Display device and electronic device including the same

Abstract

The present disclosure relates to a display device and an electronic device including the same. The display device according to an embodiment includes a display panel, a flexible printed circuit board connected to the display panel, and a cover film printed or coated on a rear surface of the display panel. The cover film defines a groove pattern therein to accommodate at least a portion of the flexible printed circuit board.

Description

Technical Field

[0001] This disclosure relates to display devices and electronic devices including such display devices. Background Technology

[0002] The display device includes pixels and can display images on the screen by controlling the brightness of each pixel. The display device may include a display panel forming the pixels. The display device may include a flexible circuit board connected to the display panel and transmitting signals to the display panel. The display device can be used to display images in electronic devices. Utility Model Content

[0003] The embodiments will provide a display device that can reduce interference between components of an electronic device and improve the usability of the internal space of the electronic device, as well as an electronic device including the display device.

[0004] The display device according to an embodiment includes: a display panel; a flexible printed circuit board; a film attached to the display panel; and a cover film printed or coated on the rear surface of the display panel. The cover film defines a recessed pattern therein for accommodating at least a portion of the flexible printed circuit board.

[0005] At least a portion of the groove pattern may have a planar shape corresponding to the planar shape of at least a portion of the flexible printed circuit board.

[0006] The groove pattern may include a first groove having a first depth from the surface of the cover film and a second groove having a second depth from the surface of the cover film. The second depth may be greater than the first depth.

[0007] A flexible printed circuit board may include a body in which electronic components are disposed, a tail extending from the body, and a connector disposed at the end of the tail. The tail may be disposed in a first recess, and the connector may be disposed in a second recess.

[0008] The cover film may further have additional groove patterns spaced apart from the groove pattern.

[0009] The cover film may further have a protruding pattern that protrudes from the main rear surface of the cover film.

[0010] The covering film may further have protrusions at the edges of the covering film that protrude from the main rear surface of the covering film.

[0011] The display panel may include a substrate, transistors disposed on the substrate, light-emitting devices electrically connected to the transistors, and a protective film disposed on the rear surface of the substrate. The cover film may directly contact the protective film.

[0012] The substrate can be a flexible substrate including a polymer layer.

[0013] The display panel may include a substrate, transistors disposed on the substrate, and light-emitting devices electrically connected to the transistors. The cover film may be in direct contact with the substrate.

[0014] The substrate can be a rigid substrate including glass.

[0015] The covering film may include at least one of a shielding layer, a padding layer, a light-shielding layer, and a heat dissipation layer.

[0016] Depending on the area covered by the membrane, the membrane can provide different functions.

[0017] An electronic device according to an embodiment includes a housing and a display device disposed within the housing. The display device includes: a display panel; and a cover film printed or coated on the rear surface of the display panel. The cover film defines a recessed pattern therein for at least a portion of a receiving component.

[0018] The display device may further include a flexible printed circuit board connected to the display panel. At least a portion of the recessed pattern may have a planar shape corresponding to the planar shape of at least a portion of the flexible printed circuit board.

[0019] The groove pattern may include a first groove having a first depth from the surface of the cover film and a second groove having a second depth from the surface of the cover film. The second depth may be greater than the first depth.

[0020] A flexible printed circuit board may include a body on which electronic components are disposed, a tail extending from the body, and a connector disposed at the end of the tail. The tail may be disposed in a first recess, and the connector may be disposed in a second recess.

[0021] The cover film may further have a protruding pattern that protrudes from the main rear surface of the cover film.

[0022] The display panel may include a substrate, transistors disposed on the substrate, light-emitting devices electrically connected to the transistors, and a protective film disposed on the rear surface of the substrate. The cover film may directly contact the protective film.

[0023] The display panel may include a substrate, transistors disposed on the substrate, and light-emitting devices electrically connected to the transistors. The cover film may be in direct contact with the substrate.

[0024] According to embodiments, a display device and an electronic device including the display device can be provided, which can reduce interference between components of an electronic device and improve the usability of the internal space of the electronic device. Furthermore, according to embodiments, there are beneficial effects that can be recognized throughout the specification. Attached Figure Description

[0025] Figure 1 This is a schematic front perspective view of an electronic device according to an embodiment.

[0026] Figure 2 This is a schematic front perspective view of a display device according to an embodiment.

[0027] Figure 3 This is a schematic top view of the connection relationship between the components of the display device according to an embodiment.

[0028] Figure 4 This is a schematic bottom perspective view of a display device according to an embodiment.

[0029] Figure 5 It is along Figure 4 A schematic cross-sectional view of the display device according to an embodiment, taken by line A-A'.

[0030] Figure 6 It is along Figure 4 A schematic cross-sectional view of the display device according to an embodiment, taken by line A-A'.

[0031] Figure 7 This is a schematic bottom perspective view of a display device according to an embodiment.

[0032] Figure 8 This is a schematic side view of a display device according to an embodiment.

[0033] Figure 9 This is a schematic bottom perspective view of a display device according to an embodiment.

[0034] Figure 10 A bottom perspective view of a display device according to an embodiment is shown schematically.

[0035] Figure 11 A schematic front perspective view of a display device according to an embodiment is shown.

[0036] Figure 12 This is a schematic cross-sectional view of a display device according to an embodiment.

[0037] Figure 13 This is a schematic cross-sectional view of a display device according to an embodiment. Detailed Implementation

[0038] The present disclosure will be described more fully below with reference to the accompanying drawings in which embodiments are illustrated.

