disposed on the second mounting surface.

[0010] In the light emitting device described above, preferably, the heat dissipation unit further includes a third heat dissipation component disposed on the driving component.

[0011] In the light emitting device described above, preferably, the driving member is located on the side of the frame body on which the deflector rotation shaft is mounted.

[0012] In the light emitting device described above, preferably, the third heat sink is mounted on the side close to the deflector mounting area.

[0013] Secondly, this utility model provides a 3D printing device, including the aforementioned light emitting device. Compared with the prior art, the light emitting device of this utility model places the light source on the first heat sink, so that the heat generated by the light source can be directly transferred to the first heat sink, shortening the heat transfer path. The heat absorbed by the first heat sink is carried away by the second heat sink, achieving rapid heat dissipation of the light source with high heat dissipation efficiency. The heat insulation component covers the first heat sink, which can improve the heat dissipation effect of the heat transfer component on the first heat sink. At the same time, it reduces the impact of external air entering and condensing into water droplets when it is cold, which would affect the performance of the light emitting unit. This is conducive to improving the output stability of light power and ensuring printing effect. Attached Figure Description

[0014] Figure 1 This is a perspective view of the light emitting device provided in Embodiment 1 of this utility model; Figure 2 This is an exploded view of the light emitting device provided in Embodiment 1 of this utility model; Figure 3 This is a cross-sectional view of the light emitting device provided in Embodiment 1 of this utility model; Figure 4 This is a schematic diagram of the heat dissipation path provided in Embodiment 1 of this utility model; Figure 5 This is a perspective view of the light emitting device provided in Embodiment 2 of this utility model; Figure 6 This is a cross-sectional view of the light emitting device provided in Embodiment 2 of this utility model; Figure 7 This is a schematic diagram of the heat dissipation path provided in Embodiment 2 of this utility model; Figure 8 This is a perspective view of the light emitting device provided in Embodiment 3 of this utility model; Figure 9 This is a schematic diagram of the heat dissipation path provided in Embodiment 3 of this utility model; Figure 10 This is a partial perspective view of the frame provided in an embodiment of the present invention; Figure 11 This is an assembly diagram of the insulation part provided in an embodiment of this utility model; Figure 12 This is an assembly diagram of the first heat sink provided in an embodiment of the present invention; Figure 13 This is an assembly diagram of the first heat dissipation part provided in an embodiment of the present invention; Figure 14 This is an assembly diagram of the drive board provided in an embodiment of this utility model; Figure 15 This is a partial perspective view of the light emitting device provided in an embodiment of this utility model; Figure 16 This is an assembly diagram of the driving component provided in an embodiment of this utility model.

[0015] Explanation of reference numerals in the attached figures: 10 - Light emitting unit; 11 - Frame body; 12 - First mounting surface; 121 - First positioning mating part; 1211 - First boss; 1212 - Second boss; 1213 - First screw post; 122 - Second positioning mating part; 1221 - Third boss; 1222 - Fourth boss; 1223 - Second screw post; 123 - Third positioning mating part; 1231 - Fifth boss; 1232 - Sixth boss; 1233 - Third screw post 13-Light source, 14-Drive board, 141-Third positioning part, 1411-Fifth mounting hole, 1412-Sixth mounting hole, 1413-Third inner hole, 15-Second mounting surface, 16-Drive component, 161-Fourth positioning part, 1611-Seventh mounting hole, 1612-Eighth mounting hole, 1613-Fourth inner hole, 17-Fourth positioning mating part, 171-Seventh boss, 172-Eighth boss, 173-Fourth screw post; 20-Heat dissipation unit, 21-First heat dissipation component, 211-Stepped hole, 212-First positioning part, 2121-First mounting hole, 2122-Second mounting hole, 2123-First inner hole, 22-Second heat dissipation component, 221-First heat dissipation part, 222-Transfer part, 2221-TEC cooling chip, 2222-Thermal grease, 223-Second heat dissipation part, 2231-Cooling fan, 224-Second positioning part, 2241-Third mounting hole, 2242-Fourth mounting hole, 2243-Second inner hole, 23-Insulation component, 231-Insulation space, 24-Third heat dissipation component. Detailed Implementation

[0016] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0017] Firstly, referring to Figures 1 to 16 As shown, this utility model provides a light emitting device, including a light emitting unit 10 and a heat dissipation unit 20, wherein: Reference Figure 2 As shown, the light emitting unit 10 includes a frame 11, a light source 13, and a driving board 14. The pins of the light source 13 are fixed on the driving board 14. The frame 11 has a first mounting surface 12. The light source 13 is located on the first mounting surface 12. The driving board 14 is connected to the first mounting surface 12. Both the light source 13 and the driving board 14 are disposed on the frame 11. The light source 13 is used to emit light, and the driving board 14 can drive the light source 13 to work.

