pxie chassis

Abstract

The application relates to a PXIe chassis, which comprises a first accommodating space and a second accommodating space arranged in a box body, wherein a back plate of the PXIe chassis and a functional module tested by the PXIe chassis are located in the second accommodating space; a power module is pluggable in the first accommodating space of the box body, and a power supply cooling fan is integrated in the power module; wherein the bottom surface of the box body is provided with a first grid air inlet and a second grid air inlet, under the action of the power supply cooling fan, cold air enters the first grid air inlet and is discharged after flowing through the inside of the power module, so as to form a first air flow channel; under the action of a main cooling fan, cold air enters the second grid air inlet and is discharged after flowing through the second accommodating space, so as to form a second air flow channel. The power module has an independent cooling air channel, can greatly reduce the influence of the heat generated by the power module on the second air flow channel, and can improve the heat dissipation efficiency of the whole PXIe chassis and the smoothness of the internal air flow field.

Description

Technical Field

[0001] This application relates to the field of industrial-grade chassis technology, and in particular to a PXIe chassis. Background Technology

[0002] PXIe (PCI eXtensions for Instrumentation) chassis serve as the foundational platform for modular instrumentation systems, widely used in automated testing, measurement, and embedded control. The PXIe chassis provides power, data bus connectivity, and clock and trigger signals via a backplane, allowing users to insert various functional modules (such as oscilloscopes, signal generators, and digital I / O cards) to build flexible and high-performance test systems. This modular design significantly enhances system flexibility and configurability, enabling it to adapt to a wide range of complex testing needs.

[0003] In practical applications, high-performance PXIe modules and power modules generate a lot of heat, and effective heat dissipation is crucial for ensuring system stability and extending module lifespan.

[0004] Traditional PXIe chassis often require balancing the cooling needs of the main system modules and power supply modules in their thermal design, resulting in complex airflow configurations and low cooling efficiency. Furthermore, replacing the power supply module sometimes necessitates opening the chassis or disassembling other components, increasing maintenance complexity and downtime. Utility Model Content

[0005] In view of this, the present application provides a PXIe chassis to solve at least one problem existing in the background art.

[0006] In a first aspect, embodiments of this application provide a PXIe chassis, the PXIe chassis comprising:

[0007] The enclosure has a first accommodating space and a second accommodating space inside. The back panel of the PXIe enclosure and the functional modules tested using the PXIe enclosure are located in the second accommodating space.

[0008] The power module is pluggable into the first accommodating space of the enclosure and can provide power for the operation of the PXIe enclosure. The power module integrates a power cooling fan.

[0009] The main cooling fan is connected to the back of the enclosure;

[0010] The bottom surface of the enclosure is provided with a first mesh air inlet and a second mesh air inlet. Under the action of the power supply cooling fan, cold air enters through the first mesh air inlet, flows through the inside of the power module, and is then discharged to form a first airflow duct. Under the action of the main cooling fan, cold air enters through the second mesh air inlet, flows through the second accommodating space, and is then discharged to form a second airflow duct.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the first side of the housing is provided with a third grid air inlet and a fourth grid air inlet, and the cold air of the first airflow duct enters through the first grid air inlet and the third grid air inlet; the cold air of the second airflow duct enters through the second grid air inlet and the fourth grid air inlet.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the second side of the housing is further provided with a fifth grid air inlet, and the cold air of the second airflow duct enters through the second grid air inlet, the fourth grid air inlet and the fifth grid air inlet, and the second side is arranged opposite to the first side.

[0013] In conjunction with the first aspect of this application, in an alternative embodiment, the second mesh air inlet corresponds to the position of the functional module and the back panel.

[0014] In conjunction with the first aspect of this application, in an optional embodiment, the PXIe chassis includes a plurality of the main cooling fans, which are distributed on the back side of the chassis.

[0015] In conjunction with a first aspect of this application, in an alternative embodiment, the first accommodating space has an opening located on the back side of the housing, through which the power module is plugged into the first accommodating space.

[0016] In conjunction with the first aspect of this application, in an alternative embodiment, the opening is located at a corner of the back side near the bottom surface and the first side surface of the housing.

[0017] In conjunction with the first aspect of this application, in an alternative embodiment, the PXIe chassis further includes:

[0018] A flow guide is connected to the housing and is used to direct the gas located in the second accommodating space to the main cooling fan.

