An integrated assembly structure for a wood detection apparatus

Abstract

The utility model provides a kind of integrated assembly structure for wood detection equipment, comprising;Shell;Photograph probe, the photograph probe is arranged on the shell, and the photograph probe is used to obtain the information data of wood surface;Piezoelectric probe, the piezoelectric probe is set on the shell by mounting bracket, and the piezoelectric probe is used to obtain the information data inside wood.The utility model connects the high-frequency piezoelectric probe of acoustic emission and ultrasonic transducer in the inside of shell by mounting bracket, fixes and connects memory stick in the inside of shell by support, fixes and connects mainboard in the inside of shell by supporting plate and support plate, and fixes and connects wireless module and battery in the inside of shell by support frame, so that the high-frequency piezoelectric probe of acoustic emission, ultrasonic transducer, memory stick, wireless module and battery are separated and set, so that air circulation, better heat dissipation effect is played.

Description

Technical Field

[0001] This utility model relates to the technical field of wood testing equipment, and in particular to an integrated assembly structure for wood testing equipment. Background Technology

[0002] With the development of non-destructive testing technology for wood, modern wood testing instruments integrate multiple electronic modules such as acoustic emission sensing, ultrasonic transducer, laser scanning, and infrared thermal imaging, and are equipped with high-performance processors, large-capacity memory, and wireless communication units.

[0003] These precision electronic components generate significant heat during operation, and the instruments typically need to operate for extended periods in high-temperature environments such as the field and forests. By integrating multiple electronic devices together, the heat dissipation efficiency directly affects the stability and lifespan of the equipment. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide an integrated assembly structure for wood testing equipment.

[0005] This utility model provides the following technical solution: an integrated assembly structure for wood testing equipment, comprising;

[0006] shell;

[0007] A camera probe is mounted on the housing and is used to acquire information data about the wood surface.

[0008] A piezoelectric probe, which is mounted on the housing via a mounting bracket, is used to acquire information data about the interior of the wood.

[0009] An ultrasonic transducer, which is also mounted on the housing via the mounting bracket, is used to emit ultrasonic waves to the wood and receive ultrasonic waves reflected back from the wood.

[0010] A display screen is disposed on the outside of the housing and is used to enable human-computer interaction;

[0011] A control module is disposed inside the housing and is used to realize the logical operation of the integrated assembly structure.

[0012] The piezoelectric probe, the ultrasonic transducer, and the control module are all located inside the housing and are spaced apart from each other.

[0013] Furthermore, the outer shell is detachably connected to a side plate, which has a plurality of first ventilation holes, and the top of the outer shell is detachably connected to a top plate, which has a second ventilation hole.

[0014] Furthermore, several fans are fixedly connected to the side plate.

[0015] Furthermore, the mounting bracket is fixedly connected to the inside of the housing. The mounting bracket includes a first upright plate fixedly connected to the housing and a plurality of first through holes opened on the first upright plate. The piezoelectric probe is disposed on the top of the first upright plate, and the ultrasonic transducer is disposed on the side of the first upright plate.

[0016] Furthermore, the control module includes: a motherboard connected to the inside of the housing via a support assembly, a memory module connected to the inside of the housing via a bracket, and a wireless module and a battery connected to the inside of the housing via a support frame.

[0017] The motherboard is used to implement the logical operation of the integrated assembly structure, the memory module is used to provide storage space, the wireless module is used to implement wireless network connectivity, and the battery is used to provide power.

[0018] Furthermore, the support assembly includes a tray fixedly connected to the inner side of the housing, a plurality of second through holes opened on the upper part of the tray, and a plurality of support plates fixedly connected to the inner side of the housing, wherein the tray and the support plates respectively support the two sides of the main board.

[0019] Furthermore, the bracket includes a second upright plate fixedly connected to the outer shell, and a through hole formed through the middle of the second upright plate.

[0020] Furthermore, the support frame includes a plurality of support members fixedly connected to the inner side of the housing, and a mounting plate connecting the plurality of support members together, wherein the wireless module and the battery are fixedly connected to the mounting plate.

