An electronic device interface test mold

Abstract

The utility model provides a kind of electronic equipment interface test mould, it is related to electronic equipment test technical field. Including support frame, its upper end is equipped with a cylinder, the cylinder is detachably connected with upper module, its bottom is detachably connected with lower module opposite the upper module;The upper module and the lower module form the space for accommodating electronic equipment when being combined, and the interface to be measured of electronic equipment is all exposed;The bottom of the support frame is equipped with at least one cylinder towards the lower module, the plug-in connector suitable for the interface to be measured is detachably installed in the cylinder;The plug-in connector is electrically connected to test fixture. The quick moulding of upper and lower module and the automatic docking of plug-in connector are realized by cylinder drive, replace manual operation, can make test efficiency greatly improve.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment testing technology, and more specifically, to an electronic equipment interface testing mold. Background Technology

[0002] With the development of technology, various electronic devices are being used more and more in industry and daily life. Each electronic product can have different shapes and different interfaces. For example, a portable hard drive has a USB interface, and a video encoder has a video interface.

[0003] For current electronic devices, due to the different interface standards, regular electronic device manufacturers generally need to test the device interfaces before leaving the factory. This is to ensure the yield rate of the device and to test whether the interface meets the relevant standards. However, while existing electronic devices are equipped with various test fixtures, testing still requires manual connection and testing, resulting in low efficiency. Different test fixtures are needed for different interfaces, further reducing testing efficiency. Therefore, this invention proposes an electronic device interface test mold to at least partially solve the problems that may exist in the prior art. Utility Model Content

[0004] To overcome or at least partially solve the above problems, this utility model provides an electronic device interface testing mold.

[0005] The embodiments of this utility model are implemented as follows: This application provides an electronic device interface test mold, including: a support frame, with a cylinder at its upper end, the cylinder being detachably connected to an upper module, and a lower module being detachably connected to its bottom opposite the upper module; When the upper module and the lower module are combined, they form a space to accommodate the electronic device, and all the interfaces of the electronic device to be tested are exposed. The bottom of the support frame is provided with at least one cylinder facing the lower module, and a connector adapted to the interface under test is detachably installed on the cylinder; the connector is electrically connected to the test fixture.

[0006] In some embodiments of this utility model, a buffer block is also provided at the lower end of the lower module.

[0007] In some embodiments of this utility model, the cylinder at the upper end of the support frame is connected to an L-shaped support block by screws; The L-shaped support block is connected to an adapter plate by screws, and the adapter plate is connected to the upper module by screws.

[0008] In some embodiments of this utility model, the support frame includes a base plate and upright plates disposed on both sides of the base plate; The upper end of the upright plate is provided with a horizontal plate; The cylinder at the upper end of the support frame is mounted on the horizontal plate; The base plate is provided with mounting holes, and a mounting bracket is provided at the lower end of the mounting holes; The cylinder at the bottom of the support frame is mounted on the mounting frame and embedded in the mounting hole.

[0009] In some embodiments of this utility model, the cylinder at the bottom of the support frame has a pad detachably mounted on its upper end, and a functional block is detachably mounted on the pad; the functional block is provided with a socket for connecting a connector.

[0010] In some embodiments of this utility model, a rotary switch is provided at the upper end of the pad.

[0011] In some embodiments of this utility model, a T-shaped groove is provided on the base plate; The lower module is detachably installed in the middle of the T-shaped groove; The T-shaped groove contains three cylinders facing the lower module.

[0012] Compared with the prior art, the embodiments of this utility model have at least the following advantages or beneficial effects: A cylinder is mounted on the upper end of a support frame, which is detachably connected to an upper module. A lower module is detachably connected to the bottom of the upper module. When the upper and lower modules are combined, they form a space to accommodate electronic equipment, with all interfaces to be tested of the electronic equipment exposed. At least one cylinder facing the lower module is located at the bottom of the support frame, and a connector adapted to the interface to be tested is detachably mounted on this cylinder. The connector is electrically connected to a test fixture. The cylinder-driven mechanism enables rapid mold closing of the upper and lower modules and automatic docking of the connector, replacing manual operation and significantly improving testing efficiency. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a top view structural diagram of an electronic device interface testing mold provided in one embodiment of the present invention; Figure 2This is a structural schematic diagram of an electronic device interface testing mold provided in one embodiment of the present invention, viewed from below. Figure 3 This is a schematic diagram of the connection structure of a cylinder for an electronic device interface testing mold provided in one embodiment of the present invention. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0016] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the various embodiments and features described below can be combined with each other.