[0019] In conjunction with the first aspect of this application, in an optional embodiment, one end of the air guide is connected to the bottom surface of the housing near the main cooling fan, and the other end is located at the top of the second accommodating space.

[0020] In conjunction with the first aspect of this application, in an optional embodiment, the end of the air guide near the second accommodating space is provided with a plurality of heat dissipation holes, so that cold air entering from the side of the back plate away from the functional module can pass through the plurality of heat dissipation holes and flow to the main cooling fan.

[0021] The PXIe chassis provided in this application embodiment has a first mesh air inlet and a second mesh air inlet on the bottom surface of the chassis. Under the action of the power supply cooling fan, cold air enters through the first mesh air inlet, flows through the inside of the power module, and is then discharged to form a first airflow channel. Under the action of the main cooling fan, cold air enters through the second mesh air inlet, flows through the second accommodating space, and is then discharged to form a second airflow channel. The first airflow channel and the second airflow channel are independent of each other.

[0022] The power module has its own independent heat dissipation channel. That is, the first airflow channel can greatly reduce the impact of the heat generated by the power module on other heat dissipation channels, and improve the heat dissipation efficiency of the entire PXIe chassis and the smoothness of the internal airflow.

[0023] This power supply module can be swapped out directly from the outside without opening the entire chassis or disassembling other internal components. This makes power supply module maintenance, troubleshooting, and upgrades based on power requirements extremely convenient and efficient, significantly reducing PXIe chassis downtime. Furthermore, an independent power supply cooling fan ensures the power supply module maintains a suitable operating temperature even under high loads, further enhancing the reliability of the power supply module itself and thus improving the overall stability of the PXIe chassis.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0026] Figure 1 This is a schematic diagram of the overall structure of the PXIe chassis provided in the embodiments of this application;

[0027] Figure 2 This is a partial exploded view of the PXIe chassis provided in an embodiment of this application;

[0028] Figure 3 A cross-sectional view of the PXIe chassis provided in an embodiment of this application;

[0029] Figure 4A schematic diagram of the first and second airflow ducts in a PXIe chassis provided in an embodiment of this application;

[0030] Figure 5 This is another schematic diagram of the PXIe chassis provided in an embodiment of this application;

[0031] Figure 6 This is a schematic diagram showing the state in which a functional module is installed in the second accommodating space of the PXIe chassis provided in this embodiment of the application.

[0032] Figure label:

[0033] 100. PXIe chassis;

[0034] 10. Housing; 11. First accommodating space; 111. Opening; 12. Second accommodating space; 13. Bottom surface; 131. First mesh air inlet; 132. Second mesh air inlet; 14. Rear side; 15. Front end; 16. First side; 161. Third mesh air inlet; 162. Fourth mesh air inlet; 17. Second side; 171. Fifth mesh air inlet;

[0035] 20. Power supply module; 21. Power supply cooling fan; 22. Inner end; 23. Outer end;

[0036] 30. Main cooling fan;

[0037] 40. Back panel;

[0038] 50. Functional modules;

[0039] 60. Airflow guide; 61. Heat dissipation through hole. Detailed Implementation

[0040] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0041] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this utility model.

[0042] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly indicate that at least one of those features is included. In the description of this utility model, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0043] In this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] In this utility model, unless otherwise explicitly defined, the terms "above," "on top of," "above," "over," "below," "below," "below," or "below" for "first feature above second feature" can refer to direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Furthermore, "above," "above," and "over" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0045] Please refer to Figures 1 to 6 This application provides a PXIe chassis 100, which includes a chassis 10, a power module 20, a main cooling fan 30, and a backplate 40.

[0046] The housing 10 is typically manufactured using sheet metal materials through processes such as stamping, bending, welding, and surface treatment.

[0047] The enclosure 10 has a first accommodating space 11 inside, into which the power module 20 is pluggable. The shape of the power module 20 is adapted to the first accommodating space 11, and it provides power to the operation of the PXIe enclosure 100. The power module 20 receives external power input to distribute electrical energy to various components inside the enclosure 10, especially the back panel 40 and various functional modules 50. As one of the input terminals of the PXIe enclosure 100, the power module 20 receives external AC power. After rectification, filtering, and voltage regulation within the power module 20, it outputs DC voltage and current conforming to the PXIe specification. The power module 20 is easily plugged in and out via a connector on the back panel 14 of the enclosure, improving the convenience of power module 20 replacement and maintenance. The connector needs to meet high current transmission requirements and mechanical strength for repeated plugging and unplugging, and is typically a custom connector, including power pins, ground pins, and possible control or status signal pins.

