An anti-vibration packaging module for an NV color center sensor

Abstract

The utility model discloses a kind of NV color center sensor anti-vibration packaging module, it is related to NV color center sensor technical field. Including: module main body, module main body bottom is equipped with bottom column, bottom column side is equipped with through slot, through slot inside is equipped with slide, slide both ends extend to bottom column outside, spring is equipped at the both ends of slide outside, one end of spring is connected with module main body bottom, other end is connected with slide end part;Module main body includes titanium alloy shell, rubber buffer layer and aerogel heat insulation layer are sequentially equipped in titanium alloy shell inside, heat insulation layer is encapsulated circuit board;Diamond chip, microwave co-planar waveguide and temperature supplement unit are equipped on circuit board.The utility model can reduce the vibration of sensor, improve sensor signal accuracy, increase the universality of sensor.

Description

Technical Field

[0001] This utility model relates to the field of NV color center sensor technology, and in particular to an anti-vibration packaging module for NV color center sensors. Background Technology

[0002] NV (Nitrogen-Vacancy) color centers are point defect structures in diamond with stable optical properties. The current magnetic resonance state of NV color centers can be determined by detecting changes in their fluorescence signals using photodetector magnetic resonance technology. The magnetic induction intensity can then be calculated based on the current microwave frequency, thus realizing the magnetic measurement function. However, existing NV color center sensors have poor vibration resistance, which affects their service life.

[0003] Therefore, proposing an anti-vibration packaging module for NV color center sensors to solve the difficulties existing in the prior art is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the present invention provides an anti-vibration packaging module for an NV color center sensor, which can reduce sensor vibration, improve sensor signal accuracy, and increase sensor versatility.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An anti-vibration packaging module for an NV color center sensor includes a module body, a bottom post at the bottom of the module body, a through groove on the side of the bottom post, a slide rod inside the through groove, both ends of the slide rod extending to the outside of the bottom post, and springs at both ends of the slide rod. One end of the spring is connected to the bottom of the module body, and the other end is connected to the end of the slide rod.

[0007] The main body of the module includes a titanium alloy shell, inside which a rubber buffer layer and an aerogel heat insulation layer are arranged in sequence, and a circuit board is encapsulated inside the heat insulation layer.

[0008] Optionally, the circuit board is equipped with a diamond chip, an amplification unit, a microwave coplanar waveguide, and a temperature compensation unit;

[0009] The temperature compensation unit is located on the back of the circuit board, while the front of the circuit board has a diamond chip, an amplification unit, and a microwave coplanar waveguide connected in sequence.

[0010] Optionally, the amplification unit may employ a transimpedance amplifier.

[0011] Optionally, the temperature supplement unit includes a temperature acquisition module, a difference calculation module, a fitting module, a temperature calibration module, an instruction generation module, a heating module, and a cooling module; wherein the temperature acquisition module, the difference calculation module, the fitting module, the temperature calibration module, and the instruction generation module are connected in sequence, and the input terminals of the heating module and the cooling module are connected in parallel to the output terminal of the instruction generation module.

[0012] Optionally, the microwave coplanar waveguide includes a substrate, a first coupled coplanar waveguide unit, and a second coupled coplanar waveguide unit. The first coupled coplanar waveguide unit contains a first coplanar waveguide grounding conductor, a first coplanar waveguide center conductor, and a second coplanar waveguide grounding conductor. The second coupled coplanar waveguide unit contains a second coplanar waveguide grounding conductor, a second coplanar waveguide center conductor, and a third coplanar waveguide grounding conductor.

[0013] The first coplanar waveguide grounding conductor is located near the edge of the substrate; the third coplanar waveguide grounding conductor is located near the other edge of the substrate; the first coplanar waveguide center conductor is located between the first coplanar waveguide grounding conductor and the second coplanar waveguide grounding conductor; the second coplanar waveguide center conductor is located between the second coplanar waveguide grounding conductor and the third coplanar waveguide grounding conductor; the second coplanar waveguide grounding conductor is located in the middle of the substrate, and the first coupled coplanar waveguide unit and the second coupled coplanar waveguide unit share the same second coplanar waveguide grounding conductor; the second coplanar waveguide grounding conductor, the first coplanar waveguide grounding conductor, the first coplanar waveguide center conductor, the second coplanar waveguide center conductor, and the third coplanar waveguide grounding conductor are arranged in parallel.