[0017] Please refer to Figures 1 to 3 As shown, some embodiments of this utility model provide an electronic device interface testing mold including: a support frame 1, with a cylinder 2 at its upper end, the cylinder being detachably connected to an upper module 3, and a lower module 4 being detachably connected to the bottom of the support frame 1 facing the upper module 3; when the upper module 3 and the lower module 4 are combined, they form a space for accommodating the electronic device, and all the interfaces of the electronic device to be tested are exposed; at least one cylinder 2 facing the lower module 4 is provided at the bottom of the support frame 1, and a connector adapted to the interface to be tested is detachably installed on the cylinder 2; the connector is electrically connected to the test fixture.

[0018] The use of cylinders enables rapid mold closing of the upper and lower modules and automatic docking of connectors, replacing manual operation and improving testing efficiency by over 60%. The upper and lower modules and connectors are all detachable; replacing different specifications of modules and connectors allows for compatibility with various electronic devices such as mobile phones, tablets, and laptops, including HDMI, USB, and Type-C interfaces, improving fixture versatility by 80%. For example, when testing the Type-C interface of a smartphone, the upper module 3, with its groove structure adapted to the shape of the phone, is installed on the cylinder 2 via a snap-fit ​​mechanism, and the lower module 4 is equipped with a support protrusion corresponding to the bottom of the phone. The bottom cylinder drives the connector (Type-C plug) to be precisely inserted into the device interface upwards, eliminating the need for manual alignment and saving time for manual operation, thereby significantly improving testing efficiency.

[0019] In some embodiments of this utility model, the lower module 4 is further provided with a buffer block 6 at its lower end.

[0020] By adding a buffer block 6 at the lower end of the lower module 4, the elastic deformation of the buffer block 6 absorbs the impact force of the cylinder during the mold closing process. The buffer force can reach 5 to 10 N, avoiding scratches on the equipment surface or deformation of the interface caused by rigid collision. It is especially suitable for testing high-end electronic equipment with glass back panels. The aforementioned buffer block 6 can be made of silicone material with a Shore hardness of 60 and a thickness of 5mm. It is wrapped in a ring around the edge of the lower module 4. When testing the tablet computer, it can effectively buffer the pressure of a 10kg cylinder and prevent the module from damaging the equipment.

[0021] In some embodiments of this utility model, the cylinder 2 at the upper end of the support frame 1 is connected to an L-shaped support block 101 by screws; the L-shaped support block 101 is connected to an adapter plate 102 by screws, and the adapter plate 102 is connected to the upper module 3 by screws.

[0022] The cylinder 2 at the upper end of the aforementioned support frame 1 is connected to the L-shaped support block 101 by screws, and then to the adapter plate 102 by screws before connecting to the upper module 3. The multi-level screw connection structure allows for fine adjustment of the upper module 3 within ±2mm, solving the problem of interface misalignment caused by equipment tolerances; the worn upper module 3 or cylinder 2 can be replaced individually by removing the screws, significantly reducing maintenance time. For example, the L-shaped support block 101 is equipped with an elongated adjustment hole with a diameter of φ8mm and a length of 15mm. When testing different brands of laptops, the horizontal position of the adapter plate 102 can be adjusted by loosening the screws, so that the buckle of the upper module 3 can be precisely aligned with the edge slot of the device, without the need to customize a new fixture.

[0023] In some embodiments of this utility model, the support frame 1 includes a base plate 106 and upright plates 104 disposed on both sides of the base plate 106; a horizontal plate 105 is provided at the upper end of the upright plate 104; a cylinder at the upper end of the support frame 1 is installed on the horizontal plate 105; the base plate 106 is provided with mounting holes, and a mounting bracket 103 is provided at the lower end of the mounting holes; a cylinder 2 at the bottom of the support frame 1 is installed on the mounting bracket 103 and embedded in the mounting holes.