[0048] In addition, the power module 20 integrates a power cooling fan 21, and the bottom surface 13 of the chassis 10 is provided with a first mesh air inlet 131. Under the action of the power cooling fan 21, cool air enters through the first mesh air inlet 131, flows through the interior of the power module 20, and is then discharged, forming a first airflow channel. This can be understood as the power module 20 having its own independent cooling channel, i.e., the first airflow channel, which can greatly reduce the impact of the heat generated by the power module 20 on other cooling channels, thereby improving the overall heat dissipation efficiency of the PXIe chassis 100 and the smoothness of the internal airflow.

[0049] In addition, the power supply cooling fan 21 is located at the outer end 23 of the power module 20, and the inner end 22 of the power module 20 is provided with a mesh-shaped air inlet, so that the cold air from the first mesh air inlet 131 flows through the inside of the power module 20 under the action of the power supply cooling fan 21 and is discharged from the outside of the casing 10 from the power supply cooling fan 21, thereby realizing the independent cooling of the power module 20 by using an independent cooling air channel.

[0050] Furthermore, the power module 20 itself is a closed unit integrating power conversion circuitry, control circuitry, and heat dissipation components. Its casing is typically made of metal to provide mechanical protection and electromagnetic shielding. The outer end 23 of the power module 20 is provided with a handle for easy plugging and unplugging by the user, and the inner end 22 of the power module 20 is provided with other interfaces, such as DB9 interface, USB interface, Ethernet interface, video output interface, etc. The above interfaces can be set according to design requirements, and this application embodiment does not impose specific limitations.

[0051] The main cooling fan 30 is connected to the rear side 14 of the enclosure 10, serving as the main exhaust vent of the PXIe enclosure 100. Multiple main cooling fans 30 are distributed on the rear side 14 of the enclosure 10 to improve heat dissipation efficiency. The specific number of main cooling fans 30 can be set according to the volume of the PXIe enclosure 100; this embodiment does not impose a specific limitation. The main cooling fan 30 can be an axial fan with a relatively large size, for example, the diameter of an axial fan can be between 80mm and 120mm. It can be fixed to the opening on the rear side 14 of the enclosure 10 with screws to provide high airflow and thus remove heat from inside the enclosure 10.

[0052] In addition, the airflow and speed of the main cooling fan 30 can be adjusted according to the control signal of the temperature control circuit to ensure that the temperature inside the cabinet 10 is within the preset range.

[0053] The enclosure 10 also has a second accommodating space 12. The back panel 40 of the PXIe enclosure 100 and the functional modules 50 tested using the PXIe enclosure 100 are all located in the second accommodating space 12, which occupies most of the internal space of the enclosure 10. The front end 15 of the enclosure 10 has multiple slots. Multiple functional modules 50 are inserted into the slots as needed. During the testing of multiple functional modules 50 using the PXIe enclosure 100, these functional modules 50 will generate a large amount of heat.

[0054] For example, the slots can be interfaces designed according to the PXIe standard. These slots are typically mounted on the backplane 40 and include mechanical rails, positioning mechanisms, and high-density connectors. The number of slots may vary depending on the chassis specifications, and this application embodiment does not impose a specific limitation.

[0055] The bottom surface 13 of the enclosure 10 is also provided with a second mesh air inlet 132. Under the action of the main cooling fan 30, cold air enters through the second mesh air inlet 132 and flows through the second accommodating space 12 before being discharged to form a second airflow duct.

[0056] Cold air from the external environment enters the second accommodating space 12 through the second mesh air inlet 132 and flows through the functional module 50 and back plate 40 area before flowing to the main cooling fan 30, thereby carrying away a large amount of heat generated by the functional module 50 and back plate 40 from the interior of the chassis 10 and improving the heat dissipation effect of the PXIe chassis 100.