[0018] Reference Figure 1 and Figure 2 As shown, the heat dissipation unit 20 includes a first heat dissipation component 21, a second heat dissipation component 22, and a heat insulation component 23. The first heat dissipation component 21 is disposed on the first mounting surface 12, the light source 13 is sleeved on the first heat dissipation component 21, the second heat dissipation component 22 is connected to the first mounting surface 12, and the heat insulation component 23 covers the first heat dissipation component 21. The second heat dissipation component 22 is used to dissipate heat from the first heat dissipation component 21.

[0019] Reference Figure 3 As shown, the first heat sink 21 is provided with a stepped hole 211, and the light source 13 is disposed in the stepped hole 211. The outer side of the light source 13 is in zero-gap fit with the inner wall of the stepped hole 211, so that the light source 13 is in direct contact with the first heat sink 21. The heat generated by the light source 13 can be directly transferred to the first heat sink 21, which shortens the heat transfer path, reduces heat transfer loss, and thus helps to improve heat dissipation efficiency.

[0020] The heat absorbed by the first heat sink 21 is dissipated by the second heat sink 22. The heat insulation component 23 helps to improve the heat dissipation effect of the second heat sink 22, so that the light source 13 can output light stably during operation and avoid affecting the printing effect.

[0021] In the embodiments provided in this application, reference is made to Figure 2 , Figure 3 and Figure 6 As shown, the second heat sink 22 includes a first heat sink 221 and a transfer part 222. One side of the transfer part 222 abuts against the side of the first heat sink 21 opposite to the first mounting surface 12, and the other side of the transfer part 222 abuts against the first heat sink 221. The transfer part 222 is used to transfer the heat from the first heat sink 21, while also transferring its own heat, to the first heat sink 221. The first heat sink 21, the transfer part 222, and the first heat sink 221 abut against each other in sequence according to the light emission direction. After the first heat sink 21 absorbs the heat from the light source 13, it transfers the heat to the transfer part 222, and then through the transfer part 222 to the first heat sink 221, where the first heat sink 221 dissipates the transferred heat.

[0022] In one feasible embodiment, the heat transfer section 222 includes a TEC cooling chip 2221 and thermal grease 2222. The opposite sides of the TEC cooling chip 2221 abut against the first heat sink 21 and the first heat dissipation section 221, respectively. The TEC cooling chip 2221 can quickly transfer the heat absorbed by the first heat sink 21 to the first heat dissipation section 221 for heat dissipation. Thermal grease 2222 is filled between the TEC cooling chip 2221 and the first heat sink 21, and between the TEC cooling chip 2221 and the first heat dissipation section 221. The thermal grease 2222 has excellent thermal conductivity, which can accelerate heat transfer and thus significantly improve heat dissipation efficiency.

[0023] Furthermore, the transmission section 222 dissipates heat from the first heat sink 21. After cooling, the outside air will liquefy into water droplets when it encounters the low-temperature TEC cooling chip 2221 or the first heat sink 21, which may affect the normal operation of the light emitting unit 10.

[0024] To solve this problem, refer to Figure 2 , Figure 3 , Figure 6 as well as Figure 11As shown, one side of the insulation component 23 is connected to the first mounting surface 12, and the other side of the insulation component 23 is connected to the first heat dissipation part 221. The first mounting surface 12, the insulation component 23, and the first heat dissipation part 221 enclose an insulation space 231. The first heat dissipation part 21 and the heat transfer part 222 are located within the insulation space 231 to isolate the heat transfer part 222, the first heat dissipation part 21, and the light source 13 from the external environment. This helps to ensure effective heat transfer and reduce the cold loss of the TEC cooling chip 2221, improving the heat dissipation effect and effectively preventing condensation. In one feasible embodiment, the insulation component 23 includes insulation cotton, which wraps around the outer periphery of the first heat dissipation part 21. The insulation cotton is connected to the first mounting surface 12 with adhesive backing, and the insulation cotton is also connected to the first heat dissipation part 221 with adhesive backing to fix the position of the insulation cotton. In other embodiments, the insulation component 23 may adopt other structures or components, which are not limited here.

