An all-in-one computer

Abstract

The utility model discloses an integrated computer relates to computer technical field, and the utility model discloses a computer main part and frame, the rear side middle part of computer main part is equipped with heat abstractor, is used for the heat dissipation of computer main part inside electrical element, and heat abstractor includes: the cooling assembly includes the shell body of setting in the rear side middle part of computer main part, and the cooling fan blows into the computer main part inside the cold air flow to the CPU, the heat dissipation of computer main part inside the heat -generating element such as display card, and the heat dissipation hole of cooperation computer main part both sides forms convection, and timely discharge internal hot air, and the heating end passes through the synergies of radiating fin and radiating fan, and the heat absorbed is rapidly discharged to the outside of shell body, avoids the heat accumulation influence refrigeration effect, effectively solves the problem that the integrated computer is close -grained and leads to the poor heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, specifically to an all-in-one computer. Background Technology

[0002] All-in-one computers are desktop computers that integrate the computer host, monitor, and other external devices into a single device. This allows the host to be integrated behind the monitor, eliminating the need for a separate host case. They are small in size and take up little space, making them suitable for small offices or home environments. However, because all components are integrated into one device, the internal space is compact, upgrades are difficult, and heat dissipation is poor.

[0003] Reference patent document: Patent Publication No. CN222213290U, Patent Publication Date 2024-12-20, discloses an all-in-one computer, relating to the field of computers. This all-in-one computer includes a computer body, with a bracket fixedly mounted on the outer wall of the computer body. A support assembly is fixedly mounted on the outer wall of the bracket. The support assembly includes a clamping unit disposed on the outer wall of the bracket. The clamping unit is used to clamp and restrict the data to be viewed around the computer body. In this all-in-one computer, the data to be viewed is placed between the clamping plate and the support plate. The pushing force of the compression spring bar causes the clamping plate to clamp and restrict the data to the support plate, placing the data above the computer body for easy viewing. Furthermore, the support plate blocks light from the top of the computer body, reducing the impact of light on the user's field of vision and improving ease of use.

[0004] Based on the search of patent numbers and the shortcomings of existing technologies, the following was found:

[0005] Current all-in-one computers integrate the core components of the host, such as the central processing unit, motherboard, memory, and hard drive, into the casing of the monitor, forming a compact overall structure. This makes it impossible to arrange reasonable heat dissipation components inside the computer, resulting in poor heat dissipation performance under long-term use. This can easily lead to performance throttling during long-term high-load operation, affecting the user experience.

[0006] Therefore, this utility model provides an all-in-one computer. Utility Model Content

[0007] To address the problem that existing all-in-one computers, which integrate all core hardware within the display casing, suffer from insufficient heat dissipation space, poor heat dissipation performance during prolonged high-load operation, and are prone to performance throttling issues, the purpose of this invention is to provide an all-in-one computer.

[0008] To achieve the above objectives, this utility model provides the following technical solution: an all-in-one computer, comprising a computer body and a frame, wherein a heat dissipation mechanism is provided at the rear center of the computer body for dissipating heat from the internal electrical components of the computer body, the heat dissipation mechanism comprising:

[0009] The cooling assembly includes an outer shell located in the middle of the rear side of the computer body. The outer shell is fixedly mounted on the upper part of the rack. A thermoelectric cooler is fixedly mounted in the middle of the outer shell. Conductive fins are fixedly mounted on the cooling end of the thermoelectric cooler. A cooling fan is fixedly mounted in the middle of the outer shell on the side near the conductive fins. Heat dissipation fins are fixedly mounted on the other side of the thermoelectric cooler. A cooling fan is fixedly mounted on the side of the outer shell near the heat dissipation fins.

[0010] The mounting components are located at the rear of the computer body and are used to secure the outer casing.

[0011] Preferably, the mounting assembly includes two sets of limiting springs fixedly mounted on the rear side of the computer body. Each of the two sets of limiting springs has a locking block fixedly mounted on one side. Each of the two locking blocks has a guide groove on one side and a handle fixedly mounted on one side.

[0012] Preferably, the outer side of the outer casing has multiple air inlet slots, and two sets of heat dissipation holes are opened on both sides of the computer body.

[0013] Preferably, slots are provided on both sides of the outer shell, and the two locking blocks are slidably locked inside the slots.

[0014] Preferably, the rear side of the computer body has two symmetrically distributed slide grooves, and the middle of the two handles are slidably engaged inside the slide grooves.

[0015] Preferably, two sets of telescopic rods are fixedly installed inside the computer body, and the other side of each set of telescopic rods is fixedly installed in the middle of one side of the card block.