[0021] The beneficial effects of this utility model are as follows: the high-frequency piezoelectric probe and ultrasonic transducer of acoustic emission are connected to the inside of the housing by the mounting bracket, the memory module is fixedly connected to the inside of the housing by the bracket, the motherboard is supported and fixedly connected to the inside of the housing by the tray and support plate, and the wireless module and battery are fixedly connected to the inside of the housing by the support bracket. In this way, the high-frequency piezoelectric probe, ultrasonic transducer, memory module, wireless module and battery are arranged separately to facilitate air circulation and achieve better heat dissipation. The motherboard is located between the high-frequency piezoelectric probe, ultrasonic transducer, memory module, wireless module and battery so that the wiring harnesses of the high-frequency piezoelectric probe, ultrasonic transducer, memory module, wireless module and battery can be connected to the motherboard. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0023] Figure 2 This is a three-dimensional structural diagram of the internal structure of this utility model.

[0024] Figure 3 This is a schematic diagram of a portion of the internal three-dimensional structure of this utility model.

[0025] Figure 4 This is a schematic diagram of the exploded three-dimensional structure of this utility model.

[0026] Figure 5 This is a three-dimensional structural diagram of the internal components of this utility model.

[0027] Figure 6 This is a three-dimensional structural diagram showing the connection between the fan and the side plate of this utility model.

[0028] The labels in the attached diagram are as follows: 1-Outer shell, 2-Laser infrared imaging probe, 3-High-frequency piezoelectric probe for acoustic emission, 5-Mounting bracket, 51-First upright plate, 52-First through hole, 6-Ultrasonic transducer, 7-Main board, 8-Bracket, 81-Second upright plate, 82-Perforation, 9-Memory module, 10-Support bracket, 101-Support component, 102-Mounting plate, 11-Wireless module, 12-Battery, 13-Display screen, 141-Pattern, 142-Second through hole, 143-Support plate, 15-Side plate, 16-First vent, 17-Top plate, 18-Second vent, 19-Fan. Detailed Implementation

[0029] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0030] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] An integrated assembly structure for wood testing equipment, such as Figures 1-4 As shown, the assembly includes: a housing 1; a camera probe mounted on the housing 1 for acquiring information data from the wood surface; a piezoelectric probe mounted on the housing 1 via a mounting bracket 5 for acquiring information data from the interior of the wood; an ultrasonic transducer 6 also mounted on the housing 1 via the mounting bracket 5 for emitting ultrasonic waves to the wood and receiving ultrasonic waves reflected back from the wood; a display screen 13 located on the outside of the housing 1 for human-computer interaction; and a control module located on the inside of the housing 1 for implementing the logical operation of the integrated assembly structure. The piezoelectric probe, the ultrasonic transducer 6, and the control module are all located on the inside of the housing 1 and are spaced apart from each other.

[0033] Specifically, the piezoelectric probe is a high-frequency piezoelectric probe 3 with acoustic emission; it detects the instantaneous elastic waves generated in wood under stress; it is mainly used to assess the damage state of wood, monitor crack propagation, determine drying stress, and identify live and dead knots; in other words, the high-frequency piezoelectric probe 3 with acoustic emission is used to passively listen to stress wave events inside the wood.

[0034] The imaging probe is fixedly connected to one side wall of the outer casing 1. The imaging probe is a laser infrared imaging probe 2, which is used to scan the surface contour of the wood and capture thermal images. In other words, laser scanning is used to accurately measure geometric dimensions and detect surface defects; external thermal imaging is used to detect internal voids, degumming, uneven moisture content distribution, decay areas, etc.

[0035] Ultrasonic transducer 6 is used to assess the quality grade of wood, detect internal defects, and measure dynamic elastic modulus.

[0036] The display screen 13 is fixedly connected to the side opposite to the imaging probe. The display screen 13 is used for human-machine interaction and displays the raw data waveforms, processed images and detection results collected by the imaging probe, ultrasonic transducer 6 and piezoelectric probe. It also provides a graphical user interface to allow the operator to set detection parameters, select detection mode, start / stop detection, view historical data, etc.

[0037] The outer shell 1 is detachably connected to a side plate 15, and the side plate 15 is provided with a plurality of first ventilation holes 16. The top of the outer shell 1 is detachably connected to a top plate 17, and the top plate 17 is provided with a second ventilation hole 18.

[0038] It is understood that the top plate 17 and the side plate 15 are detachably connected to the side of the outer casing 1 by bolts. By removing the top plate 17 and the side plate 15, people can repair or replace the electrical components inside the outer casing 1. The first vent 16 and the second vent 18 are both connected to the inside of the outer casing 1. Through the first vent 16 and the second vent 18, air can circulate on the side of the outer casing 1 to achieve heat dissipation.