[0025] To further improve the heat dissipation efficiency of the heat dissipation unit 20, in the embodiments provided in this application, reference is made to... Figure 3 and Figure 6 As shown, the second heat sink 22 further includes a second heat dissipation section 223. The second heat dissipation section 223 is disposed on the side of the first heat dissipation section 221 away from the first heat sink 21, and / or on the side intersecting with the first mounting surface 12, and close to the first heat sink 21. When the second heat dissipation section 223 is disposed on the side of the first heat dissipation section 221 away from the first heat sink 21, after heat is transferred to the first heat dissipation section 221, the heat dissipation rate of the first heat dissipation section 221 can be accelerated by the action of the second heat dissipation section 223. When the second heat dissipation section 223 is disposed on the side intersecting with the first mounting surface 12, it can directly dissipate heat from the first heat sink 21. Through the combined action of the first heat dissipation section 221 and the second heat dissipation section 223, the heat dissipation efficiency of the first heat sink 21 is improved.

[0026] Specifically, the second heat dissipation unit 223 includes a cooling fan 2231, as shown in the reference. Figure 4 As shown, when the cooling fan 2231 is disposed on the first heat dissipation part 221 away from the first heat dissipation component 21, since the light source 13 is in direct contact with the first heat dissipation component 21, the heat generated by the light source 13 can be directly transferred to the first heat dissipation component 21, and the cooling fan 2231 blows air directly onto the first heat dissipation part 221, which can quickly remove the heat received by the first heat dissipation part 221.

[0027] Reference Figure 7 As shown, when the cooling fan 2231 is located on the side intersecting with the first mounting surface 12, the cooling fan 2231 can be located above the first heat sink 21 and the first heat sink 221. The cooling fan 2231 blows air onto the first heat sink 21 and the first heat sink 221 at the same time to remove the heat absorbed by the first heat sink 21 and the first heat sink 221.

[0028] Reference Figure 9 As shown, cooling fans 2231 are provided on the side of the first heat dissipation part 221 away from the first heat dissipation component 21 and on the side intersecting with the first mounting surface 12. The heat generated by the light source 13 is directly transferred to the first heat dissipation component 21. The cooling fans 2231 can blow air on the top of the first heat dissipation component 21 and on the side of the first heat dissipation part 221 away from the first heat dissipation component 21, thereby achieving multi-directional heat dissipation and improving heat dissipation efficiency.

[0029] In one feasible implementation, the first heat sink 21, the second heat sink 22 and the drive plate 14 are all mounted on the first mounting surface 12. The first heat sink 21, the drive plate 14 and the second heat sink 22 are connected in sequence, so that each component can work stably and can effectively dissipate heat from the light source 13 during the operation of the light emitting device, thereby improving the heat dissipation efficiency.

[0030] Reference Figure 15 and Figure 16 As shown, the light emitting unit of this application also includes a second mounting surface 15 and a driving member 16. The driving member 16 is used to control the operation of the driving board 14 and the deflector. The second mounting surface 15 intersects with the first mounting surface 12. The driving member 16 is disposed on the second mounting surface 15 and is used to drive the light emitting device to work.

[0031] The drive component 16 also generates heat during operation. To avoid high temperatures affecting the working efficiency of the drive component 16, refer to... Figure 16 As shown, the heat dissipation unit 20 also includes a third heat dissipation component 24, which is disposed on the driving component 16 to dissipate heat from the driving component 16 and other functional components disposed on the driving component 16. Specifically, the third heat dissipation component 24 is a cooling fan, which is disposed on the driving component 16 and blows air onto the surface of the driving component 16 to remove the heat generated by the driving component 16 and other functional components on the driving component 16 during operation, so that the light emitting device is kept within a suitable temperature range.