[0024] The aforementioned support frame 1 includes a base plate 106, two side upright plates 104, and an upper horizontal plate 105. The upper cylinder is mounted on the horizontal plate 105, and the bottom cylinder is embedded in the mounting holes of the base plate 106 via a mounting bracket 103. The vertical frame structure has a strong load-bearing capacity of up to 50kg, ensuring stable contact between the connector and the interface during high-speed testing. The bottom cylinder's embedded mounting hole design reduces the overall height of the fixture, making it suitable for narrow workstations on automated production lines. The base plate 106 can be made of 6061-T6 aluminum alloy with a thickness of 15mm. The upright plates 104 and the horizontal plate 105 are welded together using angle brackets to form a rigid frame. Actual measurements show that in vibration tests from 10Hz to 50Hz, the interface insertion displacement deviation is <0.2mm.

[0025] Furthermore, the cylinder 2 at the bottom of the support frame 1 has a pad 201 detachably mounted on its upper end, and a functional block 203 is detachably mounted on the pad 201; the functional block 203 is provided with a socket 204 for connecting the connector.

[0026] A pad 201 is provided at the upper end of the bottom cylinder, on which a detachable functional block 203 is installed. The functional block has a connector hole 204 for connecting connectors. For example, for different interfaces such as Micro-USB and Lightning, the connector inserted into the connector hole 204 of the functional block 203 can be changed in just 3 seconds. The functional block 203 can be connected by magnetic attraction, snap-fit, or screws without disassembling the cylinder body, improving fixture switching efficiency by 90%. The functional block 203 adopts a quick-release snap-fit ​​design, with a positioning protrusion on one side engaging with the groove of the pad 201, and a spring top pin locking it on the other side. When testing iPhones, the Lightning functional block is installed, and when testing Android devices, it is replaced with the USB-C functional block, and the switching can be completed without tools.

[0027] In some embodiments of this utility model, a rotary switch 202 is provided on the upper end of the pad 201. The rotary switch 202 enables switching between manual and automatic modes. During the debugging phase, the cylinder stroke can be finely adjusted (accuracy ±0.5mm) via the rotary switch 202, avoiding connection failures caused by equipment placement deviations during automated testing, which is particularly suitable for small-batch sample testing. For example, there are automatic mode (connected to PLC control), manual mode (clockwise rotation increases the downward pressure stroke), and reset mode. When debugging a new type of foldable screen phone, the cylinder stroke can be precisely adjusted from 10mm to 8.5mm via the manual mode to ensure safe connection of the flexible screen interface.

[0028] Furthermore, the base plate 106 is provided with a T-shaped groove 5; the lower module 4 is detachably installed in the middle of the T-shaped groove 5; three cylinders 2 are respectively provided in the groove of the T-shaped groove 5 facing the lower module 4. The base plate 106 is provided with a T-shaped groove 5, the lower module 4 is installed in the middle, and three cylinders 2 are provided in the groove facing the module. The three cylinders 2 in three different positions can meet the needs of three interfaces in different positions, so that multiple interfaces of electronic devices can be plugged in at the same time; the three cylinders can drive different plugs (such as power interface, data interface, audio interface) to be plugged in synchronously, and a single test covers all interfaces to be tested on the device, which can further improve the testing efficiency compared to testing one interface at a time. The lower module 4 can move laterally ±50mm through the slider structure of the T-shaped groove 5 to adapt to the interface layout of devices of different sizes, such as the difference in interface position between mobile phones and tablets. The above refers to a certain model of gaming phone, which has a USB-C port at the bottom, an HDMI port on the side, and a 3.5mm headphone jack at the top. The lower module 4 is adjusted to the center position through the T-shaped groove 5, and the three cylinders are simultaneously plugged into the corresponding interfaces from the bottom, left, and top directions, and all interfaces are tested within 10 seconds.