[0039] like Figure 6 As shown, a number of fans 19 are fixedly connected to the side plate 15; in this embodiment, the fans 19 are located inside the housing 1, and three are provided. The display screen 13 sends a command to the control module to start the fans 19, thereby accelerating the air circulation inside the housing 1 and thus dissipating heat from the electronic components inside the housing 1.

[0040] like Figure 3 As shown, the mounting bracket 5 is fixedly connected to the inner side of the outer shell 1. The mounting bracket 5 includes a first upright plate 51 fixedly connected to the outer shell 1, and a plurality of first through holes 52 opened on the first upright plate 51. The piezoelectric probe is disposed on the top of the first upright plate 51, and the ultrasonic transducer 6 is disposed on the side of the first upright plate 51.

[0041] It is understood that the mounting bracket 5 is fixedly connected to the bottom inner side of the housing 1 near the laser infrared imaging probe 2, and the first through hole 52 is opened on the first upright plate 51 from top to bottom; the piezoelectric probe is fixedly connected to the top of the mounting bracket 5, and the ultrasonic transducer 6 is fixedly connected to the side of the first upright plate 51 near the laser infrared imaging probe 2, thereby separating the piezoelectric probe and the ultrasonic transducer 6 to facilitate heat dissipation for both, and the first through hole 52 facilitates heat dissipation for the ultrasonic transducer 6. The piezoelectric probe and the ultrasonic transducer 6 are located on the side of the main board 7.

[0042] The control module includes: a motherboard 7 connected to the inside of the housing 1 via a support component; a memory module 9 connected to the inside of the housing 1 via a bracket 8; and a wireless module 11 and a battery 12 connected to the inside of the housing 1 via a support frame 10. The motherboard 7 is used to implement the logic operation of the integrated assembly structure; the memory module 9 is used to provide storage space; the wireless module 11 is used to implement wireless network connectivity; and the battery 12 is used to provide power.

[0043] Specifically, the motherboard 7 is used to connect and coordinate the operation of the laser infrared imaging probe 2, the high-frequency piezoelectric probe 3 for acoustic emission, the ultrasonic transducer 6, the memory module 9, the wireless module 11, the battery 12, the display screen 13, and the fan 19, and provides a high-speed data channel to enable rapid information exchange between the components; in addition, it distributes power from the battery 12 to the various electronic devices.

[0044] Memory module 9 is used to provide high-speed temporary storage space for motherboard 7, and is used to store the running operating system, applications, and related data currently being processed;

[0045] The wireless module 11 provides wireless network connectivity, which can be achieved using WiFi, Bluetooth, or 4G / 5G networks. This allows the detection results, collected raw data, images, etc., to be wirelessly transmitted to a nearby computer, server, or cloud platform for further analysis, archiving, report generation, or remote expert diagnosis.

[0046] Battery 12 is a storage battery used to provide power to electronic devices.

[0047] like Figure 3 and Figure 5 As shown, the support assembly includes a tray 141 fixedly connected to the inner side of the outer casing 1, a plurality of second through holes 142 opened on the upper part of the tray 141, and a plurality of support plates 143 fixedly connected to the inner side of the outer casing 1. The tray 141 and the support plates 143 respectively support the two sides of the main board 7.

[0048] Specifically, a tray 141 and two support plates 143 are fixedly connected to the bottom of the inner side of the outer casing 1. The tray 141 is L-shaped and has multiple second through holes 142 on its upper part. The second through holes 142 are used to reduce the contact area between the tray 141 and the motherboard 7 so that the motherboard 7 can dissipate heat through the second through holes 142. The tray 141 is fixedly connected to one side of the motherboard 7, and the support plates 143 are fixedly connected to the other side of the motherboard 7. There is a gap between the two support plates 143 and between the support plates 143 and the tray 141 to allow air circulation and achieve the effect of heat dissipation. Furthermore, the support plates 143 and the tray 141 lift the motherboard 7, thereby creating a gap between the motherboard 7 and the bottom of the inner side of the outer casing 1 to improve the heat dissipation capacity of the motherboard 7.

[0049] like Figure 3 and Figure 5 As shown, the bracket 8 includes a second upright plate 81 fixedly connected to the outer shell 1, and a through hole 82 formed through the middle of the second upright plate 81.

[0050] Specifically, the second upright plate 81 is fixedly connected to the bottom of the inner side of the outer casing 1, and the second upright plate 81 is located between the first upright plate 51 and the support plate 141. The memory module 9 is fixedly connected to the upper part of the support plate 141. The through hole 82 can prevent the second upright plate 81 from blocking the first upright plate 51 and hindering air circulation. The memory module 9 is fixedly connected to the upper part of the second upright plate 81 so that the memory module 9 is located above the motherboard 7.