[0016] Beneficial effects

[0017] This invention provides an all-in-one computer. Compared with the prior art, it has the following advantages:

[0018] 1. In this application, after the semiconductor cooling chip is powered on, its cooling end is in close contact with the conductive fins, rapidly reducing the ambient air temperature. Meanwhile, the cooling fan blows the cool air into the computer body to cool the heat-generating components such as the CPU and graphics card. At the same time, it works in conjunction with the heat dissipation holes on both sides of the computer body to form convection, promptly expelling internal heat. The heating end, through the synergistic action of the heat dissipation fins and the cooling fan, quickly dissipates the absorbed heat to the outside of the casing, preventing heat accumulation from affecting the cooling effect. This effectively solves the problem of poor heat dissipation caused by the compact space of all-in-one computers.

[0019] 2. During the process of pushing the outer casing into the slot at the rear of the computer body, the guide groove of the locking block will be squeezed, causing the locking block to automatically retract. After the outer casing is fully in place, the limit spring pushes the locking block into the slot, completing the fixation of the computer body, monitor and cooling components. When disassembling, simply pull the handle to slide the locking block along the slide groove to disengage it from the slot, and the outer casing can be easily removed. This ensures the stability of the heat dissipation mechanism after installation and simplifies the disassembly and assembly process, making it convenient for users to regularly clean the heat dissipation components or perform maintenance and replacement. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2 This is another structural schematic diagram of the present invention.

[0022] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle.

[0023] Figure 4 This is a schematic diagram of the cross-sectional structure of the outer shell of this utility model.

[0024] Figure 5 This is a schematic diagram of the installation component structure of this utility model.

[0025] Figure 6 This utility model Figure 5 Enlarged view of point B in the middle.

[0026] In the diagram: 1. Computer body; 11. Heat dissipation hole; 2. Heat dissipation mechanism; 21. Cooling component; 211. Outer shell; 212. Air inlet; 213. Semiconductor cooling chip; 214. Conductive fins; 215. Cooling fan; 216. Heat dissipation fins; 217. Cooling fan; 218. Rack; 22. Mounting components; 221. Locking block; 2211. Locking slot; 222. Handle; 2221. Slide; 223. Limiting spring; 224. Telescopic rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-6This utility model provides a technical solution: an all-in-one computer, including a computer body 1 and a frame 218, wherein a heat dissipation mechanism 2 is provided in the middle of the rear side of the computer body 1 for dissipating heat from the internal electrical components of the computer body 1, and the heat dissipation mechanism 2 includes:

[0029] The cooling assembly 21 includes a housing 211 located in the middle of the rear side of the computer body 1. A groove is formed in the middle of the rear side of the computer body 1. The cooling side of the housing 211 is fitted into the groove. The housing 211 is fixedly mounted on the upper part of the frame 218. A thermoelectric cooler 213 is fixedly mounted in the middle of the housing 211. Conductive fins 214 are fixedly mounted on the cooling end of the thermoelectric cooler 213. The conductive fins 214 are tightly attached to the cooling end face of the thermoelectric cooler 213 using thermal grease. The cooling end face of 213 faces the inside of the computer body 1. A cooling fan 215 is fixedly installed in the middle of the side of the outer shell 211 near the conductive fins 214. The cooling fan 215 is used to blow the generated cold air into the computer body 1. A heat dissipation fin 216 is fixedly installed on the other side of the semiconductor cooling chip 213. A cooling fan 217 is fixedly installed on the side of the outer shell 211 near the heat dissipation fins 216. The cooling fan 217 can blow the heat generated by the semiconductor cooling chip 213 out of the outer shell 211 to cool it down.

[0030] Mounting component 22 is located on the rear side of the computer body 1 and is used to fix the outer casing 211.

[0031] The mounting assembly 22 includes two sets of limiting springs 223 fixedly mounted on the rear side of the computer body 1. Each of the two sets of limiting springs 223 has a locking block 221 fixedly mounted on one side. Each of the two locking blocks 221 has a guide groove on one side. When the outer casing 211 is pushed directly into the groove on the rear side of the computer body 1 during installation, the locking block 221 will retract backward without affecting the smooth insertion of the outer casing 211, thus making the installation faster. Each of the two locking blocks 221 has a handle 222 fixedly mounted on one side. During disassembly, by pulling the handle 222, the locking block 221 is disengaged from the slot 2211, thereby releasing the limitation on the outer casing 211, and thus the outer casing 211 can be removed from one side of the computer body 1.