[0029] As an example, see Figure 1 and Figure 2 As shown, the support frame 1 adopts a vertical frame structure. The upper cylinder 2 is mounted on the horizontal plate 105, and it is connected to the upper module 3 via an L-shaped support block 101 and an adapter plate 102. The upper module 3 has a contoured groove adapted to the top surface of the electronic device. The bottom plate 106 fixes the bottom cylinder 2 via a mounting bracket 103. A connector adapted to the interface under test, such as a Type-C plug, is installed at its output end. During testing, the device is placed between the upper and lower modules. The upper cylinder drives the upper module to press down and fix the device, while the bottom cylinder pushes the connector to automatically insert into the exposed interface. The connector is connected to an external test fixture (such as an oscilloscope or multimeter) via a ribbon cable to achieve automated signal detection. For example, a ring-shaped silicone buffer block 6, 5mm thick and with a Shore hardness of 65°, is pasted onto the lower end of the aforementioned lower module 4, with its edge extending 3mm beyond the contour of the lower module. When testing smartphones with glass back panels, the buffer block contacts the back of the device before the main body of the module, absorbing the inertial impact force (about 8N) when the cylinder is pressed down, thus preventing the device from being scratched by rigid collisions. After 1,000 tests, the device's appearance defect rate was 0. The aforementioned base plate 106 has a horizontal T-shaped groove 5, 15mm wide. The lower module 4 is fixed to the center of the groove by a bottom slider and can move left and right along the groove. Three cylinders 2 are installed on the left, right, and bottom sides of the groove. The left cylinder drives the Lightning connector to test the side charging port, the right cylinder drives the 3.5mm plug to test the top headphone jack, and the bottom cylinder drives the USB-C plug to test the bottom data port. When testing a tablet computer, the device position is adjusted by sliding the lower module so that the three interfaces are aligned with the respective connectors, achieving simultaneous testing of the three interfaces and reducing the testing time for a single device from 45 seconds to 15 seconds.

[0030] This invention, through the collaborative design of an automated drive system (cylinder assembly), modular interface components (detachable upper module, functional block), and flexible mechanical structure (T-slot, buffer block), completely solves the problems of low manual operation efficiency and poor interface compatibility of existing test fixtures.

[0031] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Although optional embodiments of this utility model have been described, those skilled in the art, once they understand the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including optional embodiments as well as all changes and modifications falling within the scope of this utility model.

[0032] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or terminal device that includes that element.

[0033] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the principle and implementation of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. An electronic device interface testing mold, characterized in that, include: The support frame (1) has a cylinder (2) at its upper end, which is detachably connected to an upper module (3), and a lower module (4) is detachably connected to its bottom facing the upper module (3). When the upper module (3) and the lower module (4) are combined, they form a space for accommodating electronic devices, and all the interfaces of the electronic devices to be tested are exposed. The bottom of the support frame (1) is provided with at least one cylinder (2) facing the lower module (4), and a connector adapted to the interface to be tested is detachably installed on the cylinder (2); the connector is electrically connected to the test fixture.

2. The electronic device interface testing mold according to claim 1, characterized in that, The lower module (4) is also provided with a buffer block (6) at its lower end.

3. The electronic device interface test mold according to claim 1 or 2, characterized in that, The cylinder (2) at the upper end of the support frame (1) is connected to an L-shaped support block (101) by screws. The L-shaped support block (101) is connected to an adapter plate (102) by screws, and the adapter plate (102) is connected to the upper module (3) by screws.

4. The electronic device interface testing mold according to claim 1, characterized in that, The support frame (1) includes a base plate (106) and upright plates (104) disposed on both sides of the base plate (106). The upper end of the vertical plate (104) is provided with a horizontal plate (105); The cylinder at the upper end of the support frame (1) is mounted on the horizontal plate (105); The base plate (106) is provided with mounting holes, and a mounting bracket (103) is provided at the lower end of the mounting holes. The cylinder (2) at the bottom of the support frame (1) is mounted on the mounting frame (103) and embedded in the mounting hole.

5. The electronic device interface testing mold according to claim 4, characterized in that, The cylinder (2) at the bottom of the support frame (1) has a pad (201) detachably mounted on its upper end. A functional block (203) is detachably mounted on the pad (201). The functional block (203) is provided with a socket (204) for connecting the connector.

6. The electronic device interface testing mold according to claim 5, characterized in that, A rotary switch (202) is provided on the upper end of the pad (201).

7. The electronic device interface testing mold according to claim 4, characterized in that, The base plate (106) is provided with a T-shaped groove (5); The lower module (4) is detachably installed in the middle of the T-slot (5); The T-shaped groove (5) has three cylinders (2) facing the lower module (4) respectively.

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