[0039] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element, or an intermediary element may be present. Conversely, when an element is referred to as being "directly" on another element, an intermediary element is not present.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0041] Unless explicitly described as having the opposite meaning, the word “including” and its variations such as “contains” or “includes” will be understood to mean including the stated element but excluding any other element.

[0042] Furthermore, throughout the specification, when “connected to” is used, it means not only that two or more components are directly connected, but also that two or more components are indirectly connected, physically connected, and electrically connected through other components, or that while being an integral unit, they are referred to by different names depending on their location or function.

[0043] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or segments, these elements, components, areas, layers, and / or segments should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, or segment from another. Therefore, without departing from the teachings herein, the first element, component, area, layer, or segment discussed below may be referred to as the second element, component, area, layer, or segment.

[0044] In the accompanying drawings, reference numerals “DR1”, “DR2” and “DR3” are used to indicate directions, where “DR1” is a first direction, “DR2” is a second direction perpendicular to the first direction, and “DR3” is a third direction perpendicular to the first and second directions.

[0045] Figure 1 This is a schematic front perspective view of an electronic device according to an embodiment, and Figure 2 This is a schematic front perspective view of a display device according to an embodiment.

[0046] refer to Figure 1 and Figure 2The electronic device 1 may include a display screen capable of displaying images on a third-direction DR3, the third-direction DR3 corresponding to a front surface on a plane defined by a first direction DR1 and a second direction DR2. The electronic device 1 may be a device that includes, as its primary function, a smartphone, mobile phone, tablet computer, multimedia player, game console, monitor, and / or laptop computer, etc. The electronic device 1 may include a cover window 10, a housing 20, and / or a display device 30, etc.

[0047] The cover window 10 may include an insulating plate. For example, the cover window 10 may be formed of glass, plastic, or a combination thereof. The front side of the cover window 10 may define the front side of the electronic device 1. In the cover window 10, the area corresponding to the display screen may be optically transparent. The cover window 10 may be disposed above the display device 30 to protect the display device 30 from external impacts, etc., and may transmit the image displayed by the display device 30. In another embodiment, the cover window 10 may be considered as a component of the display device 30.

[0048] The housing 20 can be formed of a material with relatively high rigidity. For example, the housing 20 may include multiple frames and / or panels comprising glass, plastic, or metal, or a combination of glass, plastic, or metal. The housing 20 can be combined with the cover window 10, and the combined housing 20 and cover window 10 can form the appearance of the electronic device 1 and provide the internal space of the electronic device 1. For example, the housing 20 can form the rear and side surfaces of the electronic device 1, and the cover window 10 can form the front surface of the electronic device 1. The display device 30, etc., can be disposed in the internal space defined by the cover window 10 and the housing 20, so that the display device 30, etc., can be protected from the influence of the external environment.

[0049] Display device 30 can display images and can provide a display screen for electronic device 1. Display device 30 can be an emission type display device such as an organic light-emitting display device, an inorganic emission display device, or a quantum dot emission display device.

[0050] Electronic device 1 can have various shapes. For example... Figure 1 As shown, when viewed from the front, electronic device 1 can be a quadrilateral with rounded corners. Alternatively, electronic device 1 can have a rectangular shape, a square, other polygonal shapes, a circle, and / or an ellipse, etc.

[0051] Electronic device 1 and display device 30 may each include a display area DA and a non-display area NA. Figure 1 The display area DA and the non-display area NA shown can be compared with... Figure 2The display area DA and the non-display area NA shown correspond to each other. The display area DA is the area where images are displayed and can correspond to the display screen. The non-display area NA is the area where no images are displayed. The display area DA can occupy most of the area centered on the front of the electronic device 1, and the non-display area NA can surround the display area DA.

[0052] The display area DA may include a first display area DA1 and a second display area DA2. The second display area DA2 may be an area on the back where components such as sensors and cameras are mounted to add various functions to the electronic device 1. The second display area DA2 may correspond to the component area. The second display area DA2 may be surrounded by the first display area DA1. Not only the first display area DA1, but also the second display area DA2 can display images. The position and number of the second display areas DA2 can be changed in various ways.

[0053] More specifically, the display device 30 may provide a display screen on the electronic device 1. The display device 30 may detect or capture the front of the electronic device 1. The display device 30 may have a similar flat shape to the electronic device 1.

[0054] The display device 30 may include a display panel 100, a display driver 200, a flexible printed circuit board 300, a touch driver 400, and a cover film 500, etc.

[0055] The display panel 100 can be attached to the cover window 10 via an adhesive layer. The display panel 100 may include a main area MA and a sub-area SA.

[0056] The main region MA may include a display area DA in which pixels for displaying images are arranged, and a non-display area NA surrounding the display area DA. The display area DA may include a first display area DA1 and a second display area DA2. Components such as sensors and cameras may be disposed on the back side of the second display area DA2. The second display area DA2 may correspond to the component area.

[0057] The display area DA can emit light from the light-emitting area corresponding to the light-emitting device on the third-party DR3. For example, the display panel 100 may include a pixel circuit section, which includes transistors, signal lines (e.g., gate lines, data lines, voltage lines) connected to the pixel circuit section, and light-emitting devices connected to the pixel circuit section. The display panel 100 may include a pixel defining layer that provides an opening defining the light-emitting area of ​​each light-emitting device. The light-emitting device may include an organic light-emitting diode (OLED) containing an organic light-emitting layer, a quantum dot OLED containing a quantum dot emitting layer, an inorganic OLED containing an inorganic semiconductor, or a micro OLED.