[0057] Please refer to Figure 6The large surface area of ​​the functional module 50 is positioned opposite to the side of the housing 10, that is, the small surface area of ​​the functional module 50 is positioned opposite to the bottom surface 13 of the housing 10. The cold air enters the second accommodating space 12 from the second grid air inlet 132 (that is, the bottom surface 13 of the housing 10) and can flow between adjacent functional modules 50 and through the large surface area of ​​the functional module 50, so as to carry most of the heat generated by the functional module 50 away from the second accommodating space 12 through the second airflow duct.

[0058] The first airflow channel used for cooling the power module is an independent channel, which can greatly reduce the impact of the heat generated by the power module 20 on the cooling of the second airflow channel, thereby ensuring the overall heat dissipation effect of the PXIe chassis 100.

[0059] In an optional embodiment, the first side 16 of the housing 10 is provided with a third grid air inlet 161 and a fourth grid air inlet 162. The cold air of the first airflow duct enters through the first grid air inlet 131 and the third grid air inlet 161; the cold air of the second airflow duct enters through the second grid air inlet 132 and the fourth grid air inlet 162.

[0060] Please refer to Figure 4 , Figure 4 The arrows shown are schematic diagrams illustrating the airflow direction in the first and second airflow ducts. Simultaneous input of cool air from the first side 16 and bottom 13 of the enclosure 10 further improves the heat dissipation efficiency of the PXIe enclosure 100.

[0061] In an optional embodiment, the second side 17 of the housing 10 is further provided with a fifth grid air inlet 171. The cold air of the second airflow duct enters through the second grid air inlet 132, the fourth grid air inlet 162 and the fifth grid air inlet 171. The second side 17 is arranged opposite to the first side 16.

[0062] Cold air enters the second accommodating space 12 simultaneously from the first side 16, the second side 17, and the bottom 13 of the enclosure 10, which can greatly increase the amount of cold air entering the second accommodating space 12, thereby improving the heat dissipation efficiency and effect on the functional module 50 and the back panel 40.

[0063] Please refer to Figure 5 Cool air enters through the first grid air inlet 131 and the third grid air inlet 161, flows through the power module 20, and is exhausted from the power cooling fan 21, which is the flow path of the first airflow duct. Cool air enters through the second grid air inlet 132, the fourth grid air inlet 162, and the fifth grid air inlet 171, flows through the functional module 50 and the backplate 40, and is exhausted from the main cooling fan 30, thereby dissipating the heat generated during the operation of the PXIe chassis 100.

[0064] In one alternative embodiment, please refer to Figures 3 to 6 The second grid air inlet 132, the fourth grid air inlet 162, and the fifth grid air inlet 171 correspond to the positions of the functional module 50 and the back plate 40, so that the cold air can flow directly to the surface of the functional module 50 and the back plate 40, forming an airflow field specifically for the heat dissipation of the functional module 50 and the back plate 40. Physically, this airflow field is independent of the heat dissipation field of the power module 20, which can avoid the heat generated by the power module 20 from affecting it, and ensure the smoothness of the airflow field in the second accommodating space 12 inside the enclosure 10, thereby improving the heat dissipation effect and efficiency of the functional module 50 and the back plate 40.

[0065] The first mesh air inlet 131 and the third mesh air inlet 161 correspond to the mesh-shaped air inlet provided at the inner end 22 of the power module 20, so that the cold air entering from the first mesh air inlet 131 and the third mesh air inlet 161 can enter the power module through the mesh-shaped air inlet and be discharged from the power cooling fan 21 located at the outer end 23 of the power module 20, thereby achieving independent heat dissipation of the power module 20.

[0066] In an optional embodiment, the first grid air inlet 131 and the second grid air inlet 132 on the bottom surface 13 of the housing 10, and the third grid air inlet 161, the fourth grid air inlet 162 and the fifth grid air inlet 171 on the side of the housing 10, can be formed into dense circular, square or hexagonal openings by stamping or laser cutting processes. The opening ratio of the air inlets on the housing 10 is designed to ensure structural strength while maximizing air intake; for example, the opening ratio is greater than 50%. Furthermore, the diameter of the openings is not specifically limited in this embodiment, but it needs to be able to prevent large foreign objects from entering the interior of the housing 10. For example, the opening diameter is 3mm to 8mm.