[0032] The light emitting device of this application also includes a deflector. The deflector generates heat during operation. In order to prevent the deflector from overheating and affecting the working efficiency of the light emitting device, the drive component 16 is located on the side of the frame 11 where the deflector rotation shaft is installed. The third heat sink 24 is installed on the side close to the deflector installation area. Thus, the third heat sink 24 can dissipate heat for the drive component 16, as well as for the deflector rotation shaft and the deflector data board, so that the drive component 16 and the deflector can be kept at a suitable working temperature, ensuring the normal operation of the light emitting device.

[0033] To improve the connection stability between the first heat sink 21, the second heat sink 22, and the drive plate 14 and the first mounting surface 12, and to ensure that the heat dissipation unit 20 maintains good heat dissipation efficiency, in the embodiments provided in this application, refer to... Figure 10 , Figures 12 to 14 As shown, the first heat sink 21 is provided with a first positioning part 212, and the first mounting surface 12 is provided with a first positioning mating part 121. The first positioning part 212 and the first positioning mating part 121 can form a positioning mating so that the first heat sink 21 is fixedly connected to the first mounting surface 12.

[0034] The second heat sink 22 is provided with a second positioning part 224, and the first mounting surface 12 is provided with a second positioning mating part 122. The second positioning part 224 and the second positioning mating part 122 can form a positioning mating so that the second heat sink 22 is fixedly connected to the first mounting surface 12.

[0035] The drive plate 14 is provided with a third positioning part 141, and the first mounting surface 12 is provided with a third positioning mating part 123. The third positioning part 141 and the third positioning mating part 123 can form a positioning mating so that the drive plate 14 is fixedly connected to the first mounting surface 12.

[0036] In one feasible implementation, refer to Figure 10 and Figure 12 As shown, the first positioning part 212 includes a first mounting hole 2121, a second mounting hole 2122, and a plurality of first inner holes 2123. The first positioning mating part 121 includes a first boss 1211, a second boss 1212, and a plurality of first screw posts 1213. The first mounting hole 2121 is an oblong hole. The oblong first mounting hole 2121 facilitates the adjustment of the position of the first heat sink 21 on the mounting surface 12. The first mounting hole 2121 and the second mounting hole 2122 can respectively mate with the first boss 1211 and the second boss 1212 to position the first heat sink 21 on the first mounting surface 12 and restrict the movement of the first heat sink 21 in the extension direction of the first mounting surface 12. Then, screws are used to pass through the plurality of first inner holes 2123 and the plurality of first screw posts 1213 to fix the first heat sink 21 to the first mounting surface 12.

[0037] Reference Figure 10 and Figure 13As shown, the second positioning part 224 includes a third mounting hole 2241, a fourth mounting hole 2242, and a plurality of second inner holes 2243. The second positioning mating part 122 includes a third boss 1221, a fourth boss 1222, and a plurality of second screw posts 1223. The third mounting hole 2241 is an oblong hole. The oblong shape of the third mounting hole 2241 facilitates the adjustment of the position of the first heat dissipation part 221 on the first mounting surface 12. The third mounting hole 2241 and the fourth mounting hole 2242 can respectively mate with the third boss 1221 and the fourth boss 1222 to determine the position of the first heat dissipation part 221 relative to the first mounting surface 12 and restrict the movement of the first heat dissipation part 221 along the extension direction of the mounting surface 12. Then, screws are used to pass through the plurality of second inner holes 2243 and the plurality of second screw posts 1223 to fix the first heat dissipation part 221 to the first mounting surface 12.

[0038] Reference Figure 10 and Figure 14 As shown, the third positioning part 141 includes a fifth mounting hole 1411, a sixth mounting hole 1412, and a plurality of third inner holes 1413. The third positioning mating part 123 includes a fifth boss 1231, a sixth boss 1232, and a plurality of third screw posts 1233. The fifth mounting hole 1411 is an oblong hole. The oblong fifth mounting hole 1411 facilitates the adjustment of the position of the drive plate 14 on the first mounting surface 12. The fifth mounting hole 1411 and the sixth mounting hole 1412 can respectively mate with the fifth boss 1231 and the sixth boss 1232 to determine the position of the drive plate 14 relative to the first mounting surface 12 and restrict the drive plate 14 from moving along the extension direction of the first mounting surface 12. Then, screws are used to pass through the plurality of third inner holes 1413 and the plurality of third screw posts 1233 to fix the drive plate 14 to the first mounting surface 12.