[0058] A non-display area NA may surround the display area DA. The non-display area NA may be defined as the peripheral area of ​​the main area MA of the display panel 100. Circuits and / or signal lines for generating and / or transmitting various signals applied to the display area DA may be arranged in the non-display area NA. For example, a gate driver (not shown) that supplies gate signals to the gate lines and a fan-out line (not shown) that connects the signal lines of the display driver 200 to the display area DA may be provided in the non-display area NA.

[0059] The sub-region SA can be a region extending from one side of the main region MA. The sub-region SA can include a flexible region capable of being bent, folded, and rolled. For example, the sub-region SA can be bent to overlap with the main region MA in the thickness direction (i.e., the third direction DR3). The display driver 200 can be disposed in the sub-region SA, and the pad area can be disposed at the edge of the sub-region SA. The flexible printed circuit board 300 can be connected to the pad area. In another embodiment, the sub-region SA can be omitted, and the display driver 200 and the pad area can be arranged in the non-display area NA.

[0060] The display driver 200 can output signals and voltages for driving the display panel 100. The display driver 200 can supply data voltage to data lines. The display driver 200 can supply power voltage to power lines and can supply gate control signals to the gate driver. The display driver 200 can be provided as an IC chip and mounted on the display panel 100. For example, the display driver 200 can be placed in a sub-region SA and overlapped with the main region MA in the thickness direction (i.e., third direction DR3) by bending the sub-region SA. In another embodiment, the display driver 200 can be mounted on a flexible printed circuit board 300.

[0061] The flexible printed circuit board 300 may include a body 310, a connecting part 320, a tail part 330, and a connector 340.

[0062] The body 310 can occupy the largest area in the flexible printed circuit board 300 and can be multilayered. For example, the body 310 may include four or more conductive layers. Electronic components such as a touch driver 400, capacitors, resistors, and inductors can be provided in the body 310.

[0063] The connection portion 320 may be disposed along the edge of the body 310. The connection portion 320 may be referred to as a clamping portion or a pad area. The connection portion 320 may extend in a first direction DR1. The connection portion 320 may be bonded to the pad area of ​​the display panel 100 using an electrical or physical bonding means such as an anisotropic conductive film. The pads disposed in the connection portion 320 of the flexible printed circuit board 300 may be electrically connected to the pads disposed in the pad area of ​​the display panel 100. The connection portion 320 may include one or more conductive layers. The number of conductive layers included in the connection portion 320 may be less than the number of conductive layers included in the body 310. For example, the connection portion 320 may include one or two conductive layers, and the body 310 may include four or more conductive layers.

[0064] The tail portion 330 may extend from the body 310, and the connector 340 may be disposed at the end of the tail portion 330. The tail portion 330 may be approximately straight in a plan view, or it may be bent once or multiple times. The number of conductive layers included in the tail portion 330 may be less than the number of conductive layers included in the body 310. For example, the tail portion 330 may include one or two conductive layers, and the body 310 may include four or more conductive layers.

[0065] Connector 340 may be located at the edge of tail 330. Connector 340 may include connection terminals such as pins connected to wiring connected to tail 330. Connector 340 may be connected to external devices such as graphics systems and power systems to receive digital video data and power. Mobile Industrial Processor Interface (MIPI) may be used for high-speed transmission of digital video data. Signals and power applied through connector 340 may be transmitted to wiring arranged in body 310 via wiring arranged in tail 330. Connector 340 may be thicker than other parts of flexible printed circuit board 300.

[0066] The touch driver 400 can be provided as an IC chip and mounted on the flexible printed circuit board 300. The touch driver 400 can be electrically connected to a touch detector included in the electronic device 1. The touch detector can be provided in the display area DA of the display panel 100. The touch driver 400 can supply an input signal (touch drive signal) to the sensing electrodes of the touch detector and detect changes in the electrostatic capacitance between the sensing electrodes based on the output signal (touch detection signal) from the sensing electrodes. For example, the touch drive signal can be a pulse signal with a predetermined frequency. The touch driver 400 can calculate the presence and location of a touch based on the change in the electrostatic capacitance between the sensing electrodes.

[0067] A cover film 500 can be disposed on the rear surface of the display panel 100. The cover film 500 can be printed or coated on the rear surface of the display panel 100. Therefore, the cover film 500 can self-attach to the display panel 100 without the need for attachment means such as adhesives or bonding layers, and can directly contact the rear surface of the display panel 100. The cover film 500 can protect the display panel 100 from the effects of the environment behind the display panel 100 (e.g., shock, electromagnetic waves, heat, and noise).

[0068] Figure 3 This is a schematic top view illustrating the connection relationships between components of the display device according to an embodiment. As used herein, the plan view is a view in the thickness direction (i.e., the third direction DR3) of the display device 30.

[0069] refer to Figure 3 The display panel 100 of the display device 30 may include a display area DA and a non-display area NA. The display area DA may be located at the center of the display panel 100. Pixels PX, gate lines GL, data lines DL, and power lines VL may be disposed in the display area DA. As the smallest unit of light emission, each pixel PX may include a pixel circuit portion containing transistors and capacitors, as well as a light-emitting device that receives drive current from the pixel circuit portion. Pixels PX may be connected to gate lines GL, data lines DL, and power lines VL.