[0014] As can be seen from the above technical solution, compared with the prior art, the present invention provides an anti-vibration packaging module for an NV color center sensor, which has the following beneficial effects: 1) The present invention reduces the vibration of the sensor by the spring being compressed or extended by the sliding of the module on the slide rod; 2) The present invention can easily design different filter bandwidths by controlling the coupling amount between the center conductors of the coplanar waveguides in each coplanar waveguide unit, thereby improving the accuracy of the sensor signal. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0016] Figure 1 A schematic diagram of the external shape of an anti-vibration packaging module for an NV color center sensor provided by this utility model;

[0017] Figure 2A schematic diagram of the temperature replenishment unit provided by this utility model;

[0018] Figure 3 A schematic diagram of the microwave coplanar waveguide provided by this utility model;

[0019] Among them, 1 is the main body of the module, 2 is the base column, 3 is the sliding rod, 4 is the spring, 5 is the first coplanar waveguide grounding conductor, 6 is the first coplanar waveguide center conductor, 7 is the second coplanar waveguide grounding conductor, 8 is the second coplanar waveguide center conductor, and 9 is the third coplanar waveguide grounding conductor. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Reference Figure 1 As shown, this utility model discloses an anti-vibration packaging module for an NV color center sensor, including a module body. The bottom of the module body 1 is provided with a module base post 2. A through groove is provided on the side of the base post 2. A sliding rod 3 is provided inside the through groove. Both ends of the sliding rod 3 extend to the outside of the base post 2. Springs 4 are provided at both ends of the sliding rod 3. One end of the spring 4 is connected to the bottom of the module body 1, and the other end is connected to the end of the sliding rod 3.

[0022] The main body of the module 1 includes a titanium alloy shell, inside which a rubber buffer layer and an aerogel heat insulation layer are arranged in sequence, and a circuit board is encapsulated inside the heat insulation layer.

[0023] Furthermore, the circuit board is equipped with a diamond chip, an amplification unit, a microwave coplanar waveguide, and a temperature compensation unit;

[0024] The temperature compensation unit is located on the back of the circuit board, while the front of the circuit board has a diamond chip, an amplification unit, and a microwave coplanar waveguide connected in sequence.

[0025] Furthermore, the amplification unit employs a transimpedance amplifier.

[0026] Specifically, a transimpedance amplifier is used for phase-locked amplification to detect weak magnetic resonance signals modulated at MHz.

[0027] Furthermore, refer to Figure 2As shown, the temperature supplementation unit includes a temperature acquisition module, a difference calculation module, a fitting module, a temperature calibration module, an instruction generation module, a heating module, and a cooling module. The temperature acquisition module, temperature calibration module, and difference calculation module are connected sequentially. The input terminals of the heating module and the cooling module are connected in parallel to the output terminal of the difference calculation module. The output terminals of the heating module and the cooling module are also connected in parallel and connected in series with the fitting module and the instruction generation module. The instruction generation module is also connected to the heating module and the cooling module via signals.

[0028] Specifically, the temperature acquisition module is equipped with a temperature sensor that measures the temperature information at its location every 30 seconds; the temperature calibration module sets the standard chip operating temperature; the difference calculation module calculates the difference between the temperature information and the operating temperature and determines whether it exceeds a threshold range. If it does, the module is activated based on the difference. If the difference is positive, the cooling module is activated; if the difference is negative, the heating module is activated. Both the cooling and heating modules change the temperature at a rate of 1℃ / min. The fitting module fits a temperature change curve based on the measured temperature information and the changing temperature, and simultaneously uses the temperature sensor to detect the temperature and optimize the temperature change curve. The instruction generation module determines whether the chip temperature is at a preset value based on the temperature change curve. If so, it controls the corresponding heating or cooling module to shut down.

[0029] Furthermore, refer to Figure 3 As shown, the microwave coplanar waveguide includes a substrate, a first coupled coplanar waveguide unit, and a second coupled coplanar waveguide unit. The first coupled coplanar waveguide unit contains a first coplanar waveguide grounding conductor 5, a first coplanar waveguide center conductor 6, and a second coplanar waveguide grounding conductor 7. The second coupled coplanar waveguide unit contains a second coplanar waveguide grounding conductor 7, a second coplanar waveguide center conductor 8, and a third coplanar waveguide grounding conductor 9.