[0032] Multiple air inlets 212 are provided on the outer side of the outer casing 211, and two sets of heat dissipation holes 11 are provided on both sides of the computer body 1, which are used to work together with the cooling components 21 to cool it down.

[0033] Both sides of the outer casing 211 are provided with slots 2211, and two blocks 221 are slidably locked inside the slots 2211. The size of the slots 2211 matches that of the blocks 221.

[0034] Two symmetrically distributed slide grooves 2221 are provided on the rear side of the computer body 1. The middle part of the two handles 222 are slidably locked inside the slide grooves 2221. The width of the slide grooves 2221 and the width of the handles 222 match each other to ensure smooth movement of the handles 222.

[0035] Two sets of telescopic rods 224 are fixedly installed inside the computer body 1. The other side of each set of telescopic rods 224 is fixedly installed in the middle of one side of the locking block 221. Under the limitation of the telescopic rods 224, the movement of the locking block 221 can be stabilized, and the locking block 221 can be stably limited when it is locked into the slot 2211.

[0036] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0037] When in operation, after the thermoelectric cooler 213 is powered on, a temperature difference is generated on both sides. The side closer to the inside of the computer body 1 is the cooling end. The contact area with the air is increased through the conduction fins 214 to cool the surrounding air. The cooling fan 215 is activated to blow the cold air in the conduction fins 214 into the computer body 1 to cool the internal electrical components such as the CPU and graphics card. The other side is the heating end. The heat absorbed by the heat dissipation fins 216 is in the same principle as the conduction fins 214. Then, the heat dissipation fan 217 blows air to the outside of the outer casing 211, thereby cooling one side of the thermoelectric cooler 213.

[0038] During installation, the outer casing 211 is placed close to the rear of the computer body 1 and moves into the slot at the rear. As it enters, the guide groove on the side of the locking block 221 facing the outer casing 211 causes the outer casing 211 to press against the locking block 221 as it moves into the computer body 1. When the outer casing 211 is fully inserted into the slot at the rear of the computer body 1, the locking block 221 is located directly in front of the slot 2211, thus fixing the outer casing 211 in place. This completes the installation of the cooling component 21 and the computer body 1. At this point, the frame 218 supports the computer body 1.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An all-in-one computer, comprising a computer main body (1) and a frame (218), characterized in that: A heat dissipation mechanism (2) is provided in the middle of the rear side of the computer main body (1) for dissipating heat from the electrical components inside the computer main body (1). The heat dissipation mechanism (2) includes: The temperature reduction component (21) includes a housing (211) provided in the middle of the rear side of the computer main body (1). The housing (211) is fixedly installed on the upper part of the frame (218). A semiconductor refrigeration sheet (213) is fixedly installed in the middle of the housing (211). A conduction fin (214) is fixedly installed at the refrigeration end of the semiconductor refrigeration sheet (213). A temperature reduction fan (215) is fixedly installed in the middle of one side of the housing (211) close to the conduction fin (214). A heat dissipation fin (216) is fixedly installed on the other side of the semiconductor refrigeration sheet (213). A heat dissipation fan (217) is fixedly installed on one side of the housing (211) close to the heat dissipation fin (216); An installation component (22), provided on the rear side of the computer main body (1), for fixing the housing (211).

2. The all-in-one computer according to claim 1, wherein: The installation component (22) includes two groups of limiting springs (223) fixedly installed on the rear side of the computer main body (1). A clamping block (221) is fixedly installed on one side of each of the two groups of limiting springs (223). A guiding inclined groove is provided on one side of each of the two clamping blocks (221). A handle (222) is fixedly installed on one side of each of the two clamping blocks (221).

3. An all-in-one computer according to claim 1, wherein: A plurality of air inlet grooves (212) are provided on the outer side of the housing (211). Two groups of heat dissipation holes (11) are provided on both sides of the computer main body (1).

4. An all-in-one computer according to claim 2, characterized in that: Card slots (2211) are provided on both sides of the housing (211). Both of the two clamping blocks (221) are slidably clamped inside the card slots (2211).

5. An all-in-one computer according to claim 2, characterized in that: Two symmetrically distributed sliding grooves (2221) are provided on the rear side of the computer main body (1). The middle parts of both of the two handles (222) are slidably clamped inside the sliding grooves (2221).

6. The all-in-one computer according to claim 2, wherein: Two groups of telescopic rods (224) are fixedly installed inside the computer main body (1). The other sides of the two groups of telescopic rods (224) are fixedly installed on the middle part of one side of the clamping block (221).

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