[0070] A gate line GL supplies a gate signal applied from the gate driver 210 to the pixel PX. The gate lines GL can extend along a first direction DR1 and can be spaced apart from each other along a second direction DR2. A data line DL supplies a data voltage applied from the display driver 200 to the pixel PX. The data lines DL can extend along the second direction DR2 and are spaced apart from each other along the first direction DR1. A power line VL supplies a power supply voltage applied from the display driver 200 to the pixel PX. The power supply voltage may include a high-level power supply voltage (or drive voltage), a low-level power supply voltage (or common voltage), and an initialization voltage, etc., and these power supply voltages can be transmitted to the pixel PX. The power lines VL can extend along the second direction DR2 and are spaced apart from each other along the first direction DR1.

[0071] Touch detection electrodes TSE1 and TSE2 can be placed in the display area DA. The touch detection electrodes TSE1 and TSE2 can include a first touch electrode TSE1 arranged on a first direction DR1 and a second touch electrode TSE2 arranged on a second direction DR2.

[0072] A non-display area NA can surround the display area DA. A gate driver 210, a fan-out line FOL, a gate control line GCL, and a touch signal line TSL can be located in the non-display area NA. The gate driver 210 can generate gate signals based on the gate control line GCL and can supply the gate signals to the gate line GL according to a predetermined sequence. The fan-out line FOL can extend from the display driver 200 to the display area DA. The fan-out line FOL can transmit the data voltage output from the display driver 200 to the data line DL. The gate control line GCL can extend from the display driver 200 to the gate driver 210. The gate control line GCL can transmit the gate control signal output from the display driver 200 to the gate driver 210. The touch signal line TSL can electrically connect touch pads TP1 and TP2 and sensing electrodes TSE1 and TSE2.

[0073] The display panel 100 may include a sub-region SA. The display driver 200 may be located in the sub-region SA. The sub-region SA may include a pad area PA.

[0074] Display driver 200 can output signals and voltages for driving display panel 100. Display driver 200 can supply data voltage to data line DL via fan-out line FOL. Data voltage can be supplied to pixel PX, and the brightness of pixel PX can be controlled. Display driver 200 can supply gate control signals to gate driver 210 via gate control line GCL.

[0075] The pad area PA can be located at the edge of the sub-area SA. The pad area PA may include a display pad area DPA, a first touch pad area TPA1, and a second touch pad area TPA2. The display pad DP can be located in the display pad area DPA. The display pad DP can be connected to the graphics system via the flexible printed circuit board 300. The display pad DP can be connected to the flexible printed circuit board 300 and thus receive digital video data, and can supply digital video data to the display driver 200. The first touch pad area TPA1 and the second touch pad area TPA2 can be located on one side and the other side of the display pad area DPA. Touch pads TP1 and TP2 can be located in the first touch pad area TPA1 and the second touch pad area TPA2, and touch pads TP1 and TP2 are connected to sensing electrodes TSE1 and TSE2 located in the display area DA and a touch driver 400 located on the flexible printed circuit board 300 to detect touch. The pad area PA, the first touch pad area TPA1, and the second touch pad area TPA2 can be electrically connected to the flexible printed circuit board 300 through anisotropic conductive film or self-assembled anisotropic conductive adhesive (SAP).

[0076] Figure 4This is a schematic bottom perspective view of the display device according to an embodiment. Figure 5 and Figure 6 It is along Figure 4 A schematic cross-sectional view of the display device according to an embodiment, taken along line A-A'. Figure 7 This is a schematic bottom perspective view of the display device according to an embodiment, and Figure 8 This is a schematic side view of a display device according to an embodiment.

[0077] Figure 4 This shows the state of the display panel 100 or flexible printed circuit board 300 before bending, and Figure 7 This shows the state of the display panel 100 or flexible printed circuit board 300 after bending.

[0078] refer to Figure 4 The cover film 500 can be disposed on the rear surface of the display panel 100. The cover film 500 can be formed by printing or coating functional materials on the rear surface of the display panel 100 using inkjet printing methods or the like. The cover film 500 can protect the display panel 100 from the influence of the rear environment. For this purpose, the cover film 500 may include at least one of the functional layers such as a shielding layer, a padding layer, a light-shielding layer, and a heat dissipation layer.

[0079] The shielding layer prevents electromagnetic interference (EMI) and other electromagnetic fields from flowing from the rear surface of the cover film 500 to the display panel 100. The shielding layer may include conductive materials. For example, the shielding layer may include silver flakes, silver nanowires (AgNW), carbon nanotubes (CNTs), copper powder, and / or aluminum powder.

[0080] The cushioning layer can absorb impacts and prevent damage to the display panel 100. For example, the cushioning layer can prevent damage to the display panel 100 caused by external impacts and mitigate impact and stress when the electronic device 1 is dropped. The cushioning layer can be a porous layer formed of a material such as polyurethane, dispersed polyurethane, epoxy resin, or polyethylene. The cushioning layer may contain foam resin.

[0081] The light-shielding layer can block light from entering the display panel 100 from the rear surface of the display panel 100 and can also prevent the interior of the display device 30 from being observed. The light-shielding layer may include a polymer containing a black dye or pigment (e.g., black polyethylene terephthalate).

[0082] The heat dissipation layer can dissipate heat generated from heat-generating components such as processors and batteries.

[0083] The heat dissipation layer can contain materials with excellent thermal conductivity. It can contain carbon materials such as graphite, graphene, or carbon nanotubes.

[0084] The cover film 500 may further include a support layer for ensuring strength. The support layer may be a plastic layer made of polymers such as polyimide and / or polyethylene terephthalate.