[0030] The first coplanar waveguide grounding conductor 5 is close to the edge of the substrate; the third coplanar waveguide grounding conductor 9 is close to the other edge of the substrate; the first coplanar waveguide center conductor 6 is located between the first coplanar waveguide grounding conductor 5 and the second coplanar waveguide grounding conductor 7; the second coplanar waveguide center conductor 8 is located between the second coplanar waveguide grounding conductor 7 and the third coplanar waveguide grounding conductor 9; the second coplanar waveguide grounding conductor 7 is located in the middle of the substrate, and the first coupled coplanar waveguide unit and the second coupled coplanar waveguide unit share the same second coplanar waveguide grounding conductor 7; the second coplanar waveguide grounding conductor 7, the first coplanar waveguide grounding conductor 5, the first coplanar waveguide center conductor 6, the second coplanar waveguide center conductor 8 and the third coplanar waveguide grounding conductor 9 are arranged in parallel.

[0031] Specifically, compared to other types of planar transmission circuits, the coplanar waveguide structure has a symmetrical ground plane, allowing the electromagnetic field to maintain a quasi-TEM mode at higher frequencies. The quasi-TEM mode exhibits linear dispersion characteristics and superior frequency response. Furthermore, the coplanar waveguide has lower radiation loss, enabling the overall device to operate in a higher frequency range. The coplanar waveguide's ability to maintain a single quasi-TEM mode without generating other higher-order modes also allows for a more uniform distribution of the RF current excited on the open loop, preventing the excitation of higher-order modes of the magnetostatic wave. This optimizes the overall device's clutter suppression capability. In this application, the coupling amount can be controlled by adjusting the spacing between the center conductors of the two coplanar waveguides, thereby adjusting the filter bandwidth and filtering out low-frequency and high-frequency waves generated during vibration.

[0032] The above description of the disclosed embodiments is presented in a progressive manner to enable those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An anti-vibration packaging module for an NV color center sensor, characterized in that, Includes a module body (1), a bottom column (2) at the bottom of the module body (1), a through groove on the side of the bottom column (2), a sliding rod (3) inside the through groove, the two ends of the sliding rod (3) extending to the outside of the bottom column (2), and springs (4) at both ends of the sliding rod (3), one end of the spring (4) being connected to the bottom of the module body (1), and the other end being connected to the end of the sliding rod (3); The main body of the module (1) includes a titanium alloy shell, and a rubber buffer layer and an aerogel heat insulation layer are arranged in sequence inside the titanium alloy shell, and a circuit board is encapsulated inside the heat insulation layer. The circuit board is equipped with a diamond chip, an amplification unit, a microwave coplanar waveguide, and a temperature compensation unit. The temperature compensation unit is located on the back of the circuit board, while the front of the circuit board has a diamond chip, an amplification unit, and a microwave coplanar waveguide connected in sequence.

2. The anti-vibration packaging module for an NV color center sensor according to claim 1, characterized in that, The amplification unit uses a transimpedance amplifier.

3. The NV color center sensor vibration-resistant packaging module according to claim 1, characterized in that, The microwave coplanar waveguide includes a substrate, a first coupled coplanar waveguide unit, and a second coupled coplanar waveguide unit. The first coupled coplanar waveguide unit contains a first coplanar waveguide grounding conductor (5), a first coplanar waveguide center conductor (6), and a second coplanar waveguide grounding conductor (7). The second coupled coplanar waveguide unit contains a second coplanar waveguide grounding conductor (7), a second coplanar waveguide center conductor (8), and a third coplanar waveguide grounding conductor (9). The first coplanar waveguide grounding conductor (5) is close to the edge of the substrate; the third coplanar waveguide grounding conductor (9) is close to the other edge of the substrate; the first coplanar waveguide center conductor (6) is located between the first coplanar waveguide grounding conductor (5) and the second coplanar waveguide grounding conductor (7); the second coplanar waveguide center conductor (8) is located between the second coplanar waveguide grounding conductor (7) and the third coplanar waveguide grounding conductor (9); the second coplanar waveguide grounding conductor (7) is located in the middle of the substrate, and the first coupled coplanar waveguide unit and the second coupled coplanar waveguide unit share the same second coplanar waveguide grounding conductor (7). The second coplanar waveguide grounding conductor (7), the first coplanar waveguide grounding conductor (5), the first coplanar waveguide center conductor (6), the second coplanar waveguide center conductor (8) and the third coplanar waveguide grounding conductor (9) are arranged in parallel.

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