[0067] In one optional embodiment, a handle is attached to the side of the enclosure 10. The handle is made of metal or high-strength plastic and can be connected to the side of the enclosure 10 by screws or welding to improve the ease of handling the PXIe enclosure 100. The shape of the handle and its specific position on the enclosure 10 can be set according to requirements, and this embodiment does not impose specific limitations.

[0068] In an alternative embodiment, the first accommodating space 11 has an opening 111 located on the back side 14 of the housing 10, through which the power module 20 is plugged into the first accommodating space 11.

[0069] In this embodiment, the outlets of both the first and second airflow ducts are located on the back side 14 of the housing 10. This means that the hotter gases discharged from inside the housing 10 are located on the back side 14, resulting in a greater distance between the inlets and outlets of the first and second airflow ducts. This prevents the gases discharged from the back side 14 of the housing 10 from affecting the cool air at the inlet at the front end 15 of the housing 10.

[0070] In one alternative embodiment, please refer to Figures 1 to 4 The opening 111 of the first accommodating space 11 is located on the back side 14 of the box 10, near the corner of the bottom surface 13 of the box 10 and the first side surface 16 of the box 10.

[0071] The first accommodating space 11 extends along the direction parallel to the first side 16 of the enclosure 10. The first accommodating space 11 is located at the corner formed by the first side 16, the back side 14, and the bottom surface 13 of the enclosure 10. This can shorten the path length of the first airflow channel used for independent heat dissipation of the power module, thereby improving the heat dissipation efficiency of the power module. In addition, the fact that the power module is located at the corner can prevent the first accommodating space 11 from obstructing the second airflow channel, and at the same time avoid air short circuits or dead corners, improve the integrity and directional consistency of the airflow field inside the enclosure 10, and improve the overall heat dissipation efficiency.

[0072] In one alternative embodiment, please refer to Figure 3 and Figure 4 The PXIe chassis 100 also includes a flow guide 60, which is connected to the chassis 10 and is used to guide the gas located in the second accommodating space 12 to the main cooling fan 30.

[0073] The PXIe chassis 100 utilizes a flow guide 60 to optimize airflow path, allowing incoming cool air to flow through the backplate 40 and functional modules 50 before flowing to the main cooling fan 30 and being exhausted. This significantly reduces airflow short-circuiting and heat dissipation dead zones, thereby improving the heat dissipation performance of the PXIe chassis 100.

[0074] In an optional embodiment, one end of the air guide 60 is connected to the bottom surface 13 of the housing 10 near the main cooling fan 30, and the other end is located at the top of the second accommodating space 12.

[0075] Due to the obstruction of the backplate 40 and the functional module 50, the cold air entering from the bottom surface 13 and the side of the enclosure 10 moves upward first, and then moves from the top of the second accommodating space 12 towards the front end 15 of the enclosure 10 and the back side 14 of the enclosure 10. One end of the air guide 60 is located on the bottom surface 13 of the main cooling fan 30, and the other end is located on the top of the second accommodating space 12. It can guide the hot air flow rising to the top of the second accommodating space 12 to the main cooling fan 30, thereby improving the heat dissipation efficiency and heat dissipation effect of the PXIe enclosure 100.

[0076] In an optional embodiment, the end of the air guide 60 near the second accommodating space 12 is provided with a plurality of heat dissipation holes 61, so that the cold air entering from the side of the back plate 40 away from the functional module 50 can pass through the plurality of heat dissipation holes 61 and flow to the main cooling fan 30.

[0077] In this embodiment, by providing multiple heat dissipation holes 61 at the end of the air guide 60, air on the side of the back plate 40 away from the functional module 50 flows to the main cooling fan 30 after passing through the multiple heat dissipation holes 61, which can improve the airflow efficiency on the side of the back plate 40 away from the functional module 50; at the same time, it can also improve the air guiding effect of the air guide 60 on the rising hot airflow on the side of the back plate 40 close to the functional module 50.

[0078] The independent power module 20 in this embodiment offers significant convenience, its primary function being to provide a stable and reliable power supply to the PXIe chassis 100. More importantly, as an independent unit, the power module 20 can be directly plugged in and replaced from the outside without opening the entire chassis or disassembling other internal components. This makes maintenance, troubleshooting, and upgrades based on power requirements of the power module 20 extremely convenient and efficient, greatly reducing downtime of the PXIe chassis 100. Furthermore, the independent power cooling fan 21 ensures that the power module 20 maintains a suitable operating temperature even under high loads, further enhancing the reliability of the power module 20 itself and thus improving the overall stability of the PXIe chassis 100.