[0085] Each functional layer can be formed separately, or it can be formed as a single layer to perform multiple functions. For example, the padding layer can be a black foam resin layer including black dye or pigment, or it can have a light-shielding layer function. Even if each functional layer is formed separately, it can also be formed integrally without distinguishing the layers because it is formed using inkjet printing methods, etc. Each functional layer can be formed over the entire area of ​​the cover film 500, or it can be formed in a portion of the area.

[0086] In another embodiment, the cover film 500 may further include a primer layer (e.g., a silicone primer layer) as a layer in contact with the display panel 100 to improve the adhesion of the functional layers to the display panel 100. The primer layer may be printed or coated on the rear surface of the display panel 100.

[0087] refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The cover film 500 may define a recessed pattern GP formed in its rear surface. The recessed pattern GP may be concave relative to the main rear surface 500-MB of the cover film 500. Here, the main rear surface 500-MB is a portion of the entire rear surface of the cover film 500 having the largest area and uniform thickness (i.e., t0) of the entire rear surface. The recessed pattern GP may be an engraved pattern. Since the recessed pattern GP is defined in the cover film 500, the cover film 500 may include portions with different thicknesses. The cover film 500 may have a thickness t0 between its main rear surface 500-MB and its front surface 500-F, and the portion defining the recessed pattern GP may have a thickness thinner than t0. Such a recessed pattern GP can be formed by varying the thickness of the functional material depending on the area during the printing or coating of the functional material forming the cover film 500. For example, in the area on the rear surface of the display panel 100 where the recessed pattern GP will be defined, a recessed pattern GP with a relatively thin thickness can be formed by printing a functional material that is thinner than the functional material in other areas (e.g., the main rear surface 500-MB).

[0088] The recessed pattern GP can correspond to the planar shape of a component disposed on the rear surface of the cover film 500. In an embodiment, at least a portion of the recessed pattern GP can correspond to the planar shape of the flexible printed circuit board 300. The sub-region SA of the display panel 100 can be bent, and therefore, a portion of the sub-region SA can be disposed on the rear surface of the main region MA and the rear surface of the cover film 500. Additionally, when the sub-region SA is bent, the flexible printed circuit board 300, including the connection portion 320 of the pad region PA connected to the sub-region SA, can be disposed on the rear surface of the main region MA and the rear surface of the cover film 500. The flexible printed circuit board 300 can be attached to the rear surface of the cover film 500 and secured in place by an adhesive member such as adhesive or double-sided tape. The recessed pattern GP can accommodate at least a portion of the flexible printed circuit board 300, thereby reducing the portion of the flexible printed circuit board 300 protruding from the cover film 500. The recessed pattern GP can also accommodate adhesive components to hold the flexible printed circuit board 300 in place. Since the flexible printed circuit board 300 protrudes less due to the recessed pattern GP, ​​the overall thickness of the display device 30 can be reduced. Additionally, interference with other components provided on the rear surface of the display device 30 within the electronic device 1 can be reduced, and space utilization within the electronic device 1 can be improved, allowing for greater freedom in the layout design of other components.

[0089] The edge of the 500-meter covering film can be like Figure 5 What is shown is flat, or as Figure 6 The image shown shows a slightly raised bump. When the cover film 500 is printed or coated using an inkjet printing method, a bump BP shape may appear at the edge of the cover film 500 due to the properties and energy aspects (surface tension, etc.) of the coated liquid material. The bump BP may have a shape that protrudes from the surface of the cover film 500. Due to the bump BP, the edge of the cover film 500 may be thicker than other parts of the cover film 500 (e.g., the main rear surface 500-MB). Such bump BP may be present in a display device 30 in which multiple display panels 100 are manufactured from a motherboard, the multiple display panels 100 are cut into individual units, and then the cover film 500 is formed on the rear surface of each display panel 100. In a display device 30 where multiple display panels 100 are manufactured from a motherboard and the cover film 500 is formed on the rear surface of the multiple display panels 100 before being cut into individual units, the bump BP may not be present. This is because the portion where the bump BP is located can be removed when cutting into individual units.

[0090] The groove pattern GP of the cover film 500 may include areas with different depths. For example, the groove pattern GP may include a first groove GR1 having a first depth d1 from the surface of the cover film 500 and a second groove GR2 having a second depth d2. In the area defining the first groove GR1, the cover film 500 may have a thickness corresponding to t0 minus d1, and in the area defining the second groove GR2, the cover film 500 may have a thickness corresponding to t0 minus d2. The first groove GR1 and the second groove GR2 may be connected to each other. The first groove GR1 may correspond to the tail 330 of the flexible printed circuit board 300. The second groove GR2 may correspond to the connector 340 of the flexible printed circuit board 300. The connector 340 may be thicker than other portions of the flexible printed circuit board 300 (e.g., the tail 330). Therefore, by forming a second depth d2 greater than the first depth d1, the protrusion of the connector 340 from the main rear surface 500-MB of the cover film 500 can be reduced. The first depth d1 is the depth of the first groove GR1 corresponding to the tail 330, and the second depth d2 is the depth of the second groove GR2 corresponding to the connector 340. In an embodiment, in the groove pattern GP, ​​the depth of the area corresponding to the connection portion 320 or the body 310 of the flexible printed circuit board 300 can be approximately equal to or greater than the first depth d1. In another embodiment, the groove pattern GP can further include grooves having depths different from the first depth d1 and the second depth d2.