[0039] Reference Figure 15 and Figure 16 As shown, the drive member 16 is provided with a fourth positioning part 161, and the frame body 11 is provided with a fourth positioning mating part 17. The fourth positioning part 161 and the fourth positioning mating part 17 can form a positioning mating so that the drive member 16 and the frame body 11 are fixedly connected.

[0040] The fourth positioning part 161 includes a seventh mounting hole 1611, an eighth mounting hole 1612, and a plurality of fourth inner holes 1613. The fourth positioning mating part 17 includes a seventh boss 171, an eighth boss 172, and a plurality of fourth screw posts 173. The seventh mounting hole 1611 is an oblong hole. The oblong shape of the seventh mounting hole 1611 facilitates the adjustment of the position of the drive member 16 on the frame body 11. The seventh mounting hole 1611 and the eighth mounting hole 1612 can respectively mate with the seventh boss 171 and the eighth boss 172 to position the drive member 16 on the frame body 11 and restrict the movement of the drive member 16. Then, screws are used to pass through the plurality of fourth inner holes 1613 and the plurality of fourth screw posts 173 to fix the drive member 16 on the frame body 11.

[0041] In other embodiments, the first positioning part 212 and the first positioning mating part 121, the second positioning part 224 and the second positioning mating part 122, the third positioning part 141 and the third positioning mating part 123, and the fourth positioning part 161 and the fourth positioning mating part 17 may adopt other structures or components capable of forming a positioning mating, and are not limited here.

[0042] Secondly, embodiments of this utility model provide a 3D printing device, including the aforementioned light emitting device. Since the heat dissipation unit 20 of the light emitting device can effectively dissipate heat from the light source 13, it can reduce the impact of temperature on the light source 13, which is beneficial to improving the output stability of light power, ensuring consistent light spot size, and thus guaranteeing the stability of the printing effect of the 3D printing device.

[0043] The above description, based on the embodiments shown in the drawings, details the structure, features, and effects of this utility model. The above description is only a preferred embodiment of this utility model, but the scope of implementation of this utility model is not limited to what is shown in the drawings. Any changes made in accordance with the concept of this utility model, or modifications to equivalent embodiments, that do not exceed the spirit covered by the specification and drawings, shall be within the protection scope of this utility model.

Claims

1. A light emitting device, characterized in that, include: A light emitting unit, comprising a frame, a light source, and a driver board, wherein the frame has a first mounting surface; The heat dissipation unit includes a first heat dissipation component, a second heat dissipation component, and a heat insulation component. The first heat dissipation component is disposed on the first mounting surface, the light source is sleeved on the first heat dissipation component, and the heat insulation component covers the first heat dissipation component.

2. The light emitting device according to claim 1, characterized in that, The second heat sink includes a first heat sink portion and a transfer portion. One side of the transfer portion abuts against the side of the first heat sink portion away from the mounting surface, and the other side of the transfer portion abuts against the first heat sink portion.

3. The light emitting device according to claim 2, characterized in that, One side of the insulation component is connected to the first mounting surface, and the other side of the insulation component is connected to the first heat dissipation part. The first mounting surface, the insulation component, and the first heat dissipation part enclose and form an insulation space. The first heat dissipation component and the transfer part are located within the insulation space.

4. The light emitting device according to claim 2, characterized in that, The second heat sink further includes a second heat sink portion, which is disposed on the side of the first heat sink portion away from the first heat sink, and / or disposed on the side intersecting with the first mounting surface and close to the first heat sink.

5. The light emitting device according to claim 2, characterized in that, The first heat sink, the second heat sink, and the driver board are all mounted on the first mounting surface.

6. The light emitting device according to claim 1, characterized in that, The light emitting unit further includes a second mounting surface and a driving member. The second mounting surface intersects with the first mounting surface, and the driving member is disposed on the second mounting surface.

7. The light emitting device according to claim 6, characterized in that, The heat dissipation unit further includes a third heat dissipation component, which is disposed on the driving component.

8. The light emitting device according to claim 7, characterized in that, The drive component is located on the side of the frame body where the deflector rotation shaft is mounted.

9. The light emitting device according to claim 8, characterized in that, The third heat sink is installed on the side close to the deflector mounting area.

10. A 3D printing device, characterized in that, Includes the light emitting device according to any one of claims 1 to 9.

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