[0051] The motherboard 7, memory module 9, high-frequency piezoelectric probe 3 for acoustic emission, and ultrasonic transducer 6 can be separated from each other to allow for air circulation and thus improve heat dissipation.

[0052] like Figure 3 and Figure 5 As shown, the support frame 10 includes a plurality of support members 101 fixedly connected to the inner side of the outer shell 1, and a mounting plate 102 connecting the plurality of support members together. The wireless module 11 and the battery 12 are fixedly connected to the mounting plate 102.

[0053] Specifically, the support member 101 is fixedly connected to the side wall inside the outer shell 1. In this embodiment, six support members 101 are provided, and there are gaps between the support members 101. The mounting plate 102 is fixedly connected to the upper part of the support member 101. The wireless module 11 and the battery 12 are laid flat and fixedly connected to the mounting plate 102. The mounting plate 102 can be supported more stably by setting multiple support members 101, and the wireless module 11 and the battery 12 are located on the upper side of the main board 7.

[0054] In summary, the high-frequency piezoelectric probe 3 and ultrasonic transducer 6 for acoustic emission are connected to the inside of the housing 1 via the mounting bracket 5; the memory module 9 is fixedly connected to the inside of the housing 1 via the bracket 8; the motherboard 7 is supported and fixedly connected to the inside of the housing 1 via the tray 141 and support plate 143; and the wireless module 11 and battery 12 are fixedly connected to the inside of the housing 1 via the support bracket 10. This arrangement of the high-frequency piezoelectric probe 3, ultrasonic transducer 6, memory module 9, wireless module 11, and battery 12 allows for air circulation and better heat dissipation. Furthermore, the motherboard 7 is located between the high-frequency piezoelectric probe, ultrasonic transducer 6, memory module 9, wireless module 11, and battery 12, facilitating the connection of the wiring harnesses of these components to the motherboard 7.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0056] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An integrated assembly structure for wood testing equipment, characterized in that, include; shell; A camera probe is mounted on the housing and is used to acquire information data about the wood surface. A piezoelectric probe, which is mounted on the housing via a mounting bracket, is used to acquire information data about the interior of the wood. An ultrasonic transducer, which is also mounted on the housing via the mounting bracket, is used to emit ultrasonic waves to the wood and receive ultrasonic waves reflected back from the wood. A display screen is disposed on the outside of the housing and is used to enable human-computer interaction; A control module is disposed inside the housing and is used to realize the logical operation of the integrated assembly structure. The piezoelectric probe, the ultrasonic transducer, and the control module are all located inside the housing and are spaced apart from each other.

2. The integrated assembly structure according to claim 1, characterized in that, The outer shell is detachably connected to a side plate, which has a plurality of first ventilation holes. The top of the outer shell is detachably connected to a top plate, which has a second ventilation hole.

3. The integrated assembly structure according to claim 2, characterized in that, Several fans are fixedly connected to the side plate.

4. The integrated assembly structure according to claim 1, characterized in that, The mounting bracket is fixedly connected to the inside of the housing. The mounting bracket includes a first upright plate fixedly connected to the housing and a plurality of first through holes opened on the first upright plate. The piezoelectric probe is disposed on the top of the first upright plate and the ultrasonic transducer is disposed on the side of the first upright plate.

5. The integrated assembly structure according to claim 1, characterized in that, The control module includes: a motherboard connected to the inside of the housing via a support component, a memory module connected to the inside of the housing via a bracket, and a wireless module and a battery connected to the inside of the housing via a support frame. The motherboard is used to implement the logical operation of the integrated assembly structure, the memory module is used to provide storage space, the wireless module is used to implement wireless network connectivity, and the battery is used to provide power.

6. The integrated assembly structure according to claim 5, characterized in that, The support assembly includes a tray fixedly connected to the inside of the housing, a plurality of second through holes opened on the upper part of the tray, and a plurality of support plates fixedly connected to the inside of the housing. The tray and the support plates respectively support the two sides of the main board.

7. The integrated assembly structure according to claim 5, characterized in that, The bracket includes a second upright plate fixedly connected to the outer shell, and a through hole formed through the middle of the second upright plate.

8. The integrated assembly structure according to claim 5, characterized in that, The support frame includes a plurality of support members fixedly connected to the inner side of the housing, and a mounting plate connecting the plurality of support members together, wherein the wireless module and the battery are fixedly connected to the mounting plate.

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