[0091] Figure 9 This is a schematic bottom perspective view of a display device according to an embodiment.

[0092] refer to Figure 9 In addition to the first recessed pattern GP1 corresponding to the flexible printed circuit board 300, the cover film 500 may further define recessed patterns GP2 and GP3 on its rear surface. Recessed patterns GP2 and GP3 may correspond to the shapes of components of the electronic device 1. For example, one of the recessed patterns GP2 and GP3 may have a shape corresponding to a bracket, and the other may have a shape corresponding to another flexible printed circuit board. Recessed patterns GP2 and GP3 can accommodate some of the components and improve the utilization of the internal space of the electronic device 1. Although three recessed patterns GP1, GP2, and GP3 are shown, in another embodiment, the cover film 500 may include fewer or more recessed patterns.

[0093] The depths of groove patterns GP2 and GP3 can be the same as or different from the depth of groove pattern GP1. The depth of groove pattern GP2 can be the same as or different from the depth of groove pattern GP3. Since the cover film 500 is formed by printing or coating, the thickness of the cover film 500 can be changed depending on the area, and the depths of groove patterns GP1, GP2, and GP3 can be adjusted.

[0094] In the cover film 500, the portions forming the groove patterns GP1, GP2, and GP3 can have different functions. For example, when heat generated from a component housed in the groove pattern GP2 may affect the display panel 100, the portion of the cover film 500 defining the groove pattern GP2 may include a heat dissipation layer. When electromagnetic waves generated from a component housed in the groove pattern GP3 may affect the display panel 100, the portion of the cover film 500 defining the groove pattern GP3 may include a shielding layer. When pressing the flexible printed circuit board 300 housed in the groove pattern GP1 may affect the display panel 100, the portion of the cover film 500 defining the groove pattern GP1 may include a padding layer. In the cover film 500, each portion forming the groove patterns GP1, GP2, and GP3 may include layers having one or more functions such as shielding, buffering, light blocking, and heat dissipation. Since the cover film 500 can be formed by inkjet printing or the like, the function of the cover film 500 can be improved by printing or coating different materials.

[0095] Figure 10 A bottom perspective view of a display device according to an embodiment is shown schematically.

[0096] refer to Figure 10 The cover film 500 may define a groove pattern GP2 in its rear surface, and in addition to the first groove pattern GP1 corresponding to the flexible printed circuit board 300, it also includes a protruding pattern PP. The groove pattern GP2 may be... Figure 9 The groove pattern GP2 described in the embodiments is the same. The protruding pattern PP can protrude significantly beyond the main rear surface 500-MB. In the cover film 500, the portion forming the protruding pattern PP can be thicker than other portions of the cover film 500 (e.g., the main rear surface 500-MB). Since the cover film 500 can be formed by printing or coating using an inkjet printing method, the thickness of the cover film 500 can be partially formed to be thicker than other portions. For example, when the portion forming the protruding pattern PP requires higher impact resistance than other portions, a padding layer can be formed to be thicker than the protruding pattern PP to absorb impact or disperse stress, thereby protecting the display panel 100. Although two groove patterns GP1 and GP2 and one protruding pattern PP are shown, in another embodiment, the cover film 500 may define fewer or more groove patterns and include a protruding pattern.

[0097] Figure 11 A schematic front perspective view of a display device according to an embodiment is shown.

[0098] refer to Figure 11The display device 30 may include a display panel 100, a display driver 200, a flexible printed circuit board 300, a touch driver 400, and a cover film 500, etc. The main components will be described below. Figure 11 The display device 30 shown in the figure and Figure 2 The differences between the display devices 30 shown in the figure.

[0099] and Figure 2 The display panel 100 shown is different from the one shown. The display panel 100 may include a display area DA and a non-display area NA at the periphery of the display area DA, but does not include a sub-area SA. The display driver 200 may be disposed on the flexible printed circuit board 300. The display driver 200 may be disposed in the non-display area NA of the display panel 100. The flexible printed circuit board 300 may be connected to a pad area disposed at the edge of the display panel 100. The touch driver 400 may be disposed on the flexible printed circuit board 300. The cover film 500 may be disposed on the rear surface of the display panel 100 and may be printed or coated on the rear surface of the display panel 100.

[0100] The flexible printed circuit board 300 can be bent at the portion between the main body 310 and the connecting portion 320 (hereinafter referred to as the "bent portion"), and most of the flexible printed circuit board 300 (i.e., the main body 310, the tail portion 330, and the connector 340) can be disposed on the rear surface of the display panel 100 and the cover film 500. Figure 2 In the display device 30 shown, the flexible printed circuit board 300 can be disposed on the rear surface of the display panel 100 by bending the sub-region SA of the display panel 100, but in Figure 11 In the display device 30 shown, a flexible printed circuit board 300 can be disposed on the rear surface of the display panel 100 and the rear surface of the cover film 500 by bending the bent portion of the flexible printed circuit board 300. The flexible printed circuit board 300 can be attached to the rear surface of the cover film 500 and fixed in place by adhesive means. Even in such a structure, the cover film 500 can correspond to the planar shape of the flexible printed circuit board 300 and can include the aforementioned groove pattern GP that accommodates at least a portion of the flexible printed circuit board 300. In addition, the cover film 500 can include at least one of the aforementioned groove patterns GP1, GP2, and GP3 and the protruding pattern PP.

[0101] Figure 12 This is a schematic cross-sectional view of a display device according to an embodiment.