[0079] The PXIe chassis 100 provided in this application embodiment serves as a high-performance modular test platform, commonly used in demanding applications such as automated testing, high-bandwidth data acquisition, and high-speed signal processing. In these scenarios, high-performance modules generate significant heat, and efficient and stable heat dissipation is crucial for ensuring long-term reliable system operation. The independent power module 20's heat dissipation and optimized main airflow design provided in this application embodiment effectively address this challenge. For example, in industrial automation, equipment stability and reliability directly impact production efficiency; the chassis's rapid power module 20 replacement capability reduces downtime due to hardware failures. In aerospace and defense fields, test systems frequently operate in harsh environments and have extremely high requirements for maintainability and rapid deployment capabilities. The ruggedization potential and convenient maintenance features of this application embodiment make it an ideal choice. Furthermore, in applications such as communication testing and semiconductor testing that require the integration of numerous high-density, high-power modules, the improved heat dissipation solution ensures test accuracy and repeatability, improving overall test efficiency.

[0080] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A PXIe chassis, characterized in that, The PXIe chassis (100) includes: The enclosure (10) has a first accommodating space (11) and a second accommodating space (12) inside. The back panel (40) of the PXIe chassis (100) and the functional module (50) tested using the PXIe chassis (100) are both located in the second accommodating space (12). The power module (20) is pluggable into the first accommodating space (11) of the enclosure (10) and can provide power for the operation of the PXIe chassis (100). The power module (20) integrates a power cooling fan (21). The main cooling fan (30) is connected to the back side (14) of the housing (10); The bottom surface (13) of the housing (10) is provided with a first grid air inlet (131) and a second grid air inlet (132). Under the action of the power cooling fan (21), cold air enters through the first grid air inlet (131), flows through the inside of the power module (20), and is discharged to form a first airflow channel. Under the action of the main cooling fan (30), cold air enters through the second grid air inlet (132), flows through the second accommodating space (12), and is discharged to form a second airflow channel.

2. The PXIe chassis according to claim 1, characterized in that, The first side (16) of the housing (10) is provided with a third grid air inlet (161) and a fourth grid air inlet (162). The cold air of the first airflow duct enters through the first grid air inlet (131) and the third grid air inlet (161); the cold air of the second airflow duct enters through the second grid air inlet (132) and the fourth grid air inlet (162).

3. The PXIe chassis according to claim 2, characterized in that, The second side (17) of the housing (10) is also provided with a fifth grid air inlet (171). The cold air of the second airflow duct enters through the second grid air inlet (132), the fourth grid air inlet (162) and the fifth grid air inlet (171). The second side (17) is arranged opposite to the first side (16).

4. The PXIe chassis according to claim 1, characterized in that, The second mesh air inlet (132) corresponds to the position of the functional module (50) and the back plate (40).

5. The PXIe chassis according to claim 1, characterized in that, The PXIe chassis (100) includes a plurality of main cooling fans (30), which are distributed on the back side (14) of the chassis (10).

6. The PXIe chassis according to claim 1, characterized in that, The first accommodating space (11) has an opening (111) located on the back side (14) of the housing (10), and the power module (20) is plugged into the first accommodating space (11) through the opening (111).

7. The PXIe chassis according to claim 6, characterized in that, The opening (111) is located at the corner of the back side (14) near the bottom surface (13) and the first side surface (16) of the box body (10).

8. The PXIe chassis according to any one of claims 1 to 7, characterized in that, The PXIe chassis (100) also includes: A flow guide (60) is connected to the housing (10) and is used to guide the gas located in the second accommodating space (12) to the main cooling fan (30).

9. The PXIe chassis according to claim 8, characterized in that, One end of the air guide (60) is connected to the bottom surface (13) of the housing (10) near the main cooling fan (30), and the other end is located at the top of the second accommodating space (12).

10. The PXIe chassis according to claim 8, characterized in that, The air guide (60) has a plurality of heat dissipation holes (61) at the end near the second accommodating space (12) so that cold air entering from the side of the back plate (40) away from the functional module (50) can pass through the plurality of heat dissipation holes (61) and flow to the main cooling fan (30).

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