[0102] refer to Figure 12The cross-section shown can approximately correspond to a pixel area. The display device 30 may include a display panel 100 and a cover film 500 printed or coated on the rear surface of the display panel 100.

[0103] The display panel 100 mainly includes a substrate SB, a transistor TR disposed on the substrate SB, and light-emitting diodes (LEDs) connected to the transistor TR. Each LED corresponds to a pixel.

[0104] The substrate SB can be a flexible substrate SB capable of bending, folding, and / or rolling. The substrate SB can be a plurality of layers including a first base layer BL1, an inorganic layer IL, and a second base layer BL2. The first base layer BL1 and the second base layer BL2 can contain polymer resins such as polyimide, polyamide, or polyethylene terephthalate. The first base layer BL1 and the second base layer BL2 can be polymer layers. A barrier layer BR preventing the penetration of moisture and / or oxygen can be disposed on the substrate SB. The barrier layer BR can include materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x ) and / or silicon nitride oxide (SiO) x N y Inorganic insulating materials such as (e.g., single layer or multiple layers).

[0105] A buffer layer (BF) can be disposed on the barrier layer (BR). The buffer layer (BF) can improve the characteristics of the semiconductor layer by blocking impurities from the substrate (SB) during the formation of the semiconductor layer, and can alleviate the stress of the semiconductor layer by planarizing the surface of the substrate (SB). The buffer layer (BF) can include inorganic insulating materials such as silicon nitride, silicon oxide, and silicon oxide nitride, and can be a single layer or multiple layers. The buffer layer (BF) can include amorphous silicon (a-Si).

[0106] The semiconductor layer AL of the transistor TR can be disposed on the buffer layer BF. The semiconductor layer AL may include a first region, a second region, and a channel region between the first and second regions. The semiconductor layer AL may include any of amorphous silicon, polycrystalline silicon, and oxide semiconductors. The oxide semiconductor may include at least one of zinc (Zn), indium (In), gallium (Ga), and tin (Sn). For example, the semiconductor layer AL may include low-temperature polycrystalline silicon (LTPS) or indium gallium zinc oxide (IGZO).

[0107] The first gate insulating layer GI1 can be disposed on the semiconductor layer AL. The first gate insulating layer GI1 can include inorganic insulating materials such as silicon nitride, silicon oxide, and silicon nitride, and can be a single layer or multiple layers.

[0108] A first gate conductive layer, which may include the gate electrode GE of the transistor TR, the gate line GL, and the storage capacitor CS, may be disposed on a first gate insulating layer GI1. The first gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may be a single layer or multiple layers.

[0109] The second gate insulating layer GI2 can be disposed on the first gate conductive layer. The second gate insulating layer GI2 may include inorganic insulating materials such as silicon nitride, silicon oxide, and silicon nitride, and may be a single layer or multiple layers.

[0110] A second gate conductive layer, which may include the second electrode C2 of the storage capacitor CS, may be disposed on the second gate insulating layer GI2. The second gate conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and may be a single layer or multiple layers.

[0111] The interlayer insulating layer (ILD) can be disposed on the second gate insulating layer (GI2) and the second gate conductive layer. The interlayer insulating layer (ILD) can include inorganic insulating materials such as silicon nitride, silicon oxide, and silicon nitride, and can be a single layer or multiple layers.

[0112] A first data conductive layer and a data line DL, which may include a first electrode SE and a second electrode DE of a transistor TR, may be disposed on an interlayer insulating layer ILD. The first electrode SE and the second electrode DE can be connected to a first region and a second region of a semiconductor layer AL, respectively, through contact holes defined in insulating layers GI1, GI2, and ILD. One of the first electrode SE and the second electrode DE may be a source electrode, and the other may be a drain electrode. The first data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may be a single layer or multiple layers.

[0113] The first planarization layer VIA1 may be disposed on the first data conductive layer. The first planarization layer VIA1 may comprise an organic insulating material such as a common polymer (such as polymethyl methacrylate and polystyrene), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer (e.g., polyimide), and a siloxane polymer.

[0114] A second data conductive layer, which may include a power line VL and / or a connecting member CM, may be disposed on the first planarization layer VIA1. The power line VL may transmit voltages such as drive voltage, common voltage, initialization voltage, and reference voltage. The connecting member CM may be connected to the second electrode DE of the transistor TR through contact holes defined in the first planarization layer VIA1. The second data conductive layer may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may be a single layer or multiple layers.

[0115] The second planarization layer VIA2 may be disposed on the second data conductive layer. The second planarization layer VIA2 may comprise organic insulating materials such as common polymers (such as polymethyl methacrylate and polystyrene), polymer derivatives having phenol groups, acrylic polymers, imide polymers (e.g., polyimide) and siloxane polymers.

[0116] The first electrode E1 of the light-emitting diode (LED) can be disposed on the second planarization layer VIA2. The first electrode E1 can be referred to as the pixel electrode. The first electrode E1 can be connected to the connecting member CM through a contact hole defined in the second planarization layer VIA2. Therefore, the first electrode E1 is electrically connected to the second electrode DE of the transistor TR and can receive the driving current controlling the brightness of the LED. The transistor TR to which the first electrode E1 is connected can be a driving transistor or a transistor electrically connected to a driving transistor. The first electrode E1 can be formed of a reflective conductive material or a semi-transparent conductive material, or it can be formed of a transparent conductive material. The first electrode E1 can include transparent conductive materials such as indium tin oxide (ITO) and indium zinc oxide (IZO). The first electrode E1 can include lithium (Li), calcium (Ca), aluminum (Al), silver (Ag), magnesium (Mg), and / or gold (Au).

[0117] A pixel-defining layer (PDL) can be disposed on the second planarization layer (VIA2) and the first electrode (E1). The PDL can be referred to as a dam or separator and can define an opening overlapping the first electrode (E1) in a planar view. The PDL can comprise organic insulating materials such as common polymers (e.g., polymethyl methacrylate and polystyrene), polymer derivatives having phenolic groups, acrylic polymers, imide polymers (e.g., polyimide), and siloxane polymers.

[0118] The light-emitting layer EL of a light-emitting diode (LED) can be disposed on the first electrode E1. In addition to the light-emitting layer EL, a functional layer including at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL) can be disposed on the first electrode E1.

[0119] The second electrode E2 of a light-emitting diode (LED) can be disposed on the light-emitting layer EL. The second electrode E2 can be referred to as the common electrode. The second electrode E2 can be formed to be transparent by forming a thin layer of a metal or metal alloy with a low work function, such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), or silver (Ag). The second electrode E2 can include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0120] The first electrode E1, the light-emitting layer EL, and the second electrode E2 of each pixel can form a light-emitting diode (LED), such as an organic light-emitting diode (OLED). The first electrode E1 can be the anode, and the second electrode E2 can be the cathode. The light-emitting area of ​​the LED can correspond to the pixel.

[0121] A capping layer CPL can be disposed on the second electrode E2. The capping layer CPL can improve optical efficiency by adjusting its refractive index. The capping layer CPL can be configured to completely cover the second electrode E2. The capping layer CPL may include organic insulating materials or may include inorganic insulating materials.

[0122] The encapsulation layer EN can be disposed on the capping layer CPL. The encapsulation layer EN can encapsulate the light-emitting diode (LED) to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EN can be a thin-film encapsulation layer in which the organic layer EOL is disposed between the first inorganic layer EIL1 and the second inorganic layer EIL2.

[0123] The touch sensor layer TS, including the touch electrodes, can be disposed on the encapsulation layer EN. The anti-reflective layer ARL can be disposed on the touch sensor layer TS to reduce external light reflection.

[0124] A protective film PF can be disposed under the substrate SB. The protective film PF can protect the display panel 100 during the manufacturing process of the display device. The protective film PF can contain polymers such as polyethylene terephthalate, silicone polymers (e.g., polydimethylsiloxane), and elastomers (e.g., elastic polyurethane).

[0125] The cover film 500 can be disposed below the protective film PF. The cover film 500 can have, for example, the features described above. Figures 4 to 10 The structure described. Unlike that shown, the display panel 100 may not include the protective film PF, and the cover film 500 may be printed or coated on the back surface of the substrate SB.

[0126] Figure 13 This is a schematic cross-sectional view of a display device according to an embodiment.

[0127] Figure 13 The display device 30 shown in the figure and Figure 12 The difference in the display device 30 shown lies in the substrate SB of the display panel 100. The substrate SB can be a rigid substrate made of a material such as glass. The display panel 100 may not include a protective film that can be disposed on the rear surface of the substrate SB. A cover film 500 can be printed or coated on the rear surface of the substrate SB. In contrast, the display panel 100 may include a protective film disposed on the rear surface of the substrate SB, and a cover film 500 may be printed or coated on the rear surface of the protective film.

[0128] While this disclosure has been described in conjunction with what is now considered to be actual embodiments, it should be understood that the present invention is not limited to the disclosed embodiments. Rather, it is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the claims.

Claims

1. A display device, comprising: Display panel; A flexible printed circuit board is connected to the display panel; as well as A cover film is printed or coated on the back surface of the display panel. The cover film defines a groove pattern therein for accommodating at least a portion of the flexible printed circuit board.

2. The display device according to claim 1, wherein, At least a portion of the groove pattern has a planar shape corresponding to the planar shape of at least a portion of the flexible printed circuit board.

3. The display device according to claim 1, wherein, The groove pattern includes a first groove having a first depth from the surface of the cover film and a second groove having a second depth from the surface of the cover film, wherein the second depth is greater than the first depth.

4. The display device according to claim 3, wherein, The flexible printed circuit board includes a body in which electronic components are disposed, a tail extending from the body, and a connector disposed at the end of the tail. The tail portion is disposed in the first groove, and the connector is disposed in the second groove.

5. The display device according to any one of claims 1 to 4, wherein, The cover film further has at least one of an additional groove pattern spaced apart from the groove pattern and a protruding pattern protruding from the main rear surface of the cover film.

6. The display device according to claim 1, wherein, The covering film further has protrusions at the edge of the covering film that project from the main rear surface of the covering film.

7. The display device according to claim 1, wherein: The display panel includes a substrate, transistors disposed on the substrate, light-emitting devices electrically connected to the transistors, and a protective film disposed on the rear surface of the substrate. The covering film is in direct contact with the protective film.

8. The display device according to claim 1, wherein, The display panel includes a substrate, transistors disposed on the substrate, and light-emitting devices electrically connected to the transistors. The cover film is in direct contact with the substrate.

9. The display device according to claim 1, wherein: The covering film includes at least one of a shielding layer, a padding layer, a light-shielding layer, and a heat dissipation layer.

10. An electronic device comprising a housing and a display device disposed within the housing, wherein, The display device includes: Display panel; and A cover film is printed or coated on the rear surface of the display panel, wherein the cover film defines a groove pattern therein for at least a portion of a receiving component.

Images